CN112458414A - Sputtering film coating machine under magnetic control - Google Patents
Sputtering film coating machine under magnetic control Download PDFInfo
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- CN112458414A CN112458414A CN202011194840.8A CN202011194840A CN112458414A CN 112458414 A CN112458414 A CN 112458414A CN 202011194840 A CN202011194840 A CN 202011194840A CN 112458414 A CN112458414 A CN 112458414A
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- mounting
- mounting plate
- post
- installation
- frame
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a magnetron sputtering film plating machine which comprises an installation support, a sputtering cathode and an installation frame, wherein the installation frame is arranged above the inside of the installation support, the sputtering cathode is arranged inside the installation support and below the installation frame, the installation frame is used for installing a workpiece, and the installation frame can drive the workpiece to rotate. The invention provides a film plating machine for performing sputtering film plating from the lower part of a workpiece, which effectively solves the problem that the existing film plating machine occupies a large space.
Description
Technical Field
The invention relates to the field of vacuum coating, in particular to a magnetron sputtering coating machine.
Background
Vacuum coating is a coating technology at the present leading edge, and a magnetron sputtering coating method in vacuum coating adopts a method of discharging electrons through an electrified anode and enabling the electrons to collide with gas molecules in a vacuum cavity under the acceleration action of an electric field so as to ionize the gas molecules, the ionized gas molecules bombard metal particles on a cathode under the action of the electric field so as to ionize and sputter the metal particles, and the ionized metal ions are deposited on the surface of a target material to form a film, wherein in order to enable the electrons to collide with the gas molecules more efficiently and improve the ionization rate of the gas molecules, a magnet is arranged in the cathode to form a magnetron cathode, so that the electrons form a spiral track in the vacuum cavity under the combined action of the electric field and the magnetic field so as to increase the collision probability of the electrons and the gas molecules. The existing film plating machines are used for simultaneously plating films on the upper side and the lower side of a workpiece, so that the occupied space of the film plating machines is increased undoubtedly.
Disclosure of Invention
The invention mainly aims to provide a magnetron sputtering film plating machine, and aims to solve the problem that the existing film plating machines are required to perform film plating on two sides of a workpiece, so that the film plating machines occupy larger space.
In order to achieve the purpose, the magnetron sputtering coating machine provided by the invention comprises an installation support, a sputtering cathode and an installation frame, wherein the installation frame is arranged above the inside of the installation support, the sputtering cathode is arranged inside the installation support and below the installation frame, the installation frame is used for installing a workpiece, and the installation frame can drive the workpiece to rotate.
In an embodiment, the magnetron sputtering coating machine further includes two rotating assemblies, the two rotating assemblies are respectively disposed at two ends of the mounting frame along the left-right direction, the two ends of the mounting frame are respectively connected with the two rotating assemblies, and the rotating section is used for driving the rotating frame to rotate around a connecting line of the two rotating assemblies.
In one embodiment, the rotating assembly includes a driving motor and a rotating head, the driving motor is connected with the rotating head to drive the rotating head to rotate around the axis of the driving motor, and the rotating head is connected with the end of the mounting rack to drive the mounting rack to rotate.
In an embodiment, the rotating head includes erection column and spacing post, the diameter of spacing post is greater than the diameter of erection column, spacing post is located driving motor with between the erection column, driving motor's output shaft is worn to establish the axle center of spacing post and is held in the card inside the axle center of erection column, the tip of mounting bracket is installed on the surface of erection column.
In one embodiment, the mounting bracket includes a first mounting plate and a second mounting plate, the first mounting plate being mounted above the second mounting plate, the workpiece being retained on the first mounting plate.
In an embodiment, the length of the first mounting plate is greater than the length of the second mounting plate, the end of the second mounting plate faces the side wall of the mounting column and abuts against the side wall of the mounting column, the lower wall face of the first mounting plate abuts against the outer peripheral wall of the mounting column, and the outer peripheral wall of the first mounting plate abuts against the side wall of the mounting frame facing the limiting column.
