CN108028098A - 直流电缆、组合物以及直流电缆的制造方法 - Google Patents
直流电缆、组合物以及直流电缆的制造方法 Download PDFInfo
- Publication number
- CN108028098A CN108028098A CN201580082234.8A CN201580082234A CN108028098A CN 108028098 A CN108028098 A CN 108028098A CN 201580082234 A CN201580082234 A CN 201580082234A CN 108028098 A CN108028098 A CN 108028098A
- Authority
- CN
- China
- Prior art keywords
- inorganic filler
- powder
- base resin
- direct current
- polyethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
- B29C48/154—Coating solid articles, i.e. non-hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/78—Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/375—Thiols containing six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/14—Insulating conductors or cables by extrusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/006—Other inhomogeneous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/307—Other macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0275—Disposition of insulation comprising one or more extruded layers of insulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/04—Polymers of ethylene
- B29K2023/06—PE, i.e. polyethylene
- B29K2023/0608—PE, i.e. polyethylene characterised by its density
- B29K2023/0633—LDPE, i.e. low density polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/04—Polymers of ethylene
- B29K2023/06—PE, i.e. polyethylene
- B29K2023/0691—PEX, i.e. crosslinked polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2096/00—Use of specified macromolecular materials not provided for in a single one of main groups B29K2001/00 - B29K2095/00, as moulding material
- B29K2096/02—Graft polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2507/00—Use of elements other than metals as filler
- B29K2507/04—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0007—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3462—Cables
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/066—LDPE (radical process)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
Abstract
本发明的实施方案为导电部的外周覆盖有绝缘层的直流电缆,其中所述绝缘层含有交联的基础树脂和无机填料,所述基础树脂含有聚乙烯,所述无机填料的BET比表面积为5m2/g以上,并且所述无机填料的体积平均直径为5μm以下,所述无机填料相对于所述基础树脂的质量比为0.001以上0.05以下,并且所述交联的基础树脂中的交联是通过包含有机过氧化物的交联剂实现的。
Description
技术领域
本发明的实施方案涉及一种直流电缆、组合物和直流电缆的制造方法。
