CN107034443B - The coating apparatus of high resistance film - Google Patents
The coating apparatus of high resistance film Download PDFInfo
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- CN107034443B CN107034443B CN201710179509.0A CN201710179509A CN107034443B CN 107034443 B CN107034443 B CN 107034443B CN 201710179509 A CN201710179509 A CN 201710179509A CN 107034443 B CN107034443 B CN 107034443B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of coating apparatus of high resistance film, the coating apparatus of the high resistance film includes into piece room, first surge chamber, First Transition room, sputtering chamber, second transition chamber, second surge chamber, slice room, vacuumizing assembly, cold-trap component, cathode assembly and heating component, vacuumizing assembly can be into piece room, first surge chamber, First Transition room, sputtering chamber, second transition chamber, second surge chamber and slice room vacuumize, cold-trap component includes cold-trap part, compressor and refrigerant, cold-trap part is mounted in the first surge chamber, the entrance of compressor is connected with the outlet of cold-trap part, the outlet of compressor is connected with the entrance of cold-trap part, to enable the refrigerant to circulate between cold-trap part and compressor, heating component can be into piece room, first surge chamber, First Transition room, sputtering chamber, second transition chamber, second surge chamber It is heated with slice room.The coating apparatus production efficiency of above-mentioned high resistance film is higher, and vacuum pump can be made to have longer service life.
Description
Technical field
The present invention relates to a kind of coating apparatus of high resistance film.
Background technique
Magnetron sputtering plating is a kind of currently used film plating process, however magnetron sputtering plating is usually all in vacuum shape
It is carried out under state, and is typically all directly to be vacuumized to coating chamber, not only the pumpdown time is long, low efficiency, direct shadow
Production efficiency is rung, but also is easily damaged vacuum pump, influences its service life.
Summary of the invention
Based on this, it is necessary to provide the height that a kind of production efficiency is higher and vacuum pump can be made to have longer service life
Hinder the coating apparatus of film.
A kind of coating apparatus of high resistance film, including into piece room, the first surge chamber, First Transition room, sputtering chamber, the second transition
Room, the second surge chamber, slice room, vacuumizing assembly, cold-trap component, cathode assembly and heating component, it is described into piece room, described
One surge chamber, the First Transition room, the sputtering chamber, second transition chamber, second surge chamber and the slice room
Be sequentially connected, the vacuumizing assembly can to it is described into piece room, first surge chamber, the First Transition room, described splash
Room, second transition chamber, second surge chamber and the slice room is penetrated to vacuumize, the cold-trap component include cold-trap part,
Compressor and refrigerant, the cold-trap part are mounted in first surge chamber, the entrance of the compressor and the cold-trap part
Outlet be connected, the outlet of the compressor is connected with the entrance of the cold-trap part, so that the refrigerant can be in institute
It states and is circulated between cold-trap part and the compressor, the cathode assembly is mounted in the sputtering chamber, the heating component
Can to it is described into piece room, it is first surge chamber, the First Transition room, the sputtering chamber, second transition chamber, described
Second surge chamber and the slice room are heated.
Since unplated piece can adhere to a large amount of water and/or oil in the external world, when unplated piece enters the coating apparatus of high resistance film,
The water and oil that can simultaneously adhere to it above are brought into the coating apparatus of high resistance film, and these water and oil can become in a heated state
At water vapour and oil vapour, the coating apparatus of high resistance film can be not only polluted, but also these water vapours and oil vapour when vacuumizing
It is also easy to that reflux occurs, influences the efficiency that vacuumizes of vacuumizing assembly, meanwhile, excessive water vapour and/or oil vapour can also damage
Bad vacuum pump, and the service life of vacuum pump is influenced, and the coating apparatus of above-mentioned high resistance film is cold by being arranged in the first surge chamber
Trap part, cold-trap part can trap the indoor water vapour of the first buffering and oil vapour, and condense the steam into liquid, to reduce its work
Property, can not only water vapour and oil vapour damaged caused by vacuum pump, but also the work for taking out true component can be greatly improved
Efficiency shortens the time vacuumized, production efficiency is improved, so that each chamber of the coating apparatus of above-mentioned high resistance film vacuumizes
Time only needs 25 seconds~35 seconds, and compared with the coating apparatus of traditional magnetron sputtering high resistance film, production efficiency improves 2 times；And by
Vapor and oil vapour in the coating apparatus of high resistance film be mainly derived from the water adhered on extraneous and/or film-coated part and/or
Cold-trap part is mounted in the first surge chamber by oil, it can be ensured that water and/oil are vaporized as much as possible, are allowed it to as far as possible
It is attached on cold-trap part fastly and more fully, raising vacuumizes efficiency, further increases production efficiency and prevents water from steaming
Vapour and oil vapour are damaged caused by vacuum pump.