In an embodiment, an installation step is formed at the axis of the first installation plate, and the workpiece is installed at the installation step.
According to the technical scheme, the magnetron sputtering film plating machine comprises an installation support, a sputtering cathode and an installation frame, wherein the installation frame is arranged above the inside of the installation support, the sputtering cathode is arranged inside the installation support and below the installation frame, the installation frame is used for installing a workpiece and can drive the workpiece to rotate, so that the sputtering cathode is arranged below the installation frame, when the workpiece is installed on the installation frame, the installation frame can drive the workpiece to rotate, when the sputtering cathode below the workpiece is subjected to sputtering film plating towards the upper side, the film plating of the workpiece can be realized through the rotation of the installation frame, the film plating on one side of the workpiece can be reduced, and the occupied space of the film plating machine can be effectively reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a magnetron sputtering coater according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a rotating assembly and a mounting bracket according to an embodiment of the invention.
The reference numbers illustrate: 10. mounting a bracket; 20. sputtering a cathode; 30. a mounting frame; 31. a first mounting plate; 32. a second mounting plate; 33. mounting a step; 40. a rotating assembly; 41. a drive motor; 42. rotating the head; 421. mounting a column; 422. a limiting column.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Moreover, the technical solutions in the embodiments of the present invention may be combined with each other, but it is necessary to be able to be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
The invention provides a magnetron sputtering coating machine.
As shown in fig. 1-2, a magnetron sputtering coating machine according to an embodiment of the present invention includes a mounting bracket 10, a sputtering cathode 20, and a mounting bracket 30, where the mounting bracket 30 is disposed above an inside of the mounting bracket 10, the sputtering cathode 20 is disposed inside the mounting bracket 10 and below the mounting bracket 30, the mounting bracket 30 is used to mount a workpiece, and the mounting bracket 30 can drive the workpiece to rotate.
In this embodiment, the magnetron sputtering coating machine includes installing support 10, sputtering cathode 20 is with mounting bracket 30, mounting bracket 30 sets up in the inside top of installing support 10, sputtering cathode 20 sets up in the inside below that is located mounting bracket 30 of installing support 10, mounting bracket 30 is used for installing the work piece, mounting bracket 30 can drive the work piece rotatory, therefore set up sputtering cathode 20 in mounting bracket 30 below, when the work piece is installed on mounting bracket 30, because mounting bracket 30 can drive the work piece rotatory, consequently when sputtering cathode 20 that is located the work piece below carries out the sputtering coating towards the top, the coating film of work piece also can be realized to the rotation through mounting bracket 30, thereby can reduce the one side coating film of work piece, can effectively reduce the occupation space of coating machine.
The magnetron sputtering coating machine further comprises two rotating assemblies 40, the two rotating assemblies 40 are respectively arranged at two ends of the mounting frame 30 in the left-right direction, two ends of the mounting frame 30 are respectively connected with the two rotating assemblies 40, and the rotating interval is used for driving the rotating frame to rotate around a connecting line of the two rotating assemblies 40. In this embodiment, the two rotating assemblies 40 on both sides of the mounting frame 30 can be synchronously opened or closed to realize the rotation of the mounting frame 30.
Specifically, the rotating assembly 40 includes a driving motor 41 and a rotating head 42, the driving motor 41 is connected with the rotating head 42 to drive the rotating head 42 to rotate around the axis of the driving motor 41, and the rotating head 42 is connected with the end of the mounting frame 30 to rotate the mounting frame 30. In this embodiment, the driving motor 41 can be controlled by an external power supply to turn on/off and rotate in the same direction, so that the mounting frame 30 is rotated under the synchronous driving of the driving motors 41 on both sides, thereby driving the workpiece to rotate inside the mounting bracket 10, and thus the sputtering cathode 20 located below the workpiece can be coated on the surface of the workpiece when sputtering coating is performed upward.
