CN106011765A - Magnetron sputtering vacuum coating equipment - Google Patents
Magnetron sputtering vacuum coating equipment Download PDFInfo
- Publication number
- CN106011765A CN106011765A CN201610556466.9A CN201610556466A CN106011765A CN 106011765 A CN106011765 A CN 106011765A CN 201610556466 A CN201610556466 A CN 201610556466A CN 106011765 A CN106011765 A CN 106011765A
- Authority
- CN
- China
- Prior art keywords
- magnetic control
- vacuum coating
- coating equipment
- plane
- sputtering vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention belongs to the technical field of coating machine products, and particularly discloses magnetron sputtering vacuum coating equipment which comprises a vacuum coating chamber with an extraction opening, and a control power source. The side wall of the vacuum coating chamber is provided with a plurality of sets of vertical type planar twin magnetron targets, and an opening-closing type baffle device is arranged around the planar twin magnetron targets. A vertical type planar ion source is arranged in the vacuum coating chamber. According to the magnetron sputtering vacuum coating equipment, workpiece films are evenly deposited, the performance is stable, and the coating efficiency and effects of workpieces are greatly improved; and in addition, the equipment is simple, practical and low in manufacturing cost.
Description
Technical field
The invention belongs to technical field of vacuum plating, be specifically related to a kind of magnetic control sputtering vacuum coating equipment.
Background technology
Transparent conductive film is widely used in quasiconductor and photovoltaic industry at present, and the preparation process of transparent conductive film is mainly adopted
Be magnetron sputtering technique, conventional mainly d.c. sputtering and radio-frequency sputtering, in the prior art, d.c. sputtering and radio frequency
Sputtering technology existence has the disadvantage that:
First, when d.c. sputtering metal-oxide prepares transparent conductive film, easily big in target material surface accumulation in coating process
The electric charge of amount, causes target to be poisoned, additionally, d.c. sputtering transparent conductive film sedimentation rate is the fastest, and electric discharge electricity
Pressure work process is easily subject to interference, causes target surface-discharge in sputter procedure unstable, cause depositing thin film uniform not,
Performance is not sufficiently stable so that transparent conductive film can not firm attachment etc. at substrate surface.
Second, radio-frequency (RF) sputtering equipment is high to technique and the shielding requirements of vacuum coating equipment, and filming equipment structure is loaded down with trivial details, is fabricated to
This height, is not easy to large-scale popularization and application.
Therefore, research and development one deposition thin film is uniform, stable performance, can be in substrate surface firm attachment, and simple in construction makes
The magnetic control sputtering vacuum coating equipment of low cost is extremely urgent.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, open a kind of magnetic control sputtering vacuum coating equipment, this vacuum coating sets
Standby, workpiece thin film deposition is uniform, and stable performance is greatly improved plated film efficiency and the effect of workpiece, additionally, equipment is simple and practical,
Cost of manufacture is low.
In order to reach above-mentioned technical purpose, the present invention is realized by techniques below scheme:
A kind of magnetic control sputtering vacuum coating equipment of the present invention, including with the vacuum film coating chamber of bleeding point and control power supply,
Described vacuum film coating chamber sidewall is provided with the some groups of twin magnetic control targets of erect type plane, the twin magnetic control target of described plane surrounding set
Open-close type retaining device, described vacuum coating indoor is had to be provided with vertical plane ion source.
As the further improvement of above-mentioned technology, the twin magnetic control target of described plane includes the two vertical long strip type target heads being oppositely arranged.
As the further improvement of above-mentioned technology, described open-close type retaining device includes baffle plate and drives baffle plate in dozen to open or close
The driving means of closed state.
In the present invention, described plane ion source is to stand on the strip ion source on vacuum film coating chamber sidewall.
In the present invention, the twin magnetic control target of plane on described vacuum film coating chamber sidewall is at least two groups.
In the present invention, described vacuum coating indoor are provided with for installing workpiece to be plated the rotation work that workpiece to be plated can be driven to rotate
Pallet.
In the present invention, described control power supply is high power intermediate frequency power supply.
Compared with prior art, the invention has the beneficial effects as follows:
(1) vacuum sputtering film plating machine of the present invention, owing to being provided with the twin magnetic control target of erect type plane and being arranged on plane
Open-close type retaining device around twin magnetic control target, has and preferably blocks shielding action, workpiece spinning movement to be plated, improves
The film thickness uniformity of coating and coating effects；
(2) vacuum sputtering film plating machine of the present invention, stands on, owing to being provided with, the strip ion source that vacuum coating is indoor, long
The ionogenic use of bar shaped i.e. can get large area, large-scale multi sphere ion source, and it makes full use of the feature that multi sphere ionization level is high,
The surface temperature of workpiece to be plated when reducing the most again ionization so that the granule of deposition thin film is fine and smooth, also improves film layer simultaneously and is treating
The adhesive force of plating surface of the work；
(3), in the present invention, at least two twin magnetic control targets of group combine the use of high power intermediate frequency power supply, it is possible to be effectively prevented from metal
Oxide target material surface poisoning and sputter coating cannot be stablized, the use of intermediate frequency power supply can improve film deposition rate, improves raw
Produce efficiency.
