CN107805784A - A kind of OLED evaporated devices - Google Patents

A kind of OLED evaporated devices Download PDF

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Publication number
CN107805784A
CN107805784A CN201711291603.1A CN201711291603A CN107805784A CN 107805784 A CN107805784 A CN 107805784A CN 201711291603 A CN201711291603 A CN 201711291603A CN 107805784 A CN107805784 A CN 107805784A
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CN
China
Prior art keywords
oled
mounting ring
hollow
cylinder
oled substrate
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Granted
Application number
CN201711291603.1A
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Chinese (zh)
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CN107805784B (en
Inventor
曹云娟
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Chengdu Hongrui Photoelectric Technology Co ltd
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Changzhou City Of Chi - Dou Mdt Infotech Ltd
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Priority to CN201711291603.1A priority Critical patent/CN107805784B/en
Priority to CN201811204519.6A priority patent/CN109112487A/en
Priority to CN201811204504.XA priority patent/CN109023245B/en
Priority to CN201811204513.9A priority patent/CN109023288B/en
Priority to CN201811204495.4A priority patent/CN109207928A/en
Application filed by Changzhou City Of Chi - Dou Mdt Infotech Ltd filed Critical Changzhou City Of Chi - Dou Mdt Infotech Ltd
Priority to CN201811204514.3A priority patent/CN109023246B/en
Priority to CN201811205201.XA priority patent/CN109182975A/en
Publication of CN107805784A publication Critical patent/CN107805784A/en
Application granted granted Critical
Publication of CN107805784B publication Critical patent/CN107805784B/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention relates to a kind of OLED evaporated devices, including the front and rear evaporation equipment and oled substrate feeder set respectively in the horizontal direction, oled substrate feeder has seat outside the core motor being fixedly connected with stripper loop, the center of seat is provided with hollow rotation cup outside core motor, the inner ring of the hollow front end for rotating cup and stripper loop is rotatablely connected, rotating end cap is provided with the center of hollow rotation cup, oled substrate fixing device is provided with the front end of rotating end cap.Present invention utilizes the advantages of the principle of centrifugation and hollow shaft motor structure, change original design to the arrangement of basic flush system, it is changed into the arrangement of annular tubular, so that more oled substrates can be accommodated in single vacuum chamber, the effect similar to centrifugation is produced by the rotation of oled substrate simultaneously, so that the dynamics of the deposition material molecules strike substrate in vacuum chamber is obviously improved, the uniformity coefficient of plated film can also be lifted while production efficiency increase, overall structure good leak tightness, reduce the leakage of pollution.

Description

A kind of OLED evaporated devices
Technical field
The present invention relates to the technical field of OLED manufactures, especially a kind of OLED evaporated devices.
Background technology
In known technical field, foreboard section processing procedure is the most important link in whole OLED techniques, and idiographic flow is： Cleaning, after drying for different modes is carried out to TFT substrate, is sent into nitrogen environment and is cooled, and inverts substrate, makes film surface Down.For the substrate after processing, it is sent into vacuum chamber and carries out each functional layer, the evaporation of luminescent layer.To AMOLED after evaporation Feature and the detection of aesthetic appearance and the attaching of polaroid are carried out, finally enters module set section processing procedure.
Need to use special evaporated device in OLED evaporation link, so-called evaporation, be exactly to pass through electric current in vacuum Heating, the heating means such as beam bombardment heating or laser heating make to be steamed material and flash to atom or molecule, they immediately with Larger free path makees free movement, collides substrate surface and condenses, and then forms film.Although evaporation process principle is not multiple It is miscellaneous, but many problems be present in the volume production of reality needs to solve, existing nucleus equipment evaporator major technique is grasped In the several company's hands of Japan, production capacity is extremely limited, and mainly has problem following aspects：
First, the replacement problem of vapor deposition source：, it is necessary to be added being taken out from vacuum chamber after deposition material is depleted Add or change, how to reduce the frequency of replacing, be effectively ensured with change front and rear vacuum chamber pneumatics handle, to improve production effect Rate, reduction maintenance down rate are extremely crucial, while are also easy to produce the problem of polluting, and existing equipment is typically by vacuum chamber Room is designed to directly unlatching, the design of closing type, and replacing vapor deposition source is more frequent, and during the vacuumize process consuming of vacuum chamber Between it is long, the control to temperature process is difficult to precisely quantify, it is necessary to which constantly intermittent in production debug repeatedly.
