WO2014199694A1 - 半田付け装置、及び、半田付け方法 - Google Patents
半田付け装置、及び、半田付け方法 Download PDFInfo
- Publication number
- WO2014199694A1 WO2014199694A1 PCT/JP2014/057910 JP2014057910W WO2014199694A1 WO 2014199694 A1 WO2014199694 A1 WO 2014199694A1 JP 2014057910 W JP2014057910 W JP 2014057910W WO 2014199694 A1 WO2014199694 A1 WO 2014199694A1
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- WO
- WIPO (PCT)
- Prior art keywords
- solder
- jet
- jet device
- jet nozzle
- gas
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Definitions
- the present invention relates to a technique for jetting molten solder.
- soldering apparatus that performs soldering on an object.
- a soldering apparatus an apparatus in which molten solder is jetted from a jet nozzle, and solder that flows in a state of rising from the nozzle port is brought into contact with the target to solder the target.
- This soldering device is also called a “selective soldering device (or point soldering device)”, and selectively solders only to a partial area of the object, such as an area where electronic components are placed on a printed circuit board. It can be performed.
- a gas supply type soldering apparatus is known (see, for example, Patent Documents 1 and 2).
- solder is jetted from a jet nozzle by supplying gas to a sealed solder reservoir.
- solder that is jetted from the jet nozzle and flows out without contacting the object is collected in the solder collection tank.
- the solder recovered in the solder recovery tank is returned to the solder storage tank via the communication port that connects the solder recovery tank and the solder storage tank and reused.
- the communication port is closed by an on-off valve, so that the solder storage tank is sealed.
- a configuration of the solder jet device for jetting the solder a configuration is provided in which a partition plate for partitioning the internal space of a single solder container is provided, a solder recovery tank is provided above the partition plate, and a solder storage tank is provided below the partition plate. Can be considered.
- the solder recovery tank is disposed above the solder storage tank, and a communication port that connects the solder recovery tank and the solder storage tank is provided in the partition plate.
- the communication port Since the communication port is arranged at the upper part of the solder supply tank, when the communication port is closed with an on-off valve and gas is supplied to the solder supply tank, the gas reaches below the communication port. As a result, the gas supplied to the solder storage tank may leak from the contact portion between the communication port and the on-off valve. In addition, gas may also enter the boundary portion between the solder container and the partition plate, and the gas supplied to the solder storage tank may leak from this contact portion.
- the solder storage tank cannot be maintained in a sealed state, so that the solder cannot be stably jetted from the jet nozzle. As a result, it may not be possible to accurately solder the object.
- This invention is made
- solder erosion the progress of the deterioration of the jet nozzle called “solder erosion” is accelerated, and the durability of the jet nozzle may be shortened.
- the jet nozzle is exposed to the outside air at a high temperature during a period when the solder is not jetted. For this reason, phenomena such as oxidation or flux seizure occur on the outer periphery of the jet nozzle, and the wettability of the outer periphery of the jet nozzle may deteriorate due to this phenomenon.
- the solder flowing out of the jet nozzle does not flow through the entire outer periphery of the jet nozzle, and the solder flow is biased.
- the shape of the solder flow formed at the nozzle port of the jet nozzle changes, and there is a possibility that soldering to a predetermined region of the object cannot be performed accurately.
- the present invention has been made in view of the above problems, and a second object is to maintain the wettability of the outer periphery of the jet nozzle.
- a first aspect that the present invention can take is a solder jet device for jetting solder, A solder container for containing molten solder; A jet nozzle for jetting the solder; The upper part of the solder container is a solder collection tank for collecting the solder flowing out from the jet nozzle, and the lower part of the solder container is a solder storage tank for receiving the supply of gas and supplying the solder to the jet nozzle.
- a partition plate for partitioning the inside of the solder container, A communication port formed on the partition plate to communicate the solder recovery tank and the solder storage tank; An on-off valve for opening and closing the communication port; A first cylindrical member whose upper end is joined to the lower surface of the partition plate to surround the entire lower part of the communication port, and whose lower end is disposed near the bottom surface of the solder storage tank; It has.
- gas does not enter the lower part of the communication port by the first cylindrical member surrounding the entire lower part of the communication port. For this reason, gas leakage at the contact portion between the communication port and the on-off valve can be prevented.
- the upper end is joined to the lower surface of the partition plate to cover the entire boundary portion between the partition plate and the solder container, and the lower end is the bottom surface of the solder storage tank along the inner surface of the solder container. You may further provide the cover member arrange
- the cover member prevents gas from entering the boundary portion between the partition plate and the solder container. For this reason, it is possible to prevent gas leakage at the boundary between the partition plate and the solder container.
- the solder jet device may include a second cylindrical member having a lower end disposed inside the solder storage tank and serving as a supply path of the solder from the solder storage tank to the jet nozzle.
- the position of the lower end of the first cylindrical member is lower than the position of the lower end of the second cylindrical member.
- the lower end position of the cover member may be lower than the lower end position of the second cylindrical member.
- a second aspect that the present invention can take is a solder jet device for jetting solder, A solder container for containing molten solder; A jet nozzle for jetting the solder; The upper part of the solder container is a solder collection tank for collecting the solder flowing out from the jet nozzle, and the lower part of the solder container is a solder storage tank for receiving the supply of gas and supplying the solder to the jet nozzle.
- a partition plate for partitioning the inside of the solder container A cover in which an upper end is joined to a lower surface of the partition plate to cover the entire boundary portion between the partition plate and the solder container, and a lower end is disposed near the bottom surface of the solder storage tank along the inner surface of the solder container.
- the cover member prevents gas from entering the boundary portion between the partition plate and the solder container. For this reason, it is possible to prevent gas leakage at the boundary between the partition plate and the solder container.
- the jet nozzle when the jet nozzle extends in the vertical direction, it extends along the horizontal direction at least in the vicinity of the upper end portion of the outer periphery of the jet nozzle. It is good also as a structure by which the ditch
- the solder flowing out from the upper end portion of the jet nozzle can be left in the concave groove.
- the wettability of the outer periphery of a jet nozzle can be maintained also in the state which does not jet a solder from a jet nozzle.
- the concave groove may be formed so as to continuously make a round of the outer periphery of the jet nozzle.
- the concave groove may include a plurality of the concave grooves.
- the wettability of the outer periphery of the jet nozzle can be more reliably maintained in a range where at least a plurality of concave grooves are formed.
- the plurality of concave grooves may be independent from each other.
- the solder can be reliably left in the groove without flowing out from one groove to another groove.
- the solder jet device may be configured to intermittently jet the solder from the jet nozzle.
- the wettability of the outer periphery of the jet nozzle can be maintained even when solder is intermittently jetted.
- a third aspect that the present invention can take is a soldering apparatus that performs soldering on an object, A solder jet device according to the first aspect; A gas supply unit for supplying the gas to the solder storage tank; It has.
- a fourth aspect of the present invention is a solder jet device that jets solder, A solder reservoir containing the molten solder; A jet nozzle extending in the vertical direction and jetting the solder supplied from the solder storage tank from an upper end; With A plurality of concave grooves are formed so as to extend along the horizontal direction at least in the vicinity of the upper end portion of the outer periphery of the jet nozzle, The solder jet device, wherein the plurality of concave grooves are arranged at equal intervals in the vertical direction without being connected to each other.
- the solder flowing out from the upper end portion of the jet nozzle can be left in the concave groove.
- the wettability of the outer periphery of a jet nozzle can be maintained also in the state which does not jet a solder from a jet nozzle.
- the solder does not flow from one groove to another groove, and the solder can be reliably left in the groove.
- the concave groove may be formed so as to continuously make a round of the outer periphery of the jet nozzle.
- the portion of the jet nozzle where the plurality of concave grooves are formed is preferably cylindrical.
- the solder jet device may be configured to intermittently jet the solder from the jet nozzle.
- the wettability of the outer periphery of the jet nozzle can be maintained even when solder is intermittently jetted.
- a fifth aspect that the present invention can take is a soldering apparatus that performs soldering on an object, A solder jet device according to the fourth aspect; A moving mechanism for changing a relative position between the object and the solder jet device; It has.
- FIG. 1 is a perspective view showing the appearance of the soldering apparatus according to the first embodiment of the present invention.
- FIG. 2 is an exploded perspective view of the soldering apparatus of FIG.
- FIG. 3 is a block diagram showing a schematic configuration of the soldering apparatus of FIG.
- FIG. 4 is a perspective view showing an appearance of a solder jet device provided in the soldering apparatus of FIG.
- FIG. 5 is a diagram showing an internal configuration of the solder jet device of FIG.
- FIG. 6 is a diagram showing a part of the process of assembling the solder jet device of FIG.
- FIG. 7 is an exploded perspective view of the solder jet device of FIG.
- FIG. 8 is a diagram showing a basic operation flow of the soldering apparatus of FIG. FIG.
- FIG. 9 is a diagram showing an initial state of the solder jet device of FIG.
- FIG. 10 is a view showing one state of the solder jet device of FIG.
- FIG. 11 is a diagram for explaining the operation of the soldering process using the solder jet device of FIG.
- FIG. 12 is a view showing one state of the solder jet device of FIG.
- FIG. 13 is a view showing a solder jet device as a comparative example.
- FIG. 14 is a view showing one state of the solder jet device of FIG.
- FIG. 15 is a diagram showing temporal changes in gas pressure and flow rate.
- FIG. 16 is a diagram for explaining the principle that the flow rate of the flowing solder decreases.
- FIG. 17 is a diagram showing a configuration related to the supply of gas to the solder jet device of FIG. FIG.
- FIG. 18 is a diagram showing temporal changes in gas pressure and flow rate.
- FIG. 19 is a diagram showing a flow of operation relating to the supply of gas to the solder jet device of FIG.
- FIG. 20 is a perspective view showing an appearance of a solder jet device according to the second embodiment of the present invention.
- FIG. 21 is a diagram showing an internal configuration of the solder jet device of FIG.
- FIG. 22 is an exploded perspective view of the solder jet device of FIG.
