CN108040150A - Input and output module and electronic device - Google Patents
Input and output module and electronic device Download PDFInfo
- Publication number
- CN108040150A CN108040150A CN201711437272.8A CN201711437272A CN108040150A CN 108040150 A CN108040150 A CN 108040150A CN 201711437272 A CN201711437272 A CN 201711437272A CN 108040150 A CN108040150 A CN 108040150A
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- Prior art keywords
- light
- infrared
- infrared lamp
- casing
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
Abstract
Electronic device disclosed by the invention and input and output module include encapsulating housing, infrared lamp, light-guide device, structured light projector, and proximity sensor, encapsulating housing includes package substrate, infrared lamp, light-guide device, structured light projector and proximity sensor are encapsulated in encapsulating housing, infrared lamp, structured light projector and proximity sensor are carried on package substrate, light-guide device can be movably arranged in the luminous light path of infrared lamp, when light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as infrared light compensating lamp or close to infrared lamp with the first field angle from encapsulating housing；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as close to infrared lamp or infrared light compensating lamp with the second field angle from encapsulating housing；Proximity sensor is used to receive the infrared light that is reflected by the object to detect the distance of object.The integrated level of input and output module is higher, small volume.
Description
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of input and output module and electronics dress
Put.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set
It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of input and output module and electronic device.
The input and output module of embodiment of the present invention includes encapsulating housing, infrared lamp, light-guide device, project structured light
Device and proximity sensor, the encapsulating housing include package substrate, and the infrared lamp, the light-guide device, the structure light are thrown
Emitter and the proximity sensor are encapsulated in the encapsulating housing, the infrared lamp, the structured light projector and described
Proximity sensor carries on the package substrate, and the light-guide device can be movably arranged at the luminous light of the infrared lamp
Lu Shang, when the light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the
One field angle is emitted using as infrared light compensating lamp or close to infrared lamp from the encapsulating housing；Described in being left when the light-guide device
When in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting with the second field angle from the encapsulating housing be emitted with
As close to infrared lamp or infrared light compensating lamp；The proximity sensor is used to receive the infrared light that is reflected by the object to detect thing
The distance of body.
In some embodiments, the light-guide device includes convex lens or the lens group with positive light coke, when described
When light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from institute
Encapsulating housing outgoing is stated using as close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute
The infrared light for stating infrared lamp transmitting is emitted to be used as infrared light compensating lamp with the second field angle from the encapsulating housing；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is positioned at described red
When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the first field angle from the encapsulating housing
For infrared light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp is launched infrared
Light is emitted using as close to infrared lamp with the second field angle from the encapsulating housing.
In some embodiments, the input and output module further includes chip, the infrared lamp, the project structured light
Device and the proximity sensor are respectively formed on the chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, formed with infrared at the top of the encapsulation
Light window, structure light window and close receipts light window, the infrared light window is corresponding with the infrared lamp, the structure light window
It is corresponding with the structured light projector, it is described corresponding with the proximity sensor close to light window is received.
In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide
Baffle is respectively positioned in the encapsulating housing, and multiple metal shutters are separately positioned on the infrared lamp, the structure light is thrown
In emitter and the proximity sensor it is any between the two.
The electronic device of embodiment of the present invention includes：
Casing；With
Input and output module described in above-mentioned any one embodiment, the input and output module are arranged on the casing
It is interior.
In some embodiments, the electronic device further includes the cover board of printing opacity, and it is infrared that the casing offers casing
Through hole, casing structure light through hole and casing are close to light through hole is received, and the infrared lamp is corresponding with the infrared through hole of the casing, the knot
Structure light projector is corresponding with the casing structure light through hole, and the proximity sensor is corresponding close to light through hole is received with the casing,
The cover board is set on the housing.
In some embodiments, the cover board and the surface that the casing is combined are formed with only transmitting the infrared of infrared light
Through ink, the infrared transmission ink blocks the infrared through hole of the casing, the casing structure light through hole and the casing and connects
It is at least one in nearly receipts light through hole.
In some embodiments, the electronic device further includes optical flame detector and imaging modules, and the imaging modules include
Microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include being located at institute
The mounting surface between lens barrel and described image sensor is stated, the optical flame detector is arranged on the mounting surface.
In some embodiments, the electronic device further includes imaging modules and optical flame detector, the imaging modules installation
On the housing, the imaging modules include camera case and camera lens module, the top surface of the camera case for cascaded surface simultaneously
Including connected the first sub- top surface and the second sub- top surface, the relatively described first sub- top surface inclination of the second sub- top surface and with it is described
First sub- top surface forms notch, and the top surface offers light extraction through hole, and the camera lens module is housed in the camera case simultaneously
Corresponding with the light extraction through hole, the optical flame detector is arranged at the described first sub- top surface.