In addition, referring to fig. 2, the rotating head 42 includes an installation column 421 and a limiting column 422, the diameter of the limiting column 422 is greater than the diameter of the installation column 421, the limiting column 422 is located between the driving motor 41 and the installation column 421, an output shaft of the driving motor 41 penetrates through the axis of the limiting column 422 and is clamped inside the axis of the installation column 421, and an end of the installation frame 30 is installed on an outer surface of the installation column 421. In this embodiment, the mounting posts 421 are used for fixing the end of the mounting frame 30, and meanwhile, the mounting frame 30 is limited by the limiting posts 422, so that the mounting frame 30 is prevented from falling off.
With continued reference to fig. 2, the mounting frame 30 includes a first mounting plate 31 and a second mounting plate 32, the first mounting plate 31 is mounted above the second mounting plate 32, and the workpiece is clamped on the first mounting plate 31. Further, the length of first mounting panel 31 is greater than the length of second mounting panel 32, the tip of second mounting panel 32 faces the lateral wall of erection column 421 with the lateral wall of erection column 421 supports against, the lower wall of first mounting panel 31 with the periphery wall of erection column 421 supports against, the periphery wall of first mounting panel 31 with the facing of spacing post 422 the lateral wall of mounting bracket 30 supports against. That is, in the present embodiment, the joints of the mounting bracket 30 and the swivel head 42 abut against each other, so that a stable supporting force can be formed after installation.
Further, an installation step 33 is opened at the axial center of the first installation plate 31, and the workpiece is installed at the installation step 33. In this embodiment, the wall surface of the installation step 33 and the inner wall surface of the workpiece abut against each other, so that when the workpiece is installed at the installation step 33 and the rotating assembly 40 drives the installation frame 30 to rotate, the workpiece cannot fall off, and stability of the workpiece during film coating is ensured.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. The utility model provides a sputter coating machine under magnetron which characterized in that sputter coating machine under magnetron includes installing support, sputter cathode and mounting bracket, the mounting bracket sets up the inside top of installing support, the sputter cathode sets up the installing support is inside and be located the below of mounting bracket, the mounting bracket is used for installing the work piece, the mounting bracket can drive the work piece is rotatory.
2. The magnetron sputtering coater according to claim 1, wherein the magnetron sputtering coater further comprises two rotating assemblies, the two rotating assemblies are respectively arranged at two ends of the mounting frame in the left-right direction, the two ends of the mounting frame are respectively connected with the two rotating assemblies, and the rotating section is used for driving the rotating frame to rotate around a connecting line of the two rotating assemblies.
3. The magnetron sputter coating machine of claim 2 wherein said spin pack assembly includes a drive motor and a rotary head, said drive motor coupled to said rotary head for driving said rotary head about an axis of said drive motor, said rotary head coupled to an end of said mounting frame for driving said mounting frame in rotation.
4. The magnetron sputtering coating machine according to claim 3 wherein the rotating head comprises an installation post and a limit post, the diameter of the limit post is larger than that of the installation post, the limit post is located between the driving motor and the installation post, an output shaft of the driving motor penetrates through the axis of the limit post and is clamped inside the axis of the installation post, and the end of the installation frame is installed on the outer surface of the installation post.
5. The magnetron sputtering coater of claim 4 wherein said mounting bracket comprises a first mounting plate and a second mounting plate, said first mounting plate being mounted above said second mounting plate, said workpiece being retained on said first mounting plate.
6. The magnetron sputtering coater of claim 5 wherein the length of the first mounting plate is greater than the length of the second mounting plate, the end of the second mounting plate abutting the side wall of the mounting post facing the side wall of the mounting post, the lower wall of the first mounting plate abutting the peripheral wall of the mounting post, the peripheral wall of the first mounting plate abutting the side wall of the spacing post facing the mounting bracket.
