CN107034443A - The coating apparatus of high resistance film - Google Patents
The coating apparatus of high resistance film Download PDFInfo
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- CN107034443A CN107034443A CN201710179509.0A CN201710179509A CN107034443A CN 107034443 A CN107034443 A CN 107034443A CN 201710179509 A CN201710179509 A CN 201710179509A CN 107034443 A CN107034443 A CN 107034443A
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- transition
- sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of coating apparatus of high resistance film, the coating apparatus of the high resistance film is included into piece room, first surge chamber, First Transition room, sputtering chamber, second transition chamber, second surge chamber, slice room, vacuumizing assembly, cold-trap component, cathode assembly and heating component, vacuumizing assembly can be to entering piece room, first surge chamber, First Transition room, sputtering chamber, second transition chamber, second surge chamber and slice room are vacuumized, cold-trap component includes cold-trap part, compressor and refrigerant, cold-trap part is arranged in the first surge chamber, the entrance of compressor is connected with the outlet of cold-trap part, the outlet of compressor is connected with the entrance of cold-trap part, to enable the refrigerant to circulate between cold-trap part and compressor, heating component can be to entering piece room, first surge chamber, First Transition room, sputtering chamber, second transition chamber, second surge chamber and slice room are heated.The coating apparatus production efficiency of above-mentioned high resistance film is higher, and vavuum pump can be made to have longer service life.
Description
Technical field
The present invention relates to a kind of coating apparatus of high resistance film.
Background technology
Magnetron sputtering plating is a kind of film plating process conventional at present, but magnetron sputtering plating is generally all in vacuum shape
Carried out under state, and be typically all that directly coating chamber is vacuumized, not only the pumpdown time is long, and efficiency is low, direct shadow
Production efficiency is rung, but also is easily damaged vavuum pump, its service life is influenceed.
The content of the invention
Based on this, it is necessary to provide the height that a kind of production efficiency is higher and vavuum pump can be made to have longer service life
Hinder the coating apparatus of film.
A kind of coating apparatus of high resistance film, including enter piece room, the first surge chamber, First Transition room, sputtering chamber, the second transition
Room, the second surge chamber, slice room, vacuumizing assembly, cold-trap component, cathode assembly and heating component, it is described enter piece room, described
One surge chamber, the First Transition room, the sputtering chamber, second transition chamber, second surge chamber and the slice room
Be sequentially connected, the vacuumizing assembly can to it is described enter piece room, first surge chamber, the First Transition room, described splash
Room, second transition chamber, second surge chamber and the slice room is penetrated to vacuumize, the cold-trap component include cold-trap part,
Compressor and refrigerant, the cold-trap part are arranged in first surge chamber, the entrance of the compressor and the cold-trap part
Outlet be connected, the outlet of the compressor is connected with the entrance of the cold-trap part, so that the refrigerant can be in institute
State and circulated between cold-trap part and the compressor, the cathode assembly is arranged in the sputtering chamber, the heating component
Can to it is described enter piece room, first surge chamber, the First Transition room, the sputtering chamber, second transition chamber, described
Second surge chamber and the slice room are heated.
Because unplated piece in the external world can adhere to substantial amounts of water and/or oil, when unplated piece enters the coating apparatus of high resistance film,
The water and oil that simultaneously can adhere to it above are brought into the coating apparatus of high resistance film, and these water and oil can become in a heated state
Into water vapour and oil vapour, the coating apparatus of high resistance film, and these water vapours and oil vapour when vacuumizing can be not only polluted
It is also easy to occur reflux, influence vacuumizing assembly vacuumizes efficiency, meanwhile, excessive water vapour and/or oil vapour can also be damaged
Bad vavuum pump, and the service life of vavuum pump is influenceed, and the coating apparatus of above-mentioned high resistance film in the first surge chamber by setting cold
Trap part, cold-trap part can trap water vapour and oil vapour in the first surge chamber, and condense the steam into liquid, to reduce its work
Property, can not only the damage that is caused to vavuum pump of water vapour and oil vapour, but also the work for taking out true component can be greatly improved
Efficiency, shortens time for vacuumizing, improve production efficiency so that each chamber of the coating apparatus of above-mentioned high resistance film is vacuumized
Time only needs 25 seconds~35 seconds, compared with the coating apparatus of traditional magnetron sputtering high resistance film, and production efficiency improves 2 times；And by
Vapor and oil vapour in the coating apparatus of high resistance film be mainly derived from the water that adheres on extraneous and/or film-coated part and/or
Oil, cold-trap part is arranged in the first surge chamber, it can be ensured that water and/oil are vaporized as much as possible, are allowed it to as far as possible
Fast and be more fully attached on cold-trap part, raising vacuumizes efficiency, further increasing production efficiency and prevents water from steaming
The damage that vapour and oil vapour are caused to vavuum pump.
