CN202688424U - Magnetically-controlled co-sputtering coating machine - Google Patents
Magnetically-controlled co-sputtering coating machine Download PDFInfo
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- CN202688424U CN202688424U CN 201220326833 CN201220326833U CN202688424U CN 202688424 U CN202688424 U CN 202688424U CN 201220326833 CN201220326833 CN 201220326833 CN 201220326833 U CN201220326833 U CN 201220326833U CN 202688424 U CN202688424 U CN 202688424U
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Abstract
The utility model discloses a magnetically-controlled co-sputtering coating machine. The magnetically-controlled co-sputtering coating machine comprises a machine frame, a vacuum pumping device, a gas supplying device, a power supply unit, a temperature controlling device, an automatic control system with safety protection measures, and further comprises a double-chamber high vacuum device and a sample delivering device, wherein the double-chamber high vacuum device consists of a sample delivering chamber, a magnetic sputtering chamber and a vacuum lock; the sample delivering device comprises a sample delivering and taking mechanism, a manipulator, a sample lifting mechanism and the like. The magnetically-controlled co-sputtering coating machine has the advantages that a power supply has multiple purposes, so that the manufacturing cost is saved; the sputtering chamber is always kept in a vacuum state through the vacuum lock, so that the production efficiency is improved and sputtering coating time is reduced; full-automatic control is adopted in the whole production process, so that the vacuum system and the technical process are automatic and the production efficiency is improved; and separate sputtering and co-sputtering of a magnetron sputtering target can be controlled by a radio-frequency power supply and a direct-current power supply.
Description
Technical field
The utility model relates to the magnetic control co-sputtering coating equipment, belongs to the magnetron sputtering technique field.
Background technology
Existing magnetic control is penetrated coating equipment, because structural deficiency, mostly only only has independent sputtering target correspondence on production line and carries out sputter coating and give birth to, and can not realize that many targets switch, and do not support the operation process that continuous sputter coating is produced.While is because a plurality of radio-frequency power supplies are used in radio frequency clean-out operation and sputter coating operation, but the service efficiency of radio-frequency power supply is lower in the reality, has further increased practicality and the maintenance cost of equipment.
The utility model content
The purpose of this utility model is to provide a kind of magnetic control co-sputtering coating equipment, can realize holding the operation process that continuous sputter coating is produced, and can lower practicality and the maintenance cost of equipment simultaneously.
The purpose of this utility model is achieved through the following technical solutions: the magnetic control co-sputtering coating equipment; comprise frame; vacuum suction device; air feeder; supply unit; temperature control unit; automatic control system with safety precautions; it also comprises rack-mounted pair of chamber high-vacuum installation and sample presentation sheet devices; two chambers high-vacuum installation is by the sample presentation chamber in left side; the magnetron sputtering chamber on right side and the vacuum lock composition that connects sample presentation chamber and magnetron sputtering chamber; the sample presentation sheet devices comprises rack-mounted film conveying and withdrawing mechanism; by the mechanical manipulator that drives the cylinder drive; print lifting body in the magnetron sputtering chamber and rotatable print platform; rotatable print platform is positioned on the print lifting body and with mechanical manipulator and links to each other; the top of magnetron sputtering chamber is equipped with magnetron sputtering target; the inside of magnetron sputtering chamber also has been provided with print rotating mechanism and heating arrangements; the sample presentation chamber is upper cover-opening structure; cover on the sample presentation chamber and be provided with the radio frequency plasma washing unit, magnetron sputtering target is connected with supply unit by power switcher with the radio frequency plasma washing unit.
Self-bias device and warning device also have been installed on the described frame.
Described vacuum lock is controlled by rotary cylinder.
Described vacuum suction device is comprised of molecular pump and vacuum pump.
The quantity of described magnetron sputtering target is at least two and be evenly distributed on the top of magnetron sputtering chamber.
Described supply unit comprises direct supply and radio-frequency power supply.
Comprise interlocking module, abnormal power-down automatic Memory module and automatic process programming school inspection module in the described automatic control system.
Also be provided with the viewing window with baffle plate on the described magnetron sputtering chamber.
The beneficial effects of the utility model are: the radio frequency above (1) sample presentation chamber cleans and can share a radio-frequency power supply with sputtering chamber, can realize that by power switcher a power supply is multiplex simultaneously, has saved manufacturing cost; (2) can realize that by vacuum lock sputtering chamber remains vacuum state, thereby improve production efficiency, lower the process time of sputter coating; (3) whole production process adopts the full automatic control mode, has realized vacuum system automatization and process automation, has improved production efficiency; (4) magnetron sputtering target be can control by radio-frequency power supply and direct supply and independent sputter and cosputtering carried out.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is schematic top plan view of the present utility model.