背景技术
交联聚乙烯电缆被广泛用作交流电缆,该交联聚乙烯电缆各自在覆盖导电部的外周的绝缘层中包含交联聚乙烯。
当交联聚乙烯时,使用诸如过氧化二枯基之类的有机过氧化物。
然而,当将交联聚乙烯电缆用作直流电缆时,由于交联剂的分解残余物,使得绝缘层的体积电阻率可能会降低,空间电荷的积聚可能会增加,并且空间电荷特性可能会降低。
因此,已知形成含有氧化镁或炭黑作为无机填料的绝缘层的方法(例如,参见专利文献1和2)。
[专利文献]
专利文献1:日本特开专利公开No.2014-218617
专利文献2:日本特开专利公开No.2015-883
发明内容
然而,人们希望提高绝缘层抵抗所施加的直流电压的长期绝缘性能。
鉴于上述问题而完成本发明,因此,本发明提供了一种直流电缆,其中绝缘层抵抗所施加的直流电压的长期绝缘性能以及绝缘层的空间电荷特性是优良的。
根据实施方案,提供了一种直流电缆,其包括:导电部;和覆盖所述导电部的外周的绝缘层,所述绝缘层含有交联的基础树脂和无机填料,所述基础树脂含有聚乙烯,所述无机填料的BET比表面积为5m2/g以上,并且所述无机填料的体积平均直径为5μm以下,所述无机填料相对于所述基础树脂的质量比为0.001以上0.05以下,并且所述交联的基础树脂是通过包含有机过氧化物的交联剂进行交联的。
根据实施方案,提供了一种组合物,其包含:基础树脂、无机填料和交联剂,所述基础树脂含有聚乙烯,所述无机填料的BET比表面积为5m2/g以上,并且所述无机填料的体积平均直径为5μm以下,所述无机填料相对于所述基础树脂的质量比为0.001以上0.05以下,并且所述交联剂包含有机过氧化物。
根据实施方案,可以提供这样一种直流电缆,其中绝缘层抵抗所施加的直流电压的长期绝缘性能以及绝缘层的空间电荷特性是良好的。
附图说明
图1示出了直流电缆的实例的截面图。
具体实施方式
下面,参照附图对实施方案进行描述。
图1示出了直流电缆的实例。图1是与直流电缆1的轴向垂直的截面图。
在直流电缆1中,导电部10的外周被绝缘层20覆盖。此外,在直流电缆1中,在导电部10和绝缘层20之间形成内部半导电层11。此外,在直流电缆1中,绝缘层20的外周由屏蔽层30覆盖,并且屏蔽层30的外周由覆层40覆盖。另外,在直流电缆1中,在绝缘层20和屏蔽层30之间形成有外部半导电层21。
导电部10是通过扭绞多根导电芯线而形成的。
作为构成导电芯线的材料,尽管没有特别的限制,但是可以使用铜、铝、铜合金、铝合金等。
作为构成内部半导电层11的材料,尽管没有特别的限制,但是可以使用乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-丙烯酸丁酯共聚物等。
绝缘层20含有交联的基础树脂和无机填料。
基础树脂含有聚乙烯。
聚乙烯可以是低密度、中密度和高密度中的任意一者。此外,聚乙烯可以是直链和支链中的任意一者。
交联的基础树脂是通过含有机过氧化物的交联剂进行交联的。
虽然对有机过氧化物没有特别的限制,但是可以使用过氧化二枯基、2,5-二甲基-2,5-双(叔丁基过氧)己烷、1,3-双(叔丁基过氧异丙基)苯等。
基础树脂还可以含有乙烯和极性单体的共聚物或聚乙烯-接枝-马来酸酐。由此,可以提高绝缘层20的抵抗所施加的直流电压的长期绝缘性能和绝缘层20的空间电荷特性。
作为极性单体,尽管没有特别的限制,但是可以使用丙烯酸乙酯、甲基丙烯酸酯、丙烯酸丁酯、甲基丙烯酸缩水甘油酯等,并且可以将上述两种以上组合使用。
乙烯和极性单体的共聚物或聚乙烯-接枝-马来酸酐与聚乙烯的质量比通常为1/9以下,优选为5/95以下。由此,可以提高绝缘层20抵抗所施加的直流电压的长期绝缘性能。乙烯和极性单体的共聚物或聚乙烯-接枝-马来酸酐与聚乙烯的质量比通常为0.01以上。
无机填料的BET比表面积为5m2/g以上,优选为20m2/g以上。如果无机填料的BET比表面积小于5m2/g,则绝缘层20抵抗所施加的直流电压的长期绝缘性能和绝缘层20的空间电荷特性降低。此处,无机填料的BET比表面积通常为100m2/g以下。
无机填料的体积平均直径为5μm以下,优选为2μm以下。如果无机填料的体积平均直径超过5μm,则绝缘层20抵抗所施加的直流电压的长期绝缘性能和绝缘层20的空间电荷特性降低。无机填料的体积平均直径通常为0.5μm以上。
无机填料相对于基础树脂的质量比为0.001至0.05,优选为0.005至0.03。如果无机填料相对于基础树脂的质量比小于0.001或超过0.05,则绝缘层20抵抗所施加的直流电压的长期绝缘性能和绝缘层20的空间电荷特性降低。
作为无机填料,虽然没有特别的限制,但可以使用氧化镁粉末、氧化铝粉末、二氧化硅粉末、硅酸镁粉末、硅酸铝粉末、炭黑等,也可以将上述两种以上组合使用。
可以对氧化镁粉末、氧化铝粉末、二氧化硅粉末、硅酸镁粉末和硅酸铝粉末中的每一种进行使用硅烷偶联剂的表面处理。由此,可以提高绝缘层20抵抗所施加的直流电压的长期绝缘性能和绝缘层20的空间电荷特性。
作为硅烷偶联剂,尽管没有特别的限制,但是可以使用乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、2-(3,4-环氧基环己基)乙基三甲氧基硅烷、3-缩水甘油醚氧基丙基甲基二甲氧基硅烷、3-缩水甘油醚氧基丙基三甲氧基硅烷、3-缩水甘油醚氧基丙基甲基二乙氧基硅烷、3-缩水甘油醚氧基丙基三乙氧基硅烷、3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基甲基二乙氧基硅烷、3-甲基丙烯酰氧基丙基三乙氧基硅烷、3-丙烯酰氧基丙基三甲氧基硅烷、N-(2-氨乙基)-3-氨丙基甲基二甲氧基硅烷、N-(2-氨乙基)-3-氨丙基三甲氧基硅烷、N-(2-氨乙基)-3-氨丙基三乙氧基硅烷、3-氨丙基三甲氧基硅烷、3-氨丙基三乙氧基硅烷、3-三乙氧基甲硅烷基-N-(1,3-二甲基亚丁基)丙胺等,并且可以将上述两种以上组合使用。
在此,可以组合使用表面被硅烷偶联剂处理的无机填料和表面未被硅烷偶联剂处理的无机填料。
可以对无机填料进行研磨处理。例如,当使用硅烷偶联剂进行表面处理时,无机填料会相互粘着在一起从而使粒径增加,可以通过喷射研磨对无机填料进行研磨处理。
绝缘层20还可以含有抗氧化剂。由此,能够提高绝缘层20的耐热老化性。
作为抗氧化剂,虽然没有特别的限制,但是可以使用2,2-硫代二亚乙基-双[3-(3,5-二叔丁基-4-羟基苯基)丙酸酯]、季戊四醇基-四(3-(3,5-二叔丁基-4-羟基苯基)丙酸酯)、十八烷基-3-(3,5-二叔丁基-4-羟基苯基)丙酸酯、2,4-双(正辛硫代甲基)-邻甲酚、2,4-双(正辛硫代)-6-(4-羟基-3,5-二叔丁基苯胺基)-1,3,5-三嗪、双[2-甲基-4-{3-正烷基(C12或C14)硫代丙酰氧基}-5-叔丁基苯基]硫醚、4,4'-硫代双(3-甲基-6-叔丁基苯酚)等,并且可以将上述两种以上组合使用。
绝缘层20还可以含有润滑剂、着色剂等。
作为构成外部半导电层21的材料,虽然没有特别的限制,但是可以使用乙烯-乙酸乙烯酯共聚物等。
作为构成屏蔽层30的材料,虽然没有特别的限制,但是可以使用铜等。
作为构成覆层40的材料,虽然没有特别的限制,但是可以使用聚氯乙烯等。
可以将直流电缆1用于直流电力等的电力传输。
接下来,对直流电缆1的制造方法的实例进行说明。
在导电部10的外周,将内部半导电层11的原料,作为绝缘层20的原料的含有基础树脂、无机填料和交联剂的组合物,以及外部半导电层21的原料同时挤出成型,并将其加热到预定温度以使基础树脂交联,从而形成内部半导电层11、绝缘层20和外部半导电层21。接着,通过在外部半导电层21的外周缠绕铜带或退火铜线等导电线而形成屏蔽层30。此外,在屏蔽层30的外周,通过将覆层40的原料挤出成型从而形成覆层40。
作为制造组合物的方法,尽管没有特别的限制,但是可以使用如下方法:其中将基础树脂、无机填料、以及根据需要的抗氧化剂、润滑剂、着色剂等捏合以制造粒料,然后将交联剂加热并浸渍到该粒料中。
在此,可以通过使用筛网除去凝集物从而对组合物进行挤出成型。
此外,可以将内部半导电层11的原料、上述组合物和外部半导电层21的原料同时挤出成型。
[实施例]
接下来,对本发明的实施例进行说明。在此,术语“份”是指“重量份”。
(实施例1)
将100份作为基础树脂的低密度聚乙烯(LDPE)、0.1份作为无机填料的氧化镁粉末、以及0.2份作为抗氧化剂的4,4'-硫代双(3-甲基-6-叔丁基苯酚)在约180℃下加热并捏合以制造粒料,其中该低密度聚乙烯的密度为0.920g/mm3、MFR(熔体流动速率)为1g/10分钟,该氧化镁粉末的BET比表面积为30m2/g、体积平均直径为0.45μm。接着,将2份作为交联剂的过氧化二枯基在约60℃下加热并浸渍到得到的粒料中,以得到组合物。
(实施例2)
按照与实施例1类似的方式得到组合物,不同之处在于将无机填料的量变为1份。
(实施例3)
按照与实施例1类似的方式得到组合物,不同之处在于将无机填料的量变为5份。
(实施例4)
按照与实施例2类似的方式得到组合物,不同之处在于,使用这样的氧化镁粉末作为无机填料,该氧化镁粉末的BET比表面积为145m2/g,体积平均直径为0.50μm,且其表面通过作为硅烷偶联剂的乙烯基三甲氧基硅烷进行了处理。
(实施例5)
按照与实施例4类似的方式得到组合物,不同之处在于,使用97份的密度为0.920g/mm3、MFR(熔体流动速率)为1g/10分钟的LDPE和3份的密度为0.920g/mm3、MFR(熔体流动速率)为1g/10分钟的聚乙烯-接枝-马来酸酐(MA-g-PE)作为基础树脂。
(实施例6)
按照与实施例5类似的方式得到组合物,不同之处在于,使用1.3份的2,5-二甲基-2,5-双(叔丁基过氧基)己烷作为交联剂。
(实施例7)
按照与实施例6类似的方式得到组合物,不同之处在于,使用这样的氧化镁粉末作为无机填料,该氧化镁粉末的BET比表面积为30m2/g,体积平均直径为0.50μm,且其表面通过作为硅烷偶联剂的乙烯基三甲氧基硅烷进行了处理。
(实施例8)
按照与实施例6类似的方式得到组合物,不同之处在于,使用这样的氧化镁粉末作为无机填料,该氧化镁粉末的BET比表面积为8m2/g,体积平均直径为0.2μm,且其表面通过作为硅烷偶联剂的乙烯基三甲氧基硅烷进行了处理。
(实施例9)