7. The magnetron sputtering coating machine according to claim 6 wherein the first mounting plate has an axial center provided with a mounting step, and the workpiece is mounted on the mounting step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011194840.8A CN112458414A (en) | 2020-10-30 | 2020-10-30 | Sputtering film coating machine under magnetic control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011194840.8A CN112458414A (en) | 2020-10-30 | 2020-10-30 | Sputtering film coating machine under magnetic control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112458414A true CN112458414A (en) | 2021-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011194840.8A Pending CN112458414A (en) | 2020-10-30 | 2020-10-30 | Sputtering film coating machine under magnetic control |
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| Country | Link |
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| CN (1) | CN112458414A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010010256A1 (en) * | 2000-01-31 | 2001-08-02 | Naoyuki Nozawa | Substrate support mechanism and substrate rotation device |
| CN101565278A (en) * | 2009-05-08 | 2009-10-28 | 浙江大学 | Double-sided sputtering silvered device of barrel-type quartz crystal |
| CN205501413U (en) * | 2016-04-01 | 2016-08-24 | 深圳市三海科技有限公司 | Work piece clamping tool structure is exempted from to plate by vertical barreled work rest step of coating machine |
| CN106011765A (en) * | 2016-07-12 | 2016-10-12 | 广东振华科技股份有限公司 | Magnetron sputtering vacuum coating equipment |
| CN106048552A (en) * | 2016-07-19 | 2016-10-26 | 深圳市东丽华科技有限公司 | Vacuum coating machine |
| CN205839119U (en) * | 2016-06-13 | 2016-12-28 | 浙江鼎梓塑胶科技有限公司 | A kind of vacuum magnetic control film coating machine |
| CN206359607U (en) * | 2016-12-06 | 2017-07-28 | 常州夏博士节能新材料有限公司 | Multifunctional magnetic control sputtering film plating equipment |
| CN108315706A (en) * | 2018-04-02 | 2018-07-24 | 上海应用技术大学 | A kind of vacuum coater carrying out PVD coatings to cutter |
| CN209602635U (en) * | 2018-12-30 | 2019-11-08 | 浙江星星科技股份有限公司 | A kind of positioning fixture of coating apparatus |
-
2020
- 2020-10-30 CN CN202011194840.8A patent/CN112458414A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010010256A1 (en) * | 2000-01-31 | 2001-08-02 | Naoyuki Nozawa | Substrate support mechanism and substrate rotation device |
| CN101565278A (en) * | 2009-05-08 | 2009-10-28 | 浙江大学 | Double-sided sputtering silvered device of barrel-type quartz crystal |
| CN205501413U (en) * | 2016-04-01 | 2016-08-24 | 深圳市三海科技有限公司 | Work piece clamping tool structure is exempted from to plate by vertical barreled work rest step of coating machine |
| CN205839119U (en) * | 2016-06-13 | 2016-12-28 | 浙江鼎梓塑胶科技有限公司 | A kind of vacuum magnetic control film coating machine |
| CN106011765A (en) * | 2016-07-12 | 2016-10-12 | 广东振华科技股份有限公司 | Magnetron sputtering vacuum coating equipment |
| CN106048552A (en) * | 2016-07-19 | 2016-10-26 | 深圳市东丽华科技有限公司 | Vacuum coating machine |
| CN206359607U (en) * | 2016-12-06 | 2017-07-28 | 常州夏博士节能新材料有限公司 | Multifunctional magnetic control sputtering film plating equipment |
| CN108315706A (en) * | 2018-04-02 | 2018-07-24 | 上海应用技术大学 | A kind of vacuum coater carrying out PVD coatings to cutter |
| CN209602635U (en) * | 2018-12-30 | 2019-11-08 | 浙江星星科技股份有限公司 | A kind of positioning fixture of coating apparatus |
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Application publication date: 20210309 |