Wherein, 1-frame, the two chambers of 2-high-vacuum installation, 3-sample presentation chamber, 4-magnetron sputtering chamber, 5-vacuum lock, the 6-magnetron sputtering target, 7-print rotating mechanism, 8-heating arrangements, the 9-loam cake, 10-print lifting body, 11-film conveying and withdrawing mechanism, the 12-mechanical manipulator, 13-radio frequency plasma washing unit, the rotatable print platform of 14-, the 15-warning device, 16-self-bias device, 17-viewing window.
Embodiment
Further describe the technical solution of the utility model below in conjunction with accompanying drawing, but that claimed scope is not limited to is described.
Such as Fig. 1; Fig. 2; the magnetic control co-sputtering coating equipment; comprise frame 1; vacuum suction device; air feeder; supply unit; temperature control unit; automatic control system with safety precautions; it also comprises two chambers high-vacuum installation 2 and the sample presentation sheet devices that is installed on the frame 1; two chambers high-vacuum installation 2 is by the sample presentation chamber 3 in left side; the magnetron sputtering chamber 4 on right side and vacuum lock 5 compositions that connect sample presentation chamber 3 and magnetron sputtering chamber 4; the sample presentation sheet devices comprises the film conveying and withdrawing mechanism 11 that is installed on the frame 1; by the mechanical manipulator 12 that drives the cylinder drive; print lifting body 10 in the magnetron sputtering chamber 4 and rotatable print platform 14; rotatable print platform 14 is positioned on the print lifting body 10 and with mechanical manipulator 12 and links to each other; the top of magnetron sputtering chamber 4 is equipped with magnetron sputtering target 6; the inside of magnetron sputtering chamber 4 also has been provided with print rotating mechanism 7 and heating arrangements 8; sample presentation chamber 3 is upper cover-opening structure; be provided with radio frequency plasma washing unit 13 on the loam cake 9 of sample presentation chamber 3; magnetron sputtering target 6 is connected with supply unit by power switcher with radio frequency plasma washing unit 13, and then realizes that many targets switch.
Self-bias device 16 and warning device 15 also have been installed on the described frame 1, and then have been improved sedimentation rate and warning function.
Described vacuum lock 5 is controlled by rotary cylinder.
Described vacuum suction device is comprised of molecular pump and vacuum pump.
The quantity of described magnetron sputtering target 6 is at least two and be evenly distributed on the top of magnetron sputtering chamber 4.
Described supply unit comprises direct supply and radio-frequency power supply.
Comprise interlocking module, abnormal power-down automatic Memory module and automatic process programming school inspection module in the described automatic control system.
Also be provided with the viewing window 17 with baffle plate on the described magnetron sputtering chamber 4, can guarantee the long-time cleaning of viewing window 17.
Air feeder is controlled air inlet by mass flow controller, radio frequency plasma washing unit 13 cooperates print lifting body 10 by automatic control program print to be entered magnetron sputtering chamber 4 by sample presentation chamber 3 through vacuum lock 5 by mechanical manipulator 12, air-bleed system is extracted into high vacuum state with magnetron sputtering chamber 4, air pressure by push-pull valve control sputtering chamber, radio frequency plasma washing unit 13 above the sample presentation chamber 3 can share a radio-frequency power supply with magnetron sputtering chamber 4, save cost, can realize that by power switcher a power supply is multiplex simultaneously, further save manufacturing cost, can realize various Automatic continuous motion by print lifting body 10, thereby enhance productivity, lower the process time of sputter coating.
Equipment adopts the full automatic control mode, and the print transmission after from the user print being sent into the sample presentation chamber and begun, film growth are until fetch sample the complete process process of sample introduction sample presentation chamber.
Claims (8)
1. magnetic control co-sputtering coating equipment; comprise frame (1); vacuum suction device; air feeder; supply unit; temperature control unit; automatic control system with safety precautions; it is characterized in that: it also comprises two chambers high-vacuum installations (2) and the sample presentation sheet devices that is installed on the frame (1); two chambers high-vacuum installations (2) are by the sample presentation chamber (3) in left side; the magnetron sputtering chamber on right side (4) and vacuum lock (5) composition that connects sample presentation chamber (3) and magnetron sputtering chamber (4); the sample presentation sheet devices comprises the film conveying and withdrawing mechanism (11) that is installed on the frame (1); by the mechanical manipulator (12) that drives the cylinder drive; print lifting body (10) in the magnetron sputtering chamber (4) and rotatable print platform (14); rotatable print platform (14) is positioned at print lifting body (10) and upward and with mechanical manipulator (12) links to each other; the top of magnetron sputtering chamber (4) is equipped with magnetron sputtering target (6); the inside of magnetron sputtering chamber (4) also has been provided with print rotating mechanism (7) and heating arrangements (8); sample presentation chamber (3) is upper cover-opening structure; be provided with radio frequency plasma washing unit (13) on the loam cake (9) of sample presentation chamber (3), magnetron sputtering target (6) is connected with supply unit by power switcher with radio frequency plasma washing unit (13).
2. magnetic control co-sputtering coating equipment according to claim 1 is characterized in that: self-bias device (16) and warning device (15) also have been installed on the described frame (1).