In some embodiments, the electronic device further includes imaging modules and optical flame detector, and the imaging modules include
Camera case and two camera lens modules, offer notch to form step-like top surface on the top surface of the camera case, described
Top surface includes the first tread and the second tread less than first tread, and offering two light extractions on first tread leads to
Hole, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged at second tread.
In some embodiments, the electronic device further includes optical flame detector and imaging modules, the imaging modules installation
In the casing, the imaging modules include microscope base, the lens barrel on the microscope base and part and are arranged on the microscope base
Interior substrate, the optical flame detector are set on the substrate.
In the electronic device of embodiment of the present invention, pass through the position of mobile light-guide device so that infrared lamp can be used as connecing
Near-infrared lamp or infrared light compensating lamp, integrated structure light projector and proximity sensor, the transmitting of input and output module group are infrared
Light is with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, and therefore, the integrated level of input and output module is higher, small volume,
Input and output module has saved the space for the function of realizing infrared distance measurement, infrared light filling and three-dimensional imaging.Further, since structure light
The projector, proximity sensor and infrared lamp are carried on a package substrate, and structured light projector compared to traditional handicraft, connect
Nearly sensor, the envelope for needing to be respectively adopted in different wafer manufacture recombinants to PCB substrate close to infrared lamp, infrared light compensating lamp
Dress, improves packaging efficiency.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the schematic perspective view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 3 is the view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 4 is the view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 5 and Fig. 6 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Fig. 7 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Fig. 8 is the optical flame detector of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules；
Fig. 9 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 10 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Figure 11 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 12 to Figure 14 is the partial sectional schematic view of the electronic device of embodiment of the present invention；With
Figure 15 to Figure 22 is the optical flame detector of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes input and output module 10, optical flame detector 50 (such as Fig. 8), imaging modules 60 (such as Fig. 8) and receiver 70.Electronics fills
It can be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine etc. to put 100, the embodiment of the present invention with
Electronic device 100 is illustrated exemplified by mobile phone, it will be understood that the concrete form of electronic device 100 can be other, herein not
It is restricted.
Refer to Fig. 2 and Fig. 5, input and output module 10 is single package body structure, including encapsulating housing 11, infrared lamp 12,
Light-guide device 13, structured light projector 14 and proximity sensor 1b.
Encapsulating housing 11 is used to encapsulate infrared lamp 12, light-guide device 13, structured light projector 14 and proximity sensor at the same time
1b, in other words, infrared lamp 12, light-guide device 13, structured light projector 14 and proximity sensor 1b are encapsulated in encapsulating housing at the same time
In 11.Encapsulating housing 11 includes package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electricity
Magnetic disturbance (Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to defeated
Enter to export module 10 to have an impact.In present embodiment, the center of structured light projector 14, the center of infrared lamp 12 and close
The center of sensor 1b is located on same line segment, such as：Structured light projector 14, red is followed successively by along one end of line segment to the other end
Outer lamp 12 and proximity sensor 1b；Alternatively, along one end of line segment to the other end be followed successively by infrared lamp 12, structured light projector 14 and
Proximity sensor 1b；Alternatively, it is followed successively by infrared lamp 12, proximity sensor 1b and project structured light along one end of line segment to the other end
Device 14.In other embodiments, the line of centres of structured light projector 14, infrared lamp 12 and proximity sensor 1b is in triangle
Shape.
Package substrate 111 is used to carry infrared lamp 12, structured light projector 14 and proximity sensor 1b.It is defeated in manufacture input
When going out module 10, infrared lamp 12, structured light projector 14 and proximity sensor 1b can be formed on chip 15, then by infrared lamp
12nd, structured light projector 14, proximity sensor 1b and chip 15 are set along on package substrate 111, specifically, can be by core
Piece 15 is bonded on package substrate 111.Meanwhile package substrate 111 can be used for other parts with electronic device 100
(such as the casing 20 of electronic device 100, mainboard etc.) connects, and input and output module 10 is fixed in electronic device 100.
