CN103938168A - Magnetron sputtering coating system - Google Patents
Magnetron sputtering coating system Download PDFInfo
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- CN103938168A CN103938168A CN201410138095.3A CN201410138095A CN103938168A CN 103938168 A CN103938168 A CN 103938168A CN 201410138095 A CN201410138095 A CN 201410138095A CN 103938168 A CN103938168 A CN 103938168A
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Abstract
The invention discloses a magnetron sputtering coating system, comprising a film intake chamber, a film intake buffer chamber, a film intake transition chamber, a sputtering chamber, a film discharge transition chamber, a film discharge buffer chamber, a film discharge chamber, a substrate rack and seven transmission devices which are separately arranged inside the seven chambers, wherein each transmission device comprises a plurality of transmission shafts which are arranged in parallel, and a plurality of first rubber rings arranged on each transmission shaft in a sleeving manner; the substrate rack comprises a main substrate rack body and a plurality of second rubber rings; the main substrate rack body comprises a frame, a mounting rod and a plurality of fixing rods arranged on the frame in a sliding manner; the plurality of second rubber rings are arranged on the mounting rod; a to-be-coated substrate is placed on the mounting rod of the substrate rack, resists against the second rubber rings, and is clamped among the plurality of fixing rods; the substrate rack is placed on the transmission shafts and resists against the first rubber rings; the substrate rack drives the to-be-coated substrate to horizontally run along with rotation of the transmission shafts. Coating is carried out by using the magnetron sputtering coating system, so that the yield is relatively high.
Description
Technical field
The present invention relates to magnetron sputtering technique field, particularly relate to a kind of magnetron sputtering coating system.
Background technology
Magnetron sputtering plating is a kind of film coating method often adopting at present.While using current magnetron sputtering coating system to carry out plated film, substrate is generally vertical operation or 45 degree slant operations, and this mode must be used fixture fixed substrate, thereby produces fringing effect, makes yield lower.
Summary of the invention
Based on this, be necessary to provide a kind of and can improve the magnetron sputtering coating system of producing yield.
A magnetron sputtering coating system, comprises into sheet chamber, enters sheet surge chamber, enters sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber, also comprises seven transmission mechanisms and substrate frame, wherein,
Described in described seven transmission mechanisms are arranged at respectively, enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, in sputtering chamber, slice transition chamber, slice surge chamber and slice chamber, described in each, transmission mechanism comprises a plurality of transmission shafts that be arranged in parallel and is sheathed on a plurality of the first rubber rings on transmission shaft described in each;
Described substrate frame comprises substrate frame main body and a plurality of the second rubber ring, described substrate frame main body comprises framework, is fixedly installed on the mounting rod on described framework and is mounted slidably a plurality of fixed links on described framework, and described a plurality of the second rubber rings are arranged on described mounting rod;
Substrate to be coated be positioned on the mounting rod of described substrate frame and with described the second rubber ring butt, and described substrate to be coated is held between described a plurality of fixed link; Described substrate frame be positioned on described transmission shaft and with described the first rubber ring butt, and described substrate frame with the rotation of described transmission shaft drive described substrate to be coated successively along described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber level run.
In an embodiment, described sputtering chamber comprises the first chamber and second chamber of connection therein, is provided with four DC sputtering powers in described the first chamber, is also provided with four DC sputtering powers in described the second chamber.
In an embodiment, also comprise six infrared radiation heaters therein, described in described six ir radiation intensives are arranged at respectively, enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, in the first chamber, the second chamber and slice transition chamber.
In an embodiment, also comprise eight refrigerating units therein, described eight refrigerating units respectively with describedly enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, the first chamber, the second chamber, slice transition chamber, slice surge chamber be connected with slice chamber.
Therein in an embodiment, describedly enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, be provided with water inlet pipe and rising pipe in the first chamber, the second chamber, slice transition chamber, slice surge chamber and slice chamber, described water inlet pipe and rising pipe are communicated with, described in each, refrigerating unit comprises a refrigerator, two cooling pumps and a cooling column, described refrigerator is electrically connected to described cooling column, one of them cooling pump is communicated with described water inlet pipe and cooling column, and another cooling pump is communicated with described rising pipe and cooling column.
Therein in an embodiment, also comprise vacuum extractor, described vacuum extractor comprises mechanical pump, lobe pump and molecular pump, described mechanical pump all with described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber be communicated with, described lobe pump all with described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber be communicated with, described molecular pump all with described in enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber and slice surge chamber be communicated with.