- FIG. 23 is a diagram showing an initial state of the solder jet device of FIG.
- FIG. 24 is a view showing one state of the solder jet device of FIG.
- FIG. 25 is a diagram for explaining the operation of the soldering process using the solder jet device of FIG. FIG.
- FIG. 26 is a view showing one state of the solder jet device of FIG.
- FIG. 27 is a view showing an upper portion of a jet nozzle provided in the solder jet device of FIG.
- FIG. 28 is an enlarged view showing a part of the solder remaining portion provided in the jet nozzle shown in FIG.
- FIG. 29 is an enlarged view showing a part of the solder remaining portion provided in the jet nozzle shown in FIG.
- FIG. 1 is a perspective view showing an appearance of the soldering apparatus 1 according to the first embodiment of the present invention.
- the soldering apparatus 1 has a function of performing soldering (soldering) on the printed circuit board 9 while conveying the printed circuit board 9 as an object.
- the soldering apparatus 1 fixes these electronic components to the printed circuit board 9 by bringing the molten solder into contact with the lower surface of the printed circuit board 9 (the surface on the side where the leads of the electronic components protrude).
- the soldering apparatus 1 is a selective soldering apparatus that can selectively perform soldering on a part of the printed circuit board 9 where electronic components are arranged.
- a region to be soldered on the printed circuit board 9 is referred to as a “target region”.
- the soldering apparatus 1 includes a housing 11, a warning indicator 13, and a board transport mechanism 8.
- the warning indicator 13 is fixed to the side surface of the housing 11 so as to extend in the vertical direction.
- the substrate transport mechanism 8 is provided on an upper surface plate 12 that forms the upper surface of the housing 11.
- XYZ three-dimensional orthogonal coordinate system
- This orthogonal coordinate system is fixed relative to the housing 11.
- the X-axis direction corresponds to the left-right direction
- the Y-axis direction corresponds to the front-rear direction
- the Z-axis direction corresponds to the up-down direction (vertical direction).
- the warning indicator 13 notifies the user such as a worker of information such as a warning by light emission.
- the warning indicator 13 includes a plurality of rotating lamps having different emission colors. These rotating lamps are turned on when a malfunction occurs in the operation of the soldering apparatus 1.
- the substrate transport mechanism 8 transports the printed circuit board 9 placed on the transport pallet 82 in the left-right direction (X-axis direction).
- the substrate transport mechanism 8 includes two conveyors 81 extending along the left-right direction (X-axis direction). These two conveyors 81 move in the directions of arrows AR1 and AR2 in the figure while supporting both ends of the transport pallet 82 in the front-rear direction (Y-axis direction). Thereby, the printed circuit board 9 is conveyed from the right to the left in the figure on the upper surface of the soldering apparatus 1.
- the soldering apparatus 1 performs soldering on the target area of the printed circuit board 9 exposed inside the housing 11 as described above.
- FIG. 2 is an exploded perspective view of the soldering apparatus 1 and mainly shows the internal configuration of the housing 11.
- the soldering apparatus 1 includes a solder jet device 2 that jets molten solder and a triaxial moving mechanism 6 that moves the solder jet device 2 inside a housing 11.
- the solder jet device 2 jets the melted solder and brings the jetted solder into contact with the target region of the printed board 9 to perform soldering on the printed board 9.
- the configuration of the solder jet device 2 will be described in detail later.
- the triaxial moving mechanism 6 includes a fixed portion 60 and three sliders 61, 62, and 63.
- the fixing unit 60 fixes the solder jet device 2.
- the three sliders 61, 62, and 63 extend in the left-right direction (X-axis direction), the front-rear direction (Y-axis direction), and the up-down direction (Z-axis direction), respectively.
- the triaxial moving mechanism 6 can be any of the left-right direction (X-axis direction), the front-rear direction (Y-axis direction), and the up-down direction (Z-axis direction) with the solder jet device 2 fixed by the fixing portion 60
- the solder jet device 2 can be moved. That is, the triaxial moving mechanism 6 can move the solder jet device 2 to an arbitrary position inside the housing 11 while maintaining the posture of the solder jet device 2.
- FIG. 3 is a block diagram showing a schematic configuration of the soldering apparatus 1.
- the soldering apparatus 1 includes an overall control unit 10 and a gas supply unit 7 in addition to the solder jet device 2, the warning indicator 13, the substrate transport mechanism 8, and the triaxial moving mechanism 6 described above.
- the overall control unit 10 is, for example, a programmable logic controller (PLC).
- PLC programmable logic controller
- the overall control unit 10 performs overall processing of the solder jet device 2, the warning indicator 13, the substrate transport mechanism 8, the triaxial moving mechanism 6, and the gas supply unit 7 by performing processing according to a program.
- the gas supply unit 7 supplies a gas that is an inert gas such as nitrogen to the solder jet device 2.
- a gas that is an inert gas such as nitrogen
- FIG. 4 is a perspective view showing the external appearance of the solder jet device 2.
- the vertical direction in the figure corresponds to the vertical direction (the same applies to the subsequent figures).
- the solder jet device 2 includes a solder container 20, a lid 21, and a jet nozzle 22.
- the solder container 20 accommodates the melted solder inside.
- the lid 21 is a circular member that covers the top of the solder container 20.
- the jet nozzle 22 jets solder.
- the lid 21 is provided with two circular openings 21a and 21b. The diameters of the two openings 21a and 21b are different.
- the relatively large diameter central opening 21 a is provided at a position corresponding to the center of the circle in the lid 21.
- the jet nozzle 22 is disposed in the central opening 21a. A part of the jet nozzle 22 protrudes above the lid 21. The upper end of the protruding portion forms a nozzle opening. The jet nozzle 22 jets the melted solder from the nozzle opening.
- the opening portion 21 b having a relatively small diameter is a solder supply port for supplying solder into the solder container 20.
- the opening 21 b is provided at a position away from the central opening 21 a in the lid 21.
- the solder jet device 2 includes a gas introduction pipe 23.
- the gas introduction tube 23 is provided at the upper part of the side surface of the solder container 20 and guides the gas into the solder container 20.
- the gas introduction pipe 23 introduces a gas such as nitrogen supplied from the gas supply unit 7 (see FIG. 3) into the solder container 20.
- FIG. 5 shows the internal configuration of the solder jet device 2.
- FIG. 5 shows a simplified internal configuration of the solder jet device 2 for explanation.
- the solder container 20 of the solder jet device 2 is made of metal such as stainless steel.
- the solder container 20 has a cylindrical shape and has an upper container part 20a and a lower container part 20b having different diameters.
- the upper container portion 20a having a relatively large diameter is disposed above the lower container portion 20b having a relatively small diameter.
- the solder container 20 includes a step portion 20c.
- the step portion 20c extends in the horizontal direction and connects the upper container portion 20a and the lower container portion 20b.
- the solder jet device 2 includes a partition plate 31.
- the partition plate 31 is disposed inside the solder container 20 and extends in the horizontal direction.
- the partition plate 31 is a metal and circular plate material such as stainless steel.
- the partition plate 31 is in contact with the stepped portion 20c of the solder container 20 from above.
- the partition plate 31 is fixed to the step portion 20c with a fastener 39 such as a screw.
- the partition plate 31 partitions the inside of the solder container 20 into an upper part and a lower part, and allows the upper part and the lower part to function as different purpose solder tanks.
- the upper part (inside the upper container part 20 a) than the partition plate 31 inside the solder container 20 functions as the solder collection tank 4.
- the solder recovery tank 4 recovers the solder that has flowed out after being jetted from the jet nozzle 22.
- the lower part (inside the lower container part 20 b) than the partition plate 31 inside the solder container 20 functions as the solder storage tank 5.
- the solder storage tank 5 supplies molten solder to the jet nozzle 22 in response to gas supply.
- the solder recovery tank 4 and the solder storage tank 5 are arranged vertically, so that the overall size of the solder jet device 2 can be made relatively small.
- the partition plate 31 forms the bottom surface of the solder collection tank 4 and the top surface of the solder storage tank 5.
- a communication port 33 is formed in the partition plate 31.
- the communication port 33 communicates the inside of the solder recovery tank 4 with the inside of the solder storage tank 5.
- the communication port 33 is an opening having a circular cross section.
- the solder jet device 2 includes an opening / closing valve 24.
- the on-off valve 24 is disposed above the communication port 33 and opens and closes the communication port 33.
- the on-off valve 24 is a member made of metal such as stainless steel and having a cylindrical shape.
- the on-off valve 24 is disposed so as to extend in the vertical direction.
- the lower end portion of the on-off valve 24 is formed in a hemispherical shape.
- the solder jet device 2 includes an interlocking plate 25.
- the interlocking plate 25 extends in the horizontal direction and is connected to the upper part of the on-off valve 24.
- the on-off valve 24 opens and closes the communication port 33 by moving the interlocking plate 25 up and down.
- the solder recovered in the solder recovery tank 4 returns to the solder storage tank 5.
- a central port 32 is formed at a position corresponding to the center of the circle of the partition plate 31.
- the central port 32 is an opening having a circular cross section.
- the lower end portion of the jet nozzle 22 for jetting the solder is fitted in the central port 32.
- the jet nozzle 22 is made of a metal such as stainless steel and is a cylindrical member having a circular cross section.
- the jet nozzle 22 is disposed so as to pass through the central opening 21a of the lid 21 and extend in the vertical direction.
- the upper end portion 22 a of the jet nozzle 22 is disposed above the lid body 21.
- the solder jet device 2 includes a supply pipe 35.
- the supply pipe 35 is disposed below the central port 32 of the partition plate 31.
- the supply pipe 35 serves as a solder supply path from the solder storage tank 5 to the jet nozzle 22.
- the supply pipe 35 is a cylindrical member made of a metal such as stainless steel and having a circular cross section.
- the supply pipe 35 is disposed so as to extend in the vertical direction.
- the upper end 35a of the supply pipe 35 is joined to the lower surface of the partition plate 31 without a gap by welding or the like.