Package wall 112 can be set around infrared lamp 12, light-guide device 13, structured light projector 14 and proximity sensor 1b
Put, package wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package-side
Wall 112 and package substrate 111 are detachably connected, in order to remove after package wall 112 to infrared lamp 12, light-guide device
13rd, structured light projector 14 and proximity sensor 1b are overhauled.The making material of package wall 112 can be impermeable infrared light
Material, pass through package wall 112 to avoid the infrared light that infrared lamp 12 or structured light projector 14 are sent.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
Formed with infrared light window 1131, structure light window 1132 and close receipts light window 1133, infrared light window 1131 and infrared lamp
12 correspond to, and the infrared light that infrared lamp 12 is launched is pierced by from infrared light window 1131；Structure light window 1132 and structured light projector
14 correspond to, and the structure light (infrared light) that structured light projector 14 is launched is pierced by from structure light window 1132；Close to receipts light window
1133 is corresponding with proximity sensor 1b, and the infrared light being reflected by the object can be passed through close to receipts light window 1133 and incided close
On sensor 1b.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split shape to obtain.At one
In example, infrared light window 1131, structure light window 1132 and close light window 1133 of receiving are through hole, encapsulation top 113
Making material is the material of impermeable infrared light.In another example, encapsulation top 113 by impermeable infrared light material and thoroughly it is infrared
The material co-manufactured of light forms, specifically, infrared light window 1131, structure light window 1132 and close to receive light window 1133 by
The material of saturating infrared light is made, remaining position is made of the material of impermeable infrared light, further, infrared light window 1131, knot
Structure light window 1132 and close light window 1133 of receiving could be formed with lens arrangement, to improve from infrared light window 1131 and structure
The infrared light emission angle that light window 1132 projects, such as structure light window 1132 are tied formed with concavees lens structure so as to pass through
The divergence of beam of structure light window 1132 outwards projects；Infrared light window 1131 is formed with convex lens structures, so as to pass through infrared light
The light of window 1131 gathers outside injection；Can also be formed with lens arrangement, to improve from close close to light window 1133 is received
The incident infrared light emission angle of light window 1133 is received, such as close to light window 1133 is received formed with convex lens structures 1c (such as Fig. 5
It is shown) so that by gathering close to the light for receiving the incidence of light window 1133 and projecting on proximity sensor 1b.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are referred to, input is defeated
Go out module 10 and further include actuator 17, actuator 17 is used to drive light-guide device 13 to move so as to being movably arranged at infrared lamp
In 12 luminous light path.Wherein, actuator 17 drives light-guide device 13 to move so as to being movably arranged at the hair of infrared lamp 12
Include in light light path：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared benefit
Light lamp (or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives leaded light
Element 13 is moved to leave the luminous light path of infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in infrared lamp 12
In the light path that shines, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), (or is connect when infrared lamp 12 is used as infrared light compensating lamp
Near-infrared lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified
In package wall 112, mover 174 is connected with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member
Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor
Including stator 172 and mover 174, stator 172 is installed in package wall 112, input and output module 10 further include shaft 18 and
Linking arm 19, the first end connection light-guide device 13 of linking arm 19, the of the remote light-guide device 13 of mover 174 and linking arm 19
Two ends connect, and linking arm 19 is set in shaft 18, shaft 18 between light-guide device 13 and mover 174, linear motor
Mover 174 is drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, thus, the first end of linking arm 19
Light-guide device 13 is driven to be rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or away from red
The luminous light path of outer lamp 12.In an embodiment of the present invention, input and output module 10 can also include loading plate (not shown), hold
Bearing holes are offered on support plate, light-guide device 13 is installed in bearing holes, and actuator 17 is used to drive loading plate movement to drive
Light-guide device 13 moves.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red
Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field
Angle is emitted so that as infrared light compensating lamp, at this time, the first field angle is less than the second field angle from encapsulating housing 11, wherein, first regards
The scope of rink corner is 10 degree of -30 degree, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field
The scope at angle for 60 degree -90 degree, for example, the second field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree,
Or 90 degree etc..Light-guide device 13 is used to converge light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through infrared light window
1131 scopes covered from the outgoing of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 to be used as infrared benefit
Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field
Angle is emitted so that as close to infrared lamp, at this time, the first field angle is more than the second field angle from encapsulating housing 11, wherein, first regards
The scope of rink corner for 60 degree -90 degree, for example, the first field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87
Degree or 90 degree etc., the scope of the second field angle is spent for 10 degree -30, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through infrared light window
1131 scopes covered from the outgoing of encapsulating housing 11.
When infrared lamp 12 is opened and launches infrared light to outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through
Infrared light window 1131 is to project body surface, and the reception (as shown in Figure 1) of infrared pick-up first 62 of electronic device 100 is by thing
The infrared light of body reflection is to obtain the image information of object (at this time, infrared lamp 12 is used for infrared light filling).When infrared lamp 12 is opened
And during as launching infrared light to outside encapsulating housing 11 close to infrared lamp, infrared light is through infrared light window 1131 and reaches thing
Body surface face, proximity sensor 1b the infrared lights (as shown in Figure 5) that be reflected by the object that receive are with detection object to electronic device 100
Distance (at this time, infrared lamp 12 is used for infrared distance measurement).
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp
Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power to outside encapsulating housing 11 launching close to during infrared lamp
Infrared light, launches infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp to outside encapsulating housing 11, wherein, the
One power can be less than the second power.