Therein in an embodiment, also comprise Controlling System, described Controlling System comprises PLC main control cabinet, electric heating control cabinet, driving motor housing, shielding power supply housing and Voltagre regulator, described PLC main control cabinet is used for controlling described electrically heated cabinet, driving motor housing, the work of shielding power supply housing and Voltagre regulator, described electric heating control is used for controlling described infrared radiation heater work, described driving motor housing is used for controlling described transmission mechanism operation, described shielding power supply housing is for controlling the power work of described sputtering chamber, described Voltagre regulator is for controlling the plated film voltage of described sputtering chamber.
In an embodiment, described electric heating control cabinet carries out PID computing therein, controls the heating frequency of described infrared radiation heater by the voltage pulse of solid-state relay.
In an embodiment, also comprise leak detection system therein, described leak detection system all with described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber be communicated with.
In an embodiment, also comprise mechanical arm therein, described mechanical arm is used for loading substrate and unloading substrate.
While using above-mentioned magnetron sputtering coating system plated film, substrate to be coated be positioned in substrate frame, be held between a plurality of fixed links and with the second rubber ring butt, substrate frame be positioned on transmission shaft and with the first rubber ring butt, transmission shaft rotates and drives substrate frame and substrate to be coated successively along entering sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber level run, this rotation axis rotates and drives the mode of substrate frame level run comparatively steady, and the first rubber ring and the second rubber ring can provide buffering preferably, make the stability of operation high, rock little, effectively avoid fragmentation phenomenon, improve yield.
Accompanying drawing explanation
Fig. 1 is the structural representation of the magnetron sputtering coating system of an embodiment;
Fig. 2 is the structural representation along the sectional view of the II-II line of Fig. 1 and travelling belt, translation screw rod, vacuum extractor, refrigerating unit, leak detection assembly;
Fig. 3 is the structural representation of the transmission mechanism of the magnetron sputtering coating system shown in Fig. 1;
Fig. 4 is the structural representation of the substrate frame of the magnetron sputtering coating system shown in Fig. 1;
Fig. 5 is the structural representation of the mechanical arm of the magnetron sputtering coating system shown in Fig. 1;
Fig. 6 is the structural representation of the Controlling System of the magnetron sputtering coating system shown in Fig. 1.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement to be much different from alternate manner described here, and those skilled in the art can do similar improvement without prejudice to intension of the present invention in the situation that, so the present invention is not subject to the restriction of following public concrete enforcement.
See also Fig. 1 and Fig. 2, the magnetron sputtering coating system 200 of one embodiment, comprises into sheet chamber 10, enters sheet surge chamber 20, enters sheet transition chamber 30, sputtering chamber 40, slice transition chamber 50, slice surge chamber 60, slice chamber 70, transmission mechanism and substrate frame 90.
Enter sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, sputtering chamber 40, slice transition chamber 50, slice surge chamber 60 and slice chamber 70 successively linearly formula arrange.
Transmission mechanism is for transmitting the substrate frame 90 that is mounted with substrate.Transmission mechanism is seven.Seven transmission mechanisms are located at respectively in entering sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, in sputtering chamber 40, slice transition chamber 50, slice surge chamber 60 and slice chamber 70.See also Fig. 2 and Fig. 3, each transmission mechanism comprises a plurality of transmission shafts that be arranged in parallel 82 and is sheathed on a plurality of the first rubber rings 84 on each transmission shaft 82.A plurality of the first rubber ring 84 intervals on each transmission shaft 82 arrange, and are preferably spaced set.A plurality of transmission shaft 82 levels, be set in parallel in chamber.
The transmission shaft 82 of seven transmission mechanisms is positioned on same level line, convenient transmission substrate to be coated.Transmission shaft 82 is connected with three-phase synchronous motor, and three-phase synchronous motor drives transmission shaft 82 to rotate.
Substrate frame 90 is for loading and fixed substrate, and drives substrate operation.Refer to Fig. 4, substrate frame 90 comprises substrate frame main body 92 and is arranged at a plurality of the second rubber rings 94 in substrate frame main body 92.Particularly, substrate frame main body 92 comprises framework 922, is fixedly installed on the mounting rod 924 on framework 922 and is mounted slidably a plurality of fixed links 926 on framework 922.