In one of the embodiments, the refrigerant is liquid nitrogen.
In one of the embodiments, the cold-trap part is that a metal tube starts outside from coil to coil by fixing point of one end and curled up
Formed by helical structure, the two ends of the cold-trap part are respectively outlet and the entrance of the cold-trap part.
In one of the embodiments, the heating component is multiple, it is described enter piece room, first surge chamber, described
It is mounted in First Transition room, the sputtering chamber, second transition chamber, second surge chamber and the slice room described
Heating component, each heating component includes heat reflection plate and multiple parallel and spaced heating tube, the heat reflection
Plate is vertically arranged, and multiple heating tubes are fixed on the same side of the heat reflection plate, so that the heat reflection plate is away from institute
The side for stating heating tube can be towards unplated piece.
In one of the embodiments, in first surge chamber, the heat reflection plate and the cold-trap part are relative solid
On the side wall for being scheduled on first surge chamber, so that the unplated piece can be slided between the heat reflection plate and the cold-trap part
It is dynamic.
In one of the embodiments, the vacuumizing assembly includes multiple mechanical pumps, multiple lobe pumps and multiple molecules
Pump, multiple mechanical pumps respectively with it is described enter piece room, the sputtering chamber and the slice room be connected, multiple lobe pumps
Respectively with it is described enter piece room, the sputtering chamber and the slice room be connected, multiple molecular pumps are slow with described first respectively
Room, the First Transition room, the sputtering chamber, second transition chamber is rushed with second surge chamber to be connected.
In one of the embodiments, the cathode assembly includes negative electrode and multiple conducting carrier plates for being used to install target,
The negative electrode is fixedly mounted in the sputtering chamber, and multiple conducting carrier plates are each attached on the same side of the negative electrode, and
Vertically it is arranged in order, and the two neighboring conducting carrier plate is spaced a distance.
In one of the embodiments, in addition to cloth pneumatic module, the cloth pneumatic module includes controller, gas distribution pipe and flow
Meter, the controller can control the flow of reacting gas, and one end of the gas distribution pipe is connected with the controller, and the other end is received
It is dissolved in the sputtering chamber, and is located at the same side of the negative electrode with multiple conducting carrier plates through the negative electrode, it is described
Flowmeter is arranged on the middle part of the gas distribution pipe, and is connected with the controller electric signal.
In one of the embodiments, the controller is the controller with multichannel, and the gas distribution pipe is multiple, often
One end of the individual gas distribution pipe is connected with a passage of the controller, and the other end passes through the negative electrode, and multiple described
The one end of gas distribution pipe away from the controller is arranged at intervals, and the quantity of the flowmeter is consistent with the quantity of the gas distribution pipe, and one
One gas distribution pipe of the individual flowmeter correspondence, multiple flowmeters are connected with the controller electric signal.
In one of the embodiments, the sputtering chamber includes two sputtering portions being connected, one of them described sputtering
Portion is connected with the First Transition room, and another is connected with second transition chamber, and the cathode assembly is multiple to be multiple
The cathode assembly is separately mounted in two sputtering portions.
Brief description of the drawings
Fig. 1 is the structural representation of the coating apparatus of the high resistance film of an embodiment；
Fig. 2 is the structural representation of the coating apparatus of the high resistance film shown in Fig. 1；
Fig. 3 is the structural representation of the cathode assembly of the coating apparatus of the high resistance film shown in Fig. 1；
Fig. 4 is the structural representation of the heating component of the coating apparatus of the high resistance film shown in Fig. 1；
Fig. 5 is the structural representation of the cold-trap component of the coating apparatus of the high resistance film shown in Fig. 1；
Fig. 6 is that structure of the cathode assembly of the coating apparatus of the high resistance film shown in Fig. 1 together with gas distribution assembling components is shown
It is intended to.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the preferred embodiment of the present invention.But, the present invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4, the coating apparatus 100 of the high resistance film of an embodiment is a kind of magnetron sputtering
Coating apparatus.The coating apparatus 100 of the high resistance film is included into piece room 110, the first surge chamber 120, First Transition room 130, sputtering
Room 140, the second transition chamber 150, the second surge chamber 160, slice room 170, transfer assembly 180, vacuumizing assembly 190, cold-trap group
Part 210, cathode assembly 220 and heating component 230.Specifically in the illustrated embodiment, enter piece room 110, the first surge chamber 120,
First Transition room 130, sputtering chamber 140, the second transition chamber 150, the second surge chamber 160 and slice room 170 are arranged successively along a straight line
Row.
