KR20140139339A - Apparatus and method for preventing collision of chip mounter - Google Patents

Abstract

Provided are an apparatus and method for preventing the collision of a chip mounter. The apparatus for preventing the collision of the chip mounter according to one embodiment of the present invention includes a flux supply module which supplies flux in which the chip picked up by a mounter head is dipped and a vertical driving module which vertically moves the flux supply module to prevent the collision against the mounter head.

Description

[0001] APPARATUS AND METHOD FOR PREVENTING COLLISION OF CHIP MOUNTER [0002]

The present invention relates to an apparatus and method for preventing collision of a chip mounter, and more particularly, to an apparatus and method for preventing collision between a flux supply module and a mounter head by moving a position of a flux supply module below a height at which the mounter head moves To an apparatus and method for preventing collision of a chip mounter.

BACKGROUND ART In a semiconductor manufacturing process, a flux is used to fix a flip chip or the like to a desired position of a printed circuit board (PCB) and dissolve lead or the like. Generally, this flux is supplied from the flux tank.

For this purpose, a flux dipping apparatus (flux dipping apparatus) installed on the chip mounter and applied to the plate with a predetermined thickness so that the flux can be transferred to the parts supplied to the chip mounter is referred to as a flux dipping apparatus. The chip mounter is a device for automatically mounting components such as a semiconductor chip to a predetermined position on a printed circuit board. The chip mounter receives various kinds of parts required for a printed circuit board in various ways, And mounted on the circuit board.

However, as the number of spindles to be dipped at one time increases for the purpose of increasing the productivity, the size of the tank for storing the flux is increasing, and accordingly, the UPH (Unit Per Hour) Technology is becoming increasingly important. The most effective way to increase the UPH is to reduce the travel distance of the axis with the highest frequency of operation. The axis with the highest frequency of operation in the chip mounter is the Z-axis spindle of the mounter head.

FIG. 1 is a view showing a movement locus of a mounter head in a conventional chip mounter, and FIG. 2 is a view showing height difference information of a conventional chip mounter.

Referring to FIG. 1, six spindles 4 are used for the mount head 3 to raise the UPH, six chips 2 are picked up at the pick-up base 1, Chips 2 are placed on the substrate 7. Then, six chips 2 are fluxed at the same time in order to place the picked-up chip 2 on the substrate 7. [ To this end, the length of the flux plate 6 becomes long, and the travel path of the flux tank 5 for applying the flux also becomes longer.

The basic movement locus of the mounter head 3 of the chip mounter is as follows.

① After simultaneous pickup, Flux Dipping moves in X, Y direction

② After flux dipping, move to X axis for alignment work

③ After aligning, move in X and Y direction for place work

④ Move to X, Y axis for pick-up operation after placing

In the above operation, the flux tank (5) must always reach the safety position before performing the movement trajectory (1) for performing the dipping operation. In the operating software (S / W), Traveling Height must always be maintained to avoid collision with the flux tank (5).

For example, in FIG. 2, it is assumed that the Traveling Height is 9.5 mm based on the Vacuum Block supporting the substrate. When the flux tank 5 has a height of 18 mm from the flux plate 6 and is disposed 12 mm downward and 6 mm upward from the reference point as the center, the margin between the mounter head 3 and the flux tank 5, (= 9.5 mm - 6 mm), so that the risk of collision between the mount head 3 and the flux tank 5 is increased.

In order to minimize the influence of such traveling heights, a technique such as Motion Overlap is used. However, there is a restriction that the motion overlap technique should always exist in the expected position of the device. Particularly, when the flux tank 5 is in motion and a mechanical problem occurs, the risk of collision with the mount head 3 is increased when the flux tank 5 is in the middle.

Therefore, at the time of movement of the flux tank 5, it is necessary to fundamentally prevent a collision with the mounter head 3, which may occur when the flux tank 5 is standing by an error of the equipment.

Korean Patent Publication No. 2010-0054438 (Published May 25, 2010)

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to provide an apparatus and method for preventing collision of a chip mounter by preventing a collision between a flux supply module and a mount head by moving a position of a flux supply module lower than a height at which the mount head moves .