Fig. 5 and Fig. 6 are referred to, structured light projector 14 can be formed on a piece of chip 15 with infrared lamp 12, further
Reduce volume of the structured light projector 14 with infrared lamp 12 after integrated, and preparation process is simpler.Structured light projector 14 can be to
Outer transmitting structure light, structure light can form infrared laser speckle pattern, and project structured light to target object surface, is taken the photograph by infrared light
As first 62 it is (as shown in Figure 1) gathers by the modulated structured light patterns of target object, by the structured light patterns to being modulated into
Row analysis calculates the depth image for obtaining target object (at this time, structured light projector 14 is used for three-dimensional imaging).Of the invention real
Apply in example, structured light projector 14 includes light source 141, mirror holder 142, lens 143 and diffraction optical element (diffractive
optical elements,DOE)144.The light beam that light source 141 is sent is after lens 143 are collimated or converged by diffraction optical element
144 are expanded and are outwards launched with certain beam pattern.Specifically, light source 141 can be formed on chip 15,143 He of lens
Diffraction optical element 144 can be fixed on mirror holder 1422, such as is fixed on by gluing mode on mirror holder 142.
Fig. 5 and Fig. 6 are referred to, structured light projector 14, infrared lamp 12 and proximity sensor 1b can be formed in a label
On piece 15, further reduce the volume after structured light projector 14, infrared lamp 12 and proximity sensor 1b are integrated, and preparation process
It is simpler.Proximity sensor 1b is received by the infrared light being reflected by the object close to 1133 incidence of receipts light window, with judgment object
To the distance of electronic device 100, specifically, proximity sensor 1b can receive launched and be reflected by the object by infrared lamp 12 it is red
Outer light is simultaneously used for judgment object to the distance of electronic device 100.
Please refer to Fig.1 and Fig. 7, casing 20 can be as the installation carriers of input and output module 10, in other words, input and output
Module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, casing
It can be additionally used in the display screen 90 that electronic device 100 is set in 20, since the input and output module 10 of embodiment of the present invention takes
Small volume, therefore, in casing 20 be used to set the volume of display screen 90 to correspond to increase, to improve electronic device
100 screen accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on top
Between portion 21 and bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, such as
Shown in Fig. 1, input and output module 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen
90 can be that screen open up jagged comprehensively, and display screen 90 surrounds input and output module 10, and input and output module 10 is from display
The notch of screen 90 exposes.
Casing 20 is further opened with the infrared through hole 23 of casing, casing structure light through hole 24 and casing close to receipts light through hole 25.It is defeated
When entering to export module 10 and being arranged in casing 20, the through hole 23 infrared with casing of infrared lamp 12 is corresponding, structured light projector 14 and machine
Shell structure light through hole 24 corresponds to, and proximity sensor 1b is corresponding close to light through hole 25 is received with casing.Wherein infrared lamp 12 and casing is red
The correspondence of accessibke porosity 23, which refers to the light that infrared lamp 12 is sent, to be passed through from the infrared through hole 23 of casing, can be infrared lamp 12 specifically
The light that 23 face of through hole infrared with casing or infrared lamp 12 are launched is infrared logical through casing after leaded light device acts on
Hole 23.Structured light projector 14 is corresponding with casing structure light through hole 24 similarly, and therefore not to repeat here.Proximity sensor 1b and casing
Refer to the infrared light that is reflected by the object close to receiving light through hole 25 and corresponding to and can be connect from casing close to receiving light through hole 25 and pass through and incide
Can be proximity sensor 1b 25 faces of receipts light through hole close with casing or incidence specifically on nearly sensor 1b
Infrared light close to receipts light through hole 25 and is incided on proximity sensor 1b through casing after light-guide device acts on.In such as Fig. 7 institutes
In the embodiment shown, the infrared through hole 23 of casing, casing structure light through hole 24 and casing can be with each other close to light through hole 25 is received
Every.Certainly, in other embodiments, the infrared through hole 23 of casing, casing structure light through hole 24 and casing are close receives light through hole 25
In any two can also interconnect；Alternatively, the infrared through hole 23 of casing, casing structure light through hole 24 and casing approach
Receiving light through hole 25 can also interconnect.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set
Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated
Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 7
Apply in example, cover board 30 covers the infrared through hole 23 of casing, casing structure light through hole 24 and the close receipts light through hole 25 of casing, cover board 30
It is infrared to have higher transmitance to infrared light through ink 40 such as reachable coated with infrared through ink 40 on inner surface 32
To 85% or more, and there is higher attenuation rate to visible ray, such as can reach more than 70% so that user is in normal use
In, visually it is difficult to see that on electronic device 100 by the infrared region covered through ink 40.Specifically, it is infrared to pass through ink 40
Can cover on inner surface 32 not with 90 corresponding region of display screen.