It is first chamber that unplated piece passes through to enter piece room 110.Enter piece room 110 with CD feeding port 112, enter piece room 110
The first gate valve 114 is provided with CD feeding port 112, the first gate valve 114 is controlled into the connection between piece room 110 and the external world.
Further, the coating apparatus 100 of high resistance film also includes being used to being moved to unplated piece into the CD feeding port into piece room 110
112 the first pan carriage 240.
Further, the coating apparatus 100 of high resistance film also includes First Transition frame 250, and First Transition frame 250 is arranged on
The unplated piece entered in the CD feeding port 112 of piece room 110, the first pan carriage 240 can be by First Transition frame 250 from entering piece room 110
CD feeding port 112 enter piece room 110.
First surge chamber 120 is connected with entering piece room 110.First surge chamber 120 and enter between piece room 110 to be provided with second
Gate valve 122, the second gate valve 122 controls the first surge chamber 120 and the connection entered between piece room 110.
The surge chamber 120 of First Transition room 130 and first is connected.Set between the surge chamber 120 of First Transition room 130 and first
There are the 3rd gate valve 132, the connection between the 3rd gate valve 132 control First Transition room 130 and the first surge chamber 120.
Sputtering chamber 140 is connected with First Transition room 130.Wherein, sputtering chamber 140 is directly connected with First Transition room 130.Tool
Body, sputtering chamber 140 includes two sputtering portions 142 being connected, and one of sputtering portion 142 is connected with First Transition room 130
It is logical.
Second transition chamber 150 and sputtering chamber 140 are connected.Wherein, the second transition chamber 150 is directly connected with sputtering chamber 140.Tool
Body, the second transition chamber 150 is connected with the sputtering portion 142 away from First Transition room 130.
Second surge chamber 160 is connected with the second transition chamber 150.Wherein, the second surge chamber 160 and the second transition chamber 150 it
Between be provided with the 4th gate valve 152, the 4th gate valve 152 controls the connection between the second surge chamber 160 and the second transition chamber 150.
Slice room 170 is connected with the second surge chamber 160.Wherein, it is provided between the surge chamber 160 of slice room 170 and second
5th gate valve 162, the connection between the 5th gate valve 162 control slice room 170 and the second surge chamber 160.Slice room 170 has
Be also equipped with the 6th gate valve 174 at piece mouthfuls 172, the piece mouth 172 of slice room 170, the 6th gate valve 174 control slice room 170 with
Extraneous connection.
Further, the piece mouth 172 that the coating apparatus 100 of high resistance film also includes being used to take up slice room 170 is sent out
Film-coated part the second pan carriage 260.
Further, the coating apparatus 100 of high resistance film also includes the second transition frame 270, and the second transition frame 270 is arranged on
The piece mouth 172 of slice room 170, the film-coated part that the piece mouth 172 of slice room 170 is sent out can pass through the second transition frame 270
Afterwards in the second pan carriage 260.
Transfer assembly 180 be arranged in successively into piece room 110, the first surge chamber 120, First Transition room 130, sputtering chamber 140,
Second transition chamber 150, the second surge chamber 160 and slice room 170.Wherein, transfer assembly 180 is used to transmit unplated piece, so as to treat
Plating piece enters from the CD feeding port 112 for entering piece room 110, sequentially pass through the first surge chamber 120, First Transition room 130, sputtering chamber 140,
Second transition chamber 150, the second surge chamber 160, and spread out of from the piece mouth 172 of slice room 170.Specifically, transfer assembly 180 is gone back
The first pan carriage 240, First Transition frame 250, the second transition frame 270 and the second pan carriage 260, i.e. unplated piece can be worn from
One pan carriage 240 enters on First Transition frame 250, then from the CD feeding port 112 for entering piece room 110, sequentially passes through the first surge chamber
120th, First Transition room 130, sputtering chamber 140, the second transition chamber 150, the second surge chamber 160, then from the slice of slice room 170
Mouthfuls 172 outflows to the second transition frame 270, finally in the second pan carriage 260.Specifically, transfer assembly 180 can for example be included
Conveyer belt etc..
Vacuumizing assembly 190 can be to entering piece room 110, the first surge chamber 120, First Transition room 130, sputtering chamber 140,
Two transition chambers 150, the second surge chamber 160 and slice room 170 are vacuumized.Specifically, vacuumizing assembly 190 includes multiple mechanical pumps
192nd, multiple lobe pumps 194 and multiple molecular pumps 196, multiple mechanical pumps 192 are respectively with entering piece room 110, sputtering chamber 140 and slice
Room 170 is connected, and multiple lobe pumps 194 are connected with entering piece room 110, sputtering chamber 140 and slice room 170 respectively, multiple molecular pumps 196
Connected respectively with the first surge chamber 120, First Transition room 130, sputtering chamber 140, the second transition chamber 150 and the second surge chamber 160.