Framework 922 is rectangle or square frame.Framework 922 comprises relative and parallel four union levers (figure is mark) between two between two, offers the fixed orifices 9222 at two intervals on every union lever, and the fixed orifices 9222 on two relative union levers is relative between two.Fixed orifices 9222 is bar hole.
Mounting rod 924 is a plurality of, a plurality of mounting rods 924 intervals, is set in parallel on framework 922.Particularly, mounting rod 924 is bar shaped bar, and one end of each mounting rod 924 is connected on one of them union lever of framework 922, and the other end is connected on another relative union lever of framework 922.
Fixed link 926 is four.Wherein, two fixed links 926 be arranged in parallel, and the two ends difference of each fixed link 926 is two relative union levers of connecting frame 922 slidably, and each fixed link 926 along two relative union levers slidably.Two other fixed link 926 also be arranged in parallel, and the two ends difference of each fixed link 926 is two other relative union lever of connecting frame 922 slidably, and each fixed link 926 along these two relative union levers slidably.
Particularly, with two fastening pieces (figure is mark not), pass respectively two ends and two holes 9222 that are relatively fixed of each fixed link 926, and regulate the degree of tightness of fastening piece, make each fixed link 926 along two relative fixed orificess 9222 slidably.
The quality of the substrate frame main body 92 of said structure is less, is conducive to reduce the driving force of transmission mechanism, reduces energy consumption, reduces preparation cost.Preferably, the material of said frame 922, mounting rod 924 and fixed link 926 is titanium, and the substrate frame main body 92 being made of titanium not only can support substrate to be coated, and quality is less, has further reduced the quality of substrate frame main body 92.
The second rubber ring 94 is arranged on mounting rod 924.Particularly, on each mounting rod 924, being arranged at intervals with a plurality of the second rubber ring 94, the second rubber rings 94 is horizontally placed on mounting rod 924.
While using above-mentioned magnetron sputtering coating system 200 plated film, substrate to be coated is positioned in substrate frame 90, and the bottom of substrate to be coated and the second rubber ring 94 butts, to close substrate direction slip fixed link 926 to be coated, clinch fastener, is held between four fixed links 926 substrate to be coated.The substrate frame 90 that fixes substrate is put on the transmission mechanism of sheet chamber 10, substrate frame 90 be positioned on transmission shaft 82 and substrate frame 90 be sheathed on a plurality of the first rubber ring 84 butts on transmission shaft 82, transmission shaft 82 rotates and drives substrate frame 90 to move forward, thus drive substrate to be coated successively along entering sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, sputtering chamber 40, slice transition chamber 50, slice surge chamber 60 and slice chamber 70 level runs.
While using above-mentioned magnetron sputtering coating system 200 to carry out plated film, in coating process, substrate frame 90 level runs, four fixed links 926 of substrate to be coated by substrate frame 90 are horizontal and are fixed in substrate frame 90, and be horizontal operation, be conducive to avoid frame substrate in vertical coating system to clamp the edge of substrate to be coated, drive the vertical operation of substrate to be coated or 45 degree slant operations and the fringing effect that produces; And in operational process, the first rubber ring 84 and the second rubber ring 94 provide shock absorption, be conducive to effectively reduce rocking of transmission process generation, greatly reduce fragmentation probability, thereby improved production yield.
Because above-mentioned substrate frame 90 is by regulating the position of four fixed links 926 to fix substrate to be coated, make above-mentioned magnetron sputtering coating system 200 be not limited to the substrate to be coated of fixed measure to carry out plated film, the size for the treatment of film plating substrate within the scope of certain size does not limit, realize the size diversification of substrate to be coated, can meet the requirement of different process.
Preferably, sputtering chamber 40 comprises the first chamber 42 and second chamber 44 of connection.In the first chamber 42, be provided with four DC sputtering powers, in the second chamber 44, be also provided with four DC sputtering powers, make sputtering chamber 40 that eight sputter target position can be set altogether, use eight target position to treat film plating substrate and carry out continuity plated film, target position target utilization is high, power supply temperature accumulated value is less, is conducive to guarantee the stability of technique.In this case, the first chamber 42 and the second chamber 44 are provided with transmission mechanism.
Be appreciated that, in other embodiments, DC sputtering power in the first chamber 42 and the second chamber 44 also can replace with other power supplys, as radio-frequency sputtering power supply, intermediate frequency shielding power supply etc., the first chamber 42 can be the same with the shielding power supply in the second chamber 44, also can be different, according to actual process, need to select.