It is infrared to block the infrared through hole 23 of casing, casing structure light through hole 24 and casing close to receipts light through ink 40
It is at least one in through hole 25, i.e. infrared to block the infrared through hole 23 of casing, casing structure light through hole at the same time through ink 40
24 and casing close to light through hole 25 (as shown in Figure 7) is received, user is difficult to by the infrared through hole 23 of casing and casing structure light through hole
24 see the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful.It is infrared to be covered through ink 40
The infrared through hole 23 of casing, and casing structure light through hole 24 and casing are not covered close to receipts light through hole 25；Or infrared pass through ink
40 can also cover casing structure light through hole 24, and not cover the infrared through hole 23 of casing and casing close to receipts light through hole 25；Or
It is infrared to cover casing close to receipts light through hole 25 through ink 40, and the infrared through hole 23 of casing and casing structure light are not covered
Through hole 24；Or the infrared ink 40 that passes through can also cover casing structure light through hole 24 and casing close to receipts light through hole 25, and not
Cover the infrared through hole 23 of casing；Or the infrared ink 40 that passes through can also cover casing structure light through hole 24 and the infrared through hole of casing
23, and casing is not covered close to receipts light through hole 25；Or the infrared ink 40 that passes through can also cover casing close to receipts light through hole 25
Through hole 23 infrared with casing, and casing structure light through hole 24 is not covered.
Referring to Fig. 8, optical flame detector 50 is single package body structure.Optical flame detector 50 receives the visible ray in ambient light, and detects
The intensity of visible ray, using the foundation of the display brightness as control display screen 90.
Please refer to Fig.1 and Fig. 8, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is installed on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In the embodiment shown in fig. 8, optical flame detector 50 is arranged on mounting surface 631, and specifically, optical flame detector 50 is in mounting surface 631
The plane orthographic projection at place is at least partly dropped on mounting surface 631, in this way, optical flame detector 50 sets tighter with imaging modules 60
Gather, the horizontal space that the two takes jointly is smaller.
Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by
Words device 70 is conversed.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated
The center for entering to export module 10, infrared pick-up first 62, visible image capturing first 61 and receiver 70 is located on same line segment.Specifically
Ground, input and output module 10, visible image capturing first 61 is followed successively by from one end of line segment to the other end, receiver 70, infrared light are taken the photograph
As first 62 (as shown in Figure 9)；Or from one end of line segment to the other end be followed successively by input and output module 10, receiver 70,
Light video camera head 61, infrared pick-up first 62 (as shown in Figure 1), at this time, it is seen that light video camera head 61 and infrared pick-up first 62 can be with
The double photography/videography heads (as shown in figure 19) of composition；Or it is followed successively by that infrared pick-up is first 62, input from one end of line segment to the other end
Export module 10, receiver 70, visible image capturing first 61.Certainly, input and output module 10, infrared pick-up be first 62, receiver
70 and the arrangement mode of visible image capturing first 61 be not limited to above-mentioned citing, can also have other, such as each electronic component
The shapes such as center arrangement is in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Fig. 8, optical flame detector 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, also may be used
To be arranged on the mounting surface 631 of visible image capturing first 61, certainly, optical flame detector 50 can not also be arranged on mounting surface 631, example
Such as, optical flame detector 50 can be disposed adjacent with input input and output module 10, or be disposed adjacent with receiver 70, not limited herein
System.
To sum up, in the electronic device 100 of embodiment of the present invention, the position of mobile light-guide device 13 is passed through so that infrared
Lamp 12 can be used as close to infrared lamp or infrared light compensating lamp, integrated structure light projector 14 and proximity sensor 1b, input and output mould
Group 10 has gathered transmitting infrared light with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, therefore, input and output module 10
Integrated level is higher, small volume, and input and output module 10 has saved the function of realizing infrared distance measurement, infrared light filling and three-dimensional imaging
Space.Further, since structured light projector 14, proximity sensor 1b and infrared lamp 12 are carried on a package substrate 111,
Compared to the structured light projector of traditional handicraft, proximity sensor, close to infrared lamp, infrared light compensating lamp need that difference is respectively adopted
Encapsulation in wafer manufacture recombinant to PCB substrate, improves packaging efficiency.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes multiple metal shutters 16, multiple
Metal shutter 16 is respectively positioned in encapsulating housing 11, and multiple metal shutters 16 are separately positioned on infrared lamp 12, project structured light
In device 14 and proximity sensor 1b it is any between the two.As infrared lamp 12, structured light projector 14, proximity sensor 1b
When center is located on same line segment, the quantity of metal shutter 16 is two；If one end of line segment is followed successively by infrared to the other end
Lamp 12, structured light projector 14, proximity sensor 1b, two metal shutters 16 are located at structure infrared lamp 12 and structure light respectively
Between the projector 14 and between structured light projector 14 and proximity sensor 1b；If one end of line segment is followed successively by red to the other end
Outer lamp 12, proximity sensor 1b, structured light projector 14, two metal shutters 18 are respectively positioned at infrared lamp 12 and close sensing
Between device 1b and between proximity sensor 1b and structured light projector 14；If one end of line segment is followed successively by structure light to the other end
The projector 14, infrared lamp 12, proximity sensor 1b, two metal shutters 18 are located at structured light projector 14 and infrared lamp respectively
Between 12 and between infrared lamp 12 and proximity sensor 1b.Metal shutter 16 is located at structured light projector 14 and infrared lamp 12
Between, on the one hand metal shutter 16 can be tied with shielding construction light projector 14 and the mutual electromagnetic interference of infrared lamp 12
Structure light projector 14 and the luminous intensity and sequential of infrared lamp 12 will not interact, and another aspect metal shutter 16 can be used
Cavity where 14 place cavity of isolation structures light projector and infrared lamp 12, light will not enter another from a cavity
A cavity.Metal shutter 16 can avoid structured light projector between structured light projector 14 and proximity sensor 1b
The infrared light of 14 transmittings is incided on proximity sensor 1b, moreover it is possible to which shielding construction light projector 14 and proximity sensor 1b are mutual
Between electromagnetic interference.Metal shutter 16 can avoid infrared lamp 12 from sending out between infrared lamp 12 and proximity sensor 1b
The infrared light penetrated is incided on proximity sensor 1b, moreover it is possible to shields infrared lamp 12 and electromagnetism mutual proximity sensor 1b
Interference.