The refrigerant is liquid nitrogen in one of the embodiments,.
The cold-trap part is that a metal tube starts outside from coil to coil by fixed point of one end and curls up in one of the embodiments,
And the helical structure formed, the both ends of the cold-trap part are respectively outlet and the entrance of the cold-trap part.
The heating component is multiple in one of the embodiments, it is described into piece room, it is first surge chamber, described
It is mounted in First Transition room, the sputtering chamber, second transition chamber, second surge chamber and the slice room described
Heating component, each heating component include heat reflection plate and multiple are arranged in parallel and at interval heating tube, the heat reflection
Plate is vertically arranged, and multiple heating tubes are fixed on the same side of the heat reflection plate, so that the heat reflection plate is far from institute
The side for stating heating tube can be towards unplated piece.
In one of the embodiments, in first surge chamber, the heat reflection plate and the cold-trap part are opposite solid
It is scheduled on the side wall of first surge chamber, so that the unplated piece can be slided between the heat reflection plate and the cold-trap part
It is dynamic.
The vacuumizing assembly includes multiple mechanical pumps, multiple lobe pumps and multiple molecules in one of the embodiments,
Pump, multiple mechanical pumps are connected with described into piece room, the sputtering chamber and the slice room respectively, multiple lobe pumps
It is connected respectively with described into piece room, the sputtering chamber and the slice room, multiple molecular pumps are slow with described first respectively
Rush room, the First Transition room, the sputtering chamber, second transition chamber are connected with second surge chamber.
The cathode assembly includes cathode and multiple for installing the conducting carrier plate of target in one of the embodiments,
The cathode is fixedly mounted in the sputtering chamber, and multiple conducting carrier plates are each attached on the same side of the cathode, and
It is arranged successively along the vertical direction, and the two neighboring conducting carrier plate is spaced a distance.
It in one of the embodiments, further include cloth pneumatic module, the cloth pneumatic module includes controller, gas distribution pipe and flow
Meter, the controller can control the flow of reaction gas, and one end of the gas distribution pipe is connect with the controller, and the other end is received
It is dissolved in the sputtering chamber, and is located at the same side of the cathode with multiple conducting carrier plates across the cathode, it is described
Flowmeter is mounted on the middle part of the gas distribution pipe, and connect with the controller electric signal.
In one of the embodiments, the controller be the controller with multichannel, the gas distribution pipe be it is multiple, often
One end of a gas distribution pipe is connected with a channel of the controller, and the other end passes through the cathode, and multiple described
Gas distribution pipe is arranged far from one end interval of the controller, and the quantity of the flowmeter is consistent with the quantity of the gas distribution pipe, and one
A corresponding gas distribution pipe of the flowmeter, multiple flowmeters are connect with the controller electric signal.
The sputtering chamber includes two sputtering portions being connected, one of them described sputtering in one of the embodiments,
Portion is connected with the First Transition room, another is connected with second transition chamber, the cathode assembly be it is multiple, it is multiple
The cathode assembly is separately mounted in two sputtering portions.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the coating apparatus of the high resistance film of an embodiment；
Fig. 2 is the structural schematic diagram of the coating apparatus of high resistance film shown in FIG. 1；
Fig. 3 is the structural schematic diagram of the cathode assembly of the coating apparatus of high resistance film shown in FIG. 1；
Fig. 4 is the structural schematic diagram of the heating component of the coating apparatus of high resistance film shown in FIG. 1；
Fig. 5 is the structural schematic diagram of the cold-trap component of the coating apparatus of high resistance film shown in FIG. 1；
Fig. 6 is that the structure that the cathode assembly of the coating apparatus of high resistance film shown in FIG. 1 is fitted together with cloth pneumatic module is shown
It is intended to.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4, the coating apparatus 100 of the high resistance film of an embodiment is a kind of magnetron sputtering
Coating apparatus.The coating apparatus 100 of the high resistance film includes into piece room 110, the first surge chamber 120, First Transition room 130, sputtering
Room 140, the second transition chamber 150, the second surge chamber 160, slice room 170, transfer assembly 180, vacuumizing assembly 190, cold-trap group
Part 210, cathode assembly 220 and heating component 230.Specifically in the illustrated embodiment, into piece room 110, the first surge chamber 120,
First Transition room 130, sputtering chamber 140, the second transition chamber 150, the second surge chamber 160 and slice room 170 are successively arranged along a straight line
Column.
It is first chamber that unplated piece passes through into piece room 110.There is CD feeding port 112 into piece room 110, into piece room 110
The first gate valve 114 is equipped at CD feeding port 112, the first gate valve 114 is controlled into the connection between piece room 110 and the external world.
