CN204714886U - Two-way deposition plating apparatus - Google Patents
Two-way deposition plating apparatus Download PDFInfo
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- CN204714886U CN204714886U CN201520394520.5U CN201520394520U CN204714886U CN 204714886 U CN204714886 U CN 204714886U CN 201520394520 U CN201520394520 U CN 201520394520U CN 204714886 U CN204714886 U CN 204714886U
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- plated film
- umbrella stand
- target material
- sputtering target
- substrate
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Abstract
The utility model relates to technical field of film preparation, especially two-way deposition plating apparatus, it is characterized in that: above and below described workpiece umbrella stand, be fixedly installed sputtering target material and evaporation source respectively, be positioned at the plated film that the described evaporation source below described workpiece umbrella stand is undertaken by the side surface of the ion source booster action corresponding with it to described substrate, the described sputtering target material be positioned at above described workpiece umbrella stand is excited by the radio frequency source corresponding with it and carries out plated film to the opposite side surface of described substrate.The utility model has the advantages that: the two-way deposition vacuum film coating apparatus of plated film while of can realizing two-sided, deposit to reach synchronization two coating materials sources simultaneously; The plated film link of the substrate needing double-sided coating is reduced, contributes to the raising of plated film efficiency and quality.
Description
Technical field
The utility model relates to technical field of film preparation, especially two-way deposition plating apparatus.
Background technology
Along with the development of coating technique, film quality and plated film efficiency are had higher requirement.Many coated products, such as optical lens, optical mirror slip etc., need to carry out double-sided coating to its substrate under normal conditions.These are needed to the product of double-sided coating, current common process is generally successively be coated with the surperficial film of substrate two by twice plated film; Namely carry out following A, B, C, D tetra-steps: first plated film (A) on a surface of substrate, after plated film completes, substrate is taken out (B) from fixture, reverse side and clamps (C) are again carried out to substrate, then at another plated film (D) on the surface of substrate.There is following area for improvement in above flow process: 1) substrate two surfaces at twice plated film add work time cost, and be unfavorable for the raising of production efficiency.2) in manufacturing enterprise, by often needing increase by one cleaning step B to step C, the pollution in door for vacuum chamber and sample thief process is being opened to reduce.3) carrying out in step B and step C process, often producing some substrate surface and form the factor scratching and wait and affect product yield.
For the technical process of above-mentioned double-sided coating, technician has been had to seek solution route by carrying out transformation to mechanism in vacuum plating unit.Wherein, more successful reforming mode is the method adopting upset workpiece umbrella stand.At this, when workpiece umbrella stand and plated film, place the device of film plating substrate; Upset workpiece umbrella stand refers to the workpiece umbrella stand that can carry out overturning.The key distinction of this method and above-mentioned A-B-C-D tetra-step traditional method is: after completing the steps A of coating single side, door for vacuum chamber need not be opened, substrate just does not need to take out from the fixture of workpiece umbrella stand yet, but directly workpiece umbrella stand is overturn by mechanical mechanism, make also uncoated one side towards evaporation source, thereafter again plated film is carried out to this face, thus complete double-sided coating.Above-mentioned flow process may be summarized to be A, B
/, D tri-steps: first plated film (A) on a surface of substrate, upset workpiece umbrella stand (B after plated film completes
/), then at another plated film (D) on the surface of substrate.The principal character of this upset workpiece umbrella stand method is that coated product is after completing the steps A of coating single side, coating equipment need not be exitted enabling, but under the existing vacuum state of maintenance, by the upset of workpiece umbrella stand, and enter the plated film (i.e. step D) for another surface of substrate.The method of upset workpiece umbrella stand no doubt has himself advantage, but is not difficult to find out, in fact or successively this method carries out at twice for the plated film that substrate two is surperficial; In addition, in plated film cavity, the existence of switching mechanism adds design and manufacture cost on the one hand, and the failure rate of switching mechanism also can not be ignored simultaneously.
Summary of the invention
The purpose of this utility model is according to above-mentioned the deficiencies in the prior art, provides two-way deposition plating apparatus, overlapping independently sputtering target material and evaporation source, carrying out plated film to substrate two sides simultaneously by arranging two, improves plated film efficiency and coating quality.
The utility model object realizes being completed by following technical scheme:
A kind of two-way deposition plating apparatus, comprise plated film cavity, workpiece umbrella stand is provided with in described plated film cavity, described workpiece umbrella stand carries substrate, it is characterized in that: above and below described workpiece umbrella stand, be fixedly installed sputtering target material and evaporation source respectively, be positioned at the plated film that the described evaporation source below described workpiece umbrella stand is undertaken by the side surface of the ion source booster action corresponding with it to described substrate, the described sputtering target material be positioned at above described workpiece umbrella stand is excited by the radio frequency source corresponding with it and carries out plated film to the opposite side surface of described substrate.
