JP6549731B2 - 基板を保持するための方法及び支持体 - Google Patents
基板を保持するための方法及び支持体 Download PDFInfo
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- JP6549731B2 JP6549731B2 JP2017558424A JP2017558424A JP6549731B2 JP 6549731 B2 JP6549731 B2 JP 6549731B2 JP 2017558424 A JP2017558424 A JP 2017558424A JP 2017558424 A JP2017558424 A JP 2017558424A JP 6549731 B2 JP6549731 B2 JP 6549731B2
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- 238000012545 processing Methods 0.000 claims description 29
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 3
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/084—Work-clamping means other than mechanically-actuated using adhesive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/066—Transporting devices for sheet glass being suspended; Suspending devices, e.g. clamps, supporting tongs
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Adhesive Tapes (AREA)
- Physical Vapour Deposition (AREA)
Description
上側の外周部分を受け入れるように構成されている。
(態様1)
基板を搬送するように構成された搬送システム内に含まれている支持体上に前記基板を保持するための方法であって、
材料が合成剛毛材料であり、前記支持体に前記基板を取り付けるように構成された、接着剤を前記支持体に取り付けること、及び
前記接着剤を前記基板に取り付けることを含む、方法。
(態様2)
前記接着剤が、前記支持体に取り付けられる前に前記基板に取り付けられる、態様1に記載の方法。
(態様3)
前記接着剤が、前記基板に取り付けられる前に前記支持体に取り付けられる、態様1に記載の方法。
(態様4)
前記基板の厚さが、約0.3mm以下、特に、0.2mm以下、例えば、0.1mmであり、且つ/又は、前記基板が、1.4m 2 以上、特に、4m 2 以上のサイズを有する、態様1から3のいずれか一項に記載の方法。
(態様5)
前記接着剤が、前記基板の裏側表面である前記基板の第1の表面と接触するように構成されている、態様1から4のいずれか一項に記載の方法。
(態様6)
前記接着剤が無機物である、態様1から5のいずれか一項に記載の方法。
(態様7)
前記接着剤の微細構造が、カーボンナノチューブを含む、態様1から6のいずれか一項に記載の方法。
(態様8)
前記接着剤の貯蔵弾性率G’が、600°Cまで、特に、500°Cまで実質的に一定であり、前記貯蔵弾性率が、近似的に80〜120Pa、特に、105Paである、態様1から7のいずれか一項に記載の方法。
(態様9)
前記接着剤の損失係数が、600°Cまで、特に、500°Cまでの温度範囲で実質的に一定であり、前記損失係数が、近似的に0.01〜0.1、特に、0.05である、態様1から8のいずれか一項に記載の方法。
(態様10)
支持本体と接着剤とを備えた支持体であって、前記接着剤の材料が合成剛毛材料であり、前記接着剤が基板に前記支持本体を取り付けるように構成され、前記支持体が前記基板を搬送するように構成された搬送システム内に含まれている、支持体。
(態様11)
前記支持本体がキャリア本体であり、前記キャリア本体が開孔を有するフレームである、態様10に記載の支持体。
(態様12)
前記支持本体が、前記基板の上側を保持するように構成された棒である、態様10に記載の支持体。
(態様13)
前記支持体が、前記基板の位置を固定させるように構成された少なくとも1つの配置要素、特に、少なくとも1つの誘導要素を更に備える、態様10から12のいずれか一項に記載の支持体。
(態様14)
接着剤を備えた基板であって、前記接着剤の材料が合成剛毛材料であり、前記接着剤が、前記基板を搬送するように構成された搬送システム内に含まれている支持体に前記基板を取り付けるように構成されている、基板。
(態様15)
前記基板の厚さが、約0.3mm以下、特に、0.2mm以下、例えば、0.1mmであり、且つ/又は、前記基板が、1.4m 2 以上、特に、4m 2 以上のサイズを有する、態様14に記載の基板。
Claims (15)
- 本質的に垂直配向された大面積基板の処理のために構成された支持体上に基板を保持するための方法であって、前記基板は1.4m 2 以上のサイズを有し、前記支持体は前記基板を搬送するように構成された搬送システム内に含まれており、前記方法は、
材料が合成剛毛材料であり、前記支持体に前記基板を取り付けるように構成された接着剤を前記支持体に取り付けること、
前記接着剤を前記基板に取り付けること、及び