2nd, single process oled panel count issue in vacuum chamber：The thinking of existing evaporated device generally is The design placed using substrate level is arranged, therefore vapor deposition source generally requires the top for being placed in substrate, although this kind of arrangement mode It is more ripe, but this kind of mode need to consider the stability of process parameter control, it is impossible to which that large area is by large number of base Plate is as in same vacuum chamber, therefore single process quantity is few, and space-consuming is big, and the requirement to vaccum-pumping equipment is high, Er Qiesui The increase of substrate processing size, is deposited that the Structural assignments of heater are increasingly complex, the stability of technological parameter is more difficult to control System.
3rd, the stability of evaporation process parameter：Traditional evaporated device is freely transported generally by deposition material molecule It is dynamic to remove sorbing substrate, in arrangement of the parameter that evaporation link can control substantially only to temperature and heating source, so work Skill stability is not high always, and the problem of so as to cause yields poor, the settling mode of actual volume production can only constantly be debugged Optimal parameter, improve the uniformity coefficient of plated film.
The content of the invention
The technical problem to be solved in the present invention is：Overcome above mentioned problem, there is provided a kind of OLED evaporated devices, enable to steam The Structural assignments of coating apparatus are compact, it is high in machining efficiency, be easy to control technological parameter, while lift the yields and plated film of volume production Uniformity coefficient.
The technical solution adopted for the present invention to solve the technical problems is：A kind of OLED evaporated devices, including along level side The evaporation equipment and oled substrate feeder set respectively forwards, backwards,
The evaporation equipment has the base that can move forward and backward, on the base in the horizontal direction in yi word pattern according to It is secondary to be provided with position limiting sealed ring, mounting ring, stripper loop, rotated centered on the central axis of the stripper loop, on its front end face Provided with several isosceles trapezoid spacer blocks, and smaller one of the isosceles trapezoid spacer block is towards central axial direction, adjacent Two isosceles trapezoid spacer blocks between be equipped with vapor deposition source installation slide rail, one end of each vapor deposition source installation slide rail is embedded in phase Between two adjacent isosceles trapezoid spacer blocks, the other end is fixedly connected through mounting ring and with position limiting sealed ring, and adjacent two Installation chamber is formed between individual vapor deposition source installation slide rail, electromagnetic heater is equipped with each installation cavity room, in the steaming The chute to extend vertically is equipped with plating source installation slide rail, evaporation source device is installed in chute, in the position limiting sealed The end cover by hydraulic oil cylinder driving is provided with the center of ring, the evaporation source device is connected with the inner surface of end cover,
The oled substrate feeder has seat outside the core motor being fixedly connected with stripper loop, in the core motor The center of outer seat is provided with hollow rotation cup, the inner ring rotation connection of the hollow front end for rotating cup and stripper loop, in the sky The center that the heart rotates cup is provided with rotating end cap, and oled substrate fixing device is provided with the front end of the rotating end cap.
Further, the parts machining for the ease of reality and installation, heretofore described mounting ring is by the first assembling Ring, the second mounting ring, the 3rd mounting ring are arranged side by side and formed, and in first mounting ring, the second mounting ring, the 3rd assembling Vacuum-pumping tube joint is equipped with the side wall of ring.
Further, there is Electromagnetic Heating as a kind of specific heater, heretofore described electromagnetic heater Rod, spacing adpting flange head is provided with the end of the electromagnetic heating rod, the spacing adpting flange head is arranged on position limiting sealed On the end face of ring.
Further, it is of the invention in order to adapt to the demand of different parameters and adjust gap of the deposition material in plated film Described in be provided between stripper loop and vapor deposition source installation slide rail it is T-shaped it is foxy connect, and the T-shaped slippery fellow can be radially reciprocal It is mobile.