Refer to Fig. 2, preferably, magnetron sputtering coating system 200 also comprises six infrared radiation heaters 100.Infrared radiation heater 100 is for heating.Six infrared radiation heaters 100 are arranged at respectively into sheet chamber 10, enter sheet surge chamber 20, enter in sheet transition chamber 30, the first chamber 42, the second chamber 44 and slice transition chamber 50.Arrange infrared radiation heater 100 respectively to entering sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, the first chamber 42, the second chamber 44 and slice transition chamber 50 and heat; in continuous flow procedure; heat piecemeal the temperature of each chamber; make each indoor temperature comparatively all even stable; to guarantee the envrionment temperature of substrate in coating process, be conducive to guarantee the stability of technique.
Preferably, six infrared radiation heaters 100 are arranged at respectively into sheet chamber 10, enter sheet surge chamber 20, enter the bottom of sheet transition chamber 30, the first chamber 42, the second chamber 44 and slice transition chamber 50, are more conducive to improve stability and the homogeneity of each indoor temperature.
Please again consult Fig. 1, the relative both sides of entering sheet chamber 10 are provided with first family of power and influence 11 and second family of power and influence 12, open first family of power and influence 11, and substrate to be coated is entered into sheet chamber 10.Second family of power and influence 12 is arranged at into sheet chamber 10 and enters between sheet surge chamber 20, for controlling into sheet chamber 10 and enter sheet surge chamber 20 and be communicated with or be not communicated with.Enter sheet surge chamber 20 and enter between sheet transition chamber 30 and be provided with the 3rd family of power and influence 13, the three families of power and influence 13 for controlling into sheet surge chamber 20 and entering 30 connections of sheet transition chamber or be not communicated with.Entering sheet transition chamber 30, the first chamber 42, the second chamber 44 and slice transition chamber 50 is communicated with.Between slice transition chamber 50 and slice surge chamber 60, be provided with the 4th family of power and influence 14, for controlling slice transition chamber 50 and 60 connections of slice surge chamber or not being communicated with.Between slice surge chamber 60 and slice chamber 70, be provided with the 5th family of power and influence 15, for controlling slice surge chamber 60 and 70 connections of slice chamber or not being communicated with.When a side relative with the 5th family of power and influence 15 of slice chamber 70 is provided with the 6th family of power and influence's 16, the six family of power and influencies' 16 unlatching, the substrate that has plated film moves to 70 outsides, slice chamber.
Please again consult Fig. 2, preferably, magnetron sputtering coating system 200 also comprises leak detection system 110.Leak detection system 110 all with enter sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, the first chamber 42, the second chamber 44, slice transition chamber 50, slice surge chamber 60 and slice chamber 70 and be communicated with, for detection of each chamber, whether leak gas, guarantee the stability of vacuum tightness, thereby guarantee plated film under the processing condition of setting, improve yield.
Preferably, magnetron sputtering coating system 200 also comprises vacuum extractor (not shown).Vacuum extractor comprises mechanical pump 122, lobe pump 124 and molecular pump 126.Mechanical pump 122 all with enter sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, sputtering chamber 40, slice transition chamber 50, slice surge chamber 60 and slice chamber 70 be communicated with.Lobe pump 124 all with enter sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, sputtering chamber 40, slice transition chamber 50, slice surge chamber 60 and slice chamber 70 be communicated with.Molecular pump 126 all with enter sheet surge chamber 20, enter sheet transition chamber 30, sputtering chamber 40, slice transition chamber 50 and slice surge chamber 60 be communicated with.
Preferably, the quantity of mechanical pump 122 is three, one of them with enter sheet chamber 10 and be directly communicated with, another is directly communicated with slice chamber 70, last is directly communicated with sputtering chamber 40.The quantity of lobe pump 124 is three, one of them with enter sheet chamber 10 and be directly communicated with, another is directly communicated with slice chamber 70, last is directly communicated with sputtering chamber 40.The quantity of molecular pump 126 is 14, wherein in eight molecular pumps 126, two is one group, 4 groups of molecular pumps 126 respectively with enter sheet surge chamber 20, enter sheet transition chamber 30, slice transition chamber 50 and slice surge chamber 60 be communicated with, in other six molecular pumps 126, three is one group, and two groups of molecular pumps 126 are communicated with the first chamber 42 and the second chamber 44 respectively.