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an apparatus for preventing collision of a chip mounter, comprising: a flux supply module for supplying a flux to which a chip picked up on a mount head is dipped; And a vertical drive module for moving the flux supply module up and down to prevent collision with the mounter head.

According to another aspect of the present invention, there is provided a chip mounter crash prevention method for a chip mounter, including: a mounter head for picking up and placing a chip; and a flux tank for supplying a flux dipped in the flip chip picked up to the mounter head, And a flux supply module including a base plate, the method comprising: dipping a flux supplied from the flux supply module to a chip picked up in the mount head; And lowering the flux supply module to a height lower than a height at which the mounter head is moved.

Other specific details of the invention are included in the detailed description and drawings.

According to the present invention, it is possible to prevent the collision of the flux supply module and the mount head by moving the position of the flux supply module below the height at which the mount head moves.

In addition, since the height of the flux process can be controlled, productivity can be improved.

1 is a view showing a movement locus of a mounter head in a conventional chip mounter.
2 is a view showing height difference information of a conventional chip mounter.
3 is a block diagram of an apparatus for preventing a collision of a chip mounter according to an embodiment of the present invention.
4 is a view showing a configuration of an anti-collision apparatus of a chip mounter according to an embodiment of the present invention.
Fig. 5 is a view showing a flux supply module applied to Fig. 4. Fig.
FIG. 6A is a view illustrating a position of a flux supply module in a flux dipping sequence in a chip mounter collision avoidance apparatus according to another embodiment of the present invention, and FIG. 6B is a diagram illustrating a Flux Churning Sequence ) Of the flux supply module.
FIG. 7 is a view illustrating a procedure of a method for preventing collision of a chip mounter according to an embodiment of the present invention. Referring to FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Although the first, second, etc. are used to describe various elements, components and / or sections, it is needless to say that these elements, components and / or sections are not limited by these terms. These terms are only used to distinguish one element, element or section from another element, element or section. Therefore, it goes without saying that the first element, the first element or the first section mentioned below may be the second element, the second element or the second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms "comprises" and / or "made of" means that a component, step, operation, and / or element may be embodied in one or more other components, steps, operations, and / And does not exclude the presence or addition thereof.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 3 is a block diagram of a device for preventing a collision of a chip mounter according to an embodiment of the present invention, and FIG. 4 is a diagram illustrating a configuration of a device for preventing a chip mounter from colliding according to an embodiment of the present invention. 5 is a view showing a flux supply module applied to FIG.

3 and 4, the anti-collision apparatus 100 of the chip mounter according to the embodiment of the present invention includes a flux supply module (not shown) for supplying the flux F to which the chip picked up in the mount head 50 is dipped, And a vertical drive module 120 for moving the flux supply module 110 up and down to prevent collision with the mount head 50 and the mount head 50. The chip mounter's collision avoidance apparatus 100 further includes a sensor module 130 for sensing the position of the flux supply module 110 and a control module 120 for controlling the height of the flux supply module 110 And a control module 140 for controlling the respective modules by controlling the flux supply module 110 to control the supply amount of the flux F. [

5, the flux supply module 110 includes a flux tank 112 for storing the flux F and a base plate 114 for discharging the flux from the flux tank 112 and having a predetermined thickness . Although not shown, the flux supply module 110 may include a frame (not shown) on which an upper surface of the base plate 114 is installed, and is installed to be reciprocally movable at an upper portion of the base plate 114 Various operation members (not shown) for reciprocating the flux tank 112 for supplying the flux F to the base plate 114 may be installed in the frame.

The lower surface of the chip picked up in the chip mounter is dipped in the base plate 114 having the flux F and the flux tank 112 is dipped in the upper portion of the base plate 114 The flux F accommodated in the flux tank 112 is discharged to the upper surface of the base plate 114 while the reciprocating motion is performed so that a predetermined amount of flux F is maintained in the base plate 114.