Wherein, mechanical pump 192 is roughing pump, and it is 10 mainly to vacuumize scope5~102；Lobe pump 194 is intermediate pump, mainly takes out true
Empty scope is 102~10-1；Molecular pump 196 is high-vacuum pump, and it is 10 mainly to vacuumize scope-1~10-5.Pass through three kinds of vavuum pumps
Use cooperatively, the stability of the vacuum in chamber is ensure that, so that the background vacuum of the coating apparatus 100 of high resistance film
It can be maintained in 5 × 10-4。
Specifically, mechanical pump 192 is model SV750BF mechanical pump；Lobe pump 194 is model WAU2001 sieve
Thatch pump；Molecular pump 196 is maglev molecular pump, for example, model MAG-W2200 molecular pump.
Specifically in the illustrated embodiment, mechanical pump 192 is three, and three mechanical pumps 192 are respectively with entering piece room 110, splashing
One penetrated in two sputtering portions 142 of room 140 is connected with slice room 170, that is, enters piece room 110, sputtering chamber 140 and slice room
170 these three chambers are communicated with a mechanical pump 192；Lobe pump 194 is three, and three lobe pumps 194 are respectively with entering piece room
110th, sputtering chamber 140 is connected with slice room 170, that is, enters piece room 110, sputtering chamber 140 and these three chambers of slice room 170 and connect
It is connected with a lobe pump 194；Wherein, the mechanical pump 192 and lobe pump 194 in sputtering chamber 140 are disposed therein a sputtering portion
In 142.Specifically, the mechanical pump 192 and lobe pump 194 in sputtering chamber 140 are arranged at the sputtering close to the second transition chamber 150
In portion 142.
Molecular pump 196 be 12,12 molecular pumps 196 respectively with the first surge chamber 120, First Transition room 130, splash
Penetrate two sputtering portions 142 of room 140, the second transition chamber 150 to connect with the second surge chamber 160, i.e. the first surge chamber 120, first
Transition chamber 130, two sputtering portions 142 of sputtering chamber 140, the second transition chamber 150 and the second surge chamber 160 are communicated with two points
Sub- pump 196.Specifically, the outlet of all molecular pumps 196 is connected on an escape pipe 198 being connected with the external world.
Specifically, the first surge chamber 120, First Transition room 130, two sputtering portions 142 of sputtering chamber 140, the second transition
In this six chambers of the surge chamber 160 of room 150 and second, the in the vertical direction interval of two molecular pumps 196 of each chamber connection
Arrangement.
Please refer to fig. 5, cold-trap component 210 includes cold-trap part 212, compressor 214 and refrigerant (not shown).
Cold-trap part 212 is arranged in the first surge chamber 120, and the water vapour and oil for trapping in the first surge chamber 120 steam
Vapour.Because unplated piece in the external world can adhere to substantial amounts of water and/or oil, when unplated piece enters the coating apparatus 100 of high resistance film, meeting
The water and oil that it is adhered to above simultaneously are brought into the coating apparatus 100 of high resistance film, and these water and oil in a heated state can
Become water vapour and oil vapour, these water vapours and oil vapour can not only pollute the coating apparatus 100 of high resistance film, and true taking out
These water vapours of space-time and oil vapour are also easy to occur reflux, and influence the efficiency that vacuumizes of vacuumizing assembly 190, meanwhile, mistake
Many water vapours and/or oil vapour can also damage vavuum pump, and influence the service life of vavuum pump, by installing cold-trap part 212
Water vapour and oil vapour can be made to be attached to cold-trap part 212, and be condensed into liquid, to reduce its activity, can not only be carried significantly
Height takes out the operating efficiency of true component, shortens the time vacuumized, improves production efficiency so that the pumpdown time of each chamber is only
Need 25 seconds~35 seconds, production efficiency improves 2 times, additionally it is possible to the damage that water vapour and oil vapour are caused to vavuum pump.