Accompanying drawing explanation
With specific embodiment, the present invention is described in detail below in conjunction with the accompanying drawings:
Fig. 1 is coater equipment front schematic view of the present invention；
Fig. 2 is coater equipment front schematic view (baffle plate is closure state) of the present invention；
Fig. 3 is coater equipment front schematic view (baffle plate is opening) of the present invention.
Detailed description of the invention
As shown in Figure 1 to Figure 3, a kind of magnetic control sputtering vacuum coating equipment of the present invention, true including with bleeding point 11
Empty coating chamber 1 and control power supply, described vacuum film coating chamber 1 sidewall is provided with two groups of twin magnetic control targets of erect type plane 2, described
The twin magnetic control target of plane 2 be provided around open-close type retaining device 3, described vacuum film coating chamber 1 sidewall is provided with vertical flat
Face ion source 4.
As it is shown in figure 1, the twin magnetic control target of described plane 2 includes the two vertical long strip type target heads being oppositely arranged, described Planar Ion
Source 4 is to stand on the strip ion source on vacuum film coating chamber 1 sidewall.Middle part in described vacuum film coating chamber 1 be additionally provided with for
Workpiece 10 to be plated the rotation movements and postures of actors platform 5 that workpiece 10 to be plated can be driven to rotate are installed, rotate movements and postures of actors platform 5 and drive workpiece 10 to be plated
Do real-time rotation, it is ensured that the uniformity of plated film.
As shown in Figure 2 and Figure 3, described open-close type retaining device 3 includes that baffle plate 31 can become to open or close with driving baffle plate 31
The driving means 32 of state.During as it is shown on figure 3, need plated film, driving means 32 opens baffle plate 31, and described baffle plate 31 blocks
Live the lateral location of the twin magnetic control target of plane 2, it is ensured that the sputtering effect of twin magnetic control target 2；As in figure 2 it is shown, when need not plating
During film, baffle plate 31 is closed by driving means 32, has preferably Isolated Shield effect.
In the present invention, described control power supply is high power intermediate frequency power supply, and two groups of twin magnetic control targets 2 combine high power intermediate frequency power supply
Use, it is possible to be effectively prevented from metal oxide target surface poisoning and sputter coating cannot be stablized, making of high power intermediate frequency power supply
With improving film deposition rate, improve production efficiency.
The invention is not limited in above-mentioned embodiment, every various changes to the present invention or the modification spirit without departing from the present invention
And scope, if within the scope of these change claim and the equivalent technologies belonging to the present invention with modification, then the present invention also means
And comprise these change and modification.
Claims (7)
1. a magnetic control sputtering vacuum coating equipment, including with bleeding point vacuum film coating chamber and control power supply, its feature exists
In: described vacuum film coating chamber sidewall is provided with the some groups of twin magnetic control targets of erect type plane, the twin magnetic control target of described plane week
Enclosing and be provided with open-close type retaining device, described vacuum coating indoor are provided with vertical plane ion source.
Magnetic control sputtering vacuum coating equipment the most according to claim 1, it is characterised in that: described plane twin magnetic control target bag
Include the two vertical long strip type target heads being oppositely arranged.
Magnetic control sputtering vacuum coating equipment the most according to claim 2, it is characterised in that: described open-close type retaining device bag
Include baffle plate and drive the baffle plate energy driving means opening or closing closed state in dozen.
4. according to the magnetic control sputtering vacuum coating equipment described in any one of claims 1 to 3, it is characterised in that: described plane from
Component is to stand on the strip ion source on vacuum film coating chamber sidewall.
Magnetic control sputtering vacuum coating equipment the most according to claim 1, it is characterised in that: on described vacuum film coating chamber sidewall
The twin magnetic control target of plane be at least two groups.
Magnetic control sputtering vacuum coating equipment the most according to claim 1, it is characterised in that: described vacuum coating indoor are provided with
For installing workpiece to be plated the rotation movements and postures of actors platform that workpiece to be plated can be driven to rotate.