- An upper end 35 a of the supply pipe 35 surrounds the entire lower part of the central port 32. Thereby, the inside of the supply pipe 35 and the inside of the jet nozzle 22 communicate with each other.
- a lower end 35 b of the supply pipe 35 is disposed in the vicinity of the bottom surface 5 a of the solder storage tank 5 inside the solder storage tank 5.
- the lower end 35 b of the supply pipe 35 faces the bottom surface 5 a of the solder storage tank 5 in a non-contact manner.
- the solder accommodated in the solder storage tank 5 enters the inside of the supply pipe 35 from the lower end 35b of the supply pipe 35.
- the solder that has entered the inside of the supply pipe 35 is supplied to the lower end of the jet nozzle 22 via the central port 32.
- the solder supplied to the jet nozzle 22 rises inside the jet nozzle 22 and jets from the upper end portion 22 a of the jet nozzle 22.
- the solder flowing out of the jet nozzle 22 descends along the outer periphery of the jet nozzle 22, passes through the central opening 21 a, and moves to the solder recovery tank 4.
- the diameter of the jet nozzle 22 is, for example, 14 mm.
- the diameter of the central opening 21a is sufficiently larger than the diameter of the jet nozzle 22 and is, for example, 50 mm. For this reason, a space sufficient for the movement of the solder flowing out from the jet nozzle 22 is formed between the outer periphery of the jet nozzle 22 and the wall surface of the central opening 21a.
- the gas introduction pipe 23 for guiding the gas is disposed so as to pass through the inside of the solder recovery tank 4.
- One end of the gas introduction tube 23 is disposed outside the solder container 20.
- the other end of the gas introduction pipe 23 is connected to a gas introduction port 34 provided in the partition plate 31.
- a gas such as nitrogen supplied from the gas supply unit 7 is supplied to the upper part inside the solder storage tank 5 through the gas introduction pipe 23 and the gas introduction port 34.
- the solder jet device 2 includes a return pipe 36.
- the return pipe 36 is disposed below the communication port 33 of the partition plate 31.
- the return pipe 36 is a return path of solder from the solder recovery tank 4 to the solder storage tank 5.
- the return pipe 36 is made of a metal such as stainless steel and is a cylindrical member having a circular cross section.
- the return pipe 36 is disposed so as to extend in the vertical direction.
- the upper end 36a of the return pipe 36 is joined to the lower surface of the partition plate 31 without a gap by welding or the like.
- An upper end 36 a of the return pipe 36 surrounds the entire lower part of the communication port 33.
- a lower end 36 b of the return pipe 36 is disposed in the vicinity of the bottom surface 5 a of the solder storage tank 5 inside the solder storage tank 5.
- the lower end 36 b of the return pipe 36 faces the bottom surface 5 a of the solder storage tank 5 in a non-contact manner.
- the solder jet device 2 includes a cover member 37.
- the cover member 37 covers the inner surface of the solder container 20 (the inner surface of the lower container portion 20b) from the inside.
- the cover member 37 is made of a metal such as stainless steel, and is a cylindrical member having a circular cross section.
- the diameter of the cover member 37 is larger than the diameters of the supply pipe 35 and the return pipe 36.
- the cover member 37 is disposed along the inner surface of the solder container 20 having a circular cross section (the inner surface of the lower container portion 20b). For this reason, the supply pipe 35 and the return pipe 36 are disposed inside the cover member 37.
- the cover member 37 is preferably in contact with the inner surface of the solder container 20.
- the upper end 37a of the cover member 37 is joined to the lower surface of the partition plate 31 without a gap by welding or the like.
- the upper end 37a of the cover member 37 covers the entire boundary portion between the partition plate 31 and the solder container 20 (the portion where the partition plate 31 and the stepped portion 20c abut) from the inside.
- the lower end 37 b of the cover member 37 is disposed in the vicinity of the bottom surface 5 a of the solder storage tank 5 inside the solder storage tank 5.
- the lower end 37 b of the cover member 37 faces the bottom surface 5 a of the solder storage tank 5 in a non-contact manner.
- the lower ends of the supply pipe 35, the return pipe 36, and the cover member 37 are all disposed in the vicinity of the bottom surface 5a of the solder storage tank 5.
- the heights of the lower ends of the supply pipe 35, the return pipe 36, and the cover member 37 are different.
- the lower end 35b of the supply pipe 35 is arranged highest. That is, the lower end 36 b of the return pipe 36 and the lower end 37 b of the cover member 37 are disposed lower than the lower end 35 b of the supply pipe 35.
- the supply pipe 35, the return pipe 36, and the cover member 37 are joined to the partition plate 31.
- the partition plate 31, the supply pipe 35, the return pipe 36, and the cover member 37 are integrated to form one internal container 30 indicated by hatching in the drawing.
- the solder container 2 is assembled by fitting the inner container 30 into the solder container 20.
- the inner container 30 in which the partition plate 31, the supply pipe 35, the return pipe 36, and the cover member 37 are integrated may be formed by a technique different from welding.
- FIG. 7 is an exploded perspective view showing a detailed configuration of the solder jet device 2.
- FIG. 7 corresponds to a state in which the lid 21 is removed from the solder container 20 shown in FIG.
- the solder jet device 2 includes a valve driving unit 26.
- the valve drive unit 26 is disposed outside the solder container 20.
- the valve drive unit 26 is connected to an interlocking plate 25 connected to the on-off valve 24.
- the interlocking plate 25 has a T-shape when viewed from above.
- the valve drive unit 26 includes a cylinder that is driven to extend and contract, and can move the interlocking plate 25 up and down. Therefore, when the valve drive unit 26 is driven, the on-off valve 24 connected to the interlocking plate 25 moves and opens and closes the communication port 33.
- the solder jet device 2 includes four heaters 41 and four heaters 51.
- the four heaters 41 heat and melt the solder in the solder recovery tank 4.
- the four heaters 51 heat and melt the solder in the solder storage tank 5. These heaters 41 and 51 are respectively installed inside the solder container 20.
- the four heaters 41 for the solder recovery tank 4 are arranged at equal intervals in the circumferential direction of the upper container portion 20a corresponding to the outer wall of the solder recovery tank 4.
- the four heaters 51 for the solder storage tank 5 are arranged at equal intervals in the circumferential direction of the lower container portion 20 b corresponding to the outer wall of the solder storage tank 5. Since the upper container part 20a and the lower container part 20b are cylindrical, by arranging the heaters 41 and 51 in this way, the solder accommodated in each of the upper container part 20a and the lower container part 20b is evenly distributed. Can be heated.
- the upper and lower parts of the solder container 20 can be heated at different timings.
- the soldering device 1 is turned off, the solder accommodated in the solder container 20 of the solder jet device 2 is cooled and solidified.
- the solidified solder is heated from the lower part, the lower solder is melted first.
- the melted lower solder expands and the upper unmelted solder is rapidly pushed up, and a phenomenon of overflowing outside the solder container 20 (solder explosion) may occur.
- the overall control unit 10 energizes the lower heater 51 after a certain period of time has passed since the upper heater 41 is energized. Therefore, after the solder in the upper part of the solder container 20 is sufficiently heated, the solder in the lower part of the solder container 20 is heated. Thereby, since the upper solder is melted first, the above-described phenomenon (solder explosion) can be prevented.
- the solder jet device 2 includes two temperature sensors 42 and 52. These temperature sensors 42 and 52 indirectly detect the temperature of the solder by detecting the temperature of the solder container 20. These temperature sensors 42 and 52 are, for example, thermocouples.
- the temperature sensor 42 detects the temperature of the upper container portion 20 a corresponding to the outer wall of the solder recovery tank 4.
- the temperature sensor 52 detects the temperature of the lower container portion 20 b corresponding to the outer wall of the solder storage tank 5.
- the overall control unit 10 controls the operation of the heaters 41 and 51 based on the detection results of these temperature sensors 42 and 52.
- the solder jet device 2 includes a liquid level detection unit 43.
- the liquid level detection unit 43 detects the level of the solder liquid level in the solder recovery tank 4.
- the liquid level detection unit 43 includes two electrodes 43a having different lengths. One electrode 43a is used to detect a shortage of solder. The other electrode 43a is used to detect solder overflow.
- the liquid level detection unit 43 detects whether the liquid level of the solder is up to the tip position of the electrode 43a through the energized state between the electrode 43a and the solder container 20. When the liquid level detection unit 43 detects the shortage of solder, the solder is supplied into the solder recovery tank 4 through the opening 21b of the lid 21 serving as a solder supply port.
- the solder jet device 2 includes a gas heating unit 44.
- the gas heating unit 44 is disposed outside the solder container 20.
- the gas heating unit 44 is supplied with a gas such as nitrogen from the gas supply unit 7 through a path different from the path to the gas introduction pipe 23.
- the gas heating unit 44 heats the gas supplied from the gas supply unit 7 to, for example, 300 ° C., and supplies the heated gas to the solder recovery tank 4.
- the heated gas supplied from the gas heating unit 44 to the solder recovery tank 4 passes around the jet nozzle 22 in the central opening 21 a and is jetted to the upper part of the solder jet device 2. Therefore, the gas heating unit 44 can preheat the target area of the printed circuit board 9 and can reduce oxidation of the outer periphery of the jet nozzle 22.
- FIG. 8 shows a basic operation flow of the soldering apparatus 1.
- FIG. 8 shows an operation for processing one printed circuit board 9. Therefore, the operation shown in FIG. 8 is repeated every time one printed circuit board 9 is processed. Further, at the start of the operation shown in FIG. 8, the solder jet device 2 stands by at a predetermined initial position and does not jet solder.
- FIG. 9 shows the state of the solder jet device 2 (hereinafter referred to as the initial state) at the start of the operation shown in FIG.
- the initial state of the solder jet device 2 the on-off valve 24 opens the communication port 33.
- the solder S inside the solder recovery tank 4 and the solder S inside the solder storage tank 5 are integrated.
- the liquid level of the solder S is located in the lower part of the solder recovery tank 4. Also, the solder S has entered the jet nozzle 22 up to the same position as the liquid level.