The scope that vacuumizes of mechanical pump 122 is 105～102Pa, and the scope that vacuumizes of lobe pump 124 is 102～10-1Pa, and the scope that vacuumizes of molecular pump 126 is 10-1～10-5Pa.First use mechanical pump 122 to vacuumize, when mechanical pump 122 is extracted into low hollow state, lobe pump 124 starts startup and is evacuated to middle vacuum state, then molecular pump 126 startups are evacuated to low vacuum state, mechanical pump 122, lobe pump 124 and molecular pump 126 cooperatively interact and have guaranteed the stability of vacuum tightness in each chamber, thereby guarantee the stability of coating process.
Please again consult Fig. 2, preferably, magnetron sputtering coating system 200 also comprises refrigerating unit 130.Refrigerating unit 130 is 11 (Fig. 2 only illustrates one), eight refrigerating units 130 respectively with enter sheet chamber 10, enter sheet surge chamber 20, enter sheet transition chamber 30, the first chamber 42, the second chamber 44, slice transition chamber 50, slice surge chamber 60 be connected with slice chamber 70, for the temperature of cooling each chamber and the shielding power supply of sputtering chamber 40.Other three refrigerating units 130 are connected with mechanical pump 122, lobe pump 124 and molecular pump 126 respectively, for cooling mechanical pump 122, lobe pump 124 and molecular pump 126.
Enter sheet chamber 10, enter sheet surge chamber 20, enter in sheet transition chamber 30, the first chamber 42, the second chamber 44, slice transition chamber 50, slice surge chamber 60 and slice chamber 70 to be provided with in water inlet pipe 131 and rising pipe 133(Fig. 2 only to enter in sheet surge chamber 20 and slice surge chamber 60 to draw), water inlet pipe 131 and rising pipe 133 are communicated with.
Each refrigerating unit 130 comprises a refrigerator 132, two cooling pumps 134 and cooling columns 136.Cooling column 136 is for depositing heat-eliminating medium.Refrigerator 132 is electrically connected to cooling column 136, for the heat-eliminating medium of cooling column 136 is freezed.A cooling pump 134 is communicated with water inlet pipe 131 and cooling column 136, and another cooling pump 134 is communicated with rising pipe 133 and cooling column 136.After heat-eliminating medium in 132 pairs of cooling columns 136 of refrigerator freezes, start two cooling pumps 134, make the heat-eliminating medium in cooling column 136 flow to water inlet pipe 131 by a cooling pump 134, and by another cooling pump 134 of process, flow back to cooling column 136 from rising pipe 133, through refrigerator 132, freeze, constantly circulation, realizes cooling.
See also Fig. 1 and Fig. 2, preferably, magnetron sputtering coating system 200 also comprises into sheet pan carriage 140, slice pan carriage 150, two translation screw rods 160 and travelling belts 170.Enter sheet pan carriage 140 and be arranged at into the front end of sheet chamber 10, slice pan carriage 150 is arranged at the rear end of slice chamber 70.Travelling belt 170 is positioned at the outside of each chamber, and extends horizontally to slice chamber 70 from entering sheet chamber 10.Translation screw rod 160 is as one end of travelling belt 170 and enter the transitional transmission device between sheet pan carriage 140, and another translation screw rod 160 is as the other end of travelling belt 170 and the transitional transmission device between slice pan carriage 150.
While starting plated film, substrate frame 90 is positioned in sheet transition frame 140, the clean substrate to be coated of knot is positioned in substrate frame 90, after adjusting four fixed links 926 substrate to be coated being fixed, by being fixed with the substrate frame 90 of film plating substrate, send in sheet chamber 10, and enter successively into sheet surge chamber 20 by transmission mechanism, enter sheet transition chamber 30, the first chamber 42, the second chamber 44, slice transition chamber 50, in slice surge chamber 60 and slice chamber 70, then from slice chamber 70 from out entering slice pan carriage 150, after the substrate that has plated film is taken out, substrate frame 90 enters in travelling belt 170 through translation screw rod 160 from slice pan carriage 150, and enter in another translation screw rod 160 through the transmission of travelling belt 170, translation screw rod 160 is sent into substrate frame 90 in sheet pan carriage 140, load, start new round ground filming process.
Two translation screw rods 160 are all connected with electric motor (not shown), rotating by electric motor drives the rotating of two translation screw rods, substrate frame 90 is moved up and down, thereby travelling belt 170 is moved to into sheet pan carriage 140, or move to travelling belt 170 from slice pan carriage 150.