Further, have for the ease of the demand of full-automation production, heretofore described oled substrate fixing device The support bar driven by telescopic oil cylinder, steady slide rail, and the support bar, stable cunning are respectively equipped with the both sides of the support bar The drive mechanism of rail is arranged at the outside of rotating end cap, slip cap is provided between two steady slide rails, in the support bar End be provided with stop flange, cylindrical stent is installed on the stop flange, using the central axis of the cylindrical stent as Center, in the outer ledge of the cylindrical stent several sealing positive stop strips for extending vertically are provided with, it is close in adjacent two The support panel for installing oled substrate is equipped between envelope positive stop strip, and passes through rotating shaft pin in the middle part of the support panel It is connected with cylindrical stent, fastening adjustment part is provided between two adjacent support panels, in the fastening adjustment part with sliding Pull bar is hinged between set, cushioning supportive cylinder, the cylinder body of the cushioning supportive cylinder are provided with the middle part of the pull bar Part is hinged in state obliquely and with pull bar with axial direction, and the projecting end of the cushioning supportive cylinder props up sealed end The inner surface of lid.
Further, it is heretofore described as a kind of specific structure type and the sealing structure of isolated vacuum environment The cross section of sealing positive stop strip is in isosceles trapezoid shape, and the middle plane that the sealing positive stop strip radially extends runs through tubular The central axis of support, and the smaller side in end of the sealing positive stop strip is set towards the central axis of cylindrical stent, it is described Fastening has the neck adaptable with sealing the cross section of positive stop strip on the end face of adjustment part.
Further, for the ease of adjusting suitable parameter in initial link, the present invention is in the evaporation source device and branch It is provided between support panel and blocks cylinder, and the cylinder that blocks can runs through end cover.
Further, in order to lift the pressurize efficiency of vacuum and temperature loss, heretofore described end cover, round end Lid is two-layer stratigraphic structure, and hollow thermal insulation layer is equipped with inside it.
The beneficial effects of the invention are as follows：The present invention is simple in construction, cleverly make use of the principle and hollow shaft motor of centrifugation The advantages of structure, change original design to the arrangement of basic flush system, be changed into the arrangement of annular tubular so that single vacuum chamber Interior can accommodate more oled substrates, while be produced by the rotation of oled substrate similar to the effect centrifuged so that true The dynamics of deposition material molecules strike substrate in plenum chamber is obviously improved, and plating can also be lifted while production efficiency increase The uniformity coefficient of film, in order to adapt to the design of full-automatic production line, just there is the design of forward and backward separate type, steamed needing to change During plating source, when directly taking out replacing from front console, then substrate is fetched after the completion of being deposited, moved back from the inner chamber of hollow shaft motor Go out, be aided with all kinds of mechanical arms, can greatly improving production efficiency, overall structure good leak tightness, vacuumize position, power supply connects The superiority of structure can be embodied by entering the taking-up of position, changing evaporated source position and substrate, reduce the leakage of pollution.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of the present invention；
Fig. 2 is that the present invention removes the structural representation after end cover；
Fig. 3 is the configuration schematic diagram of the present invention；
Fig. 4 is confined explosion's structural representation one of the present invention；
Fig. 5 is confined explosion's structural representation two of the present invention；
Fig. 6 is the structural representation of oled substrate feeder in the present invention；
Fig. 7 is the sectional view at oled substrate fixing device in the present invention；
Fig. 8 is the close-up schematic view at A in Fig. 7；
Embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.These accompanying drawings are simplified schematic diagram, only with Illustration illustrates the basic structure of the present invention, therefore it only shows the composition relevant with the present invention.