The up / down driving module 120 includes a pneumatic cylinder 122 that reciprocates by air pressure to move the flux supply module 110 up and down, a pneumatic line 124 that supplies pneumatic pressure to the pneumatic cylinder 122, (Not shown). Further, the up-and-down driving module 120 may further include an air pump 128 that supplies air pressure through the pneumatic line 124. At this time, the flux supply module 110 may be moved up and down only by the force of the air pressure supplied through the pneumatic line 124 without using the pneumatic cylinder 122. [

The pneumatic cylinder 122 is connected to the lower end of the flux supply module 110 so that the height of the flux supply module 110 is adjusted by the operation of the pneumatic cylinder 122 to connect the flux supply module 110 to the mounter head 50, Can be moved to a height lower than the moving path of the second lens group. That is, the upward and downward movement of the flux supply module 110 is induced through the pneumatic cylinder 122. Preferably, there may be two pneumatic cylinders 122, but it will be appreciated that they may have more than one or only one. The displacement length of the flux supply module 110 is determined by the displacement size of the pneumatic cylinder 122 to set the limit of the up-down movement.

The pneumatic pressure supplied to the pneumatic cylinder 122 is transmitted through the pneumatic line 124. Pneumatic pressure is continuously supplied to the pneumatic cylinder 122 through the pneumatic line 124 and on the pneumatic pneumatic cylinder 122 a valve 126 functioning to maintain and shut off the pneumatic pressure applied to the pneumatic line 124 is connected do. That is, the valve 126 serves to control the flow of air. Thus, adjustment of the air pressure supplied from the pneumatic line 124 through the valve 126 is possible. The valve 126 preferably uses a solenoid valve. The solenoid valve includes a solenoid and at least one orifice, and the flow of air through the orifice is controlled as the solenoid passes current, or when the current does not pass, by the movement of the core.

The pneumatic pressure for moving the pneumatic cylinder 122 is supplied through the pneumatic line 124 and the pneumatic pressure is generated by an external pneumatic source such as the air pump 128. The air pump 128 may be installed inside the main equipment or may be connected to the main equipment by a pneumatic line 124 and installed outside the main equipment.

The sensor module 130 senses the position of the flux supply module 110. For example, the sensor module 130 can determine the height of the flux supply module 110 by locating the light source 132 and the optical sensor 134 on the flux supply module 110. The light source 132 is disposed on one side of the upper part of the flux supply module 110 to irradiate incident light in the direction of the optical sensor 134. The optical sensor 134 is disposed on the upper side of the flux supply module 110 and can determine the limit height of the flux supply module 110 according to whether or not the incident light emitted from the light source 132 is detected. A laser diode module or an LED module can be used as the light source 132 and a photodiode, a CCD (Charge Coupled Device), a CMOS (Complementary Metal-Oxide Semiconductor) or the like can be used as the optical sensor 134. It will also be apparent to those skilled in the art that the sensor module 130 may employ other sensors such as a contact sensor (not shown) that sense the position of the flux supply module 110 as the flux supply module 110 contacts it .

For example, when the flux supply module 110 is detected by the sensor module 130, the control module 140 controls the up / down drive module 120 So that the height of the flux supply module 110 can be controlled. The control module 140 may control the flux supply module 110 to adjust the supply amount of the flux F discharged from the flux tank 112 to the base plate 114. Particularly, when the flux tank 112 is in the middle due to a mechanical problem while the flux tank 112 is moving and a collision with the mounter head 50 is expected, the control module 140 stops the movement of the mounter head 50 to an emergency stop .

Accordingly, the flux supply module 110 is moved up and down by the up / down driving module 120 through the anti-collision device 100 of the chip mounter according to the embodiment of the present invention, It is possible to prevent a collision with the vehicle body 50 in advance.

FIG. 6A is a view illustrating a position of a flux supply module in a flux dipping sequence in a chip mounter collision avoidance apparatus according to another embodiment of the present invention, FIG. 6B is a diagram illustrating a Flux Churning Sequence ) Of the flux supply module.

The Flux Dipping Sequence is a process in which a certain amount of flux (F) is buried in the material picked up by Vacuum on the spindle of the mount head. Flux Churning Sequence is a process in which the next material is dipped The flux tank 212 discharges the flux to the plane of the base plate 214 while reciprocally moving left and right.

