CN107920429A - DIP plate with variable cavity depth and method for wetting contact interface of electronic component - Google Patents
DIP plate with variable cavity depth and method for wetting contact interface of electronic component Download PDFInfo
- Publication number
- CN107920429A CN107920429A CN201710906653.XA CN201710906653A CN107920429A CN 107920429 A CN107920429 A CN 107920429A CN 201710906653 A CN201710906653 A CN 201710906653A CN 107920429 A CN107920429 A CN 107920429A
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- Prior art keywords
- dip
- solder flux
- plates
- cavity plate
- matrix
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Abstract
The invention relates to a DIP board (1) for a DIP process for wetting contact interfaces (2) of electronic components (3) with solder (F), the DIP board (1) having a base body (4) with an upper side (5), a lower side (6) and at least one recess (7) which is open toward the upper side (5), wherein the recess (7) extends from the upper side (5) in the direction of the lower side (6). The recess (7) is at least partially designed as a cavity (8) for receiving the solder (F). According to the invention, the cavity plate (9) of the DIP plate (1) can be arranged at least partially in the at least one recess (7), wherein the at least one cavity (8) can be delimited by the cavity plate (9) toward the lower side (6) of the base body (4), wherein the cavity plate (9) is movable at least along a path section (S) extending from the upper side (5) toward the lower side (6). The invention further relates to a DIP device, to an automatic placement machine and to a method for wetting the contact surfaces (2) of electronic components (3) in a solder (F).
Description
Technical field
The present invention relates to a kind of DIP plates for DIP- techniques, to infiltrate the contact interface of electronic component with solder flux.
Moreover, it relates to a kind of DIP- devices for DIP- techniques, to be connect with solder flux to infiltrate the contact of electronic component
Mouthful, a kind of automatic assembling machine for having and being used for circuit board assembling electronic element is further related to, and one kind infiltrates electricity in solder flux
The method of the contact interface of subcomponent.
Background technology
In surface mount device manufacturing process（SMD- is manufactured）It is middle SMD- elements are positioned on the surface of circuit board and
Directly it is connected by welding with the surface.For this reason, SMD- elements have contact interface, they being capable of connection corresponding to circuit board
Joint weld is together.In order to ensure as faultless as possible and therefore reliable welding position, it is advantageous to SMD- elements
Contact interface is loaded before navigating on circuit board with solder flux.Solder flux is extremely important to the quality of welding position.
Such as in DIP- techniques, solder flux is loaded to contact interface.In DIP- techniques provide with least one hole,
The DIP plates of recess or recess.Solder flux is filled with these holes.During the known filling in hole, these holes pass through
The fluxing devices for forming frame load solder flux.For this reason, fluxing devices are arranged on the upside of DIP plates, therefore it is together with DIP plates
Peviform thing is formed, the wherein frame of side wall and DIP plates forms basin bottom.Nowadays fluxing devices have been referred to as " peviform thing ", wherein should
" peviform thing " does not have bottom.Fluxing devices provide solder flux on DIP plates, and are moved on the upside of DIP plates.If solder flux fills
Put and be arranged on above the hole of DIP plates, then for example taken solder flux in the hole to by pure pressure, injection or similar fashion, directly
Preferably completely filled up to the hole by solder flux.The other also referred to as scraper below.
In DIP- techniques, SMD- elements so move on DIP plates so that contact interface is immersed in hole and therefore existed
Wet length is soaked with solder flux.For the consideration of process safety, the immersion of contact interface is preferably carried out, i.e. the contact interface
Contact the hole bottom in hole.The length that contact interface can soak in this DIP- techniques by solder flux depends on the sky in hole
Acupoint depth, because solder flux depth is equivalent to cavity depth for the hole filled up completely with solder flux.For many Welders
For skill, contact interface is very important by the wet length that solder flux soaks.For some welding procedures, contact connects
The wet length of mouth is for example directly related with the accessible quality being welded to connect.In addition, the exact dose of solder flux is favourable,
So as to reduce solder flux consumption.This point is especially advantageous for the solder flux of cost intensive.
When infiltrating electronic component by solder flux, the situation of appearance is that have not in the contact interface of different electronic components
Same solder flux length of invasion.Different DIP- plates must be provided for this, it is with the different hole of cavity depth.This point is very
It is bothersome, it is necessary to longer time, thus seriously affect the production efficiency of DIP- techniques.In addition, at present only when contact
When interface should be soaked with identical wet length with solder flux, the DIP- techniques with multiple electronic components are only feasible.It is right
For the different elements of the contact interface with different length, only separated at present in the case of the different DIP plates of application
DIP- techniques in could soak.The additionally known DIP plates with different holes, they have different cavity depths, and
And wetting contact interface can be come with different wetted lengths.Although the shortcomings that these DIP plates is, since each hole is different
, so limiting the full-size of wettable electronic component.In addition, these DIP plates only have the different holes of limited amount
Depth, wherein the full-size of wettable electronic component is reduced with different the increasing for number of cavities of cavity depth.
The content of the invention
Therefore the object of the present invention is to eliminate or eliminate shortcomings noted above in DIP- techniques at least in part.This
The purpose of invention is especially to provide a kind of DIP plates, a kind of DIP- devices for DIP- techniques, a kind of is used for assembling electronics member
The automatic assembling machine of part and a kind of method for the contact interface for infiltrating electronic component, they are with simple, reliable and of low cost
Mode the different wetting length of solder flux is constituted on the contact interface of electronic component.