A kind of preferred embodiment of OLED evaporated devices of the invention as shown in Fig. 1~Fig. 8, including it is front and rear in the horizontal direction The evaporation equipment 1 and oled substrate feeder 2 set respectively,
The evaporation equipment 1 has the base 11 that can be moved forward and backward, and is in yi word pattern in the horizontal direction on the pedestal 11 It is sequentially provided with position limiting sealed ring 12, mounting ring, stripper loop 16, it is contemplated that be easy to manufacture and process, while allocate various sizes of Demand, the mounting ring are arranged side by side by the first mounting ring 13, the second mounting ring 14, the 3rd mounting ring 15 and formed, and One mounting ring 13, the second mounting ring 14, the 3rd mounting ring 15 side wall on be equipped with vacuum-pumping tube joint 17, can also be arranged on Experimental test determine optimum position, centered on the central axis of stripper loop 16, on its front end face rotation be provided with several Isosceles trapezoid spacer block 18, and isosceles trapezoid spacer block 18 smaller one is towards central axial direction, in two adjacent isosceles It is equipped with vapor deposition source installation slide rail 19 between trapezoidal spacer block 18, one end of each vapor deposition source installation slide rail 19 is embedded in adjacent Between two isosceles trapezoid spacer blocks 18, by two trapezium structures, the maximum position of limitation radial direction can be smoothly caught in, it is another End is fixedly connected through mounting ring and with position limiting sealed ring 12, and forms installation between adjacent two vapor deposition source installation slide rails 19 Chamber, is equipped with electromagnetic heater 111 in each installation cavity room, and the electromagnetic heater 111 has electromagnetic heating rod 1111, spacing adpting flange first 1112 is provided with the end of electromagnetic heating rod 1111, the spacing adpting flange first 1112 is installed On the end face of position limiting sealed ring 12, the chamber location cleverly formed with being arranged at intervals is used to place heater, it is clear that Heater is not limited to electromagnetic heater, and the structure that other heating can also be used to excite, its power supply source can be unified from spacing The end face upward wiring of sealing ring 12, avoids line construction from being directly entered vacuum chamber, is equipped with vapor deposition source installation slide rail 19 The chute to extend vertically, evaporation source device 112 is installed in chute, is provided with the center of position limiting sealed ring 12 by oil cylinder The end cover 113 of driving, inner surface of the evaporation source device 112 with end cover 113 are connected, are needing to change When, direct drive end cover 113 moves laterally, takes out evaporation source device 112 vertically,
For the standard of same device fabrication, the versatility of equipment is improved, can be pacified in the stripper loop 16 and vapor deposition source Fill be provided between slide rail 19 it is T-shaped it is foxy connect, and the T-shaped slippery fellow can radially move back and forth, for correcting between radial direction The size of gap, to adapt to the requirement of different process,
The oled substrate feeder 2 has seat 21 outside the core motor being fixedly connected with stripper loop 16, in hollow electricity The center of the outer seat 21 of machine is provided with hollow rotation cup 22, and the front end of the hollow rotation cup 22 and the inner ring of stripper loop 16 are rotated and connected Connect, be provided with rotating end cap 23 at the center of hollow rotation cup 22, oled substrate fixing device is provided with the front end of rotating end cap 23 24, cleverly motionless with the outer ring of hollow shaft motor, inner ring rotates and vacant design feature, by hollow rotation cup 22 Chamber is designed to meet the space requirement that oled substrate feeder 2 is movable so that overall structure is more compact reliable,
The oled substrate fixing device 24 has the support bar 241 driven by telescopic oil cylinder, in the both sides of support bar 241 Steady slide rail 242 is respectively equipped with, and support bar 241, the drive mechanism of steady slide rail 242 are arranged at the outer of rotating end cap 23 Side, slip cap 243 is provided between two steady slide rails 242, stop flange 244 is provided with the end of support bar 241, spacing Cylindrical stent 245 is installed, centered on the central axis of cylindrical stent 245, in the outside of cylindrical stent 245 on flange 244 Edge is provided with several sealing positive stop strips 246 to extend vertically, and use is equipped between two adjacent sealing positive stop strips 246 In the support panel 247 of installation oled substrate, and the middle part of support panel 247 is connected by rotating shaft pin with cylindrical stent 245, Fastening adjustment part 248 is provided between two adjacent support panels 247, is cut with scissors between fastening adjustment part 248 and slip cap 243 Pull bar 249 is connected to, cushioning supportive cylinder 250, the cylinder body of the cushioning supportive cylinder 250 are provided with the middle part of pull bar 249 Part is in state obliquely and be hinged with pull bar 249 with axial direction, and the projecting end of the cushioning supportive cylinder 250 props up The inner surface of end cover 113.