Further, the coating apparatus 100 of high resistance film further includes for unplated piece to be moved to the CD feeding port into piece room 110
112 the first pan carriage 240.
Further, the coating apparatus 100 of high resistance film further includes First Transition frame 250, and the setting of First Transition frame 250 exists
Into the CD feeding port 112 of piece room 110, unplated piece in the first pan carriage 240 can be by First Transition frame 250 from into piece room 110
CD feeding port 112 enter into piece room 110.
First surge chamber 120 is connected with into piece room 110.First surge chamber 120 and second is provided between piece room 110
Gate valve 122, the second gate valve 122 control the first surge chamber 120 and into the connections between piece room 110.
First Transition room 130 and the connection of the first surge chamber 120.It is arranged between First Transition room 130 and the first surge chamber 120
There is third gate valve 132, third gate valve 132 controls the connection between First Transition room 130 and the first surge chamber 120.
Sputtering chamber 140 is connect with First Transition room 130.Wherein, sputtering chamber 140 is directly connected to First Transition room 130.Tool
Body, sputtering chamber 140 includes two sputtering portions 142 being connected, and one of sputtering portion 142 is connected with First Transition room 130
It is logical.
Second transition chamber 150 and sputtering chamber 140 connect.Wherein, the second transition chamber 150 is directly connected to sputtering chamber 140.Tool
Body, the second transition chamber 150 is connected with the sputtering portion 142 far from First Transition room 130.
Second surge chamber 160 is connect with the second transition chamber 150.Wherein, the second surge chamber 160 and the second transition chamber 150 it
Between be provided with the 4th gate valve 152, the 4th gate valve 152 controls the connection between the second surge chamber 160 and the second transition chamber 150.
Slice room 170 is connect with the second surge chamber 160.Wherein, it is provided between slice room 170 and the second surge chamber 160
5th gate valve 162, the 5th gate valve 162 control the connection between slice room 170 and the second surge chamber 160.Slice room 170 has
Piece mouth 172, is also equipped with the 6th gate valve 174 at the piece mouth 172 of slice room 170, the 6th gate valve 174 control slice room 170 with
Extraneous connection.
Further, the coating apparatus 100 of high resistance film further includes sending out for installing the piece mouth 172 of slice room 170
Film-coated part the second pan carriage 260.
Further, the coating apparatus 100 of high resistance film further includes the second transition frame 270, and the setting of the second transition frame 270 exists
The piece mouth 172 of slice room 170, the film-coated part that the piece mouth 172 of slice room 170 is sent out can pass through the second transition frame 270
Afterwards in the second pan carriage 260.
Transfer assembly 180 be successively arranged in into piece room 110, the first surge chamber 120, First Transition room 130, sputtering chamber 140,
Second transition chamber 150, the second surge chamber 160 and slice room 170.Wherein, transfer assembly 180 is used to transmit unplated piece, so as to
Plating piece from into piece room 110 CD feeding port 112 entrance, successively by the first surge chamber 120, First Transition room 130, sputtering chamber 140,
Second transition chamber 150, the second surge chamber 160, and spread out of from the piece mouth of slice room 170 172.Specifically, transfer assembly 180 is gone back
The first pan carriage 240, First Transition frame 250, the second transition frame 270 and the second pan carriage 260 can be worn, i.e. unplated piece is from
In one pan carriage 240 to First Transition frame 250, then from the entrance of CD feeding port 112 into piece room 110, successively pass through the first surge chamber
120, First Transition room 130, sputtering chamber 140, the second transition chamber 150, the second surge chamber 160, then from the slice of slice room 170
Mouthfuls 172 outflows to the second transition frame 270, finally in the second pan carriage 260.Specifically, transfer assembly 180 for example may include
Conveyer belt etc..
Vacuumizing assembly 190 can be into piece room 110, the first surge chamber 120, First Transition room 130, sputtering chamber 140,
Two transition chambers 150, the second surge chamber 160 and slice room 170 vacuumize.Specifically, vacuumizing assembly 190 includes multiple mechanical pumps
192, multiple lobe pumps 194 and multiple molecular pumps 196, multiple mechanical pumps 192 are respectively and into piece room 110, sputtering chamber 140 and slice
Room 170 is connected to, and multiple lobe pumps 194 are connected into piece room 110, sputtering chamber 140 and slice room 170 respectively, multiple molecular pumps 196
It is connected to respectively with the first surge chamber 120, First Transition room 130, sputtering chamber 140, the second transition chamber 150 and the second surge chamber 160.