Above-mentioned purpose is achieved by the DIP plates of the feature with independent claims, and by with only side by side
The DIP- devices of the feature of vertical claim are achieved, and the automatic dress for passing through the feature with independent claims arranged side by side
Be achieved with machine, and by the feature with independent claims arranged side by side, in solder flux infiltrate electronic component contact connect
The method of mouth is achieved.The further feature and details of the present invention is drawn by dependent claims, specification and drawings.Fit herein
For combine by the present invention DIP plates description feature and details, be of course also apply to combine by the present invention DIP- devices, by
The automatic assembling machine of the present invention and the feature and details described in the present inventive method, or in turn, therefore just in disclosure
Always can be reciprocally with reference to single invention visual angle for appearance.
By the first aspect of the present invention, this purpose is achieved by a kind of DIP plates for DIP- techniques, to use weldering
Agent infiltrates the contact interface of electronic component.DIP plates have matrix, it is with upside, downside and at least one is opened towards upside
The recess opened.Direction extension of the recess from upside along downside, the wherein recess are at least locally configured to accommodate solder flux
Hole.By the present invention, the cavity plate of DIP plates at least locally be may be provided at or be already provided at least one recess, wherein
At least one hole limits or can limit towards the downside of matrix by cavity plate.Cavity plate is at least along from upside towards downside
It is mobilizable in the distance section of extension.
DIP plates have matrix, it is preferably configured as tabular.DIP plates are preferably at least basically constituted as tabular.But
It is that matrix or DIP plates can also show other geometries, such as with circular and/or curved surface.Platy structure
Advantage is that DIP plates can be easily positioned on the DIP- devices for DIP- techniques.DIP- devices are configured to for performing
DIP- techniques, and there are fluxing devices, for preparing the solder flux in hole.Therefore, matrix or the tabular knot of DIP plates are passed through
Structure, can provide solder flux better by fluxing devices.
Matrix has the upper side and lower side, their preferable configurations must be parallel to each other.At least one recess is set in the base, and
And extend from upside along the direction of downside.The recess is opened wide towards upside, therefore can realize solder flux input and weldering by this aperture
Run in.In order to avoid the undesirable outflow of solder flux, recess is preferably limited sideways through matrix.The recess is at least locally formed
For for accommodating the hole of solder flux.Therefore, at least one regional area of the recess is at least one running position of DIP plates
It is not intended to accommodate solder flux.Could dictate that by the present invention, the recess fully constructed at least one running position of DIP plates for
To accommodate the hole of solder flux.
By the present invention, DIP plates have cavity plate, it is at least partially disposed in recess or can at least partially set
Put in recess.At least one hole can be limited by cavity plate towards the downside of matrix.Cavity plate towards hole
It is configured on the upside of cavity plate parallel with downside.Therefore the cavity depth in hole is invariable.The cavity depth preferably passes through
Defined with the spacing on the upside of cavity plate.Cavity plate is anyway movable at least in the distance section extended from upside towards downside
's.The section preferable configuration is obtained on the upside of the upside or cavity plate.Therefore by the movement of cavity plate, can effectively change
Become cavity depth.By it is currently preferred that for example by formfitting element such as step, it is arranged on cavity plate and/or base
In body, the relative motion of matrix and cavity plate is at least shape-ordinatedly limited in one direction.
Had the following advantages by the DIP plates of the present invention relative to conventional DIP- plates, can be with simple and of low cost
Mode at least one hole with variable cavity depth is provided.In order to realize that the different of different DIP- techniques require, now
The DIP plates by the present invention are only needed, wherein cavity depth need to only be adjusted as desired.DIP plates need not be arduously replaced again.This
Outside, with conventional DIP plates（It is with the different hole of multiple cavity depths）Compare, can be infiltrated by the DIP- plates by the present invention
The electronic component of bigger.
In a preferred embodiment of the invention, which has a driving device, and wherein driving device is configured to for along road
Journey section moves cavity plate.Driving device preferably has speed changer and/or screw drive device and/or adjusting screw and/or similar
Object.Alternatively or additionally, driving device preferably has electro-motor（Especially stepper motor or linear motor 0 and/or
Pressure cylinder.The advantages of driving device is that the specific phase that cavity plate towards matrix can be adjusted easily and with simple measure aligns
Put and specific cavity depth.This adjusting is for example controlled by being capable of the apparatus control of automatic assembling machine, and/or manually
Ground is controlled by the intervention of operating personnel.Driving device preferably has automatic braking, it is so formed, i.e., if driving device
Mobile cavity plate is not used to, then relative position of the fixed cavitation plate towards matrix.Therefore cavity depth can be avoided is not intended to adjusting,
Such as due to when performing DIP- techniques contact interface contact cavity plate.The DIP plates are preferably with matrix driver or at least
One matrix driving mechanism for being used for moving matrix.
It could dictate that by the present invention, which has block element, and wherein cavity plate is so arranged on matrix, that is, passes through
The movement of matrix being capable of such contact blocks element so that by the block element cavity plate can be realized towards the opposite fortune of matrix
It is dynamic.By the movement of matrix, cavity plate can be contacted directly or indirectly with block element.Be preferably able on the downside of cavity plate with
Block element contacts, and the downside is backwards to the downside of matrix.Block element is preferably provided at the lower section of cavity plate and/or towards matrix
Downside.By the further movement of matrix, pressure can be applied in cavity plate from block element, so as to fulfill cavity plate court
The relative motion of matrix.The advantages of this block element is, it is no longer necessary to for moving the additional drive system of cavity plate.By
Block element can limit relative motion of the cavity plate towards matrix in one direction, and therefore preferably under the collective effect of gravity
It is fixed.By this block element, the expense of manufacture DIP plates can be saved, because this block element can be simply to arrange
Apply and be made.The DIP plates preferably have the matrix driver for being used for moving matrix.