And because the vapor and oil vapour in the coating apparatus 100 of high resistance film are mainly derived from extraneous and/or film-coated part
The water and/or oil of upper attachment, and unplated piece is that air is exchanged with low vacuum when entering piece room 110, from entering piece room 110 to the first
Surge chamber 120 is that low vacuum is exchanged with high vacuum, i.e. the first surge chamber 120 is a chamber of low vacuum and high vacuum transition,
Film-coated part enters piece room 110 and just begun to warm up so that water and/oil are entering in piece room 110 and can not be vaporized completely, and by cold-trap
Part 212 is arranged in the first surge chamber 120, can not only be ensured that water and/oil are vaporized as much as possible, be allowed it to as far as possible
Fast and be more fully attached on cold-trap part 212, raising vacuumizes efficiency, simultaneously, additionally it is possible to avoid water vapour and oil vapour
Sputtering chamber 140 is entered by the first Transition Room, and pollutes First Transition room 130 and sputtering chamber 140.Specifically, cold-trap part 212 is consolidated
On the side wall for being scheduled on the first surge chamber 120.
Specifically in the illustrated embodiment, cold-trap part 212 is that a metal tube starts outside from coil to coil rotation by fixing point of one end
The helical structure formed by, the two ends of cold-trap part 212 are respectively outlet and the entrance of cold-trap part 212.The metal of helical structure
Pipe can increase the surface area of cold-trap part 212, so as to be conducive to water vapour and oil vapour in the first surge chamber 120 of increase to be attached to
Speed on cold-trap part 212, to shorten the time vacuumized.Wherein, cold-trap part 212 is arranged in the side wall of the first surge chamber 120
And be fixed in the first surge chamber 120.
Specifically, copper pipe has the high intensity of common metal, and more flexible than common metal, good toughness and ductility height,
With excellent antivibration, shock resistance and frost heaving resistant performance, therefore, metal tube selects copper pipe.It is appreciated that metal tube can also be
Stainless steel tube etc..
The entrance of compressor 214 is connected with the outlet of cold-trap part 212, the outlet of compressor 214 and entering for cold-trap part 212
Mouth is connected, to enable the refrigerant to circulate between cold-trap part 212 and compressor 214.Wherein, compressor 214 is set
In the outside of the first surge chamber 120, the entrance and exit of compressor 214 passes through the first surge chamber 120 by two pipelines respectively
Side wall and outlet and entrance with cold-trap part 212 are connected.
Wherein, refrigerant can be for liquid nitrogen, containing brine ice, ethylene glycol etc..Preferably, refrigerant is liquid nitrogen, uses liquid nitrogen
Can be by the temperature control of cold-trap part 212 at -130 DEG C~-150 DEG C as refrigerant so that cold-trap part 212 has stronger suction
Attached ability, so that increasing water vapour and oil vapour in the first surge chamber 120 is attached to the speed on cold-trap part 212.
Referring to Fig. 3, cathode assembly 220 is arranged in sputtering chamber 140.Specifically, cathode assembly 220 is multiple,
Multiple cathode assemblies 220 are separately mounted in two sputtering portions 142, and the edge of multiple cathode assemblies 220 in each sputtering portion 142
The direction of transfer of unplated piece is arranged in order.Specifically in the illustrated embodiment, cathode assembly 220 is four, each sputtering portion 142
Two cathode assemblies 220 are inside installed.Wherein, each cathode assembly 220 includes negative electrode 222 and multiple for installing leading for target
Electric support plate 224.
The substantially bar shaped platy structure of negative electrode 222.Specifically in the illustrated embodiment, the length direction of negative electrode 222 is with erecting
Nogata is to parallel.Negative electrode 222 is fixedly mounted in the sputtering portion 142 of sputtering chamber 140.Wherein, it is multiple in each sputtering portion 142
Negative electrode 222 is arranged in order along the direction of transfer of unplated piece.
Multiple conducting carrier plates 224 are each attached on the same side of negative electrode 222, and are vertically arranged in order, i.e., multiple
Length direction arrangement of the conducting carrier plate 224 along negative electrode 222.Wherein, two neighboring conducting carrier plate 224 is spaced a distance, with to
The reserved space expanded with heat and contract with cold of conducting carrier plate 224, causes negative electrode 222 to deform to prevent conducting carrier plate 224 from expanding with heat and contract with cold；And will
Conducting carrier plate 224 be set to it is multiple, can not only avoid a unitary conductive support plate 224 it is long it is overweight caused by conducting carrier plate
224 buckling problem, and relative to a unitary conductive support plate 224, install and viscous target more facilitates, improve installation and viscous target
Efficiency.
Specifically, two neighboring conducting carrier plate 224 is spaced 0.5 millimeter~0.8 millimeter.For example, the length of negative electrode 222 is
1.5 meters, 5 pieces of conducting carrier plates 224 29 millimeters long are fixed with negative electrode 222.Wherein, target is remote installed in conducting carrier plate 224
On the side of negative electrode 222.Operationally, each conducting carrier plate 224 is provided with the one of target facing to unplated piece.
Wherein, conducting carrier plate 224 is copper coin, it will be understood that the material of conducting carrier plate 224 is not limited to copper, or
Other materials with conductive capability.