Be positioned at described sputtering target material above described workpiece umbrella stand towards described substrate, be positioned at described radio frequency source above described workpiece umbrella stand towards described sputtering target material, and arrange in angle between described sputtering target material and described radio frequency source, ensure when described radio frequency source excites described sputtering target material, the sputtered atom sputtering sedimentation of described sputtering target material is in a side surface of described substrate.
Amending plates is provided with between described substrate and described sputtering target material, one end of described amending plates is fixedly installed on the sidewall of plated film cavity, arrange in angle between the sidewall of described amending plates and plated film cavity, angle angle is between the two satisfied with, and the sputtered atom of described sputtering target material is by described amending plates.
The sidewall of described plated film cavity is fixedly installed backplate, and described backplate is for separating the described plated film cavity above and below described workpiece umbrella stand, and the rational height of described backplate and the height location of described workpiece umbrella stand lower-most point coincide adaptive.
The utility model has the advantages that: the two-way deposition vacuum film coating apparatus of plated film while of can realizing two-sided, deposit to reach synchronization two coating materials sources simultaneously; The plated film link of the substrate needing double-sided coating is reduced, contributes to the raising of plated film efficiency and quality; The material that multiple double-faced sputter device can not or be difficult to deposit can be plated easily, certain hardware superiority is also provided for subsequent thin film process exploitation; Machine cost is lower; Can place on more convenient product ground, lens dimension shape is allowed greatly, and need not be confined to planar substrates again.
Accompanying drawing explanation
Fig. 1 is the structural representation of film coating apparatus in the utility model;
Fig. 2 is A-A in Fig. 1
'to sectional view;
Fig. 3 is B-B in Fig. 1
'to sectional view.
Embodiment
The utility model feature and other correlated characteristic are described in further detail by embodiment below in conjunction with accompanying drawing, so that the understanding of technician of the same trade:
As Figure 1-3, mark 1-11 in figure to be expressed as: plated film cavity 1, substrate 2, workpiece umbrella stand 3, sputtering target material 4, evaporation source 5, radio frequency source 6, ion source 7, rotating mechanism 8, amending plates 9, amending plates 10, backplate 11.
Embodiment: as shown in Figure 1, the two-way deposition plating apparatus in the present embodiment comprises plated film cavity 1.Plated film cavity 1 inside is provided with the workpiece umbrella stand 3 for carrying substrates 2.Workpiece umbrella stand 3 center position is provided with rotating mechanism 8, and rotating mechanism 8 is rotated by external drive unit, and workpiece umbrella stand 3 can along with rotating mechanism 8 together uniform rotation.The below of workpiece umbrella stand 3 is provided with evaporation source 5 and ion source 7, and wherein ion source 7 makes evaporation coating materials be deposited on a side surface (being expressed as the lower surface of substrate 2 in FIG) of substrate 2 for auxiliary evaporation source 5.
The top of workpiece umbrella stand 3 is provided with sputtering target material 4 and radio frequency source 6, and sputtering target material 4 is arranged on the top of plated film cavity 1, and radio frequency source 6 is arranged on the sidewall of plated film cavity 1, and radio frequency source 6 is for exciting sputtering target material 4.Form angle between radio frequency source 6 and the sputtering target material above workpiece umbrella stand 34 to arrange, when making it excite sputtering target material 4, the sputtered atom of sputtering target material 4 is deposited on the opposite side surface of substrate 2 (being expressed as the upper surface of substrate 2 in FIG).Be positioned at sputtering target material 4 above and below workpiece umbrella stand 3 and evaporation source 5, sputtering target material 4 and radio frequency source 6 work simultaneously, with realize at substrate 2 two surperficial while plated film.In addition, the position of placing evaporation source 5 also can replace with the sputtering source be made up of sputtering target material 4 and radio frequency source 6 thereof.
Sputtering target material 4 is placed on plated film cavity 1 top, and towards the substrate 2 be carried on workpiece umbrella stand 3.Atom on sputtering target material 4 due to be subject to radio frequency source 6 launch energetic ion (shown in figure dashed arrows) excitation and from target material surface overflow become sputtered atom (dotted arrows).Sputtered atom is finally deposited on a side surface of substrate 2, forms film.Radio frequency source 6 can be triggered by direct current or alternating-current.For sputtering target material 4, can by install rotate or switching mechanism to realize the plated film of multiple coating materials, namely realize the multiple film plating differing materials, different thickness in the side of substrate 2 on the surface successively.
