CN109112487A - A kind of OLED evaporated device with high stability oled substrate feeder - Google Patents

A kind of OLED evaporated device with high stability oled substrate feeder Download PDF

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Publication number
CN109112487A
CN109112487A CN201811204519.6A CN201811204519A CN109112487A CN 109112487 A CN109112487 A CN 109112487A CN 201811204519 A CN201811204519 A CN 201811204519A CN 109112487 A CN109112487 A CN 109112487A
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CN
China
Prior art keywords
oled
oled substrate
cylinder
vapor deposition
positive stop
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Pending
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CN201811204519.6A
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Chinese (zh)
Inventor
曹云娟
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Changzhou City Of Chi - Dou Mdt Infotech Ltd
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Changzhou City Of Chi - Dou Mdt Infotech Ltd
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Priority to CN201811204519.6A priority Critical patent/CN109112487A/en
Publication of CN109112487A publication Critical patent/CN109112487A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention relates to a kind of OLED evaporated devices with high stability oled substrate feeder, including the respectively arranged vapor deposition equipment in front and back and oled substrate feeder in the horizontal direction, oled substrate feeder has seat outside the core motor being fixedly connected with stripper loop, the center of seat is equipped with hollow rotation cup outside core motor, the front end of hollow rotation cup and the inner ring of stripper loop are rotatablely connected, it is equipped with rotating end cap at the center of hollow rotation cup, is equipped with the fixed device of oled substrate in the front end of rotating end cap.The present invention changes original design to the arrangement of basic flush system, become the arrangement of annular tubular, so that more oled substrates can be accommodated in single vacuum chamber, the effect for being similar to centrifugation is generated by the rotation of oled substrate simultaneously, so that the dynamics of the indoor evaporation material molecules strike substrate of vacuum chamber is obviously improved, the uniformity coefficient of plated film can also be promoted while production efficiency increases, overall structure good leak tightness reduces the leakage of pollution.