Enter in sheet pan carriage 140 and slice pan carriage 150 and be provided with transmission mechanism, facilitate substrate frame 90 operations.
Refer to Fig. 5, preferably, magnetron sputtering coating system 200 also comprises mechanical arm 180, and mechanical arm 180, for load, is positioned over the substrate to be coated of cleaning in substrate frame 90 and by the substrate that has plated film and takes off from substrate frame 90.Preferably, mechanical arm 180 is sucker mechanical arm, comprises the first connecting arm 182, the second connecting arm 184 and sucker 186.One end of the first connecting arm 182 and external bracing thing 300 are hinged, and the other end and the second connecting arm 184 are hinged, and sucker 186 is arranged at the second connecting arm 184 away from one end of the first connecting arm 182.Sucker 186 is for adsorbing substrate to be coated, by first motion of connecting arm 182 relative external bracing things 300 and the relative movement of the first connecting arm 182 and the second connecting arm 184, the substrate to be coated of cleaning is positioned in substrate frame 90 and by the substrate that has plated film and is taken off from substrate frame 90, realize automated job, raise the efficiency.
Preferably, refer to Fig. 6, magnetron sputtering coating system 200 also comprises Controlling System 190.Controlling System 190 comprises PLC main control cabinet 191, electrically heated cabinet 192, driving motor housing 193, shielding power supply housing 194, pump group housing 195 and Voltagre regulator 196.
196 communications are connected PLC main control cabinet 191 with power regulator with electrically heated cabinet 192, driving motor housing 193, shielding power supply housing 194, pump group housing 195, for controlling the work of electrically heated cabinet 192, driving motor housing 193, shielding power supply housing 194, power regulator 195 and pump group housing 196.Meanwhile, PLC main control cabinet 191 is connected with the 6th family of power and influence's 16 communications with first family of power and influence 11, second family of power and influence 12, the 3rd family of power and influence 13, the 4th family of power and influence 14, the 5th family of power and influence 15, controls these family of power and influencies' unlatching or closes.
Electric heating control cabinet 192 is for controlling infrared radiation heater 100 work, driving motor housing 193 is for controlling the work of the drive disk assemblies such as transmission mechanism, motor, shielding power supply housing 194 is for controlling the power work of sputtering chamber 40, Voltagre regulator 195 is for controlling the plated film voltage of sputtering chamber 40, and pump group housing 196 is for controlling the work of vacuum extractor.
Preferably, electric heating control cabinet 192 carries out PID computing, controls the heating frequency of infrared radiation heater 100 by the voltage pulse of solid-state relay (not shown), is conducive to control the temperature of each chamber, improves stability and the homogeneity of temperature.
Controlling System 190 is set and realizes fully automatic system operation, enhance productivity.
Please again consult Fig. 1, preferably, magnetron sputtering coating system 200 also comprise in a plurality of infrared inductor 210(Fig. 1 only mark 2).Enter sheet pan carriage 140, enter sheet chamber 10, enter sheet surge chamber 20, enter in sheet transition chamber 30, the first chamber 42, the second chamber 44, slice transition chamber 50, slice surge chamber 60, slice chamber 70 and slice pan carriage 150 to be provided with infrared inductor 210.Infrared inductor 210 is connected with 191 communications of PLC housing, after infrared inductor 210 senses that substrate puts in place, the signal that will put in place sends PLC housing 191 to, PLC housing 191 is controlled 193 work of driving motor housing, driving motor housing 193 starts three-phase synchronous motor operation, and transmission shaft 82 is rotated.
Above-mentioned magnetron sputtering coating system 200 adopts full-automatic mechanical equalization, coating process temperature, and substrate operates steadily, and produces yield high, and cost is low, and efficiency is high.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a magnetron sputtering coating system, comprises into sheet chamber, enters sheet surge chamber, enters sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber, it is characterized in that, also comprises seven transmission mechanisms and substrate frame, wherein,
Described in described seven transmission mechanisms are arranged at respectively, enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, in sputtering chamber, slice transition chamber, slice surge chamber and slice chamber, described in each, transmission mechanism comprises a plurality of transmission shafts that be arranged in parallel and is sheathed on a plurality of the first rubber rings on transmission shaft described in each;
Described substrate frame comprises substrate frame main body and a plurality of the second rubber ring, described substrate frame main body comprises framework, is fixedly installed on the mounting rod on described framework and is mounted slidably a plurality of fixed links on described framework, and described a plurality of the second rubber rings are arranged on described mounting rod;
Substrate to be coated be positioned on the mounting rod of described substrate frame and with described the second rubber ring butt, and described substrate to be coated is held between described a plurality of fixed link; Described substrate frame be positioned on described transmission shaft and with described the first rubber ring butt, and described substrate frame with the rotation of described transmission shaft drive described substrate to be coated successively along described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber level run.