Evaporation source 5 is placed on center or other positions of the bottom of plated film cavity 1.Ion source 7 assistant depositing can be utilized when evaporation source 5 works.Evaporation source 5 can adopt the evaporation pattern such as electron beam evaporation plating or resistance steaming.The quantity of evaporation source 5 is not limited to one, namely when in the face of large-area workpiece umbrella stand 3, can increase evaporation source 5 thus the efficiency of guarantee plated film and coating quality.
As shown in Figures 2 and 3, in order to the film making the surface energy of the substrate 2 corresponding to each evaporation source form uniform thickness, the amending plates 9 for improving film caliper uniformity and amending plates 10 can be set among plated film cavity 1.Amending plates 10 is arranged between the lower surface of evaporation source 5 and workpiece umbrella stand 3, and amending plates 9 is arranged between the upper surface of sputtering target material 4 and workpiece umbrella stand 4.One end of amending plates 9 and amending plates 10 is fixedly installed on the sidewall of plated film cavity 1 respectively, arrange in angle between the sidewall of wherein amending plates 9 and plated film cavity 1, angle angle is between the two satisfied with, and the sputtered atom of described sputtering target material by amending plates 9, thus makes amending plates 9 onset.Amending plates 9 does not contact with film plating substrate when placing with amending plates 10, otherwise causes workpiece umbrella stand can not normal rotation.Amending plates 9 and amending plates 10 are a flap, realize the substrate 2 of different positions on workpiece umbrella stand 3 can have uniform coating film thickness by the part evaporation angle of optionally blocking evaporation source.The film uniformity that the upper surface that amending plates 9 is used to revise substrate on workpiece umbrella stand 3 respectively encloses from inside to outside; The film uniformity that the lower surface that amending plates 10 is used to revise substrate on workpiece umbrella stand 3 respectively encloses from inside to outside.
The present embodiment is in the specific implementation: be two evaporation sources reduced in same plated film cavity and the coating materials that exists pollutes, can take following measure:
1), during plated film after workpiece umbrella stand 3 upper slice, ensureing on workpiece umbrella stand 3 without small opening and weakly to block, on guarantee workpiece umbrella stand 3, fixture is firm seamless.This respect can be realized by the design of substrate fixture.Such as, jaw thickness does the distortion of use of thicker reduction later stage and causes leakage film, and the laminating gap tolerance between fixture and product is as far as possible little, in case the pollution of interpenetrating of upper and lower coating materials.
2) adjust the angle of divergence and the radiation areas of two kinds of evaporation sources, avoid upper and lower coating materials radiation overlapping as far as possible.
3) as shown in Figure 1, plated film cavity wall is provided with backplate 11.Backplate is for separating the plated film cavity 1 above and below workpiece umbrella stand 3, the rational height of backplate 11 and the height location of workpiece umbrella stand 3 lower-most point coincide adaptive, thus make the evaporation source above workpiece umbrella stand 3 can not flow to the lower surface of workpiece umbrella stand 3 via the space between workpiece umbrella stand 3 and plated film cavity 1 from the upper surface of workpiece umbrella stand 3, avoid
coating materialspollution of interpenetrating.
Owing to being provided with two evaporation sources in a plated film cavity 1, therefore may relate to the interference of high-voltage, upfield, so shielding jamming countermeasure need be carried out in electrical control, avoid because the fault, the accident that cause are disturbed in high-voltage, upfield.
Evaporation source 5 adopts electron beam evaporation plating pattern.That is, there is an electron beam gun at the floor installation of plated film cavity, after adding high pressure to electron beam gun, after the camber electron beam of generation gets to the coating materials in evaporation source 5, produce the film atom to surrounding evaporation, thus on the eyeglass of umbrella stand, start deposition.Arrange an ion source 7 on evaporation source side, it can produce high-octane ion beam bombardment eyeglass simultaneously, improves the compactness of depositional coating.
The present embodiment, when specifically using, relates to following plating steps
1) machinery of film coating apparatus and electric software control are carried out designing and debugging, ensure carrying out smoothly of coating process.
2) realization that controls of coating film thickness: become the thickness monitoring of film can adopt brilliant control or light control method for evaporation source institute; For sputtering source become the thickness monitoring of film can adopt speed monitor or light control method.
3) debugging of coating film thickness homogeneity: the shape being revised amending plates 9 and amending plates 10 by adjustment can realize uniform coated to make two of substrate 2 surfaces.
4) in filming control, different plating run is run to film plating substrate upper and lower surface, and realize the monitoring of two-way simultaneous coating process parameters and state.
5) owing to relating to high-voltage, may the disturbing of upfield, shielding jamming countermeasure need be carried out in electrical control aspect.