3. magnetic control co-sputtering coating equipment according to claim 1, it is characterized in that: described vacuum lock (5) is controlled by rotary cylinder.
4. magnetic control co-sputtering coating equipment according to claim 1, it is characterized in that: described vacuum suction device is comprised of molecular pump and vacuum pump.
5. magnetic control co-sputtering coating equipment according to claim 1 is characterized in that: the quantity of described magnetron sputtering target (6) is at least two and be evenly distributed on the top of magnetron sputtering chamber (4).
6. magnetic control co-sputtering coating equipment according to claim 1, it is characterized in that: described supply unit comprises direct supply and radio-frequency power supply.
7. magnetic control co-sputtering coating equipment according to claim 1 is characterized in that: comprise interlocking module, abnormal power-down automatic Memory module and automatic process programming school inspection module in the described automatic control system.
8. magnetic control co-sputtering coating equipment according to claim 1 is characterized in that: also be provided with the viewing window (17) with baffle plate on the described magnetron sputtering chamber (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220326833 CN202688424U (en) | 2012-07-09 | 2012-07-09 | Magnetically-controlled co-sputtering coating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220326833 CN202688424U (en) | 2012-07-09 | 2012-07-09 | Magnetically-controlled co-sputtering coating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202688424U true CN202688424U (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220326833 Expired - Fee Related CN202688424U (en) | 2012-07-09 | 2012-07-09 | Magnetically-controlled co-sputtering coating machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN202688424U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105088170A (en) * | 2014-04-29 | 2015-11-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Processing chamber power-supply sharing method and equipment |
| CN105421040A (en) * | 2015-12-29 | 2016-03-23 | 广州市新景机电股份有限公司 | Conductive cloth, dedicated production equipment and production method thereof |
| CN107815658A (en) * | 2017-11-29 | 2018-03-20 | 沈阳鹏程真空技术有限责任公司 | A kind of target of small size vacuum magnetic control three sputtering plating Mo machines |
| CN108277468A (en) * | 2018-02-26 | 2018-07-13 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process with vacuum machine arm |
| CN108315704A (en) * | 2018-02-26 | 2018-07-24 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process |
| CN109112496A (en) * | 2018-09-26 | 2019-01-01 | 武汉华星光电半导体显示技术有限公司 | The method of oxide layer on magnetron sputtering apparatus and removal substrate |
| CN111286705A (en) * | 2018-12-06 | 2020-06-16 | 北京华业阳光新能源有限公司 | Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment |
| CN112281134A (en) * | 2020-10-30 | 2021-01-29 | 湘潭宏大真空技术股份有限公司 | Double-chamber high-efficiency film coating machine |
| CN113817999A (en) * | 2021-08-24 | 2021-12-21 | 中山凯旋真空科技股份有限公司 | Vacuum coating equipment for preparing piezoelectric ceramics |
-
2012
- 2012-07-09 CN CN 201220326833 patent/CN202688424U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105088170A (en) * | 2014-04-29 | 2015-11-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Processing chamber power-supply sharing method and equipment |
| CN105088170B (en) * | 2014-04-29 | 2018-03-09 | 北京北方华创微电子装备有限公司 | Processing chamber shares power source method and equipment |
| CN105421040A (en) * | 2015-12-29 | 2016-03-23 | 广州市新景机电股份有限公司 | Conductive cloth, dedicated production equipment and production method thereof |
| CN105421040B (en) * | 2015-12-29 | 2018-06-22 | 广州市新景机电股份有限公司 | A kind of conductive fabric and its production equipment special and production method |
| CN107815658A (en) * | 2017-11-29 | 2018-03-20 | 沈阳鹏程真空技术有限责任公司 | A kind of target of small size vacuum magnetic control three sputtering plating Mo machines |
| CN108315704A (en) * | 2018-02-26 | 2018-07-24 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process |
| CN108277468A (en) * | 2018-02-26 | 2018-07-13 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process with vacuum machine arm |
| CN109112496A (en) * | 2018-09-26 | 2019-01-01 | 武汉华星光电半导体显示技术有限公司 | The method of oxide layer on magnetron sputtering apparatus and removal substrate |
| CN111286705A (en) * | 2018-12-06 | 2020-06-16 | 北京华业阳光新能源有限公司 | Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment |
| CN111286705B (en) * | 2018-12-06 | 2024-05-03 | 北京华业阳光新能源有限公司 | Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment |
| CN112281134A (en) * | 2020-10-30 | 2021-01-29 | 湘潭宏大真空技术股份有限公司 | Double-chamber high-efficiency film coating machine |
| CN113817999A (en) * | 2021-08-24 | 2021-12-21 | 中山凯旋真空科技股份有限公司 | Vacuum coating equipment for preparing piezoelectric ceramics |
| CN113817999B (en) * | 2021-08-24 | 2023-12-26 | 中山凯旋真空科技股份有限公司 | Vacuum coating equipment for preparing piezoelectric ceramics |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20210709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |