CN107920429A - 具有可变空穴深度的dip板及浸润电子元件接触接口的方法 - Google Patents

具有可变空穴深度的dip板及浸润电子元件接触接口的方法 Download PDF

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Publication number
CN107920429A
CN107920429A CN201710906653.XA CN201710906653A CN107920429A CN 107920429 A CN107920429 A CN 107920429A CN 201710906653 A CN201710906653 A CN 201710906653A CN 107920429 A CN107920429 A CN 107920429A
Authority
CN
China
Prior art keywords
dip
solder flux
plates
cavity plate
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710906653.XA
Other languages
English (en)
Chinese (zh)
Inventor
阿诺·斯坦恩
托马斯·利贝克
克里斯托夫·菲舍尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT GmbH and Co KG
Original Assignee
ASM Assembly Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Assembly Systems GmbH and Co KG filed Critical ASM Assembly Systems GmbH and Co KG
Priority to CN202111468042.4A priority Critical patent/CN114340206A/zh
Publication of CN107920429A publication Critical patent/CN107920429A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201710906653.XA 2016-10-07 2017-09-29 具有可变空穴深度的dip板及浸润电子元件接触接口的方法 Pending CN107920429A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111468042.4A CN114340206A (zh) 2016-10-07 2017-09-29 具有可变空穴深度的dip板及浸润电子元件接触接口的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016219558.1 2016-10-07
DE102016219558.1A DE102016219558B4 (de) 2016-10-07 2016-10-07 DIP-Platte mit variabler Kavitätstiefe und Verfahren zum Dippen von Kontaktanschlüssen elektronischer Bauelemente

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202111468042.4A Division CN114340206A (zh) 2016-10-07 2017-09-29 具有可变空穴深度的dip板及浸润电子元件接触接口的方法

Publications (1)

Publication Number Publication Date
CN107920429A true CN107920429A (zh) 2018-04-17

Family

ID=61695731

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201710906653.XA Pending CN107920429A (zh) 2016-10-07 2017-09-29 具有可变空穴深度的dip板及浸润电子元件接触接口的方法
CN202111468042.4A Pending CN114340206A (zh) 2016-10-07 2017-09-29 具有可变空穴深度的dip板及浸润电子元件接触接口的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202111468042.4A Pending CN114340206A (zh) 2016-10-07 2017-09-29 具有可变空穴深度的dip板及浸润电子元件接触接口的方法

Country Status (3)

Country Link
KR (1) KR102067952B1 (de)
CN (2) CN107920429A (de)
DE (1) DE102016219558B4 (de)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3532710A1 (de) * 1985-09-13 1987-03-19 Wemhoener Heinrich Gmbh Co Membran-formenpresse
JP2001291732A (ja) * 2000-04-10 2001-10-19 Matsushita Electric Ind Co Ltd 導電性ボールの搭載装置および搭載方法
JP2008124263A (ja) * 2006-11-13 2008-05-29 Juki Corp フラックス膜形成装置
JP2010287702A (ja) * 2009-06-11 2010-12-24 Fuji Mach Mfg Co Ltd 電子部品実装機およびその融剤転写装置
CN103518256A (zh) * 2011-09-05 2014-01-15 米卡多科技株式会社 真空加热接合装置及真空加热接合方法
KR20140139339A (ko) * 2013-05-27 2014-12-05 삼성테크윈 주식회사 칩 마운터의 충돌 방지 장치 및 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3532710A1 (de) * 1985-09-13 1987-03-19 Wemhoener Heinrich Gmbh Co Membran-formenpresse
JP2001291732A (ja) * 2000-04-10 2001-10-19 Matsushita Electric Ind Co Ltd 導電性ボールの搭載装置および搭載方法
JP2008124263A (ja) * 2006-11-13 2008-05-29 Juki Corp フラックス膜形成装置
JP2010287702A (ja) * 2009-06-11 2010-12-24 Fuji Mach Mfg Co Ltd 電子部品実装機およびその融剤転写装置
CN103518256A (zh) * 2011-09-05 2014-01-15 米卡多科技株式会社 真空加热接合装置及真空加热接合方法
KR20140139339A (ko) * 2013-05-27 2014-12-05 삼성테크윈 주식회사 칩 마운터의 충돌 방지 장치 및 방법

Also Published As

Publication number Publication date
KR102067952B1 (ko) 2020-01-21
CN114340206A (zh) 2022-04-12
KR20180038996A (ko) 2018-04-17
DE102016219558B4 (de) 2021-12-30
DE102016219558A1 (de) 2018-04-12

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Application publication date: 20180417

RJ01 Rejection of invention patent application after publication