Referring to Fig. 10, in some embodiments, input and output module 10 further includes optics sealing cover 1a.Optics sealing cover 1a
It is made of light transmissive material, optics sealing cover 1a is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1a is wrapped up
Firmly infrared lamp 12 and proximity sensor 1b.Specifically, optics sealing cover 1a can be formed by encapsulating injection molding and forming technology, optics envelope
Cover 1a can be made of transparent thermosetting epoxy resin, and to be not easy to soften in use, optics sealing cover 1a can fix red
The position of outer lamp 12 and proximity sensor 1b, and cause infrared lamp 12 and proximity sensor 1b to be not easy to shake in encapsulating housing 11
It is dynamic.At this time, light-guide device 13 is arranged on beyond optics sealing cover 1a and is movably housed in encapsulating housing 11.
1 is please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Offer cover board sound outlet hole 35, the position correspondence of receiver 70 and cover board sound outlet hole 35 and casing sound outlet hole.Input and output module
10th, the center of infrared pick-up first 62 and visible image capturing first 61 is located on same line segment, and receiver 70 is located at the line segment and machine
Between the top 21 of shell 20.
On the line segment, each electronic component (input and output module on cover board 30 has not been saved in the center of receiver 70
10th, first 62, visible image capturing first 61 of infrared pick-up etc.) horizontal space that takes.In embodiment as shown in figure 12, cover board
Sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 12, the infrared through hole 33 of cover board, cover board can also be offered in some embodiments, on cover board 30
The infrared through hole 23 infrared with casing of through hole 33 is corresponding, and the infrared light that infrared lamp 12 is launched can be from after passing through the infrared through hole 23 of casing
Electronic device 100 is pierced by the infrared through hole 33 of cover board.At this time, can be with 24 corresponding position of casing structure light through hole on cover board 30
Infrared transmission ink 40 is set, and user is difficult to the structure light that the inside of electronic device 100 is seen by casing structure light through hole 24
The projector 14；Infrared transmission ink 40, user can also be set by approaching 25 corresponding position of receipts light through hole with casing on cover board 30
It is difficult to approach the proximity sensor 1b for receiving the inside that light through hole 25 sees electronic device 100 by casing, outside electronic device 100
Shape is more beautiful.
3 are please referred to Fig.1, covering plate structure light through hole 34, cover board knot can also be opened up in some embodiments, on cover board 30
Structure light through hole 34 is corresponding with casing structure light through hole 24, and the infrared light that structured light projector 14 is launched passes through casing structure light through hole
Electronic device 100 can be pierced by after 24 from covering plate structure light through hole 34.At this time, through hole 23 infrared with casing is corresponding on cover board 30
Position can set it is infrared pass through ink 40, user is difficult to the inside that electronic device 100 is seen by the infrared through hole 23 of casing
Light-guide device 13 and infrared lamp 12；On cover board 30 with casing close to receive 25 corresponding position of light through hole can also set it is infrared
Ink 40 is crossed, user is difficult to the proximity sensor 1b for seeing the inside of electronic device 100 close to receipts light through hole 25 by casing, electricity
The shape of sub-device 100 is more beautiful.
4 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to receipts light through hole 36, cover board
Corresponding close to receipts light through hole 25 and proximity sensor 1b with casing close to light through hole 36 is received, electronic device 100 is outer anti-by object
The infrared light penetrated can incide proximity sensor 1b through cover board close to after receiving light through hole 36 and the close receipts light through hole 25 of casing
On.At this time, infrared transmission ink 40 can be set on cover board 30 with 24 corresponding position of casing structure light through hole, and user is difficult to lead to
Cross the structured light projector 14 that casing structure light through hole 24 sees the inside of electronic device 100；It is infrared logical with casing on cover board 30
23 corresponding position of hole can also set infrared transmission ink 40, and user is difficult to see electronic device by the infrared through hole 23 of casing
The light-guide device 13 and infrared lamp 12 of 100 inside；Can also close to 25 corresponding position of receipts light through hole with casing on cover board 30
Approaching for the inside infrared through ink 40, user is difficult to see electronic device 100 close to receipts light through hole 25 by casing is set
Sensor 1b, the shape of electronic device 100 are more beautiful.