- one printed circuit board 9 that is an object is carried into the soldering apparatus 1 (step S11).
- the substrate transport mechanism 8 receives the printed circuit board 9 on which the flux is applied from an adjacent device or the like, and transports it to a predetermined position (arrow AR1 in FIG. 1).
- the board transport mechanism 8 stops moving the printed board 9.
- the triaxial moving mechanism 6 moves the solder jet device 2 from the initial position to a processing position for performing soldering (step S12). Then, during the movement of the solder jet device 2 to the processing position by the triaxial moving mechanism 6, the solder jet device 2 starts jetting the solder S (step S13).
- FIG. 10 shows a state of the solder jet device 2 that starts the jet of the solder S.
- the valve drive unit 26 is driven, and the on-off valve 24 closes the communication port 33.
- the inside of the solder storage tank 5 is in a sealed state.
- the gas supply unit 7 (see FIG. 3) supplies a gas such as pressurized nitrogen to the gas introduction pipe 23 of the solder jet device 2.
- This gas is supplied to the inside of the solder storage tank 5 from the gas introduction port 34 disposed in the upper part of the solder storage tank 5 via the gas introduction pipe 23.
- the pressurized gas is supplied above the liquid level of the solder S accommodated in the solder storage tank 5.
- the solder storage tank 5 receives this gas supply and supplies the solder S to the jet nozzle 22. Since the inside of the solder reservoir 5 is sealed, the solder S accommodated in the solder reservoir 5 is pressed downward by the pressure of the gas. A part of the pressed solder S enters the jet nozzle 22 via the supply pipe 35. The solder S that has entered the jet nozzle 22 rises inside the jet nozzle 22 and jets from the upper end of the jet nozzle 22. As a result, a flow of solder S in a hemispherical shape is formed at the upper end of the jet nozzle 22.
- Solder S flowing out from the jet nozzle 22 descends along the outer peripheral surface of the jet nozzle 22 while covering the entire circumference of the jet nozzle 22.
- the descending solder passes through the central opening 21 a and moves to the solder recovery tank 4.
- the solder S flowing out from the jet nozzle 22 is recovered in the solder recovery tank 4.
- the triaxial moving mechanism 6 moves the solder jet device 2 in the state of jetting the solder S to the processing position.
- a soldering process for selectively soldering the target area of the printed circuit board 9 is performed (step S14).
- FIG. 11 is a diagram for explaining the operation of the soldering process.
- the triaxial moving mechanism 6 raises the solder jet device 2 (arrow AR11).
- the solder S flowing in a state of rising from the upper end portion of the jet nozzle 22 contacts a part of the lead 92 of the electronic component 91 in the target region of the printed circuit board 9.
- the triaxial moving mechanism 6 moves the solder jet device 2 in the horizontal direction within the range of the target area of the printed circuit board 9 (arrow AR12).
- the solder S jetted from the jet nozzle 22 adheres to the entire lead 92 of the electronic component 91 in the target area of the printed circuit board 9.
- the triaxial moving mechanism 6 lowers the solder jet device 2 (arrow AR13).
- the solder jet device 2 can jet the solder S continuously in a predetermined jet period (for example, 60 seconds). The solder jet device 2 completes the soldering process for all the target areas existing on one printed circuit board 9 during this jet period. During the jet period, the position of the liquid surface of the solder S inside the solder reservoir 5 is gradually lowered.
- the triaxial moving mechanism 6 moves the solder jet device 2 from the processing position to the initial position (step S16). Then, during the movement of the solder jet device 2 to the initial position by the triaxial moving mechanism 6, the solder jet device 2 stops the jet of solder (step S17).
- FIG. 12 shows a state of the solder jet device 2 in which the jet of the solder S is stopped.
- the gas supply unit 7 stops supplying the gas to the solder jet device 2, and the valve driving unit 26 is driven to open the communication port 33 by the on-off valve 24.
- solder S collected and accumulated in the solder collection tank 4 flows into the solder storage tank 5 via the communication port 33 and the return pipe 36.
- the solder S jetted from the jet nozzle 22 and flowing out without contacting the printed circuit board 9 returns to the solder reservoir 5.
- the gas filled in the solder storage tank 5 is pushed out by such solder S, flows back through the gas introduction pipe 23 via the gas introduction port 34, and is discharged outside the solder jet device 2. Thereafter, when the solder S fills the entire interior of the solder storage tank 5, the solder jet device 2 returns to the initial state shown in FIG.
- step S18 the printed circuit board 9 having been subjected to the soldering process is carried out (step S18).
- the board transport mechanism 8 transports the printed circuit board 9 from a predetermined position to the end of the soldering apparatus 1 and delivers the printed circuit board 9 to an adjacent apparatus or the like (arrow AR2 in FIG. 1).
- the soldering apparatus 1 performs soldering with respect to one printed circuit board 9 by performing a series of operations as described above.
- the solder jet device 2 performs an operation of returning the solder S recovered in the solder recovery tank 4 to the solder storage tank 5 (the operation of FIG. 12). That is, the solder jet device 2 is in a state in which the solder S is not jetted at regular intervals, and the solder S is jetted intermittently. Therefore, it can be said that the soldering apparatus 1 is an intermittent jet soldering apparatus.
- the solder jet device 2 of the present embodiment is configured such that the inside of the solder storage tank 5 is maintained in a sealed state by the return pipe 36 and the cover member 37 joined to the lower surface of the partition plate 31. Yes.
- FIG. 13 shows a solder jet device 2a according to a comparative example.
- the configuration of the solder jet device 2a is different from the configuration of the solder jet device 2 according to the present embodiment only in that the return pipe 36 and the cover member 37 are not provided.
- solder jet device 2a in order to jet the solder S from the jet nozzle 22, it is assumed that the communication port 33 is closed by the on-off valve 24 and the gas is supplied to the gas introduction pipe. Also in this case, the gas is supplied from the gas inlet 34 to above the liquid level of the solder S accommodated in the solder reservoir 5, and the extruded solder S is jetted through the supply pipe 35. Jets from the upper end of 22.
- a communication port 33 is formed on the upper surface of the solder storage tank 5. Therefore, when the gas is supplied to the solder storage tank 5 in this way, the gas enters under the communication port 33. The gas also enters the boundary portion between the partition plate 31 and the solder container 20 (the portion where the partition plate 31 and the stepped portion 20c abut). The size of the gas molecules is smaller than the size of the molten solder S molecules.
- the on-off valve 24 closes the communication port 33, the on-off valve 24 and the communication port 33 are in contact with each other.
- a contact portion between the on-off valve 24 and the communication port 33 (a portion surrounded by a broken line A1 in the figure) has a slight gap that allows the gas to enter although the solder S cannot enter. For this reason, the gas supplied to the solder storage tank 5 may leak into the solder recovery tank 4 from such a slight gap.
- solder jet device 2a in the solder jet device 2a according to the comparative example, gas may leak from the solder storage tank 5 to the solder recovery tank 4.
- the gas leaks in this way, the inside of the solder storage tank 5 cannot be maintained in a sealed state. Therefore, the solder S cannot be stably jetted from the jet nozzle 22. As a result, there is a possibility that soldering to the target area of the printed circuit board 9 cannot be performed accurately.
- the upper end 36 a of the return pipe 36 is joined to the lower surface of the partition plate 31 so as to surround the entire lower part of the communication port 33. Yes.
- the gas cannot enter the return pipe 36. Therefore, since the inside of the return pipe 36 is filled with the solder S, gas does not enter below the communication port 33. Therefore, it is possible to prevent gas leakage from a contact portion between the on-off valve 24 and the communication port 33 (portion surrounded by a broken line A1 in the drawing).
- the solder S cannot enter the contact portion between the on-off valve 24 and the communication port 33 due to the size of the molecule, the solder storage tank 5 can be maintained in a sealed state.
- the upper end 37a of the cover member 37 is joined to the lower surface of the partition plate 31, and the entire boundary portion between the partition plate 31 and the solder container 20 (the portion surrounded by the broken line A2 in the figure). Is covered from the inside. Although it is desirable that the cover member 37 and the inner surface of the solder container 20 are in contact with each other, the gap is filled with the solder S even when there is a gap between the cover member 37 and the inner surface of the solder container 20.
- the solder storage tank 5 when the gas is supplied to the solder storage tank 5, the gas cannot enter between the cover member 37 and the inner surface of the solder container 20. Since gas does not enter the boundary portion between the partition plate 31 and the solder container 20, gas leakage from the boundary portion between the partition plate 31 and the solder container 20 can also be prevented. Further, since the solder S cannot enter the boundary portion between the partition plate 31 and the solder container 20 due to the size of the molecule, the solder storage tank 5 can be maintained in a sealed state.
- the inside of the solder storage tank 5 can be maintained in a sealed state by the return pipe 36 and the cover member 37 joined to the lower surface of the partition plate 31. For this reason, the solder S can be stably jetted from the jet nozzle 22. Therefore, the soldering can be accurately performed on the target area of the printed circuit board 9.
- the solder S accommodated in the solder storage tank 5 during the supply of gas to the solder storage tank 5 (during the jet flow) due to a decrease in the amount of solder S in the solder storage tank 5 or the like. It is conceivable that the position of the liquid level is lower than expected. In this case, as shown in FIG. 14, when the position of the liquid surface of the solder S accommodated in the solder storage tank 5 is lowered to the lower end 35b of the supply pipe 35, the gas is supplied to the supply pipe 35 and the jet flow. It goes out of the solder jet device 2 via the nozzle 22.
- the gas does not press the liquid surface of the solder S. Therefore, the solder S does not jet from the jet nozzle 22. For this reason, the position of the liquid level of the solder S accommodated in the solder storage tank 5 is not significantly lower than the lower end 35 b of the supply pipe 35.
