CN108060403B - 氮铝化钛薄膜及其制备方法 - Google Patents
氮铝化钛薄膜及其制备方法 Download PDFInfo
- Publication number
- CN108060403B CN108060403B CN201711402344.5A CN201711402344A CN108060403B CN 108060403 B CN108060403 B CN 108060403B CN 201711402344 A CN201711402344 A CN 201711402344A CN 108060403 B CN108060403 B CN 108060403B
- Authority
- CN
- China
- Prior art keywords
- aluminum nitride
- titanium aluminum
- target
- diffusion layer
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 238000002360 preparation method Methods 0.000 title abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 89
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 87
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 70
- 238000009792 diffusion process Methods 0.000 claims description 46
- 239000010936 titanium Substances 0.000 claims description 42
- 238000005546 reactive sputtering Methods 0.000 claims description 40
- 229910052757 nitrogen Inorganic materials 0.000 claims description 38
- 229910052786 argon Inorganic materials 0.000 claims description 35
- 239000007789 gas Substances 0.000 claims description 31
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 29
- 238000004544 sputter deposition Methods 0.000 claims description 26
- 239000001257 hydrogen Substances 0.000 claims description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims description 20
- 239000012298 atmosphere Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 239000010409 thin film Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000012300 argon atmosphere Substances 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 54
- 230000007547 defect Effects 0.000 abstract description 34
- 238000000576 coating method Methods 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 abstract description 10
- 239000003344 environmental pollutant Substances 0.000 abstract description 7
- 231100000719 pollutant Toxicity 0.000 abstract description 7
- 239000002245 particle Substances 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 description 53
- 239000000356 contaminant Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 12
- 229910001873 dinitrogen Inorganic materials 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 6
- 210000002381 plasma Anatomy 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 229910010037 TiAlN Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- GJNGXPDXRVXSEH-UHFFFAOYSA-N 4-chlorobenzonitrile Chemical compound ClC1=CC=C(C#N)C=C1 GJNGXPDXRVXSEH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711402344.5A CN108060403B (zh) | 2017-12-22 | 2017-12-22 | 氮铝化钛薄膜及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711402344.5A CN108060403B (zh) | 2017-12-22 | 2017-12-22 | 氮铝化钛薄膜及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108060403A CN108060403A (zh) | 2018-05-22 |
CN108060403B true CN108060403B (zh) | 2020-09-01 |
Family
ID=62139998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711402344.5A Active CN108060403B (zh) | 2017-12-22 | 2017-12-22 | 氮铝化钛薄膜及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN108060403B (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008021912A1 (de) * | 2008-05-01 | 2009-11-05 | Cemecon Ag | Beschichtungsverfahren und Vorrichtung zum Beschichten |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1962926A (zh) * | 2005-11-08 | 2007-05-16 | 中国科学院金属研究所 | 一种金属材料防护方法之二 |
CN102345099B (zh) * | 2011-09-15 | 2014-02-05 | 西北工业大学 | 一种汽轮机叶片材料表面多层抗点蚀涂层的制备方法 |
CN102321873A (zh) * | 2011-10-14 | 2012-01-18 | 成都名钨科技有限责任公司 | 一种TiAlN涂层硬质合金刀片 |
KR101823893B1 (ko) * | 2012-10-04 | 2018-01-31 | 현대자동차주식회사 | 엔진 배기계 부품용 코팅재 및 이의 제조방법 |
CN103234293B (zh) * | 2013-04-27 | 2015-05-13 | 江苏夏博士节能工程股份有限公司 | 耐高温太阳能选择性吸收镀层及其制备方法 |
CN103469154B (zh) * | 2013-09-05 | 2016-01-20 | 江西稀有稀土金属钨业集团有限公司 | 一种TiAlN复合涂层及其设有该涂层的刀具的制备方法 |
CN103726026B (zh) * | 2014-01-10 | 2016-03-02 | 中国科学院长春光学精密机械与物理研究所 | 采用氧化物陶瓷靶磁控溅射制备薄膜的方法 |
-
2017
- 2017-12-22 CN CN201711402344.5A patent/CN108060403B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008021912A1 (de) * | 2008-05-01 | 2009-11-05 | Cemecon Ag | Beschichtungsverfahren und Vorrichtung zum Beschichten |
Also Published As
Publication number | Publication date |
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CN108060403A (zh) | 2018-05-22 |
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PB01 | Publication | ||
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Effective date of registration: 20190606 Address after: 324000 No. 1-98, 11 A, 11 Garden East Avenue, Kecheng District, Quzhou, Zhejiang. Applicant after: QUZHOU LIANGZHI TECHNOLOGY CO.,LTD. Address before: 324000 No. 28, Zhou Jiashan village, hang Bu Town, Kecheng District, Quzhou, Zhejiang Applicant before: Jiang Yuxian |
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Effective date of registration: 20230710 Address after: Room 521, 5th Floor, Building 6, Yard 49, Badachu Road, Shijingshan District, Beijing 100043 Patentee after: Beijing Zhiyuan chuangtong Information Technology Co.,Ltd. Address before: 324000 No. 1-98, 11 A, 11 Garden East Avenue, Kecheng District, Quzhou, Zhejiang. Patentee before: QUZHOU LIANGZHI TECHNOLOGY CO.,LTD. |
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Effective date of registration: 20240316 Address after: 324000 No. 1-98, 11A Block, 258 Garden East Avenue, Kecheng District, Quzhou City, Zhejiang Province Patentee after: QUZHOU LIANGZHI TECHNOLOGY CO.,LTD. Country or region after: China Address before: Room 521, 5th Floor, Building 6, Yard 49, Badachu Road, Shijingshan District, Beijing 100043 Patentee before: Beijing Zhiyuan chuangtong Information Technology Co.,Ltd. Country or region before: China |