6) angle between the position of the described sputtering target material of adjustment above described workpiece umbrella stand and the described radio frequency source corresponding with its formation thereof, makes its angle of divergence and radiation areas correspondence cover the upper surface of the described substrate be carried on described workpiece umbrella stand; Angle between the position of the described evaporation source of adjustment below described workpiece umbrella stand and the described ion source corresponding with its formation thereof, makes its angle of divergence and radiation areas correspondence cover the lower surface of the described substrate be carried on described workpiece umbrella stand; Above-mentioned steps realizes carrying out deposition plating to the both side surface of described substrate, and avoids upper and lower radiation areas overlapping.
7) drive rotating mechanism 8 to drive workpiece umbrella stand 3 to rotate, excite described sputtering target material 4 and evaporation source 5 simultaneously, deposition plating is carried out to the both side surface of the substrate 2 be positioned on workpiece umbrella stand 3.
Although above embodiment elaborates the design of the utility model object and embodiment with reference to accompanying drawing, but those of ordinary skill in the art can recognize, under the precondition not departing from claim limited range, still various improvement and conversion can be made to the utility model, as: the shape, size etc. of replacing the kind of evaporation source, position, workpiece umbrella stand 3, therefore do not repeat one by one at this.
Claims (4)
1. a two-way deposition plating apparatus, comprise plated film cavity, workpiece umbrella stand is provided with in described plated film cavity, described workpiece umbrella stand carries substrate, it is characterized in that: above and below described workpiece umbrella stand, be fixedly installed sputtering target material and evaporation source respectively, be positioned at the plated film that the described evaporation source below described workpiece umbrella stand is undertaken by the side surface of the ion source booster action corresponding with it to described substrate, the described sputtering target material be positioned at above described workpiece umbrella stand is excited by the radio frequency source corresponding with it and carries out plated film to the opposite side surface of described substrate.
2. the two-way deposition plating apparatus of one according to claim 1, it is characterized in that: be positioned at described sputtering target material above described workpiece umbrella stand towards described substrate, be positioned at described radio frequency source above described workpiece umbrella stand towards described sputtering target material, and arrange in angle between described sputtering target material and described radio frequency source, ensure when described radio frequency source excites described sputtering target material, the sputtered atom sputtering sedimentation of described sputtering target material is in a side surface of described substrate.
3. the two-way deposition plating apparatus of one according to claim 2, it is characterized in that: between described substrate and described sputtering target material, be provided with amending plates, one end of described amending plates is fixedly installed on the sidewall of plated film cavity, arrange in angle between the sidewall of described amending plates and plated film cavity, angle angle is between the two satisfied with, and the sputtered atom of described sputtering target material is by described amending plates.
4. the two-way deposition plating apparatus of one according to claim 1, it is characterized in that: the sidewall of described plated film cavity is fixedly installed backplate, described backplate is for separating the described plated film cavity above and below described workpiece umbrella stand, and the rational height of described backplate and the height location of described workpiece umbrella stand lower-most point coincide adaptive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520394520.5U CN204714886U (en) | 2015-06-10 | 2015-06-10 | Two-way deposition plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520394520.5U CN204714886U (en) | 2015-06-10 | 2015-06-10 | Two-way deposition plating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204714886U true CN204714886U (en) | 2015-10-21 |
Family
ID=54313892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520394520.5U Withdrawn - After Issue CN204714886U (en) | 2015-06-10 | 2015-06-10 | Two-way deposition plating apparatus |
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|---|---|
| CN (1) | CN204714886U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104862656A (en) * | 2015-06-10 | 2015-08-26 | 光驰科技(上海)有限公司 | Bidirectional deposition coating device and coating method |
| CN111424239A (en) * | 2020-04-14 | 2020-07-17 | 杭州纤纳光电科技有限公司 | Evaporation furnace and double-sided coating device |
| CN113774335A (en) * | 2021-09-15 | 2021-12-10 | 佛山市博顿光电科技有限公司 | Thin film deposition equipment, film coating method thereof and vacuum film coating machine |
-
2015
- 2015-06-10 CN CN201520394520.5U patent/CN204714886U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104862656A (en) * | 2015-06-10 | 2015-08-26 | 光驰科技(上海)有限公司 | Bidirectional deposition coating device and coating method |
| CN111424239A (en) * | 2020-04-14 | 2020-07-17 | 杭州纤纳光电科技有限公司 | Evaporation furnace and double-sided coating device |
| CN113774335A (en) * | 2021-09-15 | 2021-12-10 | 佛山市博顿光电科技有限公司 | Thin film deposition equipment, film coating method thereof and vacuum film coating machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20151021 Effective date of abandoning: 20171208 |