In preferable implement, recess is at least locally unlimited towards the downside of matrix.Its advantage especially, passes through the hole
Mouth can engage cavity plate and block element.This recess can be made by simple measure and inexpensively.
It is also preferred that DIP plates have a sealing device, hole is by the sealing device towards lower side seals.The sealing device
Such as can have film, it extends and is sealingly fixed on matrix in cavity plate.It is alternative or additional, sealing
Device has seal frame, it is fixed on the circular fringe region of cavity plate and/or matrix.Such as by clip, paste or
Similar fashion realizes the fixation of sealing device.Alternative or additional, sealing device has sealing ring, it is surrounded from side
Cavity plate and towards matrix seal.Sealing ring is preferably directed in the circular groove of cavity plate or matrix.Sealing device is configured to
Neatly improve sealing effect for preferably at least local.When cavity plate moves simultaneously therefore when cavity depth changes,
The hole also keeps sealing.It could dictate that by the present invention, sealing device is at least partially configured to elasticity, therefore reset force can
Cavity plate is set to be resetted in the relative position of definition towards matrix.
Cavity plate is preferably sealingly held on matrix by sealing device.This point for example can be real by sealing element
Existing, it is preferably hermetically fixed in cavity plate and hermetically extrudes or be sealingly fixed on matrix towards matrix, and court
Cavity plate hermetically extrudes.Fixed it is preferred that being realized by clip, stickup or similar fashion.The advantages of this sealing device, is, empty
Cave plate is sealingly held on matrix with simple measure, is flowed out which avoids solder flux from hole.Moved even in cavity plate
When dynamic simultaneously therefore when cavity depth changes, which also keeps sealing.
Preferably, sealing device is fixed in matrix and cavity plate and has at least one flexure region, and leads to
Crossing cavity plate can deform the flexure region relative to the movement of matrix.For this reason, sealing device is both fixed（Especially be stuck in,
Paste or in a similar manner）On matrix, it is also secured in cavity plate.When cavity plate carries out relative motion towards matrix, this is close
Seal apparatus for example, at least extensibility.It could dictate that herein, which is configured to elasticity.It is alternative or additional,
The flexure region is preferably configured as balance section, and sealing device in section is balanced at this to be had for balancing this relative motion
Balancing material.The balancing material is for example configured to vestibule diaphragm shape, corrugated or similar.It is also preferred that particularly by sealing
The resistance of the plastic deformation of device, which, which is set, must be used for keeping cavity plate towards the relative position of matrix.The sealing fills
Put and preferably so form, i.e., provide reset force when cavity plate is moved from neutral position relative to matrix, reset to cavity plate
In neutral position.Therefore sealing device is the reset element of elasticity, therefore only need to rise in one direction to move cavity plate
The adjusting driver of effect.The advantages of this sealing device is that cavity plate is sealingly held on matrix with simple measure, wherein
Solder flux is avoided to flow out from hole.When cavity plate moves simultaneously therefore when cavity depth changes, which also keeps
Sealing.
In favourable structural scheme by the present invention, wherein cavity plate has at least one first plate region and the second plate area
Domain, wherein the first plate region and the second plate region can mutual relative motions.The preferred difference in first plate region and the second plate region can
Relative to substrate motion, preferably mutually movement.Alternatively could dictate that, the first plate area rigid or be substantially rigidly maintained at
On matrix, or it is set together with matrix.The advantages of plate region in the first plate region and the second plate region is that cavity depth only needs
The position for needing to contact with the contact interface of electronic component in infiltration changes.If a part for contact interface and cavity plate or
Second plate region contacts, and is just enough to realize infiltration, because avoiding tumbling for electronic component in infiltration.By making cavity depth
Match with the relative position in hole, the required adjusting of the solder flux amount in hole can be reduced.Therefore can save manufacturing time and
Cost.
By it is currently preferred that DIP plates have at least two holes, they are connected with each other by least one passage.
Therefore hole cavity depth by the corresponding movement of cavity plate to reduce when, solder flux can squeeze into another sky by the passage
In cave.Therefore other manipulations need not be carried out to the solder flux amount of DIP plates.Therefore the spilling in hole can be avoided and thus caused
Solder flux loss.Additionally can by this way particularly by scraper to another hole provide solder flux, therefore at least temporarily not
Solder flux must be provided by additional fluxing devices.
By the second aspect of the present invention, this purpose is achieved by a kind of DIP- devices for DIP- techniques, so as to
The contact interface of electronic component is infiltrated with solder flux.DIP- devices have the DIP plates and fluxing devices by the present invention, the DIP plates
With at least one hole for being used for accommodating solder flux, so as to wetting contact interface, which is used for providing weldering in hole
Agent.
Fluxing devices preferably have frame, and are so arranged on the upside of DIP plates so that the frame and DIP plates one
Rise and form peviform thing, wherein the frame of side wall and DIP plates form basin bottom.Fluxing devices preferably have the solder flux for being used for accommodating solder flux
Tank.Fluxing devices further preferably have the pump or pressure apparatus for being used for conveying solder flux.The frame is preferably sealed towards DIP plates, to keep away
Exempt from or at least reduce the leakage of solder flux.Fluxing devices are preferably so moved by the hole of DIP plates so that the frame surrounds completely
Hole.In this case, solder flux can be delivered on hole from fluxing devices, top edge or matrix until being filled to hole
Upside.In order to fill other holes, which can also be moved by the upside of DIP plates.For this reason, DIP- devices preferably have
There is fluxing devices driving device.The DIP- devices preferably have the cavity plate driving device for being used for moving cavity plate.By the present invention,
DIP- devices can be configured to a part for automatic assembling machine.