5 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, optical flame detector 50 may be also secured on substrate 66.Specifically, FPC, a part for substrate 66 are provided with substrate 66
In microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying imaging sensor
65, the other end can be connected with the mainboard of electronic device 100.When optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is arranged on
Outside microscope base 63, optical flame detector 50 can also be connected with FPC.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically,
Optical flame detector 50 can be fixed on the substrate 66 of visible image capturing first 61；Optical flame detector 50 can be fixed on infrared pick-up first 62
On substrate 66.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with optical flame detector 50, to increase base
The integral strength of plate 66 so that FPC is not susceptible to around folding, while when optical flame detector 50 is arranged on substrate 66 is not susceptible to rock.
In one example, optical flame detector 50 may be also secured on the lateral wall of microscope base 63, such as be fixed on mirror by cohesive mode
On the lateral wall of seat 63.
6 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first
Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out
Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould
Group 68 is simultaneously delivered on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Optical flame detector 50 is arranged on
At one sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing first 61, and optical flame detector 50 is single packaging body
Structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the first sub- top surface 671
On, optical flame detector 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics dress
Put the installation space in 100.
Please continue to refer to Figure 16, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the first son top
On face 671 and positioned at the outside of camera case 67, specifically, whole optical flame detector 50 is along the projection perpendicular to the first sub- top surface 671
It can be located in the first sub- top surface 671 (as shown in figure 16)；Alternatively, part optical flame detector 50 is along perpendicular to the first sub- top surface 671
Projection be located in the first sub- top surface 671.That is, optical flame detector 50 is at least part of to be located at the first sub- top surface 671 just
Top, in this way, optical flame detector 50 sets compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, further
The installation space in electronic device 100 is saved.
7 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, and optical flame detector 50 is located at phase
It is in casing body 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be delivered to light
On sensor 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67
More stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20.
8 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, base
It is provided with FPC on plate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with
The mainboard connection of electronic device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.
The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more
Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 set substrate 66 simultaneously
Optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is firmly mounted in camera case 67.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module, including two imaging sensors 65, camera case 67 and two camera lens moulds to be double
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a positioned at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be delivered on imaging sensor 65.This reality
Apply in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time
Corresponding camera lens module.Optical flame detector 50 is arranged on the second tread 678 and outside camera case 67.Optical flame detector 50 encapsulates to be single
Body structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62, and two camera lens modules 68 are at this time
First 62 corresponding camera lens module of infrared pick-up.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and
Infrared pick-up first 62, one of camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up at this time, another mirror
Head mould group 68 is first 61 corresponding camera lens module of visible image capturing.
The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the second tread 678
On, optical flame detector 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics dress
Put the installation space in 100.
Figure 20 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this time, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating optical flame detector 50 is arranged on the second tread 678
On.
9 and Figure 20 is please referred to Fig.1, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the second ladder
On face 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670, entirely
Optical flame detector 50 can be located in the second tread 678 (as shown in figure 19) along perpendicular to the projection of the second tread 678；Alternatively, portion
Light splitting sensor 50 is located in the second tread 678 along perpendicular to the projection of the second tread 678.That is, optical flame detector 50 is at least
A part is located at the surface of the second tread 678.When notch 675 is opened on the centre position of top surface 670, whole optical flame detector
50 can be located in the second tread 678 (as shown in figure 20) along perpendicular to the projection of the second tread 678.In this way, optical flame detector 50
Set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, further saves in electronic device 100
Installation space.
Figure 21 is referred to, the second tread 678 of the above embodiment offers loophole 676, and optical flame detector 50 is located at camera
It is in housing 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be delivered to light sensation
On device 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more
Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20.
Figure 22 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, imaging sensor 65
It is arranged on substrate 66, optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, substrate 66
On be provided with FPC, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with electronics
The mainboard connection of device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.
The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more
Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 set substrate 66 simultaneously
Optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (12)
1. a kind of input and output module, it is characterised in that the input and output module includes encapsulating housing, infrared lamp, guide-lighting member
Part, structured light projector and proximity sensor, the encapsulating housing include package substrate, the infrared lamp, the guide-lighting member
Part, the structured light projector and the proximity sensor are encapsulated in the encapsulating housing, the infrared lamp, the structure
On the package substrate, the light-guide device can be movably arranged at described for light projector and proximity sensor carrying
In the luminous light path of infrared lamp, when the light-guide device is located in the luminous light path of the infrared lamp, the infrared lamp transmitting
Infrared light be emitted with the first field angle from the encapsulating housing using as infrared light compensating lamp or close to infrared lamp；Led when described
When optical element is left in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the second field angle from described
Encapsulating housing outgoing is using as close to infrared lamp or infrared light compensating lamp；The proximity sensor is reflected by the object red for reception
Outer light is to detect the distance of object.