2. magnetron sputtering coating system according to claim 1, it is characterized in that, described sputtering chamber comprises the first chamber and second chamber of connection, is provided with four DC sputtering powers in described the first chamber, is also provided with four DC sputtering powers in described the second chamber.
3. magnetron sputtering coating system according to claim 2, it is characterized in that, also comprise six infrared radiation heaters, described in described six ir radiation intensives are arranged at respectively, enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, in the first chamber, the second chamber and slice transition chamber.
4. magnetron sputtering coating system according to claim 2, it is characterized in that, also comprise eight refrigerating units, described eight refrigerating units respectively with describedly enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, the first chamber, the second chamber, slice transition chamber, slice surge chamber be connected with slice chamber.
5. magnetron sputtering coating system according to claim 4, it is characterized in that, describedly enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, the first chamber, the second chamber, slice transition chamber, in slice surge chamber and slice chamber, be provided with water inlet pipe and rising pipe, described water inlet pipe and rising pipe are communicated with, described in each, refrigerating unit comprises a refrigerator, two cooling pumps and a cooling column, described refrigerator is electrically connected to described cooling column, one of them cooling pump is communicated with described water inlet pipe and cooling column, another cooling pump is communicated with described rising pipe and cooling column.
6. magnetron sputtering coating system according to claim 1, it is characterized in that, also comprise vacuum extractor, described vacuum extractor comprises mechanical pump, lobe pump and molecular pump, described mechanical pump all with described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber are communicated with, described lobe pump all with described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber are communicated with, described molecular pump all with described in enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber and slice surge chamber are communicated with.
7. magnetron sputtering coating system according to claim 3, it is characterized in that, also comprise Controlling System, described Controlling System comprises PLC main control cabinet, electric heating control cabinet, driving motor housing, shielding power supply housing and Voltagre regulator, described PLC main control cabinet is used for controlling described electrically heated cabinet, driving motor housing, the work of shielding power supply housing and Voltagre regulator, described electric heating control is used for controlling described infrared radiation heater work, described driving motor housing is used for controlling described transmission mechanism operation, described shielding power supply housing is for controlling the power work of described sputtering chamber, described Voltagre regulator is for controlling the plated film voltage of described sputtering chamber.
8. magnetron sputtering coating system according to claim 7, is characterized in that, described electric heating control cabinet carries out PID computing, controls the heating frequency of described infrared radiation heater by the voltage pulse of solid-state relay.
9. magnetron sputtering coating system according to claim 1, it is characterized in that, also comprise leak detection system, described leak detection system all with described in enter sheet chamber, enter sheet surge chamber, enter sheet transition chamber, sputtering chamber, slice transition chamber, slice surge chamber and slice chamber be communicated with.
10. magnetron sputtering coating system according to claim 1, is characterized in that, also comprises mechanical arm, and described mechanical arm is used for loading substrate and unloading substrate.