By the DIP- devices of the present invention have the advantages that with by DIP plates of the invention.Accordingly, by the DIP- of the present invention
Device has the following advantages relative to conventional DIP- devices, can be provided in a manner of simple and is of low cost at least one
Have cuniculate DIP plates, which has variable cavity depth.To realize different wet lengths to be generated, now only
The cavity depth of the DIP plates of the DIP- devices by the present invention need to correspondingly be adjusted.DIP plates need not be arduously replaced again.In addition, with
Conventional DIP- devices with DIP plates are compared, and the electronic component of bigger can be infiltrated by the DIP- devices by the present invention, this is normal
The DIP- devices of rule have the different hole of multiple cavity depths, these cavity depths are immutable.
Preferably, fluxing devices are configured to for receiving solder flux from least one hole of DIP plates.In order to accommodate
Solder flux, fluxing devices are preferably able to be arranged on above hole and/or are sealed towards DIP plates.The cavity depth in hole can pass through sky
The movement of cave plate is so reduced, even if solder flux can be extruded from hole.The solder flux of the extrusion can be connect by fluxing devices again
Receive.Fluxing devices preferable configuration must be used for receiving solder flux by scraper.The advantages of this fluxing devices is that solder flux can be exactly
Metering, and when reducing the cavity depth in the hole filled with solder flux, the solder flux of extrusion can recycle.So as to improve weldering
Agent soaks.This point is especially advantageous for the high solder flux of price.
In preferable improvement project by the present invention, it could dictate that for DIP- devices, DIP- devices have control list
Member, for controlling movement of the cavity plate relative to the matrix of DIP plates.Control unit preferable configuration must be used for adjusting accurate hole
Depth and realized by the movement of cavity plate, and to ensure that constant cavity depth preferably controls within the specific period
The position of cavity plate, malfunctions to avoid DIP- techniques.
By the third aspect of the present invention, this purpose is able to by a kind of automatic assembling machine to circuit board assembling electronic element
Realize.Automatic assembling machine has the removable assembly head for being used for fixed and mobile electron element.By the present invention, automatic assembling equipment
There are the DIP plates by the present invention or the DIP- devices by the present invention.
Automatic assembling machine preferably has the element supply device and circuit board conveyor for being used for supplying element, for supplying
With convey the non-circuit board through assembling and for conveying the circuit board assembled.The element supply device preferably there is belt to hold
Portion is received, for accommodating at least one element band.Element belt has belt like and rollable containing body, and electronic component is protected
Hold on this element band.By this element band, arrange electronic component for automatic assembling machine and can supply in a defined manner
Automatic assembling machine should be given.Alternative or additional, element supply device has the chip or similar for being used for providing electronic component
Object.Assembly head preferable configuration must be used for taking out electronic component from element band.In addition, assembly head is configured to for fixing and moving
Dynamic electronic component.The movement of electronic component for example including：Immerse in hole and set on circuit boards.
By the present invention automatic assembling machine have with by the present invention DIP plates or by the present invention DIP- devices and
Advantage.Accordingly, had the following advantages by the automatic assembling machine of the present invention relative to conventional automatic assembling machine, with simple and cost
Cheap mode can efficiently and securely perform the different DIP- processes with different solder flux wet lengths.Therefore need not take again
DIP plates are replaced for different wetting depths or different size of electronic component to power.In order to realize the difference of different DIP- techniques
It is required that the cavity depth of the DIP plates of the DIP- devices by the present invention only need to be correspondingly adjusted now.
By the fourth aspect of the present invention, by the present invention, this purpose passes through a kind of contact that electronic component is infiltrated in solder flux
The method of interface.The method has steps of：
- provide by DIP plates of the invention, at least one hole of wherein DIP plates is filled with solder flux.
- cavity plate of DIP plates is so moved relative to the matrix of DIP plates, so as to change the cavity depth in hole；
- so manipulate hole in solder flux solder flux amount so that hole has solder flux amount set in advance；And
- by the assembly head of automatic assembling machine element is so infiltrated along the direction of cavity plate so that at least one of the element connects
Touch interface contact cavity plate and soaked with solder flux.
When providing DIP plates, preferably DIP plates are arranged in the receiving portion of DIP- devices or automatic assembling machine, and use
Solder flux is filled.The unlimited side at least one hole of DIP plates preferably upward, therefore insert the solder flux in hole cannot be again
It is secondary to be flowed out from hole.Within the framework of the invention, if DIP plates are already provided on automatic assembling machine and by automatic assembling
Machine performs other method and steps, then this also referred to as provides DIP plates.
Carry out filling hole preferably by known method, such as by scraper as previously mentioned, wherein being filled with
The frame of solder flux（It is also referred to as " peviform thing "）So moved by the upside of DIP plates so that solder flux flows into DIP plates from the frame
Hole in.It according to applicable cases, could dictate that by the present invention, be not that all holes of DIP plates are all filled, but only for
Hole of the specific DIP- techniques needed for wetting contact interface is just filled.
In mobile cavity plate, otherwise make the cavity plates of DIP plates relative to the matrix of DIP plates along the unlimited side in hole
Direction is moved, otherwise move in opposite direction.When cavity plate is moved along the unlimited side in hole, cavity depth is reduced simultaneously
Therefore also reduce and accommodate volume for the hole of solder flux.In cavity plate in opposite direction（I.e. backwards to the unlimited side in hole）
When mobile, expand cavity depth and therefore expand the receiving volume of solder flux.
By the present invention, manipulation is carried out to the solder flux amount of solder flux and means solder flux being supplied to hole or by solder flux from hole
Discharge.The manipulation is preferably carried out, i.e., is fully filled with hole after manipulation, until the upside of matrix.Preferably by weldering
Agent device, especially as one described above fluxing devices, to manipulate solder flux amount.