- the lower end 36b of the return pipe 36 and the lower end 37b of the cover member 37 are disposed lower than the lower end 35b of the supply pipe 35. According to such a configuration, the position of the liquid level of the solder S accommodated in the solder storage tank 5 is not significantly lower than the lower end 35b of the supply pipe 35. Therefore, the inside of the return pipe 36 and the cover member Gas does not enter between 37 and the inner surface of the solder container 20.
- gas supply to the solder storage tank 5 will be described. As described above, when the gas supply unit 7 supplies a pressurized gas such as nitrogen to the solder storage tank 5 of the solder jet device 2, the solder S is jetted from the jet nozzle 22.
- a pressurized gas such as nitrogen
- the flow rate of the solder S jetted by the jet nozzle 22 is proportional to the flow rate of the gas supplied from the gas supply unit 7 to the solder storage tank 5.
- the flow rate Q1 of the solder S jetted by the jet nozzle 22 is expressed by the following equation (1) by the gas flow rate Q2 supplied to the solder storage tank 5 by the gas supply unit 7 and a predetermined coefficient K.
- the coefficient K is a value determined according to the type of gas, the size of the solder jet device, and the like.
- the coefficient K is, for example, 0.7. Since the gas supplied to the solder storage tank 5 is compressed inside the solder storage tank 5, the flow rate Q1 of the solder S jetted is smaller than the flow rate Q2 of this gas.
- the flow rate Q1 of the solder S jetted by the jet nozzle 22 is proportional to the flow rate Q2 of the gas supplied to the solder storage tank 5 by the gas supply unit 7, if the flow rate Q2 of the gas supplied to the solder storage tank 5 can be grasped, the jet flow The flow rate Q1 of the solder S jetted by the nozzle 22 can be indirectly grasped.
- FIG. 15 shows temporal changes in the pressure P and the flow rate Q2 of the gas supplied from the gas supply unit 7 to the solder storage tank 5 in this case.
- the solid line in the figure indicates the gas pressure P.
- the broken line in the figure indicates the gas flow rate Q2.
- the gas supply unit 7 starts supplying gas at time T1 and stops supplying gas at time T2.
- the gas flow rate Q ⁇ b> 2 supplied to the solder storage tank 5 by the gas supply unit 7 is the passage of time. It gradually decreases with time. That is, the flow rate Q1 of the solder S jetted by the jet nozzle 22 gradually decreases with time.
- FIG. 16 is a diagram for explaining this principle.
- the figure on the left shows the state of the solder jet device 2 immediately after the gas supply unit 7 starts supplying gas.
- the diagram on the right side shows the state of the solder jet device 2 after a certain amount of time has elapsed since the gas supply unit 7 started supplying gas.
- the jet nozzle 22 and the supply pipe 35 are regarded as one nozzle and are simply referred to as the jet nozzle 22.
- the solder jet device 2 when the gas supplied into the solder storage tank 5 presses the liquid level of the solder S downward, the jet nozzle 22 starts from the position L of the liquid level of the solder S inside the jet nozzle 22. A force is generated that pushes up the solder S to a position above the upper end 22a. As a result, the solder jet device 2 jets the solder S from the upper end portion 22 a of the jet nozzle 22.
- the position L of the solder S liquid level in the solder reservoir 5 gradually decreases.
- the distance H that needs to push up the solder S inside the jet nozzle 22 gradually increases. Therefore, if a constant pressure is continuously applied to the liquid level of the solder S inside the solder storage tank 5, the force for pushing up the solder S above the upper end portion 22a of the jet nozzle 22 gradually decreases due to the Pascal principle. .
- the flow rate Q1 of the solder S jetted by the jet nozzle 22 (that is, the flow rate Q2 of the gas supplied by the gas supply unit 7) gradually decreases with time.
- the soldering apparatus 1 has a function of making the flow rate Q2 of the gas supplied to the solder reservoir 5 constant.
- FIG. 17 shows a configuration related to gas supply in the soldering apparatus 1.
- the gas supply unit 7 includes a gas supply source 71 and a gas supply path 79.
- the gas supply source 71 is a supply source of a gas such as nitrogen.
- the gas is supplied from the gas supply source 71 to the solder jet device 2 through the gas supply path 79.
- An example of the gas supply source 71 is a cylinder.
- Examples of the gas supply path 79 include a hose.
- the gas supply unit 7 includes a pressure adjustment unit 72 and a flow rate detection unit 73. The pressure adjustment unit 72 and the flow rate detection unit 73 are disposed on the gas supply path 79.
- the pressure adjusting unit 72 adjusts the pressure of the gas flowing through the gas supply path 79 (that is, the gas supplied to the solder reservoir 5).
- the pressure adjustment unit 72 includes a valve inside.
- the pressure adjustment unit 72 adjusts the pressure of the gas flowing through the gas supply path 79 by adjusting the opening degree of the valve in accordance with the electrical signal given from the overall control unit 10.
- the flow rate detection unit 73 detects the flow rate Q2 of the gas flowing through the gas supply path 79 (that is, the gas supplied to the solder reservoir 5).
- the flow rate detection unit 73 is, for example, a thermal mass flow meter, and detects the flow rate Q2 of the gas flowing through the gas supply path 79 by detecting the amount of heat taken away by the gas.
- the flow rate detection unit 73 outputs the detected gas flow rate Q2 to the overall control unit 10 as an electrical signal.
- the overall control unit 10 includes a pressure instruction unit 10a and an abnormality detection unit 10b as part of functions realized by performing processing according to a program.
- the pressure indicator 10a performs feedback control so that the gas flow rate Q2 is constant. That is, based on the gas flow rate Q2 detected by the flow rate detection unit 73, the pressure instruction unit 10a applies the gas pressure to the pressure adjustment unit 72 so that the gas flow rate Q2 approaches a predetermined reference amount. Let them adjust.
- the pressure instruction unit 10a causes the pressure adjustment unit 72 to increase the gas pressure.
- the pressure instruction unit 10a causes the pressure adjustment unit 72 to reduce the gas pressure.
- FIG. 18 shows temporal changes in the pressure P and the flow rate Q2 of the gas supplied to the solder storage tank 5 by the gas supply unit 7 according to this embodiment.
- the solid line in the figure indicates the gas pressure P.
- the broken line in the figure indicates the gas flow rate Q2.
- the gas supply unit 7 starts supplying gas at time T1 and stops supplying gas at time T2.
- the pressure indicating unit 10a and the pressure adjusting unit 72 adjust the pressure P of the gas supplied to the solder storage tank 5, and gradually increase the pressure P of the gas over time.
- the gas flow rate Q2 supplied to the solder reservoir 5 by the gas supply unit 7 is made constant.
- the flow rate Q1 of the solder S jetted by the jet nozzle 22 is proportional to the gas flow rate Q2. Therefore, the flow rate Q1 of the solder S jetted by the jet nozzle 22 is also constant and stabilized.
- the 17 detects an abnormality of the soldering apparatus 1 based on the gas pressure P adjusted by the pressure instruction unit 10a and the pressure adjustment unit 72.
- the abnormality detection unit 10b shown in FIG. When the soldering apparatus 1 is operating normally, the gas pressure P adjusted by the pressure indicating unit 10a and the pressure adjusting unit 72 is a value within a predetermined reference range.
- the abnormality detection unit 10b determines that an abnormality has occurred when the adjusted gas pressure P is higher than the predetermined first threshold value.
- the abnormality detection unit 10b determines that an abnormality has occurred even when the adjusted gas pressure P is lower than the predetermined second threshold value. Therefore, the abnormality detection unit 10b can easily detect the abnormality of the soldering apparatus 1 based on the gas pressure P adjusted by the pressure instruction unit 10a and the pressure adjustment unit 72.
- FIG. 19 shows a flow of operation of the soldering apparatus 1 relating to gas supply.
- the operation of FIG. 19 is performed in parallel with the operation (steps S13 to S17) from the start of the jet of solder S to the stop of the jet of solder S in FIG.
- step S21 the gas supply unit 7 starts supplying gas to the solder jet device 2 (step S21).
- step S21 the solder jet device 2 starts jetting the solder S.
- step S21 corresponds to step S13 in FIG.
- the flow rate detector 73 detects the flow rate Q2 of the gas supplied to the solder reservoir 5 (step S22).
- the flow rate detection unit 73 outputs the detected gas flow rate Q2 to the overall control unit 10 as an electrical signal.
- the pressure instruction unit 10a of the overall control unit 10 compares the gas flow rate Q2 detected by the flow rate detection unit 73 with a predetermined reference amount (step S23).
- the pressure instruction unit 10a sends a signal to the pressure adjustment unit 72 to increase the gas pressure P (step S25).
- the pressure instruction unit 10a sends a signal to the pressure adjustment unit 72 to lower the gas pressure P (step S26).
- the abnormality detection unit 10b of the overall control unit 10 determines whether or not an abnormality has occurred in the soldering apparatus 1 based on the gas pressure P adjusted by the pressure instruction unit 10a and the pressure adjustment unit 72 ( Step S27). If abnormality detection unit 10b does not detect an abnormality (No in step S28), the process returns to step S22 again, and the same operation as described above is repeated. Such a series of operations is repeated until a predetermined jet period (for example, 60 seconds) ends (during No in step S29).
- a predetermined jet period for example, 60 seconds
- the pressure instruction unit 10a and the pressure adjustment unit 72 adjust the gas pressure P so that the gas flow rate Q2 approaches the reference amount in response to a change in the gas flow rate Q2 supplied to the solder storage tank 5 in real time. To do. As a result, the flow rate Q2 of the gas supplied to the solder reservoir 5 is maintained constant from the start to the end of the jet period. That is, the flow rate Q1 of the solder S jetted by the jet nozzle 22 is maintained constant.
- step S30 the gas supply unit 7 stops supplying gas to the solder jet device 2 (step S30). Thereby, the solder jet device 2 stops the jet of the solder S.
- step S30 corresponds to step S17 in FIG.
- the abnormality detection unit 10b detects an abnormality during the jet period (Yes in step S28), the abnormality detection unit 10b forcibly stops the operation of the soldering apparatus 1 (step S31). Further, the abnormality detection unit 10b turns on the rotating lamp of the warning indicator 13 to notify the user of the abnormality (step S32).