按照与实施例6类似的方式得到组合物,不同之处在于,作为基础树脂,使用了95份的密度为0.920g/mm3、MFR(熔体流动速率)为1g/10分钟的LDPE和5份的密度为0.930g/mm3、MFR(熔体流动速率)为4g/10分钟的乙烯-丙烯酸乙酯共聚物(聚(E-co-EA)),其中在乙烯-丙烯酸乙酯共聚物中,来自丙烯酸乙酯的单元的含量为7质量%;作为无机填料,使用了BET比表面积为50m2/g、体积平均直径为0.03μm的二氧化硅粉末。
(实施例10)
按照与实施例6类似的方式得到组合物,不同之处在于,使用了BET比表面积为90m2/g、体积平均直径为0.02μm的二氧化硅粉末作为无机填料。
(实施例11)
按照与实施例6类似的方式得到组合物,不同之处在于,作为基础树脂,使用了97份的密度为0.920g/mm3、MFR(熔体流动速率)为1g/10分钟的LDPE和3份的密度为0.930g/mm3、MFR(熔体流动速率)为4g/10分钟的聚(E-co-EA),其中在该聚(E-co-EA)中,来自丙烯酸乙酯的单元的含量为7质量%;作为无机填料,使用了BET比表面积为120m2/g、体积平均直径为0.02μm的氧化铝粉末;并且使用1,3-双(叔丁基过氧化异丙基)苯作为交联剂。
(实施例12)
按照与实施例6类似的方式得到组合物,不同之处在于,作为基础树脂,使用了93份的密度为0.920g/mm3、MFR(熔体流动速率)为1g/10分钟的LDPE和7份的密度为0.930g/mm3、MFR(熔体流动速率)为4g/10分钟的聚(E-co-EA),其中在该聚(E-co-EA)中,EA浓度为7%;作为无机填料,使用了BET比表面积为50m2/g、体积平均直径为0.05μm的炭黑。
(实施例13)
按照与实施例6类似的方式得到组合物,不同之处在于,作为无机填料,使用了1份的BET比表面积为145m2/g、体积平均直径为0.50μm、且其表面通过作为硅烷偶联剂的乙烯基三甲氧基硅烷进行了处理的氧化镁粉末,和2份的BET比表面积为50m2/g、体积平均直径为0.03μm的二氧化硅粉末。
(实施例14)
按照与实施例6类似的方式得到组合物,不同之处在于,作为无机填料,使用了2份的BET比表面积为145m2/g、体积平均直径为0.50μm、且表面通过作为硅烷偶联剂的乙烯基三甲氧基硅烷进行了处理的氧化镁粉末,和3份的BET比表面积为120m2/g、体积平均直径为0.02μm的氧化铝粉末。
(比较例1)
按照与实施例1类似的方式得到组合物,不同之处在于,不使用无机填料。
(比较例2)
按照与实施例1类似的方式得到组合物,不同之处在于,将无机填料的量变为10份。
(比较例3)
按照与实施例1类似的方式得到组合物,不同之处在于,使用2份的BET比表面积为1.4m2/g、体积平均直径为3μm的氧化镁粉末作为无机填料。
(比较例4)
按照与实施例1类似的方式得到组合物,不同之处在于,使用2份的BET比表面积为0.5m2/g、体积平均直径为17μm的氧化镁粉末作为无机填料。
(比较例5)
按照与实施例1类似的方式得到组合物,不同之处在于,使用2份的BET比表面积为4.1m2/g、体积平均直径为1.5μm的氧化铝粉末作为无机填料。
表1示出了组合物中含有的无机填料的特性。
表2示出了组合物的特性。
(片材的制造)
对各组合物进行压制成型,以得到厚度T为0.15mm的片材。
接下来,对各片材的体积电阻率、抵抗所施加的直流电压的长期绝缘性能和空间电荷特性进行评价。
(体积电阻率)
通过将片材浸渍在90℃的硅油中,并使用直径为25mm的平板电极对片材施加80kV/mm的直流电场来测量体积电阻率。
(抵抗所施加的直流电压的长期绝缘性能)
使用该片材,通过以下方式来获得V-t曲线:将片材浸渍在90℃的硅油中,使用直径为25mm的平板电极对片材施加10至300kV/mm的直流电场V0[kV/mm],并测定时间“t”[小时],直到片材中发生电介质击穿。接下来,由下式获得寿命指数“n”,
V0 n×t=常数,
并对抵抗所施加的直流电压的长期绝缘性能进行评价。在此,当“n”大于等于20时,判定为双圈,当“n”大于等于15且小于20时,判定为“○”(圈),并且当“n”小于15时,判定为“x”。
(空间电荷特性)
使用脉冲电声无损检测系统(由Five Lab制造)来评价片材的空间电荷特性。具体而言,按照以下方式对片材的空间电荷特性进行评价:在30℃的大气压下对片材连续施加50kV/mm的直流电场V0持续1小时,测定片材中的最大电场V1,并且获得由下式定义的场致增强因子FEF
V1/(V0×T)。
在此,当FEF小于1.15时,判定为“○”(圈),并且当FEF大于等于1.15时,判定为“x”。
表3中示出了各片材的体积电阻率、抵抗所施加的直流电压的长期绝缘性能和空间电荷特性的评价结果。
从表3可以看出,分别对于由实施例1至13的组合物制造的各片材,可以理解的是,体积电阻率高,并且抵抗所施加的直流电压的长期绝缘性能和空间电荷特性良好。
另一方面,由于由比较例1的组合物制造的片材不包含无机填料,因此体积电阻率、抵抗所施加的直流电压的长期绝缘性能和空间电荷特性降低。
对于由比较例2的组合物制造的片材,由于无机填料2与基础树脂的质量比为0.1,因此抵抗所施加的直流电压的长期绝缘性能和空间电荷特性降低。
对于由比较例3和5的组合物制造的片材,由于各无机填料的BET比表面积分别为1.4m2/g和4.1m2/g,因此体积电阻率、抵抗所施加的直流电压的长期绝缘性能和空间电荷特性降低。