In infiltration, by least one contact interface of electronic component（It is preferred that multiple contact interfaces）Immerse in hole.Will
At least one contact interface（Preferably at least three contact interfaces）The cavity plate in hole is contacted, to realize this infiltration of book.Logical
When crossing at least three contact interfaces contact cavity plate, in the case where being appropriately arranged with contact interface, electronic component can be avoided
Tumble.In the case where hole Board position is fixed, deeper leaching can not be realized in the case where not influencing the shape of contact interface
Profit.Because hole is preferably completely（I.e. until the upside of matrix）Filled with solder flux, so can equally determine when performing the method
Justice or the wetting depth for presetting contact interface.When by definition with solder flux filling hole, it is meant that determine positioned at sky
The solder flux depth of solder flux in cave.
In the present inventive method have with by the present invention DIP plates or by the present invention DIP- devices and by the present invention from
Move the advantages of assembly machine is the same.Accordingly, had the following advantages in the present inventive method relative to conventional method, with it is simple and into
This cheap mode can efficiently and securely perform the different DIP- processes with different solder flux wet lengths.Therefore need not be again
Arduously DIP plates are replaced for different wetting depths or different size of electronic component.In order to realize different DIP- techniques not
With requirement, the cavity depth of the present DIP plates that only need to correspondingly adjust the DIP- devices by the present invention.
Cavity plate preferably so moves, and is reduced even if obtaining cavity depth, wherein the weldering by the DIP- devices by the present invention
Agent device manipulates solder flux amount by receiving solder flux.Pass through the direction along the upside of matrix（I.e. upward）Mobile cavity plate, to contract
Small cavity depth.Therefore the receiving portion volume for being used for accommodating solder flux in hole is reduced.As long as hole is before cavity plate movement
Filled up completely with solder flux, then the diminution of cavity depth can extrude solder flux.By the present invention, the solder flux of the extrusion is by DIP- devices
Or the fluxing devices of automatic assembling machine are received, particularly by scraper.Its advantage is to reduce solder flux loss, because the weldering of extrusion
Agent can reuse by this way.
Brief description of the drawings
Below by attached drawing illustrating in detail by the present invention DIP plates, by the present invention DIP- devices, by the present invention
Automatic assembling machine and in the present inventive method.Identical feature sets identical reference marker in these attached drawings respectively.At this
It schematically show in a little attached drawings：
Fig. 1 shows the first state of the first preferred embodiment of the DIP plates by the present invention in side view；
Fig. 2 shows the second state of the DIP plates of Fig. 1 in side view；
Fig. 3 shows the first state of the second preferred embodiment of the DIP plates by the present invention in side view；
Fig. 4 shows the second state of the DIP plates of Fig. 3 in side view；
Fig. 5 shows the third state of the DIP plates of Fig. 3 and Fig. 4 in side view；
Fig. 6 shows the third preferred embodiment of the DIP plates by the present invention in side view；
Fig. 7 shows the 4th preferred embodiment of the DIP plates by the present invention in side view；
Fig. 8 shows the 5th preferred embodiment of the DIP plates by the present invention in side view；
Fig. 9 shows the preferred embodiment of the DIP- devices by the present invention in a top view；
Figure 10 shows the preferred embodiment of the automatic assembling machine by the present invention in side view；And
Figure 11 shows the preferred embodiment by the method for the present invention in flow charts.
List of numerals
1 DIP plates
2 contact interfaces
3 elements
4 matrixes
5 upsides
6 downsides
7 recesses
8 holes
9 cavity plates
The first plates of 9a region
The second plates of 9b region
10 driving devices
11 block elements
12 sealing devices
13 flexure regions
14 passages
15DIP- devices
16 fluxing devices
17 control units
18 matrix drivers
19 installing plates
20 automatic assembling machines
21 assembly heads
22 steps
23 circuit boards
24 circuit board conveyors
100 first method steps
200 second method steps
300 third method steps
400 fourth method steps
F solder flux
R scrapers direction
S distance sections
T cavity depths.
Embodiment
Fig. 1 diagrammatically illustrates the first state of the first preferred embodiment of the DIP plates by the present invention in side view.
DIP plates 1 have the matrix 4 of tabular, it is with upside 5 and downside 6.The recess 7 opened wide towards upside 5 is provided with the matrix 4.
Cavity plate 9 is movably disposed in this recess 7.Cavity plate 9 is movable on the distance section S between upside 5 and downside 6
's.In order to move cavity plate 9, DIP plates 1 have driving device 10, it is arranged between matrix 4 and cavity plate 9.In addition, hole
Plate 9 is fixed on matrix 4 by being configured to the sealing device 12 of flexure region 13 and is sealed towards this matrix.In upside 5 and sky
Between cave plate 9, therefore which is configured to hole 8 that accommodate solder flux F, that cavity depth is T.The hole 8 is by solder flux F
It is fully filled with.The matrix 4 is movably fixed on installing plate 19 by matrix driver 18 and therefore relative to installing plate 19
It is mobilizable.Installing plate 19 can for example be configured to automatic assembling machine 20（Referring to Figure 10）A part.In this first state
Under, cavity plate 9 moves maximum downward along the direction of the downside 6 of matrix 4, therefore cavity depth T has most under this first state
Big value.
Fig. 2 schematically shows the second state of the DIP plates of Fig. 1 in side view.Herein under the second state, cavity plate
9 move maximum along the direction of the upside 5 of matrix 4 upward, therefore cavity depth T has minimum value under the second state herein.