Wherein, mechanical pump 192 is roughing pump, and mainly vacuumizing range is 105~102；Lobe pump 194 is intermediate pump, main to take out very
Empty range is 102~10-1；Molecular pump 196 is high-vacuum pump, and mainly vacuumizing range is 10-1~10-5.Pass through three kinds of vacuum pumps
Be used cooperatively, can guarantee the stability of the indoor vacuum degree of chamber, so that the background vacuum of the coating apparatus 100 of high resistance film
It can be maintained in 5 × 10-4。
Specifically, mechanical pump 192 is the mechanical pump of model SV750BF；Lobe pump 194 is sieve of model WAU2001
Thatch pump；Molecular pump 196 is maglev molecular pump, for example, the molecular pump of model MAG-W2200.
Specifically in the illustrated embodiment, mechanical pump 192 be three, three mechanical pumps 192 respectively with into piece room 110, splash
One penetrated in two sputtering portions 142 of room 140 is connected with slice room 170, i.e., into piece room 110, sputtering chamber 140 and slice room
170 these three chambers are communicated with a mechanical pump 192；Lobe pump 194 is three, and three lobe pumps 194 are respectively and into piece room
110, sputtering chamber 140 is connected with slice room 170, i.e., connects into piece room 110, sputtering chamber 140 and these three chambers of slice room 170
It is connected with a lobe pump 194；Wherein, the mechanical pump 192 in sputtering chamber 140 and lobe pump 194 are disposed therein a sputtering portion
In 142.Specifically, the mechanical pump 192 in sputtering chamber 140 and lobe pump 194 are arranged at the sputtering close to the second transition chamber 150
In portion 142.
Molecular pump 196 be 12,12 molecular pumps 196 respectively with the first surge chamber 120, First Transition room 130, splash
Penetrate two sputtering portions 142 of room 140, the second transition chamber 150 is connected to the second surge chamber 160, i.e. the first surge chamber 120, first
Transition chamber 130, two sputtering portions 142 of sputtering chamber 140, the second transition chamber 150 and the second surge chamber 160 divide there are two being connected to
Son pump 196.Specifically, the outlet of all molecular pumps 196 is connected on the escape pipe 198 that one is connected with the external world.
Specifically, the first surge chamber 120, First Transition room 130, two sputtering portions 142 of sputtering chamber 140, the second transition
In room 150 and the second surge chamber 160 this six chambers, two molecular pumps 196 of each chamber connection are spaced in the vertical direction
Arrangement.
Please refer to fig. 5, cold-trap component 210 includes cold-trap part 212, compressor 214 and refrigerant (not shown).
Cold-trap part 212 is mounted in the first surge chamber 120, is steamed for trapping the water vapour in the first surge chamber 120 and oil
Vapour.Since unplated piece can adhere to a large amount of water and/or oil in the external world, when unplated piece enters the coating apparatus 100 of high resistance film, meeting
The water and oil that it is adhered to above simultaneously are brought into the coating apparatus 100 of high resistance film, and these water and oil in a heated state can
Become water vapour and oil vapour, these water vapours and oil vapour can not only pollute the coating apparatus 100 of high resistance film, but also take out very
These water vapours and oil vapour are also easy to that reflux occurs when empty, and influence the efficiency that vacuumizes of vacuumizing assembly 190, meanwhile, mistake
More water vapours and/or oil vapour can also damage vacuum pump, and influence the service life of vacuum pump, by installing cold-trap part 212
Water vapour and oil vapour can be made to be attached to cold-trap part 212, and be condensed into liquid, to reduce its activity, can not only be mentioned significantly
Height takes out the working efficiency of true component, shortens the time vacuumized, improves production efficiency, so that the pumpdown time of each chamber is only
It needs 25 seconds~35 seconds, production efficiency improves 2 times, additionally it is possible to which water vapour and oil vapour are damaged caused by vacuum pump.
And due in the coating apparatus of high resistance film 100 vapor and oil vapour be mainly derived from extraneous and/or film-coated part
The water and/or oil of upper attachment, and when unplated piece enters into piece room 110 is that atmosphere is exchanged with low vacuum, from into piece room 110 to the first
Surge chamber 120 is that low vacuum is exchanged with high vacuum, i.e. the first surge chamber 120 is a chamber of low vacuum Yu high vacuum transition,
Film-coated part enters just to be begun to warm up into piece room 110, so that water and/oil be into cannot be vaporized in piece room 110 completely, and by cold-trap
Part 212 is mounted in the first surge chamber 120, can not only be ensured that water and/oil are vaporized as much as possible, be allowed it to as far as possible
It is attached on cold-trap part 212 fastly and more fully, raising vacuumizes efficiency, simultaneously, additionally it is possible to avoid water vapour and oil vapour
Enter sputtering chamber 140 by the first Transition Room, and pollutes First Transition room 130 and sputtering chamber 140.Specifically, cold-trap part 212 is solid
It is scheduled on the side wall of the first surge chamber 120.