对于由比较例4的组合物制造的片材,由于无机填料的BET比表面积和体积平均直径分别为0.5m2/g和17μm,因此体积电阻率、抵抗所施加的直流电压的长期绝缘性能和空间电荷特性降低。
(直流电缆1的制造)
首先,制备导电部10,其通过扭绞直径为14mm的由低铜合金制成的导电芯线而形成。接下来,在导电部10的外周,将由乙烯-丙烯酸乙酯共聚物制成的内部半导电层11、作为绝缘层20的原料的组合物、以及由乙烯-丙烯酸乙酯共聚物制成的外部半导电层21同时挤出成型,使其厚度分别为1mm、14mm和1mm。然后,将产物在约250℃下加热以使基础树脂交联并形成内部半导电层11、绝缘层20和外部半导电层21。接下来,通过在外部半导电层21的外周缠绕直径为1mm的导线(例如退火铜线)等,从而形成屏蔽层30。然后,在屏蔽层30的外周处将聚氯乙烯挤出成型,以形成厚度为3mm的覆层40,从而获得直流电缆1。
[符号说明]
1 直流电缆
10 导电部
11 内部半导电层
20 绝缘层
21 外部半导电层
30 屏蔽层
40 覆层
Claims (9)
1.一种直流电缆,其包括:
导电部;和
覆盖所述导电部的外周的绝缘层,
所述绝缘层含有交联的基础树脂和无机填料,
所述基础树脂含有聚乙烯,
所述无机填料的BET比表面积为5m2/g以上,并且所述无机填料的体积平均直径为5μm以下,
所述无机填料相对于所述基础树脂的质量比为0.001以上0.05以下,并且
所述交联的基础树脂是通过包含有机过氧化物的交联剂进行交联的。
2.根据权利要求1所述的直流电缆,其中所述无机填料为选自由氧化镁粉末、氧化铝粉末、二氧化硅粉末、硅酸镁粉末、硅酸铝粉末和炭黑所构成的组中的一种或多种。
3.根据权利要求2所述的直流电缆,其中所述氧化镁粉末、氧化铝粉末、二氧化硅粉末、硅酸镁粉末和硅酸铝粉末各自的表面经过硅烷偶联剂的处理。
4.根据权利要求1所述的直流电缆,
其中所述基础树脂还含有乙烯和极性单体的共聚物或聚乙烯-接枝-马来酸酐,并且
其中所述乙烯和极性单体的共聚物或所述聚乙烯-接枝-马来酸酐相对于所述聚乙烯的质量比为1/9以下。
5.一种组合物,其包含:基础树脂、无机填料和交联剂,
所述基础树脂含有聚乙烯,
所述无机填料的BET比表面积为5m2/g以上,并且所述无机填料的体积平均直径为5μm以下,
所述无机填料相对于所述基础树脂的质量比为0.001以上0.05以下,并且
所述交联剂包含有机过氧化物。
6.根据权利要求5所述的组合物,其中所述无机填料是选自由氧化镁粉末、氧化铝粉末、二氧化硅粉末、硅酸镁粉末、硅酸铝粉末和炭黑所构成的组中的一种或多种。
7.根据权利要求6所述的组合物,其中所述氧化镁粉末、氧化铝粉末、二氧化硅粉末、硅酸镁粉末和硅酸铝粉末各自的表面经过硅烷偶联剂的处理。
8.根据权利要求5所述的组合物,
其中所述基础树脂还含有乙烯和极性单体的共聚物或聚乙烯-接枝-马来酸酐,并且
其中所述乙烯和极性单体的共聚物或所述聚乙烯-接枝-马来酸酐相对于所述聚乙烯的质量比为1/9以下。
9.一种制造直流电缆的方法,其中在该直流电缆中,导电部的外周覆盖有绝缘层,该方法包括:
通过对权利要求5所述的组合物进行挤出成型以覆盖所述导电部的外周,从而制造挤出成型材料;和
通过在预定温度下对所述挤出成型材料进行加热以使所述基础树脂交联,从而形成所述绝缘层。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/072676 WO2017026039A1 (ja) | 2015-08-10 | 2015-08-10 | 直流ケーブル、組成物及び直流ケーブルの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108028098A true CN108028098A (zh) | 2018-05-11 |
Family
ID=57983610
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580082234.8A Pending CN108028098A (zh) | 2015-08-10 | 2015-08-10 | 直流电缆、组合物以及直流电缆的制造方法 |
CN201680004492.9A Active CN107112089B (zh) | 2015-08-10 | 2016-08-05 | 直流电缆、组合物以及直流电缆的制造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680004492.9A Active CN107112089B (zh) | 2015-08-10 | 2016-08-05 | 直流电缆、组合物以及直流电缆的制造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20180218804A1 (zh) |
EP (2) | EP3336857A4 (zh) |
JP (1) | JPWO2017026391A1 (zh) |
KR (2) | KR20180039635A (zh) |
CN (2) | CN108028098A (zh) |