本質的に垂直配向にある前記基板を処理すること
を含む、方法。 - 前記接着剤が、前記支持体に取り付けられる前に前記基板に取り付けられる、請求項1に記載の方法。
- 前記接着剤が、前記基板に取り付けられる前に前記支持体に取り付けられる、請求項1に記載の方法。
- 前記基板の厚さが、約0.3mm以下である、請求項1から3のいずれか一項に記載の方法。
- 前記基板が、4m 2 以上のサイズを有する、請求項1から4のいずれか一項に記載の方法。
- 前記接着剤が、前記基板の裏側表面である前記基板の第1の表面と接触するように構成されている、請求項1から5のいずれか一項に記載の方法。
- 前記接着剤が無機物である、請求項1から6のいずれか一項に記載の方法。
- 前記接着剤の微細構造が、カーボンナノチューブを含む、請求項1から7のいずれか一項に記載の方法。
- 前記接着剤の貯蔵弾性率G’が、500°Cまで実質的に一定であり、前記貯蔵弾性率が、近似的に80〜120Paである、請求項1から8のいずれか一項に記載の方法。
- 本質的に垂直配向された大面積基板の処理のために構成され、支持本体と接着剤とを備えた支持体であって、前記接着剤の材料が合成剛毛材料であり、前記接着剤が1.4m 2 以上のサイズを有する基板に前記支持本体を取り付けるように構成される、支持体。
- 前記支持本体がキャリア本体であり、前記キャリア本体が開孔を有するフレームである、請求項10に記載の支持体。
- 前記支持本体が、前記基板の上側を保持するように構成された棒である、請求項10に記載の支持体。
- 前記支持体が、前記基板の位置を固定させるように構成された少なくとも1つの配置要素を更に備える、請求項10から12のいずれか一項に記載の支持体。
- 接着剤を備え、1.4m 2 以上のサイズを有する基板であって、前記接着剤の材料が合成剛毛材料であり、前記接着剤が、本質的に垂直配向された大面積基板の処理のために構成された支持体に前記基板を取り付けるように構成される、基板。
- 前記基板の厚さが、約0.3mm以下であり、且つ/又は、前記基板が4m2以上のサイズを有する、請求項14に記載の基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/EP2015/060235 WO2016180449A1 (en) | 2015-05-08 | 2015-05-08 | Methods and supports for holding substrates |
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JP2018523009A JP2018523009A (ja) | 2018-08-16 |
JP6549731B2 true JP6549731B2 (ja) | 2019-07-24 |
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US (1) | US10807207B2 (ja) |
EP (1) | EP3294921B1 (ja) |
JP (1) | JP6549731B2 (ja) |
KR (1) | KR102047020B1 (ja) |
CN (1) | CN107873062B (ja) |
WO (1) | WO2016180449A1 (ja) |
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WO2018103852A1 (en) * | 2016-12-08 | 2018-06-14 | Applied Materials, Inc. | Holding arrangement for holding a substrate, carrier including the holding arrangement, method for holding a substrate, and method for releasing a substrate |
JP2020505513A (ja) * | 2017-01-23 | 2020-02-20 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板のためのホルダ |
CN110656316B (zh) * | 2019-10-31 | 2021-11-09 | 中山凯旋真空科技股份有限公司 | 夹具及具有其的镀膜设备 |
DE102021002293A1 (de) * | 2021-04-30 | 2022-11-03 | Singulus Technologies Aktiengesellschaft | Substratträger mit Zentrierfunktion |
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JP2006274301A (ja) | 2005-03-28 | 2006-10-12 | Optrex Corp | 蒸着方法 |
JP5035499B2 (ja) * | 2005-12-13 | 2012-09-26 | 大日本印刷株式会社 | スパッタ装置および基板搬送用キャリア |
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US10807207B2 (en) | 2020-10-20 |
CN107873062B (zh) | 2020-10-30 |
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