The cross section of the sealing positive stop strip 246 is in isosceles trapezoid shape, and seals what positive stop strip 246 radially extended Middle plane runs through the central axis of cylindrical stent 245 so that is steaming in the gap between sealing positive stop strip 246 and support panel 247 Combined closely when plating work, do not influence vacuum chamber, and seal the smaller side in end of positive stop strip 246 towards cylindrical stent 245 Central axis set, there is the card adaptable with sealing the cross section of positive stop strip 246 on the end face of the fastening adjustment part 248 Groove, for limiting the radial direction pushing distance of pull bar 249,
For the ease of adjusting suitable parameter in initial link, avoid the generation of waste product at initial stage, evaporation source device 112 with It is provided between support panel 247 and blocks cylinder, and block cylinder to run through end cover 113, plays covering during tuning parameter in the early stage Effect, removed when reaching optimised process environment, do not influence the smooth realization of integrated artistic.Because at the both ends of total Jun You travel mechanisms, so in order to lift the pressurize efficiency of vacuum and temperature loss, the end cover 113, rotating end cap 23 It is two-layer stratigraphic structure, hollow thermal insulation layer is equipped with inside it.
In the above-described embodiments, principal mode is that vapor deposition source is motionless, when deposition material molecule forms phase in vacuum chamber During to stable ring-type colloid environment, with the rotation of the support panel 247 surrounded, a part of deposition material molecule overlay film On oled substrate, the state for being similar to and flicking and throwing away can be presented in another part, and this part deposition material molecule can be controllable Rotating speed under, stable ring-type colloid environment can be formed, so as to lift the uniformity coefficient of plated film, while be also possible that evaporation The colloid environment of material forms the stable trend around center axis thereof, the uniformity coefficient of overlay film is further lifted, not In the disconnected above-mentioned environment being repeated, deposition material molecule will also bear oled substrate radially on impact, carry Rise plated film effect, it is clear that, can also will in above-described embodiment be deposited equipment 1 evaporation source device 112, with reference to sky The principle of spindle motor, it is arranged to the steering opposite with support panel 247, the circulation that can further speed up said process is realized.
The specific course of work of the present embodiment is as follows：State is as shown in figure 1, whole device keeps close in the course of the work Closed state, vacuum-pumping tube joint 17 are vacuumized, and when reaching pressure requirements, start electromagnetic heater 111, due to two-by-two The setting at interval, heating will be caused to be more uniformly distributed, conversion efficiency is also higher, is overflow in the deposition material molecule of evaporation source device 112 After going out, with the rotation of support bar 241, the whole concomitant rotation of cylindrical stent 245, due to the characteristic of hollow shaft motor, Ke Yishi Existing stepless time adjustment, the best curve of the control of rotational parameters can be obtained by the experiment of early stage, seals positive stop strip 246 and fastening The air-tight state of adjustment part 248 now by pull bar 249 extended state ensure, with evaporation process completion, support bar 241 to Backed off after random, exiting for whole cylindrical stent 245 is driven, after the inner chamber of hollow rotation cup 22 is exited completely, pass through slip cap 243 Move horizontally, controllable pull bar 249 jacks upwards, and then fastens adjustment part 248 and be caught in sealing positive stop strip 246, then props up Support panel 247 and rotate tilting, now coordinate corresponding mechanical arm, complete the taking-up of oled substrate completed to plated film, and The feeding of oled substrate to be processed, after OLED to be processed is sent into substantially, said process is inverted, cushioning supportive cylinder 250 Play a part of support, buffering, connection in the action of pull bar 249, lift the rigidity of overall cylindrical stent 245.
When the deposition material being deposited in source device 112 totally when, sidesway goes out end cover 113 forward, is taken out of by slide rail Source device 112 is deposited, addition is realized by mechanical arm or directly changed, whole device is compact-sized reliable, can be disposable Polylith oled substrate is processed, can be realized at the head and the tail both ends of technological design by automating, be advantageous to whole piece OLED line Capacity in Automatic Technological Design, also allow for controlling spilling and the control of technological parameter of contaminated materials, also fully used total The characteristics of, can significantly solve the problems, such as above-mentioned need to solve.