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104611676A (en) * | 2015-01-12 | 2015-05-13 | 宜昌南玻显示器件有限公司 | Magnetron sputtering coating equipment and preparation method of ITO (indium tin oxide) glass |
| CN104651792A (en) * | 2015-03-09 | 2015-05-27 | 常州工学院 | Single-sided continuous winding magnetron sputtering coating automatic production line for flexible substrate |
| CN105803398A (en) * | 2016-05-31 | 2016-07-27 | 苏州普京真空技术有限公司 | Coating device easy to cool |
| CN105803386A (en) * | 2016-05-31 | 2016-07-27 | 苏州普京真空技术有限公司 | Vacuum coating device |
| CN105803396A (en) * | 2016-05-31 | 2016-07-27 | 苏州普京真空技术有限公司 | Coating device easy to operate |
| CN106544637A (en) * | 2016-10-20 | 2017-03-29 | 江西沃格光电股份有限公司 | Magnetic-controlled sputtering coating equipment |
| CN107034443A (en) * | 2017-03-23 | 2017-08-11 | 江西沃格光电股份有限公司 | The coating apparatus of high resistance film |
| CN108914081A (en) * | 2018-09-30 | 2018-11-30 | 佛山市钜仕泰粉末冶金有限公司 | A kind of magnetron sputtering film production line |
| CN109913831A (en) * | 2017-12-12 | 2019-06-21 | 湘潭宏大真空技术股份有限公司 | TFT-LCD coating film on glass production line |
| CN110578127A (en) * | 2019-10-31 | 2019-12-17 | 浙江工业大学 | Device for increasing deposition rate of magnetron sputtering coating |
| CN111607774A (en) * | 2020-07-02 | 2020-09-01 | 苏州锐世讯光学科技有限公司 | Vacuum sputtering coating production system |
| CN112573185A (en) * | 2020-11-24 | 2021-03-30 | 江苏工大金凯高端装备制造有限公司 | Automatic clamping process for hardening and coating resin lenses |
| CN114457315A (en) * | 2021-12-28 | 2022-05-10 | 凯盛信息显示材料(黄山)有限公司 | Glass magnetron sputtering coating system |
| CN117119859A (en) * | 2023-10-18 | 2023-11-24 | 深圳市汉嵙新材料技术有限公司 | Perovskite solar cell preparation device and perovskite solar cell preparation method |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104611676B (en) * | 2015-01-12 | 2017-04-05 | 宜昌南玻显示器件有限公司 | The preparation method of magnetic-controlled sputtering coating equipment and ito glass |
| CN104611676A (en) * | 2015-01-12 | 2015-05-13 | 宜昌南玻显示器件有限公司 | Magnetron sputtering coating equipment and preparation method of ITO (indium tin oxide) glass |
| CN104651792A (en) * | 2015-03-09 | 2015-05-27 | 常州工学院 | Single-sided continuous winding magnetron sputtering coating automatic production line for flexible substrate |
| CN105803398A (en) * | 2016-05-31 | 2016-07-27 | 苏州普京真空技术有限公司 | Coating device easy to cool |
| CN105803386A (en) * | 2016-05-31 | 2016-07-27 | 苏州普京真空技术有限公司 | Vacuum coating device |
| CN105803396A (en) * | 2016-05-31 | 2016-07-27 | 苏州普京真空技术有限公司 | Coating device easy to operate |
| CN106544637A (en) * | 2016-10-20 | 2017-03-29 | 江西沃格光电股份有限公司 | Magnetic-controlled sputtering coating equipment |
| CN107034443A (en) * | 2017-03-23 | 2017-08-11 | 江西沃格光电股份有限公司 | The coating apparatus of high resistance film |
| CN109913831A (en) * | 2017-12-12 | 2019-06-21 | 湘潭宏大真空技术股份有限公司 | TFT-LCD coating film on glass production line |
| CN108914081A (en) * | 2018-09-30 | 2018-11-30 | 佛山市钜仕泰粉末冶金有限公司 | A kind of magnetron sputtering film production line |
| CN110578127A (en) * | 2019-10-31 | 2019-12-17 | 浙江工业大学 | Device for increasing deposition rate of magnetron sputtering coating |
| CN111607774A (en) * | 2020-07-02 | 2020-09-01 | 苏州锐世讯光学科技有限公司 | Vacuum sputtering coating production system |
| CN111607774B (en) * | 2020-07-02 | 2022-03-18 | 苏州锐世讯光学科技有限公司 | Vacuum sputtering coating production system |
| CN112573185A (en) * | 2020-11-24 | 2021-03-30 | 江苏工大金凯高端装备制造有限公司 | Automatic clamping process for hardening and coating resin lenses |
| CN114457315A (en) * | 2021-12-28 | 2022-05-10 | 凯盛信息显示材料(黄山)有限公司 | Glass magnetron sputtering coating system |
| CN114457315B (en) * | 2021-12-28 | 2023-07-25 | 凯盛信息显示材料(洛阳)有限公司 | Glass magnetron sputtering coating system |
| CN117119859A (en) * | 2023-10-18 | 2023-11-24 | 深圳市汉嵙新材料技术有限公司 | Perovskite solar cell preparation device and perovskite solar cell preparation method |
| CN117119859B (en) * | 2023-10-18 | 2024-01-23 | 深圳市汉嵙新材料技术有限公司 | Perovskite solar cell preparation device and perovskite solar cell preparation method |
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