Specifically in the illustrated embodiment, cold-trap part 212 is that a metal tube starts outside from coil to coil rotation by fixed point of one end
Around and formed helical structure, the both ends of cold-trap part 212 are respectively outlet and the entrance of cold-trap part 212.The metal of helical structure
Pipe can increase the surface area of cold-trap part 212, be attached to be conducive to increase water vapour and oil vapour in the first surge chamber 120
Rate on cold-trap part 212, to shorten the time vacuumized.Wherein, cold-trap part 212 is arranged in the side wall of the first surge chamber 120
And it is fixed in the first surge chamber 120.
Specifically, copper pipe has the high intensity of common metal, and more flexible than common metal, good toughness and ductility height,
With excellent antivibration, shock resistance and frost heaving resistant performance, therefore, metal tube selects copper pipe.It is appreciated that metal tube can also be
Stainless steel tube etc..
The entrance of compressor 214 is connected with the outlet of cold-trap part 212, the outlet of compressor 214 and entering for cold-trap part 212
Mouth is connected, to enable the refrigerant to circulate between cold-trap part 212 and compressor 214.Wherein, compressor 214 is arranged
In the outside of the first surge chamber 120, the entrance and exit of compressor 214 passes through two pipelines across the first surge chamber 120 respectively
Side wall and be connected with the outlet of cold-trap part 212 and entrance.
Wherein, refrigerant can be liquid nitrogen, containing brine ice, ethylene glycol etc..Preferably, refrigerant is liquid nitrogen, uses liquid nitrogen
The temperature of cold-trap part 212 can be controlled at -130 DEG C~-150 DEG C as refrigerant, so that cold-trap part 212 has stronger suction
Attached ability, so that increasing water vapour and oil vapour in the first surge chamber 120 is attached to the rate on cold-trap part 212.
Referring to Fig. 3, cathode assembly 220 is mounted in sputtering chamber 140.Specifically, cathode assembly 220 is multiple,
Multiple cathode assemblies 220 are separately mounted in two sputtering portions 142, and 220 edge of multiple cathode assemblies in each sputtering portion 142
The direction of transfer of unplated piece is arranged successively.Specifically in the illustrated embodiment, cathode assembly 220 is four, each sputtering portion 142
There are two cathode assemblies 220 for interior installation.Wherein, each cathode assembly 220 includes cathode 222 and multiple for installing leading for target
Electric support plate 224.
The substantially bar shaped plate structure of cathode 222.Specifically in the illustrated embodiment, the length direction of cathode 222 and perpendicular
Histogram is to parallel.Cathode 222 is fixedly mounted in the sputtering portion 142 of sputtering chamber 140.Wherein, multiple in each sputtering portion 142
Cathode 222 is arranged successively along the direction of transfer of unplated piece.
Multiple conducting carrier plates 224 are each attached on the same side of cathode 222, and are arranged successively along the vertical direction, i.e., multiple
Conducting carrier plate 224 is arranged along the length direction of cathode 222.Wherein, two neighboring conducting carrier plate 224 is spaced a distance, to give
The reserved space expanded with heat and contract with cold of conducting carrier plate 224, causes cathode 222 to deform to prevent conducting carrier plate 224 from expanding with heat and contract with cold；And it will
Conducting carrier plate 224 is set as multiple, can not only avoid a unitary conductive support plate 224 it is too long it is overweight caused by conducting carrier plate
224 buckling problem, and relative to a unitary conductive support plate 224, installation and viscous target are more convenient, improve installation and viscous target
Efficiency.
Specifically, two neighboring conducting carrier plate 224 is spaced 0.5 millimeter~0.8 millimeter.For example, the length of cathode 222 is
1.5 meters, 5 pieces 29 millimeters long of conducting carrier plate 224 is fixed on cathode 222.Wherein, it is separate to be mounted on conducting carrier plate 224 for target
On the side of cathode 222.At work, each conducting carrier plate 224 is equipped with the one of target facing towards unplated piece.
Wherein, conducting carrier plate 224 is copper sheet, it will be understood that the material of conducting carrier plate 224 is not limited to copper, or
Other materials with conductive capability.
Referring to Figure 6 together, further, the coating apparatus 100 of high resistance film further includes for being passed through into sputtering chamber 140
The cloth pneumatic module 280 of reaction gas.Specifically, the quantity of cloth pneumatic module 280 is consistent with the quantity in sputtering portion 142, for example, scheming
In the embodiment shown, sputtering portion 142 is two, and cloth pneumatic module 280 corresponds to two.Wherein, each cloth pneumatic module 280 includes control
Device 282, gas distribution pipe 284 and flowmeter 286 processed.