- the flow rate detection unit 73 detects the flow rate Q2 of the gas supplied to the solder storage tank 5, thereby indirectly setting the flow rate Q1 of the solder jetted by the jet nozzle 22. To detect. For this reason, the flow rate Q1 of the solder can be grasped without directly detecting the flow rate Q1 of the flowing solder.
- the pressure indicating unit 10 a and the pressure adjusting unit 72 adjust the pressure of the gas supplied to the solder storage tank 5 based on the gas flow rate Q ⁇ b> 2 detected by the flow rate detection unit 73, and the gas supplied to the solder storage tank 5.
- the flow rate Q2 is kept constant. Therefore, the flow rate Q1 of the solder S jetted by the jet nozzle 22 can be stabilized, and soldering can be accurately performed on the target region of the printed circuit board 9.
- the cross sections of the jet nozzle 22, the supply pipe 35, and the return pipe 36 are circular.
- these cross sections may be other shapes such as an ellipse or a rectangle.
- the cross section of the cover member 37 is also circular.
- the cross-sectional shape of the cover member 37 may be a shape that matches the shape of the inner surface of the solder container 20 so that the cover member 37 can be disposed along the inner surface of the solder container 20.
- the partition plate 31 is fixed to the stepped portion 20c of the solder container 20.
- the partition plate may be fixed to the wall surface of the solder container having no stepped portion. In this case, if the cover member covers the entire boundary portion between the partition plate and the solder container, gas leakage from the boundary portion between the partition plate and the solder container can be prevented.
- the partition plate 31 and the solder container 20 are fixed by a fastener 39.
- the partition plate and the solder container may be joined without a gap by welding or the like.
- a cover member for preventing gas leakage from the boundary portion between the partition plate and the solder container can be omitted.
- the jet nozzle 22 and the supply pipe 35 are configured as separate members. However, the jet nozzle 22 and the supply pipe 35 may be configured as one member.
- FIG. 20 is a perspective view showing the appearance of the solder jet device 102.
- the vertical direction in the figure corresponds to the vertical direction (the same applies to the subsequent figures).
- the solder jet device 102 includes a housing 121 and a lid body 122.
- the casing 121 accommodates the melted solder inside.
- the casing 121 has a cylindrical shape and has a large-diameter portion and a small-diameter portion. The large diameter portion is disposed above the small diameter portion.
- the lid body 122 is a circular member that covers the upper cylindrical portion of the housing 121.
- the lid body 122 is provided with two large and small circular openings 122a and 122b.
- the relatively large central opening 122 a is provided at a position corresponding to the center of the circle in the lid 122.
- the solder jet device 102 includes a jet nozzle 124.
- the jet nozzle 124 is disposed in the central opening 122a. A part of the jet nozzle 124 protrudes above the lid 122. The upper end of the protruding portion forms a nozzle opening.
- the jet nozzle 124 jets molten solder from the nozzle port.
- the relatively small opening 122b is a solder supply port for supplying solder into the housing 121.
- the opening 122b is provided at a position away from the central opening 122a in the lid 122.
- the solder jet device 102 includes a gas introduction pipe 123.
- the gas introduction pipe 123 is provided at the upper part of the side surface of the housing 121 and guides the gas into the housing 121.
- the gas introduction pipe 123 introduces a gas such as nitrogen supplied from the gas supply unit 7 (see FIG. 3) into the housing 121.
- FIG. 21 shows the internal configuration of the solder jet device 102.
- FIG. 21 shows a simplified internal configuration of the solder jet device 102 for the sake of explanation.
- the solder jet device 102 includes an inner wall 121a.
- the inner wall 121a is disposed inside the housing 121 and divides the interior of the housing 121 into an upper part and a lower part.
- the divided upper and lower parts function as solder tanks for different purposes.
- the lower part than the inner wall 121a functions as the solder storage tank 104.
- the solder storage tank 104 stores the melted solder before jetting from the jet nozzle 124.
- the upper part of the inner wall 121 a functions as the solder recovery tank 103.
- the solder recovery tank 103 recovers the solder that has flowed out after being jetted from the jet nozzle 124. Since the solder recovery tank 103 is disposed above the solder storage tank 104, the overall size of the solder jet device 102 can be made relatively small.
- the inner wall 121 a forms the bottom surface of the solder recovery tank 103 and the top surface of the solder storage tank 4.
- a communication port 130 is provided in the inner wall 121a.
- the communication port 130 communicates the inside of the solder recovery tank 103 and the inside of the solder storage tank 104.
- the communication port 130 has a small truncated cone shape whose diameter gradually decreases from the solder recovery tank 103 side toward the solder storage tank 104 side.
- the solder jet device 102 includes an on-off valve 131.
- the on-off valve 131 is disposed above the communication port 130 and opens and closes the communication port 130.
- the on-off valve 131 has a truncated cone shape similar to that of the communication port 130.
- the on-off valve 131 closes the communication port 130 by entering the communication port 130.
- a valve shaft 132 extending in the vertical direction is connected to the upper part of the on-off valve 131.
- the on-off valve 131 opens and closes the communication port 130 by moving the valve shaft 132 up and down.
- the jet nozzle 124 is disposed at the center of the solder recovery tank 103 and the solder storage tank 104.
- the jet nozzle 124 is a cylindrical body having an annular cross section.
- the jet nozzle 124 is made of, for example, a metal such as iron, and the outer periphery thereof is plated with solder.
- the jet nozzle 124 is disposed so as to extend through the inner wall 121a in the vertical direction.
- a lower end portion 124 b of the jet nozzle 124 is disposed inside the solder storage tank 104.
- the upper end portion 124 a of the jet nozzle 124 is disposed above the lid body 122.
- the solder accommodated in the solder storage tank 104 is supplied to the inside of the jet nozzle 124 via the lower end portion 124b of the jet nozzle 124.
- the solder supplied to the jet nozzle 124 rises inside the jet nozzle 124 and jets from the upper end portion 124 a of the jet nozzle 124. Then, the solder flowing out from the jet nozzle 124 descends along the outer periphery of the jet nozzle 124, passes through the central opening 122 a, and moves to the solder recovery tank 103.
- the diameter of the jet nozzle 124 is, for example, 14 mm.
- the diameter of the central opening 122a is sufficiently larger than the diameter of the jet nozzle 124, and is, for example, 50 mm. Therefore, a space sufficient for the movement of the solder flowing out from the jet nozzle 124 is formed between the outer periphery of the jet nozzle 124 and the wall surface of the central opening 122a.
- the gas introduction pipe 123 for guiding the gas is disposed so as to pass through the inside of the solder recovery tank 103.
- One end of the gas introduction pipe 123 is disposed outside the housing 121.
- the other end of the gas introduction pipe 123 is connected to a gas introduction port 140 provided on the upper surface of the solder storage tank 104.
- a gas such as nitrogen supplied from the gas supply unit 7 is supplied to the upper part of the solder storage tank 104 via the gas introduction pipe 123 and the gas introduction port 140.
- FIG. 22 is an exploded perspective view showing a more detailed configuration of the solder jet device 102.
- FIG. 22 corresponds to a state in which the lid body 122 is removed from the housing 121 shown in FIG.
- the solder jet device 102 includes a valve driving unit 134.
- the valve drive unit 134 is disposed outside the housing 121.
- the valve drive unit 134 is connected to an interlocking plate 133 connected to the on-off valve 131 via the valve shaft 132.
- the interlocking plate 133 has a T shape as viewed from above.
- the valve drive unit 134 includes a cylinder that is extended and contracted, and can move the interlocking plate 133 up and down. Therefore, when the valve drive unit 134 is driven, the on-off valve 131 connected to the interlocking plate 133 and the valve shaft 132 moves to open and close the communication port 130.
- the solder jet device 102 includes four heaters 135 and four heaters 145.
- the four heaters 135 heat and melt the solder in the solder recovery tank 103.
- the four heaters 145 heat and melt the solder in the solder storage tank 104.
- These heaters 135 and 145 are respectively installed inside the casing 121.
- the four heaters 135 for the solder recovery tank 103 are arranged at equal intervals in the circumferential direction of the upper portion of the housing 121 corresponding to the outer wall of the solder recovery tank 103.
- the four heaters 145 for the solder storage tank 104 are arranged at equal intervals in the circumferential direction of the lower part of the housing 121 corresponding to the outer wall of the solder storage tank 104.
- the independent heaters 135 and 145 at the upper and lower portions of the housing 121, the upper and lower portions of the housing 121 can be heated at different timings.
- soldering apparatus 101 When the soldering apparatus 101 is turned off, the solder accommodated in the casing 121 of the solder jet apparatus 102 is cooled and solidified. When the solidified solder is heated from the lower part, the lower solder is melted first. As a result, the melted lower solder expands and the upper unmelted solder is rapidly pushed up, and a phenomenon of overflowing outside the housing 121 (solder explosion) may occur.
- the overall control unit 10 When the soldering apparatus of the present embodiment is started from a power-off state, the overall control unit 10 (see FIG. 3) energizes the lower heater 145 after a certain period of time has passed since the upper heater 135 is energized. To do. Therefore, after the solder on the upper portion of the casing 121 is sufficiently heated, the solder on the lower portion of the casing 121 is heated. Thereby, since the upper solder is melted first, the above-described phenomenon (solder explosion) can be prevented.
- the solder jet device 102 includes two temperature sensors 136 and 146. These temperature sensors 136 and 146 indirectly detect the temperature of the solder by detecting the temperature of the casing 121. These temperature sensors 136 and 146 are, for example, thermocouples.
- the temperature sensor 136 detects the temperature of the upper part of the housing 121 corresponding to the outer wall of the solder recovery tank 103.
- the other temperature sensor 146 detects the temperature of the lower part of the housing 121 corresponding to the outer wall of the solder storage tank 104.
- the overall control unit 10 controls the operation of the heaters 135 and 146 based on the detection results of the temperature sensors 136 and 146.