Also referring to Fig. 6, further, the coating apparatus 100 of high resistance film also includes being used to be passed through into sputtering chamber 140
The cloth pneumatic module 280 of reacting gas.Specifically, the quantity of cloth pneumatic module 280 is consistent with the quantity in sputtering portion 142, for example, in figure
In the embodiment shown, sputtering portion 142 is two, and cloth pneumatic module 280 corresponds to two.Wherein, each cloth pneumatic module 280 includes control
Device 282 processed, gas distribution pipe 284 and flowmeter 286.
Controller 282 is used for the flow for controlling reacting gas.Specifically, controller 282 is the controller with multichannel,
For example, the Speedflo controllers 282 of the multichannel of true section of Britain (GENCOA).
One end of gas distribution pipe 284 is connected with controller 282, and the other end is contained in sputtering chamber 140, and passes through negative electrode 222
And it is located at the same side of negative electrode 222 with multiple conducting carrier plates 224.Specifically, gas distribution pipe 284 is multiple, each gas distribution pipe 284
One end is connected with a passage of controller 282, and the other end passes through negative electrode 222, and multiple gas distribution pipes 284 are away from controller
282 one end is arranged at intervals.
Flowmeter 286 is arranged on the middle part of gas distribution pipe 284, and is connected with the electric signal of controller 282.Specifically, flowmeter
286 quantity is consistent with the quantity of gas distribution pipe 284, and one gas distribution pipe 284 of correspondence of flowmeter 286, multiple flowmeters 286 are equal
It is connected with the electric signal of controller 282.
By the cooperation of many gas distribution pipes 284, multithread gauge 286 and Multi Channel Controller 282, and a gas distribution pipe 284
One passage of correspondence controller 282, one gas distribution pipe 284 of correspondence of flowmeter 286, can make the flow of reacting gas
Accuracy is higher, to be accurately controlled the amount of reactant gases being charged into sputtering chamber 140 so that it is very thick that target material surface is unlikely to covering
Oxide (target material surface has been formed during glow discharge oxide skin(coating) or nitride layer, referred to as intoxicating phenomenon) and shadow
The quality for the film that target is formed on unplated piece is rung, and improves sedimentation rate, the consistency of film is improved, makes anti-wear performance of film etc.
More preferably.
For example, specifically in the illustrated embodiment, each cloth pneumatic module 280 has the Speedflo controllers of eight passages
282nd, eight gas distribution pipes 284 and eight flowmeters 286, wherein four intervals of gas distribution pipe 284 are arranged in a negative electrode 222, in addition
Four intervals of gas distribution pipe 284 are arranged in another negative electrode 222 so that the flow of each cloth pneumatic module 280 precisely arrives 0.1sccm2/
S。
It is appreciated that cloth pneumatic module 280 can be omitted, at this point it is possible to be directly passed through using aerator to sputtering chamber 140
Reacting gas.
Heating component 230 can be to entering piece room 110, the first surge chamber 120, First Transition room 130, sputtering chamber 140, second
Transition chamber 150, the second surge chamber 160 and slice room 170 are heated.Wherein, heating component 230 is multiple, enters piece room 110, first
In surge chamber 120, First Transition room 130, sputtering chamber 140, the second transition chamber 150, the second surge chamber 160 and slice room 170
Heating component 230 is installed.Specifically, two sputtering portions 142 of sputtering chamber 140 are mounted on heating component 230.
Referring to Fig. 4, wherein, each heating component 230 includes heat reflection plate 232 and multiple parallel and interval setting
Heating tube 234, heat reflection plate 232 is vertically arranged, and multiple heating tubes 234 are fixed on the same side of heat reflection plate 232 so that
Side of the heat reflection plate 232 away from heating tube 234 can be towards unplated piece.Specifically, multiple in the vertical directions of heating tube 234
It is spaced and arranged in parallel.
Wherein, the material of heat reflection plate 232 is metal, for example, stainless steel, copper, specular aluminium, iron etc..Heat reflection plate 232
Two relative surfaces are smooth surface.Heating tube 234 is fixed on a surface of heat reflection plate 232.
Further, in the first surge chamber 120, heat reflection plate 232 is relatively fixed in the first surge chamber with cold-trap part 212
On 120 side wall, so that unplated piece can be slided between heat reflection plate 232 and cold-trap part 212.