Controller 282 is used to control the flow of reaction gas.Specifically, controller 282 is the controller with multichannel,
For example, the Speedflo controller 282 of the multichannel of true section, Britain (GENCOA).
One end of gas distribution pipe 284 is connect with controller 282, and the other end is contained in sputtering chamber 140, and passes through cathode 222
And it is located at the same side of cathode 222 with multiple conducting carrier plates 224.Specifically, gas distribution pipe 284 is multiple, each gas distribution pipe 284
One end is connected with a channel of controller 282, and the other end passes through cathode 222, and multiple gas distribution pipes 284 are far from controller
282 one end interval setting.
Flowmeter 286 is mounted on the middle part of gas distribution pipe 284, and connect with 282 electric signal of controller.Specifically, flowmeter
286 quantity is consistent with the quantity of gas distribution pipe 284, and the corresponding gas distribution pipe 284 of a flowmeter 286, multiple flowmeters 286 are
It is connect with 282 electric signal of controller.
By the cooperation of more gas distribution pipes 284, multithread meter 286 and Multi Channel Controller 282, and a gas distribution pipe 284
One channel of corresponding controller 282, the corresponding gas distribution pipe 284 of a flowmeter 286, can make the flow of reaction gas
Accuracy is higher, to be accurately controlled the amount of reactant gases being charged into sputtering chamber 140 so that target material surface be unlikely to covering it is very thick
Oxide (oxide skin(coating) or nitride layer that target material surface has been formed when glow discharge, referred to as intoxicating phenomenon) and shadow
The quality for the film that target is formed on unplated piece is rung, and improves deposition rate, the consistency of film is improved, makes the wear-resisting property etc. of film
More preferably.
For example, specifically in the illustrated embodiment, each cloth pneumatic module 280 has the Speedflo controller in eight channels
282, eight gas distribution pipes 284 and eight flowmeters 286, wherein four intervals of gas distribution pipe 284 are arranged in a cathode 222, in addition
Four intervals of gas distribution pipe 284 are arranged in another cathode 222, so that the flow of each cloth pneumatic module 280 precisely arrives 0.1sccm2/
S。
It is appreciated that cloth pneumatic module 280 can be omitted, it is passed through at this point it is possible to directly adopt aerator to sputtering chamber 140
Reaction gas.
Heating component 230 can be into piece room 110, the first surge chamber 120, First Transition room 130, sputtering chamber 140, second
Transition chamber 150, the second surge chamber 160 and slice room 170 are heated.Wherein, heating component 230 is multiple, into piece room 110, first
In surge chamber 120, First Transition room 130, sputtering chamber 140, the second transition chamber 150, the second surge chamber 160 and slice room 170
Heating component 230 is installed.Specifically, two sputtering portions 142 of sputtering chamber 140 are mounted on heating component 230.
Referring to Fig. 4, wherein each heating component 230 includes heat reflection plate 232 and multiple parallel and interval setting
Heating tube 234, heat reflection plate 232 is vertically arranged, and multiple heating tubes 234 are fixed on the same side of heat reflection plate 232 so that
It side of the heat reflection plate 232 far from heating tube 234 can be towards unplated piece.Specifically, multiple heating tubes 234 are in the vertical direction
It is spaced and arranged in parallel.
Wherein, the material of heat reflection plate 232 is metal, for example, stainless steel, copper, specular aluminium, iron etc..Heat reflection plate 232
Two opposite surfaces are smooth surface.Heating tube 234 is fixed on a surface of heat reflection plate 232.
Further, in the first surge chamber 120, heat reflection plate 232 and cold-trap part 212 are relatively fixed in the first surge chamber
On 120 side wall, so that unplated piece can slide between heat reflection plate 232 and cold-trap part 212.