- the solder jet device 102 includes a liquid level detection unit 137.
- the liquid level detection unit 137 detects the level of the solder liquid level in the solder recovery tank 104.
- the liquid level detection unit 137 includes two electrodes 137a having different lengths. One electrode 137a is used to detect a shortage of solder. The other electrode 137a is used to detect solder overflow.
- the liquid level detection unit 137 detects whether the liquid level of the solder is up to the tip position of the electrode 137a through the energized state between the electrode 137a and the housing 121. When the liquid level detection unit 137 detects the shortage of solder, the solder is supplied into the solder recovery tank 103 through the opening 122b of the lid 122 serving as a solder supply port.
- the solder jet device 102 includes a gas heating unit 138.
- the gas heating unit 138 is disposed outside the housing 121.
- a gas such as nitrogen is supplied from the gas supply unit 7 to the gas heating unit 138 through a path different from the path to the gas introduction pipe 123.
- the gas heating unit 138 heats the gas supplied from the gas supply unit 7 to, for example, 300 ° C., and supplies the heated gas to the solder recovery tank 103.
- the heated gas supplied from the gas heating unit 138 to the solder recovery tank 103 passes around the jet nozzle 124 in the central opening 122a and is jetted to the upper part of the solder jet device 102. Therefore, the gas heating unit 138 can preheat the target region of the printed circuit board 9 (see FIG. 2) and can reduce oxidation of the outer periphery of the jet nozzle 124.
- the solder jet device 102 also operates based on the basic flow shown in FIG. FIG. 23 shows the state (initial state) of the solder jet device 102 at the start of the operation shown in FIG.
- the on-off valve 131 opens the communication port 130.
- the solder 108 inside the solder recovery tank 103 and the solder 108 inside the solder storage tank 104 are integrated.
- the liquid level of the solder 108 is located below the solder recovery tank 103. Also, the solder 108 has penetrated into the jet nozzle 124 up to the same position as the liquid level.
- FIG. 24 is a diagram showing the state of the solder jet device 102 that has started jetting the solder 108 (step S13 in FIG. 8).
- the valve drive unit 134 is driven, and the on-off valve 131 closes the communication port 130.
- the solder 108 remaining in the solder recovery tank 103 completely closes the periphery of the on-off valve 131, and the interior of the solder storage tank 104 becomes a sealed space.
- the gas supply unit 7 supplies pressurized gas such as nitrogen to the gas introduction pipe 123 of the solder jet device 102.
- This gas is supplied to the inside of the solder storage tank 104 through the gas introduction pipe 123 from the gas introduction port 140 arranged at the upper part of the solder storage tank 104.
- the pressurized gas is supplied above the liquid level of the solder 108 accommodated in the solder storage tank 104. Since the solder reservoir 104 is sealed, the solder 108 accommodated in the solder reservoir 104 is pressed downward by the pressure of the gas. Part of the pressed solder 108 rises inside the jet nozzle 124 and jets from the upper end of the jet nozzle 124. As a result, a flow of the solder 108 in a hemispherical shape is formed at the upper end of the jet nozzle 124.
- the solder 108 flowing out of the jet nozzle 124 descends along the outer peripheral surface of the jet nozzle 124 while covering the entire circumference of the jet nozzle 124.
- the descending solder passes through the central opening 122a and moves to the solder recovery tank 103.
- the solder 108 flowing out from the jet nozzle 124 is recovered in the solder recovery tank 103.
- FIG. 25 is a diagram for explaining the operation of the soldering process (corresponding to step S14 in FIG. 8).
- the triaxial moving mechanism 6 raises the solder jet device 102 (arrow AR111).
- the solder 108 flowing in a state of rising from the upper end portion of the jet nozzle 124 comes into contact with a part of the lead 92 of the electronic component 91 in the target region of the printed circuit board 9.
- the triaxial moving mechanism 6 moves the solder jet device 102 in the horizontal direction within the range of the target area of the printed circuit board 9 (arrow AR112).
- solder 108 jetted from the jet nozzle 124 adheres to the entire lead 92 of the electronic component 91 in the target area of the printed circuit board 9. Then, the triaxial moving mechanism 6 lowers the solder jet device 102 (arrow AR113). By such a series of operations, soldering is performed on one target region of the printed circuit board 9.
- FIG. 26 shows a state of the solder jet device 102 in which the jet of the solder 108 is stopped (corresponding to step S17 in FIG. 8).
- the gas supply unit 7 stops supplying gas
- the valve driving unit 134 is driven to open the communication port 130 by the on-off valve 131. Therefore, the solder 108 collected and accumulated in the solder collection tank 103 passes through the communication port 130 and flows into the solder storage tank 104 disposed below the solder collection tank 103.
- the solder 108 jetted from the jet nozzle 124 returns to the solder storage tank 104. Thereafter, when the solder 108 fills the entire inside of the solder storage tank 104, the solder jet device 102 returns to the initial state shown in FIG.
- the gas supply unit 7 supplies a pressurized gas such as nitrogen to the solder storage tank 104 of the solder jet device 102, the solder 108 is jetted from the jet nozzle 124. Therefore, the flow rate of the gas supplied from the gas supply unit 7 to the solder storage tank 104 corresponds to the flow rate of the solder 108 jetted by the jet nozzle 124.
- the process and operation related to the supply of gas to the solder reservoir 104 can be applied to the description of the solder jet device 2 according to the first embodiment with reference to FIGS. 15 to 19.
- FIG. 27 shows the upper part of the jet nozzle 124.
- the jet nozzle 124 includes a solder residual portion 125.
- the solder remaining portion 125 is provided in the vicinity of the upper end portion 124 a on the outer periphery of the jet nozzle 124.
- the solder residue portion 125 is configured to leave the solder 108 flowing out from the jet nozzle 124.
- the solder remaining portion 125 is formed in a range from the upper end portion 124a of the jet nozzle 124 to a predetermined distance (for example, 15 mm or more and 20 mm or less).
- FIG. 28 shows a part of the solder remaining portion 125 of the jet nozzle 124 in an enlarged manner.
- a plurality of concave grooves 126 are formed so as to be arranged at equal intervals along the direction in which the jet nozzle 124 extends.
- Each of the plurality of concave grooves 126 extends along a direction orthogonal to the extending direction of the jet nozzle 124. Since the jet nozzle 124 extends in the vertical direction (vertical direction), the plurality of concave grooves 126 each extend in the horizontal direction.
- Each of the plurality of concave grooves 126 continuously circles the outer periphery of the jet nozzle 124 without having a discontinuous portion.
- the plurality of concave grooves 126 are independent from each other without being connected to each other. For this reason, a convex portion 127 is formed between the plurality of adjacent concave grooves 126 so as to continuously go around the outer periphery of the jet nozzle 124.
- each concave groove 126 is, for example, not less than 0.2 mm and not more than 0.3 mm.
- the depth of each concave groove 126 is, for example, not less than 0.1 mm and not more than 0.2 mm. Further, the larger the number of the plurality of concave grooves 126 is, the more desirable, but for example, 20 to 40.
- These concave grooves 126 are formed by processing such as cutting the outer periphery of the jet nozzle 124.
- the solder 108 flowing out from the upper end portion 124a of the jet nozzle 124 descends while covering the outer peripheral surface of the jet nozzle 124 in which the plurality of concave grooves 126 of the solder remaining portion 125 are formed. To do. At this time, the solder 108 enters each of the plurality of concave grooves 126 of the solder remaining portion 125. Since the concave groove 126 extends in the horizontal direction, even if the jet nozzle 124 stops the jet of the solder 108, the solder 108 that has entered the concave groove 126 does not flow down. That is, as shown in FIG. 29, an appropriate amount of solder 108 remains in each of the plurality of concave grooves 126 by the action of surface tension.
- the wettability of the outer peripheral surface of the jet nozzle 124 can be maintained by the solder 108 remaining in each of the plurality of concave grooves 126.
- the solder 108 flowing out from the upper end portion 124 a of the jet nozzle 124 flows while being attracted to the solder 108 remaining in the concave groove 126. Since the concave groove 126 continuously goes around the outer peripheral surface of the jet nozzle 24, the solder 108 remains on the entire circumference of the jet nozzle 124. Therefore, the solder 108 can be made to flow uniformly over the entire outer periphery of the jet nozzle 124. For this reason, the shape of the flow of the solder 108 formed on the upper end portion 124 a of the jet nozzle 124 can be stabilized, and the soldering can be accurately performed on the target region of the printed circuit board 9.
- the plurality of concave grooves 26 are formed in a range from the upper end portion 124a of the jet nozzle 124 to a predetermined distance (that is, a range of the solder remaining portion 125). For this reason, at least in the range of the solder remaining portion 125, the wettability of the outer periphery of the jet nozzle 124 can be maintained, and the solder 108 can flow uniformly over the entire outer periphery of the jet nozzle 124. Thereby, the shape of the flow of the solder 108 formed on the upper end portion 124a of the jet nozzle 124 can be further stabilized.
- the solder 108 remaining in one concave groove 126 does not flow out to the other concave grooves 126. For this reason, the solder 108 can reliably remain in the concave groove 126.
- the jet nozzle of the solder jet device such as rubbing with a metal brush.
- solder plating or the like on the outer periphery of the jet nozzle may be peeled off, and the wettability of the outer periphery of the jet nozzle may deteriorate.
- the jet nozzle 124 in which the plurality of concave grooves 126 according to the present embodiment are formed even if excessive cleaning is performed, the function of the concave grooves 126 to leave the solder 108 is not impaired. Therefore, the wettability of the outer periphery of the jet nozzle 124 can be maintained.
- the state where the solder 108 remains on the outer periphery of the jet nozzle 124 can be maintained. Therefore, the outer periphery of the jet nozzle 124 can be prevented from being oxidized. Even in the soldering process immediately after the soldering apparatus is started from the power-off state, the wettability of the jet nozzle 124 can be maintained by the solder 108 remaining on the outer periphery of the jet nozzle 124.