6A and 6B, after the dipping process, the positions of the flux tank 212 and the base plate 214 are moved below the height at which the mounter head moves. At this time, the height of the flux tank 212 and the base plate 214 is controlled by the air pressure supplied through the valve 226 and the pneumatic line 224. By moving the positions of the flux tank 212 and the base plate 214 below the height at which the mount head moves, a collision with the mount head, which may occur when the flux tank 212 is standing due to a hardware error And it is possible to control the height of the flux process, which can help improve the productivity.

At this time, a separate contact sensor 234 is attached to the electromagnet 232 that fixes the flux tank 212 as the flux tank 212 and the base plate 214 rise to the maximum, It is possible to judge whether or not it is going down. The flux tank 212 and the base plate 214 can be moved up and down by the air pressure supplied through the valve 226 and the pneumatic line 224 to separate the flux tank 212 and the flux tank 212 There is a spatial margin in which the mounting sensors 234 of the respective sensors can be disposed. A separate cylinder or the like is not required to move the flux tank 212 and the base plate 214 up and down and can be moved up and down by the air pressure supplied through the valve 226 and the pneumatic line 224 Additional cost savings are possible.

FIG. 7 is a view illustrating a procedure of a method for preventing collision of a chip mounter according to an embodiment of the present invention. Referring to FIG.

Referring to FIG. 7, a method for preventing a chip mounter from crashing according to an embodiment of the present invention includes a mounter head for picking up and placing chips, a flux tank for supplying a flux to which the flip chip picked up in the mounter head is dipped, To prevent collision between the flux supply modules including the base plate. To this end, a flux dipping process is performed in which the flux supplied from the flux supply module is dipped into chips picked up in the mount head (S10), and then the flux supply module is moved to a height lower than the height at which the mount head is moved (S20) to prevent a collision between the mount head and the flux supply module.

When the mounting operation is completed (Yes), the mounting operation is terminated. When the mounting operation is not completed (No), the flux tank is moved from the upper portion of the base plate to the left and right The flux supply module is raised for Flux Dipping (S50) after Flux Churning process in which the flux in the flux tank is discharged to the surface of the base plate (S40). Thereafter, steps S10 to S50 are repeatedly executed until the mounting operation is completed.

Therefore, it is possible to prevent the collision between the mechanisms, which may occur at the time of optimizing the movement locus of various structures of the chip mounter, through the method of preventing the chip mounter from colliding according to the embodiment of the present invention. It can be applied to the technique of collision avoidance of chip mounter which requires high productivity in the future.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: Anti-collision device of chip mounter
110: flux supply module
120: Up and down drive module
130: Sensor module
140: Control module

Claims (6)

A flux supply module for supplying the flux dipped into chips picked up in the mounter head; And
And a vertical drive module for moving the flux supply module up and down to prevent collision with the mount head. The method according to claim 1,
The flux supply module includes:
A flux tank for storing the flux; And
And a base plate on which the flux is discharged from the flux tank and is stacked to a predetermined thickness. The method according to claim 1,
The up / down drive module includes:
A pneumatic cylinder reciprocating by air pressure to move the flux supply module up and down;
A pneumatic line for supplying pneumatic pressure to the pneumatic cylinder; And
And a valve for regulating a pneumatic pressure supplied from said pneumatic line. The method according to claim 1,
Further comprising a sensor module for sensing a position of the flux supply module. A method for preventing collision between a mounter head picking up and placing a chip and a flux supply module including a flux tank and a base plate for supplying a flux dipped in the flip chip picked up to the mounter head As a result,
Dipping the flux supplied from the flux supply module to a chip picked up in the mounter head; And
Wherein the flux supply module is lowered to a height lower than a height at which the mounter head is moved. 6. The method of claim 5,
Wherein the flux tank moves leftward and rightward from the upper portion of the base plate to discharge the flux in the flux tank to the surface of the base plate; And
Further comprising raising the flux supply module for dipping of the flux.

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