WO (2) | WO2017026039A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109438807A (zh) * | 2018-10-29 | 2019-03-08 | 北京科技大学 | 一种绝缘材料及其制备方法和应用 |
CN111607142A (zh) * | 2019-02-25 | 2020-09-01 | 住友电气工业株式会社 | 树脂组合物成形体和直流电缆 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102371836B1 (ko) * | 2017-04-12 | 2022-03-07 | 엘에스전선 주식회사 | 직류 전력 케이블 |
KR102272724B1 (ko) * | 2017-06-22 | 2021-07-06 | 엘에스전선 주식회사 | 직류 전력 케이블 |
WO2019072388A1 (en) * | 2017-10-12 | 2019-04-18 | Prysmian S.P.A. | ELECTRICAL CABLE WITH ENHANCED THERMOPLASTIC INSULATING LAYER |
KR102515699B1 (ko) * | 2017-11-17 | 2023-03-30 | 스미토모 덴키 고교 가부시키가이샤 | 수지 성형체 및 탭 리드 |
JP6852725B2 (ja) * | 2018-11-26 | 2021-03-31 | 日立金属株式会社 | ケーブル及びハーネス |
KR102044105B1 (ko) * | 2018-12-07 | 2019-11-12 | 엘에스전선 주식회사 | 절연 조성물 및 이로부터 형성된 절연층을 갖는 직류 전력 케이블 |
FR3090986B1 (fr) * | 2018-12-20 | 2022-08-12 | Nexans | Câble électrique comprenant au moins une couche réticulée |
JP6575701B1 (ja) * | 2019-02-25 | 2019-09-18 | 住友電気工業株式会社 | 樹脂組成物、無機充填剤、直流電力ケーブル、および直流電力ケーブルの製造方法 |
KR20210140731A (ko) * | 2019-03-29 | 2021-11-23 | 후루카와 덴키 고교 가부시키가이샤 | 전력 케이블의 접속부 피복용 절연 테이프, 전력 케이블의 접속부 외면에의 절연 피복 형성 방법 및 전력 케이블 |
CN113896971B (zh) * | 2020-06-22 | 2023-08-11 | 中国石油化工股份有限公司 | 聚乙烯组合物及其制备方法 |
CN111704761A (zh) * | 2020-06-30 | 2020-09-25 | 江苏益帆高分子材料有限公司 | 一种交联聚乙烯绝缘电缆料及其制备方法 |
JPWO2022163197A1 (zh) * | 2021-01-29 | 2022-08-04 | ||
WO2024095407A1 (en) | 2022-11-02 | 2024-05-10 | Sumitomo Electric Industries, Ltd. | Resin composition, pellet, power cable, and method for manufacturing power cable |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04368717A (ja) * | 1991-06-14 | 1992-12-21 | Hitachi Cable Ltd | 直流電力ケーブル |
JP2013026048A (ja) * | 2011-07-22 | 2013-02-04 | Viscas Corp | 直流電力ケーブル及び直流電力線路の製造方法 |
CN103289214A (zh) * | 2013-06-27 | 2013-09-11 | 上海三原电缆附件有限公司 | 高压直流电缆附件用三元乙丙橡胶绝缘材料及其制备方法 |
CN103613828A (zh) * | 2013-11-26 | 2014-03-05 | 无锡市明珠电缆有限公司 | 一种高压直流电缆料及其制备方法和应用 |
JP2015000883A (ja) * | 2013-06-13 | 2015-01-05 | 株式会社ジェイ・パワーシステムズ | ポリエチレン組成物およびそれを用いた直流用ケーブル |
CN104448493A (zh) * | 2014-12-12 | 2015-03-25 | 国家电网公司 | 一种直流电缆绝缘材料 |
WO2015090643A1 (en) * | 2013-12-19 | 2015-06-25 | Abb Technology Ltd | An electrical hv transmission power cable |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19818552A1 (de) * | 1998-04-24 | 1999-10-28 | Bayer Ag | Mischungen aus Kautschuken und aktivierten und hydrophobierten exidischen und silikatischen Füllstoffen und ein Verfahren zur Herstellung |