It is complete by above-mentioned description, relevant staff using the above-mentioned desirable embodiment according to the present invention as enlightenment Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention Property scope is not limited to the content on specification, it is necessary to determines its technical scope according to right.

Claims (8)

  1. A kind of 1. OLED evaporated devices, it is characterised in that：Including the front and rear evaporation equipment (1) set respectively in the horizontal direction With oled substrate feeder (2),
    The evaporation equipment (1) has the base (11) that can be moved forward and backward, and is in the horizontal direction on the base (11) Yi word pattern is sequentially provided with position limiting sealed ring (12), mounting ring, stripper loop (16), using the central axis of the stripper loop (16) in The heart, rotation is provided with several isosceles trapezoid spacer blocks (18) on its front end face, and the isosceles trapezoid spacer block (18) is smaller One, towards central axial direction, is equipped with vapor deposition source installation slide rail between two adjacent isosceles trapezoid spacer blocks (18) (19), one end of each vapor deposition source installation slide rail (19) is embedded between two adjacent isosceles trapezoid spacer blocks (18), another End is fixedly connected through mounting ring and with position limiting sealed ring (12), and is formed between adjacent two vapor deposition source installation slide rails (19) Chamber is installed, electromagnetic heater (111) is equipped with each installation cavity room, on vapor deposition source installation slide rail (19) Provided with the chute to extend vertically, evaporation source device (112) is installed in chute, at the center of the position limiting sealed ring (12) Place is provided with the end cover (113) by hydraulic oil cylinder driving, inner side table of the evaporation source device (112) with end cover (113) Face connects,
    The oled substrate feeder (2) has the outer seat (21) of the core motor being fixedly connected with stripper loop (16), described The center of the outer seat (21) of core motor is provided with hollow rotation cup (22), the hollow front end for rotating cup (22) and stripper loop (16) Inner ring rotation connection, it is described it is hollow rotate cup (22) center be provided with rotating end cap (23), in the rotating end cap (23) Front end be provided with oled substrate fixing device (24).
  2. A kind of 2. OLED evaporated devices as claimed in claim 1, it is characterised in that：The mounting ring is by the first mounting ring (13), the second mounting ring (14), the 3rd mounting ring (15) are arranged side by side and formed, and in first mounting ring (13), second Mounting ring (14), the 3rd mounting ring (15) side wall on be equipped with vacuum-pumping tube joint (17).
  3. A kind of 3. OLED evaporated devices as claimed in claim 1, it is characterised in that：The electromagnetic heater (111) has Electromagnetic heating rod (1111), spacing adpting flange head (1112), the limit are provided with the end of the electromagnetic heating rod (1111) Position adpting flange head (1112) is arranged on the end face of position limiting sealed ring (12).
  4. A kind of 4. OLED evaporated devices as claimed in claim 1, it is characterised in that：The stripper loop (16) is installed with vapor deposition source T-shaped foxy connection is provided between slide rail (19), and the T-shaped slippery fellow can radially move back and forth.
  5. A kind of 5. OLED evaporated devices as described in Claims 1 to 4, it is characterised in that：The oled substrate fixing device (24) there is the support bar (241) driven by telescopic oil cylinder, steady slide rail is respectively equipped with the both sides of the support bar (241) (242), and the support bar (241), the drive mechanism of steady slide rail (242) are arranged at the outside of rotating end cap (23), Slip cap (243) is provided between two steady slide rails (242), stop flange is provided with the end of the support bar (241) (244) cylindrical stent (245), is installed on the stop flange (244), with the central axis of the cylindrical stent (245) Centered on, in the outer ledge of the cylindrical stent (245) be provided with several sealing positive stop strips (246) for extending vertically, The support panel (247) for installing oled substrate, and the support are equipped between two adjacent sealing positive stop strips (246) The middle part of panel (247) is connected by rotating shaft pin with cylindrical stent (245), between two adjacent support panels (247) Provided with fastening adjustment part (248), pull bar (249) is hinged between the fastening adjustment part (248) and slip cap (243), Cushioning supportive cylinder (250), the cylinder part of the cushioning supportive cylinder (250) are provided with the middle part of the pull bar (249) In state obliquely and be hinged with pull bar (249) with axial direction, the projecting end of the cushioning supportive cylinder (250) props up The inner surface of end cover (113).