Fig. 3 schematically shows the first state of the second preferred embodiment of the DIP plates by the present invention in side view.
DIP plates 1 have the matrix 4 of tabular, it is with upside 5 and downside 6.It is provided with the matrix 4 towards upside 5 and spacious towards downside 6
The recess 7 opened.Cavity plate 9 is movably disposed in this recess 7.Distance section S of the cavity plate 9 between upside 5 and downside 6
On be mobilizable.Cavity plate 9 is fixed on matrix 4 by being configured to the sealing device 12 of flexure region 13 and towards this matrix
Sealing.Between upside 5 and cavity plate 9, therefore which is configured to hole that accommodate solder flux F, that cavity depth is T
8.This was movably fixed on installing plate 19 by matrix driver 18 in body 4 and be therefore movable relative to installing plate 19
's.Installing plate 19 can for example be configured to automatic assembling machine 20（Referring to Figure 10）A part.Use is provided with installing plate 19
To contact the block element 11 of cavity plate 9.The second embodiment is not used for moving the additional drive system 10 of cavity plate 9.
Under this first state, cavity plate 9 moves maximum, therefore cavity depth T the first shapes herein downward along the direction of the downside 6 of matrix 4
There is maximum under state.The matrix 4 is moved away from installing plate 19 upward by matrix driver 18, and for example with towards installing plate 19
Maximum spacing.Cavity plate 9 does not contact directly with block element 11.Solder flux F is also not provided with the hole 8.
Fig. 4 schematically shows the second state of the DIP plates of Fig. 3 in side view.In this second state, matrix 4
It is mobile maximum downward by matrix driver 18.Therefore, cavity plate 9 contacts with block element 11 and by the block element court
On along the direction of the upside 5 of matrix 4 move maximum, therefore cavity depth T has minimum value under the second state herein.Herein second
Under state, hole 8 is fully filled with by solder flux F.
Fig. 5 schematically shows the third state of the DIP plates of Fig. 3 and Fig. 4 in side view.In this third state,
Matrix 4 is moved upwardly by maximum again by matrix driver 18, therefore cavity plate 9 is mobile maximum downward again.Solder flux F is also set up
In hole 8, and the second state solder flux depth T with definition according to Fig. 4.
Fig. 6 diagrammatically illustrates the third preferred embodiment of the DIP plates by the present invention in side view.DIP plates 1 are substantially
The second embodiment of DIP plates as shown in Figure 3 is formed, and has two recesses 7 formed in the same fashion, it has respectively
Hole 8, cavity plate 9, the sealing element 12 and block element 11 with flexure region 13.The function of mobile cavity plate 9 equivalent to
Second embodiment.DIP plates are similar with Fig. 4 to be in the second state, is wherein also not filled by solder flux F in hole 8.Between hole 8,
Passage 14 is provided with the upside 5 of matrix 4, these holes 8 are connected with each other by the mode of the passage in fluid communication.
During beyond the maximum filling extent in hole 8, such as when cavity plate 9 is moved up when hole 8 has reached maximum filling extent,
The solder flux F extruded from hole 8 is directed in another hole 8 by passage 14.Therefore solder flux loss can be reduced.It is real the 3rd
Apply in example, cavity plate 9 alternatively can be by one, and preferably respectively one, driving device 10 moves.
Fig. 7 diagrammatically illustrates the 4th preferred embodiment of the DIP plates by the present invention in side view.DIP plates 1 are substantially
The second embodiments of DIP plates as shown in Figure 3 is formed, and wherein cavity plate 9 and matrix 4 have step 22 respectively, it is along level side
To（I.e. along parallel to the upside 5 of matrix 4 or the direction of downside 6）With common overlapping region.Therefore, with the side of form fit
Formula defines that cavity plate 9 is upward towards matrix 4（I.e. along the direction of block element 11）Relative motion.In the figure 7, cavity plate 9 is set
Put in the end position of cavity depth maximum.In the fourth embodiment, cavity plate 9 can alternatively be moved by driving device 10
It is dynamic.
Fig. 8 diagrammatically illustrates the 5th preferred embodiment of the DIP plates by the present invention in side view.DIP plates 1 are substantially
The second embodiment of DIP plates as shown in Figure 3 is formed, and wherein cavity plate 9 has the first plate region 9a and the second plate region 9b.The
One plate region 9a is rigidly held on matrix 4, and the second plate region 9b can be moved relative to matrix along distance section S
It is dynamic.It is provided with before first plate region 9a and the second plate region 9b and between the second plate region 9b and matrix 4 and is configured to scratch
The sealing device 12 in property region 13.Optionally, another unshowned sealing is provided between the first plate region 9a and matrix 4
Region 12.The advantages of five embodiments is that cavity depth T is merely able to be adjusted in the region of the second plate region 9b, because
This can slightly change the solder flux carrying capacity in hole 8 by adjusting the second plate region 9b.Therefore need slightly to manipulate solder flux amount.
Alternatively, the first plate region 9a is equally mobilizable, it is mobilizable preferably towards the second plate region 9b.Therefore cavity plate 9
Movement can so carry out so that solder flux capacity remains unchanged, and this solder flux amount need not be manipulated.It is real the 5th
Apply in example, 9 or second plate region 9b of cavity plate and the first plate region 9a can alternatively be moved by driving device 10.