The coating apparatus 100 of above-mentioned high resistance film at least has the advantage that
(1) a large amount of water and/or oil can be adhered in the external world due to unplated piece, enters the coating apparatus of high resistance film in unplated piece
When 100, the water and oil that can simultaneously adhere to it above are brought into the coating apparatus 100 of high resistance film, and these water and oil are heating
It will become water vapour and oil vapour under state, can not only pollute the coating apparatus 100 of high resistance film, but also these water when vacuumizing
Steam and oil vapour be also easy to occur reflux, influence the efficiency that vacuumizes of vacuumizing assembly 190, meanwhile, excessive water vapour and/
Or oil vapour can also damage vacuum pump, and influence the service life of vacuum pump, and the coating apparatus 100 of above-mentioned high resistance film by
Cold-trap part 212 is arranged in first surge chamber 120, and cold-trap part 212 can trap the water vapour and oil vapour in the first surge chamber 120,
And condense the steam into liquid, to reduce its activity, can not only water vapour and oil vapour damaged caused by vacuum pump, but also
The working efficiency for taking out true component can be greatly improved, the time vacuumized is shortened, improves production efficiency, so that above-mentioned high resistance film
The pumpdown time of each chamber of coating apparatus 100 only needs 25 seconds~35 seconds, the plated film with traditional magnetron sputtering high resistance film
Device 100 is compared, and production efficiency improves 2 times；And due in the coating apparatus of high resistance film 100 vapor and oil vapour mainly come
The water and/or oil adhered on extraneous and/or film-coated part, cold-trap part 212 is mounted in the first surge chamber 120, can be true
Water conservation and/oil are vaporized as much as possible, are allowed it to as fast as possible and are more fully attached on cold-trap part 212, improve
Efficiency is vacuumized, production efficiency is further increased and prevents the damage caused by vacuum pump of water vapour and oil vapour.Meanwhile
Cold-trap part 212 is mounted in the first surge chamber 120, additionally it is possible to avoid water vapour and oil vapour from entering by the first Transition Room and splash
Room 140 is penetrated, and pollutes First Transition room 130 and sputtering chamber 140.
(2) the cloth pneumatic module for being used to be passed through reaction gas into sputtering chamber 140 of the coating apparatus 100 of above-mentioned high resistance film
280 include controller 282, gas distribution pipe 284 and flowmeter 286, and controller 282 is the controller with multichannel, gas distribution pipe 284
To be multiple, a channel of a correspondence controller 282 of gas distribution pipe 284, flowmeter 286 is multiple a, correspondence of flowmeter 286
One gas distribution pipe 284, multiple flowmeters 286 are connect with 282 electric signal of controller, can make the accurate of the flow of reaction gas
Du Genggao, to be accurately controlled the amount of reactant gases being charged into sputtering chamber 140, so that target material surface is unlikely to cover very thick oxygen
Compound (oxide skin(coating) or nitride layer that target material surface has been formed when glow discharge, referred to as intoxicating phenomenon) and influence target
The quality for the film that material is formed on unplated piece, and improve deposition rate, the consistency of film is improved, makes wear-resisting property of film etc. more
It is good.And the experiment proved that, compared with current magnetic control sputtering film plating device 100, the deposition speed of the coating apparatus 100 of the high resistance film
Rate improves 2 times~5 times, and the uniformity for the film layer for using the coating apparatus 100 of above-mentioned high resistance film to obtain for -1.5%~
1.5%, than the obtained film layer of coating apparatus 100 of the magnetron sputtering high resistance film of Sony Corporation of Japan uniformity (- 3%~
3%) more preferable.
(3) each heating component 230 of the coating apparatus 100 of above-mentioned high resistance film include heat reflection plate 232 with it is multiple parallel
And spaced heating tube 234, heat reflection plate 232 are vertically arranged, multiple heating tubes 234 are fixed on the same of heat reflection plate 232
On side, so that side of the heat reflection plate 232 far from heating tube 234 can be towards unplated piece, so as to make each chamber
It is heated more uniformly, Temperature Distribution more uniformly (- 1.5 DEG C of temperature deviation~1.5 DEG C) so that the temperature of unplated piece from room temperature to
100 DEG C only need 3 minutes~5 minutes, with traditional magnetron sputtering apparatus (temperature of the unplated piece of traditional magnetron sputtering apparatus from
Room temperature generally requires 10 minutes~15 minutes to 100 DEG C) it compares, improve 3 times~5 times；Meanwhile above-mentioned heating component 230 has
Conducive to avoiding because of fragmentation problem caused by temperature distribution is non-uniform in each chamber, to reduce fragment rate, yields is improved,
To further increase production efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (7)
1. a kind of coating apparatus of high resistance film, which is characterized in that including into piece room, the first surge chamber, First Transition room, sputtering
Room, the second transition chamber, the second surge chamber, slice room, vacuumizing assembly, cold-trap component, cathode assembly and heating component, it is described into
Piece room, first surge chamber, the First Transition room, the sputtering chamber, second transition chamber, second surge chamber and