- the configuration of the present embodiment in which a plurality of concave grooves 126 are formed on the outer peripheral surface of the jet nozzle 124 is also applicable to the jet nozzle 22 according to the first embodiment. Further, the present invention can be applied not only to an intermittent jet soldering apparatus but also to a continuous jet soldering apparatus that always jets solder from a jet nozzle. Even in the case of a continuous jet type soldering apparatus, the wettability of the jet nozzle can be maintained in the soldering process immediately after starting by adopting the jet nozzle in which the concave groove is formed.
- a plurality of concave grooves 126 are formed in a range from the upper end portion 124a of the jet nozzle 124 to a predetermined distance.
- a plurality of concave grooves 126 may be formed over the entire upper end portion and lower end portion of the jet nozzle 124.
- the cross-sectional shape of the jet nozzles 22 and 124 is circular.
- the cross-sectional shape of the jet nozzles 22 and 124 may be elliptical or rectangular.
- solder jet devices 2 and 102 jet solder from the jet nozzles 22 and 124 by supplying pressurized gas.
- solder may be jetted from the jet nozzles 22 and 124 by operating a pump or the like.
- the soldering apparatus 1 is configured to move the solder jet apparatuses 2 and 102 with respect to the printed circuit board 9 arranged at a predetermined position when performing a soldering process.
- the printed circuit board 9 may be moved with respect to the solder jet devices 2 and 102 arranged at predetermined positions.
- the soldering device only needs to include a moving mechanism that changes the relative position between the object and the solder jet device.
- the function described as one block in the above embodiment is not necessarily realized by a single physical element, and may be realized by distributed physical elements.
- the functions described as a plurality of blocks in the above embodiment may be realized by a single physical element.
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Abstract
Description
溶融された半田を収容する半田容器と、
前記半田を噴流する噴流ノズルと、
前記半田容器の上部が前記噴流ノズルから流れ出た前記半田を回収する半田回収槽とされ、前記半田容器の下部が気体の供給を受けて前記噴流ノズルに前記半田を供給する半田貯留槽とされるように、前記半田容器の内部を区画する区画板と、
前記区画板に形成されて前記半田回収槽と前記半田貯留槽とを連通する連通口と、
前記連通口を開閉する開閉弁と、
上端が前記区画板の下面に接合されて前記連通口の下部全体を囲み、下端が前記半田貯留槽の底面近傍に配置されている第1筒状部材と、
を備えている。
溶融された半田を収容する半田容器と、
前記半田を噴流する噴流ノズルと、
前記半田容器の上部が前記噴流ノズルから流れ出た前記半田を回収する半田回収槽とされ、前記半田容器の下部が気体の供給を受けて前記噴流ノズルに前記半田を供給する半田貯留槽とされるように、前記半田容器の内部を区画する区画板と、
上端が前記区画板の下面に接合されて前記区画板と前記半田容器との境界部分の全体を覆い、下端が前記半田容器の内面に沿って前記半田貯留槽の底面近傍に配置されているカバー部材と、
を備えている。
上記第1の態様に係る半田噴流装置と、
前記半田貯留槽に前記気体を供給する気体供給部と、
を備えている。
溶融された前記半田を収容する半田貯留槽と、
鉛直方向に延び、前記半田貯留槽から供給された前記半田を上端部から噴流する噴流ノズルと、
を備えており、
前記噴流ノズルの外周における少なくとも前記上端部の近傍に、水平方向に沿って延びるように複数の凹溝が形成されており、
前記複数の凹溝は、互いに接続することなく前記鉛直方向に等間隔で配列されている、半田噴流装置。
上記第4の態様に係る半田噴流装置と、
前記対象物と前記半田噴流装置との相対位置を変更する移動機構と、
を備えている。
次に、半田噴流装置2の構成について説明する。図4は、半田噴流装置2の外観を示す斜視図である。図中の縦方向は、上下方向に相当する(以降の図においても同様)。
本実施形態に係る半田噴流装置2では、係数Kは例えば0.7である。半田貯留槽5に供給された気体は半田貯留槽5の内部で圧縮されるため、この気体の流量Q2よりも噴流する半田Sの流量Q1は少なくなる。
Claims (16)
- 半田を噴流する半田噴流装置であって、
溶融された半田を収容する半田容器と、
前記半田を噴流する噴流ノズルと、
前記半田容器の上部が前記噴流ノズルから流れ出た前記半田を回収する半田回収槽とされ、前記半田容器の下部が気体の供給を受けて前記噴流ノズルに前記半田を供給する半田貯留槽とされるように、前記半田容器の内部を区画する区画板と、
前記区画板に形成されて前記半田回収槽と前記半田貯留槽とを連通する連通口と、
前記連通口を開閉する開閉弁と、
上端が前記区画板の下面に接合されて前記連通口の下部全体を囲み、下端が前記半田貯留槽の底面近傍に配置されている第1筒状部材と、
を備えている、半田噴流装置。 - 請求項1に記載の半田噴流装置において、
上端が前記区画板の下面に接合されて前記区画板と前記半田容器との境界部分の全体を覆い、下端が前記半田容器の内面に沿って前記半田貯留槽の底面近傍に配置されているカバー部材を備えている、半田噴流装置。 - 請求項1に記載の半田噴流装置において、
下端が前記半田貯留槽の内部に配置され、前記半田貯留槽から前記噴流ノズルへの前記半田の供給経路となる第2筒状部材を備えており、
前記第1筒状部材の下端の位置は、前記第2筒状部材の下端の位置よりも低い、半田噴流装置。 - 請求項2に記載の半田噴流装置において、
下端が前記半田貯留槽の内部に配置され、前記半田貯留槽から前記噴流ノズルへの前記半田の供給経路となる第2筒状部材を備えており、
前記カバー部材の下端の位置は、前記第2筒状部材の下端の位置よりも低い、半田噴流装置。 - 半田を噴流する半田噴流装置であって、
溶融された半田を収容する半田容器と、
前記半田を噴流する噴流ノズルと、
前記半田容器の上部が前記噴流ノズルから流れ出た前記半田を回収する半田回収槽とされ、前記半田容器の下部が気体の供給を受けて前記噴流ノズルに前記半田を供給する半田貯留槽とされるように、前記半田容器の内部を区画する区画板と、
上端が前記区画板の下面に接合されて前記区画板と前記半田容器との境界部分の全体を覆い、下端が前記半田容器の内面に沿って前記半田貯留槽の底面近傍に配置されているカバー部材と、
を備えている、半田噴流装置。 - 請求項1から5のいずれか一項に記載の半田噴流装置であって、
前記噴流ノズルは、鉛直方向に延びており、
前記噴流ノズルの外周における少なくとも前記上端部の近傍に、水平方向に沿って延びるように凹溝が形成されている、半田噴流装置。 - 請求項6に記載の半田噴流装置において、
前記凹溝は、前記噴流ノズルの前記外周を連続して一周するように形成されている、半田噴流装置。 - 請求項7に記載の半田噴流装置において、
前記凹溝は、複数の前記凹溝を含んでいる、半田噴流装置。 - 請求項8に記載の半田噴流装置において、
前記複数の凹溝はそれぞれ独立している、半田噴流装置。 - 請求項6から9のいずれか一項に記載の半田噴流装置において、
前記噴流ノズルから前記半田を間欠的に噴流するように構成されている、半田噴流装置。 - 対象物に対して半田付けを行う半田付け装置であって、
請求項1から10のいずれか一項に記載の半田噴流装置と、
前記半田貯留槽に前記気体を供給する気体供給部と、
を備えることを特徴とする半田付け装置。 - 半田を噴流する半田噴流装置であって、
溶融された前記半田を収容する半田貯留槽と、
鉛直方向に延び、前記半田貯留槽から供給された前記半田を上端部から噴流する噴流ノズルと、
を備えており、
前記噴流ノズルの外周における少なくとも前記上端部の近傍に、水平方向に沿って延びるように複数の凹溝が形成されており、
前記複数の凹溝は、互いに接続することなく前記鉛直方向に等間隔で配列されている、半田噴流装置。 - 請求項12に記載の半田噴流装置において、
前記複数の凹溝のそれぞれは、前記噴流ノズルの前記外周を連続して一周するように形成されている、半田噴流装置。 - 請求項12または13に記載の半田噴流装置において、
前記噴流ノズルにおける前記複数の凹溝が形成される部分は、円筒形状である、半田噴流装置。 - 請求項12から14のいずれか一項に記載の半田噴流装置において、
前記噴流ノズルから前記半田を間欠的に噴流するように構成されている、半田噴流装置。 - 対象物に対して半田付けを行う半田付け装置であって、
請求項12から15のいずれか一項に記載の半田噴流装置と、
前記対象物と前記半田噴流装置との相対位置を変更する移動機構と、
を備えることを特徴とする半田付け装置。
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- 2014-03-20 WO PCT/JP2014/057910 patent/WO2014199694A1/ja active Application Filing
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Publication number | Priority date | Publication date | Assignee | Title |
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CN107251666A (zh) * | 2015-02-25 | 2017-10-13 | 富士机械制造株式会社 | 钎焊装置 |
CN107251666B (zh) * | 2015-02-25 | 2019-10-01 | 株式会社富士 | 钎焊装置 |
CN109202201A (zh) * | 2017-07-03 | 2019-01-15 | 株式会社电装天 | 焊接装置及焊接方法 |
US20200398359A1 (en) * | 2019-06-19 | 2020-12-24 | Denso Ten Limited | Soldering device and control method for soldering device |
JP2021000640A (ja) * | 2019-06-19 | 2021-01-07 | 株式会社デンソーテン | はんだ付け装置およびはんだ付け装置の制御方法 |
JP7249215B2 (ja) | 2019-06-19 | 2023-03-30 | 株式会社デンソーテン | はんだ付け装置およびはんだ付け装置の制御方法 |
US11697169B2 (en) * | 2019-06-19 | 2023-07-11 | Denso Ten Limited | Soldering device and control method for soldering device |
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CN105324203B (zh) | 2018-04-17 |
CN105324203A (zh) | 2016-02-10 |
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