Fig. 9 diagrammatically illustrates the preferred embodiment of the DIP- devices 15 by the present invention in a top view.The DIP- devices
15 have the DIP plates of the ribbon matrix 4 by the present invention, are provided with the matrix towards the unlimited recess 7 in the upside 5 of matrix 4.Hole
Plate 9 is movably disposed in this recess 7, which is movably protected by being configured to the sealing device 12 of flexure region 13
Hold on matrix 4.What cavity plate 9 defined recess 7 downward leaves blank 8.In addition, the DIP- devices also have fluxing devices 16 and use
To control the control unit 17 of fluxing devices 16.Fluxing devices 16 are used for giving hole 8 filling flux F, and for will be unnecessary
Solder flux F is discharged from hole 8.For this reason, fluxing devices 16 can be moved on the R of scraper direction by hole 8 along the direction of upside 5
It is dynamic.Fluxing devices 16 are preferably sealed towards upside 5, are flowed out to avoid or at least reduce solder flux from side.
Figure 10 diagrammatically illustrates the preferred embodiment of the automatic assembling machine 20 by the present invention in side view.This is filled automatically
There is the DIP plates and circuit board conveyor 24 by the present invention with machine 20, circuit board 23 to be assembled sets defeated in this circuit board
Send on device.Be provided with DIP plates assembling device 20 along the moveable assembly head 21 of multiple axis.Assembly head 21 is herein
Fixed electronic component to be infiltrated is together with multiple contact interfaces 2 in attached drawing.Automatic assembling machine preferably has unshowned by this
The DIP- devices 15 and/or unshowned welder and/or unshowned offer device of invention, the welder are used for electricity
Subcomponent 3 is welded with circuit board 23, which is used for providing electronic component 3.
Figure 11 diagrammatically illustrates preferred embodiment in the present inventive method in flow charts.In first method step
The DIP plates 1 by the present invention are provided in 100, the hole 8 of wherein DIP plates 1 is fully filled with by solder flux F.In second method step 200
The cavity plate 9 of middle DIP plates 1 moves.Therefore the cavity depth T in hole 8 is changed.When being moved in the direction of cavity plate 9 along upside 5,
Cavity depth T reduces, and when cavity plate is moved away from upside 5, cavity depth T expands.So manipulated in third method step 300 empty
The solder flux amount of solder flux F in cave 8 so that hole 8 has solder flux amount set in advance, such as is fully filled with.It is deep expanding hole
When spending T, need to be further filled with solder flux F in principle, and solder flux F need to be discharged when reducing cavity depth T.Preferably by fluxing devices 16
Manipulated.Second method step 200 and third method step 300 are to be carried out at the same time preferably especially when cavity depth T reduces
's.In fourth method step 400, element 3 is so moved by the assembly head 21 of automatic assembling machine 20 along the direction of cavity plate 9
It is dynamic so that at least one contact interface 2 of electronic component 3（Preferably at least three or all contact interfaces）Cavity plate is contacted, is made
Contact interface is obtained to be soaked with solder flux with the wet length defined.
Claims (15)
- A kind of 1. DIP plates for DIP- techniques（1）, to use solder flux（F）To infiltrate electronic component（3）Contact interface （2）, the DIP plates have matrix（4）, it is with upside（5）, downside（6）It is and at least one towards upside（5）Unlimited recess （7）, the wherein recess（7）From upside（5）Along downside（6）Direction extension, the wherein recess（7）It is at least local to be configured to Accommodate solder flux（F）Hole（8）,It is characterized in that,DIP plates（1）Cavity plate（9）It is at least local to may be provided at least one recess（7）In, wherein described at least one Hole（8）Can be by cavity plate（9）Towards matrix（4）Downside（6）Limit, wherein cavity plate（9）At least along from upside（5）Court Downside（6）The distance section of extension（S）On be mobilizable.
- 2. DIP plates according to claim 1（1）, it is characterised in thatThe DIP plates（1）With driving device（10）, wherein driving device（10）It is configured to for along distance section（S）It is mobile Cavity plate（9）.
- 3. DIP plates according to claim 1（1）, it is characterised in thatThe DIP plates（1）With block element（11）, wherein cavity plate（9）So it is arranged on matrix（4）On, that is, pass through matrix（4） Movement being capable of such contact blocks element（11）So that pass through the block element（11）It can realize cavity plate（9）Towards matrix （4）Relative motion.
- 4. the DIP plates according to any one of the claims（1）, it is characterised in thatRecess（7）Towards matrix（4）Downside be at least locally unlimited.
- 5. the DIP plates according to any one of the claims（1）, it is characterised in thatDIP plates（1）With sealing device（12）, hole（8）By the sealing device towards downside（6）Sealing.
- 6. DIP plates according to claim 5（1）, it is characterised in thatCavity plate（9）Pass through sealing device（12）It is sealingly held in matrix（4）On.
- 7. the DIP plates according to claim 5 or 6（1）, it is characterised in thatSealing device（12）It is fixed on matrix（4）And cavity plate（9）Go up and there is at least one flexure region（13）, and lead to Cross cavity plate（9）Relative to matrix（4）Movement can make the flexure region（13）Deformation.
- 8. the DIP plates according to any one of the claims（1）, it is characterised in thatCavity plate（9）With at least one first plate region（9a）With the second plate region（9b）, wherein the first plate region（9a）With Second plate region（9b）Can mutual relative motion.
- 9. the DIP plates according to any one of the claims（1）, it is characterised in thatDIP plates have（1）At least two holes（8）, they pass through at least one passage（14）It is connected with each other.
- A kind of 10. DIP- devices for DIP- techniques（15）, to use solder flux（F）To infiltrate electronic component（3）Contact connect Mouthful（2）, which has DIP plates（1）And fluxing devices（16）, the DIP plates have it is at least one be used for accommodate solder flux（F） Hole（8）, so as to wetting contact interface（2）, the fluxing devices are in hole（8）Middle offer solder flux（F）,It is characterized in that,Construct the DIP plates as any one of the claims（1）.