  6. A kind of 6. OLED evaporated devices as claimed in claim 5, it is characterised in that：It is described to seal the transversal of positive stop strip (246) Face is in isosceles trapezoid shape, and the middle plane that the sealing positive stop strip (246) is radially extended is through cylindrical stent (245) Central axis, and the smaller side in end of the sealing positive stop strip (246) is set towards the central axis of cylindrical stent (245), There is the neck adaptable with the cross section of sealing positive stop strip (246) on the end face of the fastening adjustment part (248).
  7. A kind of 7. OLED evaporated devices as claimed in claim 6, it is characterised in that：In the evaporation source device (112) and branch It is provided between support panel (247) and blocks cylinder, and the cylinder that blocks can runs through end cover (113).
  8. A kind of 8. OLED evaporated devices as claimed in claim 7, it is characterised in that：The end cover (113), rotating end cap (23) it is two-layer stratigraphic structure, hollow thermal insulation layer is equipped with inside it.
CN201711291603.1A 2017-12-08 2017-12-08 A kind of OLED evaporated device Active CN107805784B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201811204519.6A CN109112487A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with high stability oled substrate feeder
CN201811204504.XA CN109023245B (en) 2017-12-08 2017-12-08 High stability OLED evaporation equipment
CN201811204513.9A CN109023288B (en) 2017-12-08 2017-12-08 OLED evaporation equipment with high-efficient evaporation equipment
CN201811204495.4A CN109207928A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with quick oled substrate conveying capacity
CN201711291603.1A CN107805784B (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device
CN201811204514.3A CN109023246B (en) 2017-12-08 2017-12-08 High-efficient OLED evaporation equipment
CN201811205201.XA CN109182975A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device for capableing of quick-replaceable evaporation source

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Application Number Priority Date Filing Date Title
CN201711291603.1A CN107805784B (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device

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CN201811205201.XA Division CN109182975A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device for capableing of quick-replaceable evaporation source
CN201811204513.9A Division CN109023288B (en) 2017-12-08 2017-12-08 OLED evaporation equipment with high-efficient evaporation equipment
CN201811204504.XA Division CN109023245B (en) 2017-12-08 2017-12-08 High stability OLED evaporation equipment
CN201811204495.4A Division CN109207928A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with quick oled substrate conveying capacity
CN201811204519.6A Division CN109112487A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with high stability oled substrate feeder
CN201811204514.3A Division CN109023246B (en) 2017-12-08 2017-12-08 High-efficient OLED evaporation equipment

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CN201811204504.XA Active CN109023245B (en) 2017-12-08 2017-12-08 High stability OLED evaporation equipment
CN201711291603.1A Active CN107805784B (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device
CN201811205201.XA Withdrawn CN109182975A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device for capableing of quick-replaceable evaporation source
CN201811204495.4A Withdrawn CN109207928A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with quick oled substrate conveying capacity
CN201811204514.3A Active CN109023246B (en) 2017-12-08 2017-12-08 High-efficient OLED evaporation equipment
CN201811204513.9A Active CN109023288B (en) 2017-12-08 2017-12-08 OLED evaporation equipment with high-efficient evaporation equipment

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CN201811205201.XA Withdrawn CN109182975A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device for capableing of quick-replaceable evaporation source
CN201811204495.4A Withdrawn CN109207928A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with quick oled substrate conveying capacity
CN201811204514.3A Active CN109023246B (en) 2017-12-08 2017-12-08 High-efficient OLED evaporation equipment
CN201811204513.9A Active CN109023288B (en) 2017-12-08 2017-12-08 OLED evaporation equipment with high-efficient evaporation equipment

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CN107805784B (en) 2018-12-21
CN109023246B (en) 2020-08-14
CN109023245A (en) 2018-12-18
CN109182975A (en) 2019-01-11
CN109023288A (en) 2018-12-18
CN109207928A (en) 2019-01-15
CN109023288B (en) 2020-10-13
CN109023246A (en) 2018-12-18
CN109112487A (en) 2019-01-01
CN109023245B (en) 2020-04-03

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