WO2000065609A1 (fr) * | 1999-04-22 | 2000-11-02 | Mitsui Chemicals, Inc. | Fil electrique et son procede de fabrication |
WO2011093211A1 (ja) * | 2010-01-28 | 2011-08-04 | 株式会社ビスキャス | 架橋ポリオレフィン組成物、直流電力ケーブル及び直流電力線路の施工方法 |
KR101362560B1 (ko) * | 2011-08-08 | 2014-02-14 | 주식회사 엘지화학 | 가교 폴리에틸렌 조성물 |
JP5720081B2 (ja) | 2013-05-10 | 2015-05-20 | 株式会社ジェイ・パワーシステムズ | 樹脂組成物および直流ケーブル |
JP6320692B2 (ja) | 2013-06-10 | 2018-05-09 | 住友電気工業株式会社 | 直流ケーブル及び電気絶縁組成物 |
CN103627064A (zh) * | 2013-11-05 | 2014-03-12 | 西安交通大学 | 具有抗水树功能的交联聚乙烯电缆绝缘料及其制备方法 |
JP6318749B2 (ja) * | 2014-03-20 | 2018-05-09 | 住友電気工業株式会社 | 絶縁材料の製造方法、マスタバッチ、絶縁材料および電力ケーブル |
WO2016101988A1 (en) * | 2014-12-22 | 2016-06-30 | Abb Technology Ag | Composite formulations for direct current insulation |
-
2015
- 2015-08-10 CN CN201580082234.8A patent/CN108028098A/zh active Pending
- 2015-08-10 WO PCT/JP2015/072676 patent/WO2017026039A1/ja active Application Filing
- 2015-08-10 US US15/747,324 patent/US20180218804A1/en not_active Abandoned
- 2015-08-10 KR KR1020187003004A patent/KR20180039635A/ko unknown
- 2015-08-10 EP EP15900993.5A patent/EP3336857A4/en not_active Withdrawn
-
2016
- 2016-08-05 KR KR1020177013412A patent/KR20180042822A/ko unknown
- 2016-08-05 CN CN201680004492.9A patent/CN107112089B/zh active Active
- 2016-08-05 WO PCT/JP2016/073095 patent/WO2017026391A1/ja active Application Filing
- 2016-08-05 JP JP2017534409A patent/JPWO2017026391A1/ja not_active Withdrawn
- 2016-08-05 EP EP16835088.2A patent/EP3336858A4/en active Pending
- 2016-08-05 US US15/531,104 patent/US10643763B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04368717A (ja) * | 1991-06-14 | 1992-12-21 | Hitachi Cable Ltd | 直流電力ケーブル |
JP2013026048A (ja) * | 2011-07-22 | 2013-02-04 | Viscas Corp | 直流電力ケーブル及び直流電力線路の製造方法 |
JP2015000883A (ja) * | 2013-06-13 | 2015-01-05 | 株式会社ジェイ・パワーシステムズ | ポリエチレン組成物およびそれを用いた直流用ケーブル |
CN103289214A (zh) * | 2013-06-27 | 2013-09-11 | 上海三原电缆附件有限公司 | 高压直流电缆附件用三元乙丙橡胶绝缘材料及其制备方法 |
CN103613828A (zh) * | 2013-11-26 | 2014-03-05 | 无锡市明珠电缆有限公司 | 一种高压直流电缆料及其制备方法和应用 |