The coating apparatus 100 of above-mentioned high resistance film at least has the advantage that：
(1) because unplated piece in the external world can adhere to substantial amounts of water and/or oil, the coating apparatus of high resistance film is entered in unplated piece
When 100, the water and oil that simultaneously can adhere to it above are brought into the coating apparatus 100 of high resistance film, and these water and oil are in heating
Water vapour and oil vapour can be become under state, the coating apparatus 100 of high resistance film, and these water when vacuumizing can be not only polluted
Steam and oil vapour are also easy to occur reflux, and influence vacuumizing assembly 190 vacuumizes efficiency, meanwhile, excessive water vapour and/
Or oil vapour can also damage vavuum pump, and influence the service life of vavuum pump, and the coating apparatus 100 of above-mentioned high resistance film by
First surge chamber 120 sets cold-trap part 212, and cold-trap part 212 can trap the water vapour and oil vapour in the first surge chamber 120,
And condense the steam into liquid, to reduce its activity, can not only the damage that is caused to vavuum pump of water vapour and oil vapour, but also
The operating efficiency for taking out true component can be greatly improved, shortens the time vacuumized, production efficiency is improved so that above-mentioned high resistance film
The pumpdown time of each chamber of coating apparatus 100 only needs 25 seconds~35 seconds, the plated film with traditional magnetron sputtering high resistance film
Device 100 is compared, and production efficiency improves 2 times；And because the vapor and oil vapour in the coating apparatus 100 of high resistance film mainly come
The water and/or oil adhered on extraneous and/or film-coated part is come from, cold-trap part 212 is arranged in the first surge chamber 120, can be true
Water conservation and/oil are vaporized as much as possible, are allowed it to as fast as possible and are more fully attached on cold-trap part 212, improve
Efficiency is vacuumized, production efficiency and the damage for preventing water vapour and oil vapour from being caused to vavuum pump is further increasing.Meanwhile,
Cold-trap part 212 is arranged in the first surge chamber 120, additionally it is possible to avoid water vapour and oil vapour from entering by the first Transition Room and splash
Room 140 is penetrated, and pollutes First Transition room 130 and sputtering chamber 140.
(2) the cloth pneumatic module for being used to be passed through reacting gas into sputtering chamber 140 of the coating apparatus 100 of above-mentioned high resistance film
280 include controller 282, gas distribution pipe 284 and flowmeter 286, and controller 282 is the controller with multichannel, gas distribution pipe 284
For multiple a, passage of a correspondence controller 282 of gas distribution pipe 284, flowmeter 286 is multiple a, correspondence of flowmeter 286
One gas distribution pipe 284, multiple flowmeters 286 are connected with the electric signal of controller 282, can make reacting gas flow it is accurate
Du Genggao, to be accurately controlled the amount of reactant gases being charged into sputtering chamber 140 so that target material surface is unlikely to cover very thick oxygen
Compound (target material surface has been formed during glow discharge oxide skin(coating) or nitride layer, referred to as intoxicating phenomenon) and influence target
The quality for the film that material is formed on unplated piece, and improve sedimentation rate, the consistency of film is improved, makes anti-wear performance of film etc. more
It is good.And the experiment proved that, compared with current magnetic control sputtering film plating device 100, the deposition speed of the coating apparatus 100 of the high resistance film
Rate improves 2 times~5 times, and use the uniformity for the film layer that the coating apparatus 100 of above-mentioned high resistance film obtains for -1.5%~
1.5%, than the obtained film layer of coating apparatus 100 of the magnetron sputtering high resistance film of Sony corporation of Japan uniformity (- 3%~
3%) more preferably.
(3) each heating component 230 of the coating apparatus 100 of above-mentioned high resistance film include heat reflection plate 232 with it is multiple parallel
And spaced heating tube 234, heat reflection plate 232 is vertically arranged, and multiple heating tubes 234 are fixed on the same of heat reflection plate 232
On side, so that side of the heat reflection plate 232 away from heating tube 234 can be towards unplated piece, so as to make each chamber
Heated more uniform, Temperature Distribution is more uniform (- 1.5 DEG C of temperature deviation~1.5 DEG C) so that the temperature of unplated piece from normal temperature to
100 DEG C only need 3 minutes~5 minutes, with traditional magnetron sputtering apparatus (temperature of the unplated piece of traditional magnetron sputtering apparatus from
Normal temperature is generally required 10 minutes~15 minutes to 100 DEG C) compare, improve 3 times~5 times；Meanwhile, above-mentioned heating component 230 has
Beneficial to avoid because in each chamber temperature distributing disproportionation it is even caused by fragmentation problem, so as to reduce fragment rate, improve yields,
Further to improve production efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of coating apparatus of high resistance film, it is characterised in that including entering piece room, the first surge chamber, First Transition room, sputtering
Room, the second transition chamber, the second surge chamber, slice room, vacuumizing assembly, cold-trap component, cathode assembly and heating component, it is described enter
Piece room, first surge chamber, the First Transition room, the sputtering chamber, second transition chamber, second surge chamber and
The slice room is sequentially connected, the vacuumizing assembly can to it is described enter piece room, first surge chamber, the First Transition
Room, the sputtering chamber, second transition chamber, second surge chamber and the slice room are vacuumized, the cold-trap component bag
Cold-trap part, compressor and refrigerant are included, the cold-trap part is arranged in first surge chamber, the entrance of the compressor and institute
The outlet for stating cold-trap part is connected, and the outlet of the compressor is connected with the entrance of the cold-trap part, so that the refrigerant
It can be circulated between the cold-trap part and the compressor, the cathode assembly is arranged in the sputtering chamber, described
Heating component can to it is described enter piece room, first surge chamber, the First Transition room, the sputtering chamber, second mistake
Room, second surge chamber and the slice room is crossed to be heated.