The slice room is sequentially connected, and the vacuumizing assembly can be to described into piece room, first surge chamber, the First Transition
Room, the sputtering chamber, second transition chamber, second surge chamber and the slice room vacuumize, the cold-trap component packet
Cold-trap part, compressor and refrigerant are included, the cold-trap part is mounted in first surge chamber, the entrance of the compressor and institute
The outlet for stating cold-trap part is connected, and the outlet of the compressor is connected with the entrance of the cold-trap part, so that the refrigerant
It can be circulated between the cold-trap part and the compressor, the cathode assembly is mounted in the sputtering chamber, described
Heating component can be to described into piece room, first surge chamber, the First Transition room, the sputtering chamber, second mistake
It crosses room, second surge chamber and the slice room to be heated, the cathode assembly includes cathode and multiple for installing target
The conducting carrier plate of material, the cathode are fixedly mounted in the sputtering chamber, and multiple conducting carrier plates are each attached to the cathode
The same side on, and be arranged successively along the vertical direction, and the two neighboring conducting carrier plate is spaced a distance, the heating group
Part be it is multiple, it is described into piece room, first surge chamber, the First Transition room, the sputtering chamber, second transition chamber,
The heating component is mounted in second surge chamber and the slice room, each heating component includes heat reflection plate
It is arranged in parallel and at interval heating tube with multiple, the heat reflection plate is vertically arranged, and multiple heating tubes are fixed on the heat
On the same side of reflecting plate, so that side of the heat reflection plate far from the heating tube can be towards unplated piece, described
In one surge chamber, the heat reflection plate and the cold-trap part are relatively fixed on the side wall of first surge chamber, so that described
Unplated piece can slide between the heat reflection plate and the cold-trap part.
2. the coating apparatus of high resistance film according to claim 1, which is characterized in that the refrigerant is liquid nitrogen.
3. the coating apparatus of high resistance film according to claim 1, which is characterized in that the cold-trap part is a metal tube with one
End is that fixed point starts the helical structure that outside from coil to coil is curled up and formed, and the both ends of the cold-trap part are respectively the cold-trap part
Outlet and entrance.
4. the coating apparatus of high resistance film according to claim 1, which is characterized in that the vacuumizing assembly includes multiple machines
Tool pump, multiple lobe pumps and multiple molecular pumps, multiple mechanical pumps respectively with it is described into piece room, the sputtering chamber and it is described go out
Piece room is connected, and multiple lobe pumps are connected with described into piece room, the sputtering chamber and the slice room respectively, Duo Gesuo
State molecular pump respectively with first surge chamber, the First Transition room, the sputtering chamber, second transition chamber and described
Two surge chambers are connected.
5. the coating apparatus of high resistance film according to claim 1, which is characterized in that further include cloth pneumatic module, the gas distribution
Component includes controller, gas distribution pipe and flowmeter, and the controller can control the flow of reaction gas, and the one of the gas distribution pipe
End is connect with the controller, and the other end is contained in the sputtering chamber, and is passed through the cathode and carried with multiple conductions
Plate is located at the same side of the cathode, and the flowmeter is mounted on the middle part of the gas distribution pipe, and with the controller electric signal
Connection.
6. the coating apparatus of high resistance film according to claim 5, which is characterized in that the controller is with multichannel
Controller, the gas distribution pipe be it is multiple, one end of each gas distribution pipe is connected with a channel of the controller, another
End is across the cathode, and multiple gas distribution pipes are arranged far from one end interval of the controller, the quantity of the flowmeter
Consistent with the quantity of the gas distribution pipe, the corresponding gas distribution pipe of the flowmeter, multiple flowmeters are and institute
State the connection of controller electric signal.
7. the coating apparatus of high resistance film according to claim 1, which is characterized in that the sputtering chamber includes two and is connected
Sputtering portion, one of them described sputtering portion is connected with the First Transition room, another is connected with second transition chamber
It is logical, the cathode assembly be it is multiple, multiple cathode assemblies are separately mounted in two sputtering portions.
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| CN102677011B (en) * | 2012-05-23 | 2014-08-20 | 文晓斌 | Non-balanced closed field magnetron sputtering ion plating equipment |
| CN103436847B (en) * | 2013-07-24 | 2016-11-23 | 无锡元创华芯微机电有限公司 | The reaction sputtering system controlled based on vibrating type reacting gas |
| CN103820762B (en) * | 2014-02-20 | 2016-07-20 | 江西沃格光电股份有限公司 | Magnetron sputtering coating system |
| CN103866294B (en) * | 2014-04-03 | 2017-01-11 | 江西沃格光电股份有限公司 | Film coating gas charging device |
| CN103938168B (en) * | 2014-04-08 | 2016-08-17 | 江西沃格光电股份有限公司 | Magnetron sputtering coating system |
| CN104120397B (en) * | 2014-07-31 | 2018-03-16 | 深圳市豪威薄膜技术有限公司 | Tin indium oxide low temperature deposition method and system |
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