Magnetic control sputtering vacuum coating equipment the most according to claim 1, it is characterised in that: described control power supply is high power
Intermediate frequency power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556466.9A CN106011765A (en) | 2016-07-12 | 2016-07-12 | Magnetron sputtering vacuum coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556466.9A CN106011765A (en) | 2016-07-12 | 2016-07-12 | Magnetron sputtering vacuum coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106011765A true CN106011765A (en) | 2016-10-12 |
Family
ID=57118194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556466.9A Pending CN106011765A (en) | 2016-07-12 | 2016-07-12 | Magnetron sputtering vacuum coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106011765A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108277468A (en) * | 2018-02-26 | 2018-07-13 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process with vacuum machine arm |
| CN108315704A (en) * | 2018-02-26 | 2018-07-24 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process |
| CN108754444A (en) * | 2018-06-12 | 2018-11-06 | 广东振华科技股份有限公司 | A kind of PVD coating apparatus |
| CN109402587A (en) * | 2018-12-24 | 2019-03-01 | 浙江莱宝科技有限公司 | A kind of vacuum coater |
| CN112458414A (en) * | 2020-10-30 | 2021-03-09 | 湘潭宏大真空技术股份有限公司 | Sputtering film coating machine under magnetic control |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030096711A1 (en) * | 2001-11-22 | 2003-05-22 | Communications Research Laboratory, Independent Administrative Institution | Method of forming a superconductor film |
| CN2846439Y (en) * | 2005-12-13 | 2006-12-13 | 深圳国家863计划材料表面工程技术研究开发中心 | Column cathode composite ion coating device |
| CN101736292A (en) * | 2008-11-19 | 2010-06-16 | 中国科学院沈阳科学仪器研制中心有限公司 | Composite magnetic control and ion beam sputtering and depositing system |
| CN104711527A (en) * | 2013-12-11 | 2015-06-17 | 中国科学院大连化学物理研究所 | Method for magnetron sputtering low-temperature preparation of TiN film |
| CN105714256A (en) * | 2014-12-05 | 2016-06-29 | 中国科学院大连化学物理研究所 | Method for low-temperature preparation of DLC film through magnetron sputtering |
-
2016
- 2016-07-12 CN CN201610556466.9A patent/CN106011765A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030096711A1 (en) * | 2001-11-22 | 2003-05-22 | Communications Research Laboratory, Independent Administrative Institution | Method of forming a superconductor film |
| CN2846439Y (en) * | 2005-12-13 | 2006-12-13 | 深圳国家863计划材料表面工程技术研究开发中心 | Column cathode composite ion coating device |
| CN101736292A (en) * | 2008-11-19 | 2010-06-16 | 中国科学院沈阳科学仪器研制中心有限公司 | Composite magnetic control and ion beam sputtering and depositing system |
| CN104711527A (en) * | 2013-12-11 | 2015-06-17 | 中国科学院大连化学物理研究所 | Method for magnetron sputtering low-temperature preparation of TiN film |
| CN105714256A (en) * | 2014-12-05 | 2016-06-29 | 中国科学院大连化学物理研究所 | Method for low-temperature preparation of DLC film through magnetron sputtering |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108277468A (en) * | 2018-02-26 | 2018-07-13 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process with vacuum machine arm |
| CN108315704A (en) * | 2018-02-26 | 2018-07-24 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process |
| CN108277468B (en) * | 2018-02-26 | 2019-11-12 | 沈阳中北真空技术有限公司 | A kind of magnetron sputtering optical coating apparatus and film plating process with vacuum machine arm |
| CN108754444A (en) * | 2018-06-12 | 2018-11-06 | 广东振华科技股份有限公司 | A kind of PVD coating apparatus |
| CN109402587A (en) * | 2018-12-24 | 2019-03-01 | 浙江莱宝科技有限公司 | A kind of vacuum coater |
| CN112458414A (en) * | 2020-10-30 | 2021-03-09 | 湘潭宏大真空技术股份有限公司 | Sputtering film coating machine under magnetic control |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106011765A (en) | Magnetron sputtering vacuum coating equipment | |
| CN105543792B (en) | Magnetic control sputtering device and magnetically controlled sputter method | |
| CN101877372B (en) | Back electrode film of thin film solar cell | |
| CN201598329U (en) | Twin-target magnetron sputtering device provided with gas ion sources | |
| CN107058970A (en) | A kind of fuel battery metal polar plate vacuum plated film pipelining equipment and its film plating process | |
| CN110106481A (en) | Coating apparatus and Pvd equipment | |
| CN202576553U (en) | Magnetron sputtering target material | |
| CN105789603A (en) | Preparation method of CuxVyOz coating for positive electrode of lithium ion battery | |
| CN202643828U (en) | Magnetron sputtering cathode moving target | |
| CN104810228A (en) | Spiral magnetron and magnetron sputtering device | |
| CN206736351U (en) | A kind of rectangle magnetic control sputtering cathode of high target utilization ratio | |
| CN211999903U (en) | Coating equipment for manufacturing double-sided transparent conductive oxide film | |
| CN103014644A (en) | ITO (indium tin oxide) film for touch screen and preparation method thereof | |
| CN204714886U (en) | Two-way deposition plating apparatus | |
| CN204720433U (en) | Snap ring, bogey and semiconductor processing equipment | |
| CN110747446A (en) | Coating equipment for manufacturing double-sided transparent conductive oxide film | |
| CN106119795A (en) | Utilize the method that vacuum magnetron sputtering coating film technology prepares lithium battery C Si negative pole coating | |
| CN202157113U (en) | Magnetic-control sputtering coating device | |
| CN205774780U (en) | Stacking-type Sputting film-plating apparatus | |
| CN201793720U (en) | Resistive vacuum evaporation coating machine | |
| JP5003667B2 (en) | Thin film manufacturing method and thin film manufacturing apparatus | |
| CN205205222U (en) | Magnetron sputtering apparatus | |
| CN103074586B (en) | Low-temperature and low-damage multifunctional composite coating device and method | |
| CN201890918U (en) | Segmented vacuum coating machine | |
| CN209456554U (en) | Battery material filming equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |
|
| RJ01 | Rejection of invention patent application after publication |