2. the coating apparatus of high resistance film according to claim 1, it is characterised in that the refrigerant is liquid nitrogen.
3. the coating apparatus of high resistance film according to claim 1, it is characterised in that the cold-trap part is a metal tube with one
Hold for fixing point start outside from coil to coil curl up formed by helical structure, the two ends of the cold-trap part are respectively the cold-trap part
Outlet and entrance.
4. the coating apparatus of high resistance film according to claim 1, it is characterised in that the heating component be it is multiple, it is described
Enter piece room, first surge chamber, the First Transition room, the sputtering chamber, second transition chamber, second surge chamber
Be mounted on the heating component with the slice room, each heating component include heat reflection plate with it is multiple parallel and
Every the heating tube of setting, the heat reflection plate is vertically arranged, and multiple heating tubes are fixed on the same side of the heat reflection plate
On, so that side of the heat reflection plate away from the heating tube can be towards unplated piece.
5. the coating apparatus of high resistance film according to claim 4, it is characterised in that described in first surge chamber
Heat reflection plate is relatively fixed on the side wall of first surge chamber with the cold-trap part, so that the unplated piece can be described
Slided between heat reflection plate and the cold-trap part.
6. the coating apparatus of high resistance film according to claim 1, it is characterised in that the vacuumizing assembly includes multiple machines
Tool pump, multiple lobe pumps and multiple molecular pumps, multiple mechanical pumps respectively with it is described enter piece room, the sputtering chamber and it is described go out
Piece room is connected, multiple lobe pumps respectively with it is described enter piece room, the sputtering chamber and the slice room be connected, Duo Gesuo
State molecular pump respectively with first surge chamber, the First Transition room, the sputtering chamber, second transition chamber and described
Two surge chambers are connected.
7. the coating apparatus of high resistance film according to claim 1, it is characterised in that the cathode assembly includes negative electrode and many
The individual conducting carrier plate for being used to install target, the negative electrode is fixedly mounted in the sputtering chamber, and multiple conducting carrier plates are solid
On the same side for being scheduled on the negative electrode, and be vertically arranged in order, and one section of the two neighboring conducting carrier plate interval away from
From.
8. the coating apparatus of high resistance film according to claim 7, it is characterised in that also including cloth pneumatic module, the gas distribution
Component includes controller, gas distribution pipe and flowmeter, and the controller can control the flow of reacting gas, the one of the gas distribution pipe
End is connected with the controller, and the other end is contained in the sputtering chamber, and is carried through the negative electrode with multiple conductions
Plate be located at the negative electrode the same side, the flowmeter be arranged on the gas distribution pipe middle part, and with the controller electric signal
Connection.
9. the coating apparatus of high resistance film according to claim 8, it is characterised in that the controller is with multichannel
Controller, the gas distribution pipe is multiple, and each one end of the gas distribution pipe is connected with a passage of the controller, another
End is arranged at intervals through the negative electrode, and the one end of multiple gas distribution pipes away from the controller, the quantity of the flowmeter
It is consistent with the quantity of the gas distribution pipe, the flowmeter one gas distribution pipe of correspondence, multiple flowmeters are and institute
State the connection of controller electric signal.
10. the coating apparatus of high resistance film according to claim 7, it is characterised in that the sputtering chamber includes two and is connected
Logical sputtering portion, one of them described sputtering portion is connected with the First Transition room, another and the second transition chamber phase
Connection, the cathode assembly is multiple, and multiple cathode assemblies are separately mounted in two sputtering portions.
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| CN114836728A (en) * | 2022-04-27 | 2022-08-02 | 中山凯旋真空科技股份有限公司 | Method and device for keeping stable vacuum degree of coating cavity and readable storage medium |
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| CN107034443B (en) | 2019-03-29 |
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