WO2015090643A1 (en) * | 2013-12-19 | 2015-06-25 | Abb Technology Ltd | An electrical hv transmission power cable |
CN104448493A (zh) * | 2014-12-12 | 2015-03-25 | 国家电网公司 | 一种直流电缆绝缘材料 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109438807A (zh) * | 2018-10-29 | 2019-03-08 | 北京科技大学 | 一种绝缘材料及其制备方法和应用 |
CN109438807B (zh) * | 2018-10-29 | 2020-12-01 | 北京科技大学 | 一种绝缘材料及其制备方法和应用 |
CN111607142A (zh) * | 2019-02-25 | 2020-09-01 | 住友电气工业株式会社 | 树脂组合物成形体和直流电缆 |
CN111607142B (zh) * | 2019-02-25 | 2021-11-23 | 住友电气工业株式会社 | 树脂组合物成形体和直流电缆 |
Also Published As
Publication number | Publication date |
---|---|
KR20180039635A (ko) | 2018-04-18 |
EP3336858A4 (en) | 2018-08-22 |
US10643763B2 (en) | 2020-05-05 |
US20170330645A1 (en) | 2017-11-16 |
CN107112089B (zh) | 2019-07-05 |
EP3336858A1 (en) | 2018-06-20 |
KR20180042822A (ko) | 2018-04-26 |
JPWO2017026391A1 (ja) | 2018-05-31 |
CN107112089A (zh) | 2017-08-29 |
US20180218804A1 (en) | 2018-08-02 |
EP3336857A4 (en) | 2018-09-05 |
WO2017026039A1 (ja) | 2017-02-16 |
EP3336857A1 (en) | 2018-06-20 |
WO2017026391A1 (ja) | 2017-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107112089B (zh) | 直流电缆、组合物以及直流电缆的制造方法 | |
JP4933344B2 (ja) | シールドツイストペアケーブル | |
JP6575701B1 (ja) | 樹脂組成物、無機充填剤、直流電力ケーブル、および直流電力ケーブルの製造方法 | |
JP6558511B1 (ja) | 樹脂組成物、無機充填剤、直流電力ケーブル、および直流電力ケーブルの製造方法 | |
CN102725344B (zh) | 交联聚烯烃组合物、直流电力电缆和直流电力线路的施工方法 | |
KR20150022988A (ko) | 공간 전하 트랩 층을 포함하는 디바이스 | |
JP6286886B2 (ja) | 直流用ケーブル | |
JP2022037067A (ja) | 直流電力ケーブル | |
JP6320692B2 (ja) | 直流ケーブル及び電気絶縁組成物 | |
CN111292875B (zh) | 绝缘组合物及具有由该绝缘组合物形成的绝缘层的直流电力电缆 | |
KR20190072868A (ko) | 고전압 케이블 절연소재 조성물 및 그의 제조방법 | |
WO2017175270A1 (ja) | 送電ケーブル | |
JP6171663B2 (ja) | 電気絶縁組成物、直流用ケーブル、電気絶縁組成物の製造方法および直流用ケーブルの製造方法 | |
WO2021100288A1 (ja) | 樹脂組成物、無機充填剤群、直流電力ケーブル、および直流電力ケーブルの製造方法 | |
WO2018236013A1 (ko) | 직류 전력 케이블 | |
JP6298441B2 (ja) | 半導電性樹脂組成物及びこれを用いた電力ケーブル | |
CN208922759U (zh) | 一种具有防潮散热功能的电线电缆 | |
JP2724494B2 (ja) | 半導電性組成物、及び電力ケーブルの剥離性外部半導電層 | |
CN206516368U (zh) | 一种柔性矿物绝缘防火电缆 | |
JP2016065208A (ja) | 半導電性樹脂組成物およびこれを用いた電力ケーブル | |
JPH11329077A (ja) | 半導電層用組成物及び電力ケーブル | |
CN116457899A (zh) | 树脂组合物以及电力电缆 | |
WO2017175269A1 (ja) | 送電ケーブル | |
CN116710510A (zh) | 树脂组合物以及电力电缆 | |
JPH10287774A (ja) | シラン架橋性半導電樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180511 |