- 11. DIP- devices according to claim 10（15）, it is characterised in thatFluxing devices（16）It is configured to for from DIP plates（1）At least one hole（8）Receive solder flux（F）.
- 12. the DIP- devices according to claim 10 or 11（15）, it is characterised in thatDIP- devices（15）With control unit（17）, for controlling cavity plate（9）Relative to DIP plates（1）Matrix（4）Fortune It is dynamic.
- 13. one kind is used for giving circuit board assembling electronic element（3）Automatic assembling machine（20）, it, which has, is used for fixing and moving Electronic component（3）Removable assembly head（21）,It is characterized in that,Automatic assembling machine（20）With DIP plates according to any one of claim 1 to 9（1）Or according to claim 10 To the DIP- devices any one of 12.
- 14. one kind is in solder flux（F）Middle infiltration electronic component（2）Contact interface（2）Method, it has steps of：The DIP plate of-offer according to any one of the claims 1 to 9（1）, wherein DIP plates（1）At least one sky Cave（8）Use solder flux（F）Filling；- make DIP plates（1）Cavity plate（9）Relative to DIP plates（1）Matrix（4）It is so mobile, so as to change hole（8）'s Cavity depth（T）；- so manipulate hole（8）In solder flux（F）Solder flux amount so that hole（8）With solder flux amount set in advance；And- by automatic assembling machine（20）Assembly head（21）Along cavity plate（9）Direction so infiltrate element（3）So that this yuan Part（3）At least one contact interface（2）Contact cavity plate（9）And use solder flux（F）Wetting.
- 15. the method as described in claim 14, it is characterised in thatCavity plate（9）It is preferred that it is so mobile, even if obtaining cavity depth（T）Reduce, wherein by according in claim 10 to 12 Any one of them DIP- devices（15）Fluxing devices（16）By receiving solder flux（F）To manipulate solder flux amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111468042.4A CN114340206A (en) | 2016-10-07 | 2017-09-29 | DIP plate with variable cavity depth and method for wetting contact interface of electronic component |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016219558.1 | 2016-10-07 | ||
| DE102016219558.1A DE102016219558B4 (en) | 2016-10-07 | 2016-10-07 | DIP plate with variable cavity depth and method for dipping contact connections of electronic components |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111468042.4A Division CN114340206A (en) | 2016-10-07 | 2017-09-29 | DIP plate with variable cavity depth and method for wetting contact interface of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107920429A true CN107920429A (en) | 2018-04-17 |
Family
ID=61695731
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710906653.XA Pending CN107920429A (en) | 2016-10-07 | 2017-09-29 | DIP plate with variable cavity depth and method for wetting contact interface of electronic component |
| CN202111468042.4A Pending CN114340206A (en) | 2016-10-07 | 2017-09-29 | DIP plate with variable cavity depth and method for wetting contact interface of electronic component |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111468042.4A Pending CN114340206A (en) | 2016-10-07 | 2017-09-29 | DIP plate with variable cavity depth and method for wetting contact interface of electronic component |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102067952B1 (en) |
| CN (2) | CN107920429A (en) |
| DE (1) | DE102016219558B4 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3532710A1 (en) * | 1985-09-13 | 1987-03-19 | Wemhoener Heinrich Gmbh Co | Diaphragm forming press |
| JP2001291732A (en) * | 2000-04-10 | 2001-10-19 | Matsushita Electric Ind Co Ltd | Apparatus and method of mounting conductive ball |
| JP2008124263A (en) * | 2006-11-13 | 2008-05-29 | Juki Corp | Flux-film forming apparatus |
| JP2010287702A (en) * | 2009-06-11 | 2010-12-24 | Fuji Mach Mfg Co Ltd | Electronic component mounting machine and flux transfer device thereof |
| CN103518256A (en) * | 2011-09-05 | 2014-01-15 | 米卡多科技株式会社 | Vacuum thermal bonding device and vacuum thermal bonding method |
| KR20140139339A (en) * | 2013-05-27 | 2014-12-05 | 삼성테크윈 주식회사 | Apparatus and method for preventing collision of chip mounter |
-
2016
- 2016-10-07 DE DE102016219558.1A patent/DE102016219558B4/en active Active
-
2017
- 2017-09-29 CN CN201710906653.XA patent/CN107920429A/en active Pending
- 2017-09-29 CN CN202111468042.4A patent/CN114340206A/en active Pending
- 2017-09-29 KR KR1020170127573A patent/KR102067952B1/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3532710A1 (en) * | 1985-09-13 | 1987-03-19 | Wemhoener Heinrich Gmbh Co | Diaphragm forming press |
| JP2001291732A (en) * | 2000-04-10 | 2001-10-19 | Matsushita Electric Ind Co Ltd | Apparatus and method of mounting conductive ball |
| JP2008124263A (en) * | 2006-11-13 | 2008-05-29 | Juki Corp | Flux-film forming apparatus |
| JP2010287702A (en) * | 2009-06-11 | 2010-12-24 | Fuji Mach Mfg Co Ltd | Electronic component mounting machine and flux transfer device thereof |
| CN103518256A (en) * | 2011-09-05 | 2014-01-15 | 米卡多科技株式会社 | Vacuum thermal bonding device and vacuum thermal bonding method |
| KR20140139339A (en) * | 2013-05-27 | 2014-12-05 | 삼성테크윈 주식회사 | Apparatus and method for preventing collision of chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102016219558B4 (en) | 2021-12-30 |
| CN114340206A (en) | 2022-04-12 |
| KR102067952B1 (en) | 2020-01-21 |
| KR20180038996A (en) | 2018-04-17 |
| DE102016219558A1 (en) | 2018-04-12 |
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