2. input and output module according to claim 1, it is characterised in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as connecing with the first field angle from the encapsulating housing
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing to be used as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as red with the first field angle from the encapsulating housing
Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. input and output module according to claim 1, it is characterised in that the input and output module further includes chip,
The infrared lamp, the structured light projector and the proximity sensor are respectively formed on the chip.
4. input and output module according to claim 3, it is characterised in that the encapsulating housing further include package wall and
Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it
Between, formed with infrared light window, structure light window and close to receiving light window at the top of the encapsulation, the infrared light window with it is described
Infrared lamp correspondence, the structure light window is corresponding with the structured light projector, described close to light window is received with described close to biography
Sensor corresponds to.
5. input and output module according to claim 3, it is characterised in that the input and output module further includes multiple gold
Belong to shutter, multiple metal shutters are respectively positioned in the encapsulating housing, and multiple metal shutters are separately positioned on
In the infrared lamp, the structured light projector and the proximity sensor it is any between the two.
A kind of 6. electronic device, it is characterised in that including：
Casing；With
Input and output module described in claim 1-5 any one, the input and output module are arranged in the casing.
7. electronic device according to claim 6, it is characterised in that the electronic device further includes the cover board of printing opacity, institute
State casing and offer the infrared through hole of casing, casing structure light through hole and casing close to receipts light through hole, the infrared lamp and the machine
The infrared through hole of shell corresponds to, and the structured light projector is corresponding with the casing structure light through hole, the proximity sensor with it is described
Casing is corresponded to close to light through hole is received, and the cover board is set on the housing.
8. electronic device according to claim 7, it is characterised in that the cover board is formed with the surface that the casing is combined
Have and only transmit the infrared of infrared light and pass through ink, it is described infrared to block the infrared through hole of the casing, the casing knot through ink
Structure light through hole and the casing are at least one in light through hole close to receiving.
9. electronic device according to claim 6, it is characterised in that the electronic device further includes optical flame detector and imaging mould
Group, the imaging modules include microscope base, the lens barrel on the microscope base and the image sensing being housed in the microscope base
Device, the microscope base include the mounting surface between the lens barrel and described image sensor, and the optical flame detector is arranged on described
Mounting surface.
10. electronic device according to claim 6, it is characterised in that the electronic device further includes imaging modules and light
Sensor, on the housing, the imaging modules include camera case and camera lens module, the camera for the imaging modules installation
The top surface of housing is for cascaded surface and the first sub- top surface and the second sub- top surface including being connected, the second sub- top surface relatively described the
One sub- top surface inclination simultaneously forms notch with the described first sub- top surface, and the top surface offers light extraction through hole, and the camera lens module is received
Appearance is in the camera case and corresponding with the light extraction through hole, and the optical flame detector is arranged at the described first sub- top surface.
11. electronic device according to claim 6, it is characterised in that the electronic device further includes imaging modules and light
Sensor, the imaging modules include camera case and two camera lens modules, offered on the top surface of the camera case notch with
Step-like top surface is formed, the top surface includes the first tread and the second tread less than first tread, first ladder
Two light extraction through holes are offered on face, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged on institute
State at the second tread.
12. electronic device according to claim 6, it is characterised in that the electronic device further includes optical flame detector and imaging
Module, the imaging modules are installed in the casing, and the imaging modules include microscope base, the lens barrel on the microscope base
The substrate being partly arranged in the microscope base, the optical flame detector are set on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437272.8A CN108040150A (en) | 2017-12-26 | 2017-12-26 | Input and output module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437272.8A CN108040150A (en) | 2017-12-26 | 2017-12-26 | Input and output module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108040150A true CN108040150A (en) | 2018-05-15 |
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ID=62101345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711437272.8A Pending CN108040150A (en) | 2017-12-26 | 2017-12-26 | Input and output module and electronic device |
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| Country | Link |
|---|---|
| CN (1) | CN108040150A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN106412159A (en) * | 2016-10-26 | 2017-02-15 | 广东欧珀移动通信有限公司 | Panel, panel assembly and terminal |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
| CN107508938A (en) * | 2017-09-06 | 2017-12-22 | 广东欧珀移动通信有限公司 | Camera module and electronic installation |
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2017
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN106412159A (en) * | 2016-10-26 | 2017-02-15 | 广东欧珀移动通信有限公司 | Panel, panel assembly and terminal |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
| CN107508938A (en) * | 2017-09-06 | 2017-12-22 | 广东欧珀移动通信有限公司 | Camera module and electronic installation |
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Application publication date: 20180515 |