Description

A kind of OLED evaporated device with high stability oled substrate feeder
Technical field
It is especially a kind of with high stability oled substrate feeder the present invention relates to the technical field of OLED manufacture OLED evaporated device.
Background technique
In well known technical field, foreboard section processing procedure is the most important link in entire OLED technique, detailed process are as follows: After TFT substrate is carried out the cleaning of different modes, dried, it is sent into nitrogen environment and cools down, and invert substrate, make film surface Downward.For treated substrate, it is sent into vacuum chamber and carries out the vapor deposition of each functional layer, luminescent layer.To AMOLED after vapor deposition Functional and the detection of aesthetic appearance and the attaching of polaroid are carried out, module set section processing procedure is finally entered.
Need to use dedicated evaporated device in the vapor deposition link of OLED, so-called vapor deposition is exactly to pass through electric current in vacuum Heating, the heating means such as beam bombardment heating or laser heating make to be steamed material and flash to atom or molecule, they immediately with Biggish free path makees free movement, collides substrate surface and condenses, and then forms film.Although evaporation process principle is not multiple It is miscellaneous, but there are many problems to need to solve in actual volume production, existing core equipment evaporator major technique is grasped In the several company's hands of Japan, production capacity is extremely limited, and mainly has problem following aspects:
One, it the replacement problem of evaporation source: after evaporation material is depleted, needs to be added taking out from vacuum chamber Add or replace, how to reduce the frequency of replacement, the pneumatics processing with changing front and back vacuum chamber is effectively ensured, imitated to production is improved Rate, reduction maintenance down rate are extremely crucial, while being also easy to lead to the problem of pollution, and existing equipment is generally by vacuum chamber Room is designed to directly unlatching, the design of closing type, and replacement evaporation source is more frequent, and when the vacuumize process consuming of vacuum chamber Between it is long, the control of temperature process is difficult to precisely quantify, needs continuous intermittent in production to debug repeatedly.
Two, single process oled panel count issue in vacuum chamber: the thinking of existing evaporated device generally is Using the design for placing substrate level arrangement, therefore evaporation source generally requires the top for being placed in substrate, although this kind of arrangement mode It is more mature, but this kind of mode need to consider the stability of process parameter control, it is impossible to which that large area is by large number of base Plate is as in same vacuum chamber, therefore single process quantity is few, and occupied space is big, and the requirement to vaccum-pumping equipment is high, Er Qiesui Processing substrate size increase, the Structural assignments that heating device is deposited are increasingly complex, and the stability of technological parameter is more difficult to control System.
Three, the stability of evaporation process parameter: traditional evaporated device is freely transported generally by evaporation material molecule It is dynamic to remove sorbing substrate, in arrangement of the parameter that vapor deposition link can control substantially only to temperature and heating source, so work Skill stability is not high always, and so as to cause the problem that yields is poor, the settling mode of practical volume production can only constantly be debugged Optimal parameter improves the uniformity coefficient of plated film.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the above mentioned problems and provide one kind, and there is high stability oled substrate to send The OLED evaporated device for entering device, enable to the Structural assignments of evaporated device it is compact, it is high in machining efficiency, convenient for control technique ginseng Number, while promoting the yields of volume production and the uniformity coefficient of plated film.
The technical solution adopted by the present invention to solve the technical problems is: there is one kind high stability oled substrate to be sent into dress The OLED evaporated device set, including the respectively arranged vapor deposition equipment in front and back and oled substrate feeder in the horizontal direction,
The oled substrate feeder has seat outside the core motor being fixedly connected with stripper loop, in the core motor The center of outer seat is equipped with hollow rotation cup, and the front end of the hollow rotation cup and the inner ring of stripper loop are rotatablely connected, in the sky The center that the heart rotates cup is equipped with rotating end cap, is equipped with the fixed device of oled substrate in the front end of the rotating end cap,
The fixed device of the oled substrate has the support rod driven by telescopic oil cylinder, distinguishes in the two sides of the support rod Driving mechanism equipped with steady slide rail, and the support rod, steady slide rail is arranged at the outside of rotating end cap, in two stabilizations It is equipped with sliding sleeve between sliding rail, is equipped with stop flange in the end of the support rod, tubular is installed on the stop flange Bracket, centered on the central axis of the cylindrical stent, the cylindrical stent outer ledge be equipped with several along axial direction The sealing positive stop strip of extension is equipped with the support panel for installing oled substrate between two adjacent sealing positive stop strips, And the middle part of the support panel is connect by rotating shaft pin with cylindrical stent, is equipped between two adjacent support panels tight Gu adjustment part is hinged with push-pull rod between fastening adjustment part and the sliding sleeve, buffering is equipped at the middle part of the push-pull rod Cylinder is supported, the cylinder part of the cushioning supportive cylinder is in state obliquely and hinged with push-pull rod with axial direction, described The projecting end of cushioning supportive cylinder resists the inner surface of end cover.
The cross section of the sealing positive stop strip is in isosceles trapezoid shape, and during the sealing positive stop strip radially extends Plane run through cylindrical stent central axis, and it is described sealing positive stop strip the smaller side in end towards cylindrical stent central axis Line is arranged, and has the card slot adaptable with the cross section of sealing positive stop strip on the end face of the fastening adjustment part.
Further, as a kind of specific embodiment, heretofore described vapor deposition equipment has can front and back shifting Dynamic pedestal is successively arranged position limiting sealed ring, mounting ring, stripper loop in "-" type in the horizontal direction on the base, with institute Centered on stating the central axis of stripper loop, on its front end face rotation be equipped with several isosceles trapezoid spacer blocks, and the isosceles Trapezoidal spacer block smaller one, towards central axial direction, is equipped with evaporation source between two adjacent isosceles trapezoid spacer blocks Sliding rail is installed, one end of each evaporation source installation sliding rail is embedded between two adjacent isosceles trapezoid spacer blocks, and the other end passes through It wears mounting ring and is fixedly connected with position limiting sealed ring, and constitute installation chamber between adjacent two evaporation sources installation sliding rail, It is equipped with electromagnetic heater in each installation cavity room, the cunning along axial extension is equipped on evaporation source installation sliding rail Slot is equipped with vapor deposition source device in sliding slot, and the end cover driven by oil cylinder is equipped at the center of the position limiting sealed ring, The vapor deposition source device is connect with the inner surface of end cover.
Further, for the ease of actual parts machining and installation, heretofore described mounting ring is by the first assembly Ring, the second mounting ring, third mounting ring are arranged side by side and constitute, and in first mounting ring, the second mounting ring, third assembly Vacuum-pumping tube connector is equipped on the side wall of ring.
Further, as a kind of specific heating device, heretofore described electromagnetic heater has electromagnetic heating Stick is equipped with limit connecting flange head in the end of the electromagnetic heating rod, and the limit connecting flange head is mounted on position limiting sealed On the end face of ring.
Further, of the invention in order to adapt to the gap of the demand and adjustment evaporation material of different parameters in plated film Described in be equipped with T-type slippery fellow between stripper loop and evaporation source installation sliding rail and connect, and the T-type slippery fellow can be radially reciprocal It is mobile.
Further, for the ease of adjusting suitable parameter in initial link, heretofore described vapor deposition equipment has There is vapor deposition source device, be equipped between the vapor deposition source device and support panel and block cylinder, and the cylinder that blocks can be through sealing End cap.
Further, in order to promote the pressure maintaining efficiency and temperature loss of vacuum, heretofore described end cover, round end Lid is two-layer stratigraphic structure, is equipped with hollow thermal insulation layer inside it.
The beneficial effects of the present invention are: the configuration of the present invention is simple, is cleverly utilized the principle and hollow shaft motor of centrifugation The advantages of structure, changes original design to the arrangement of basic flush system, becomes the arrangement of annular tubular, so that single vacuum chamber Interior can accommodate more oled substrates, while the effect for being similar to centrifugation is generated by the rotation of oled substrate, so that very The dynamics of the indoor evaporation material molecules strike substrate of cavity is obviously improved, and can also promote plating while production efficiency increases The uniformity coefficient of film, just there is the design of forward and backward separate type, steams to adapt to the design of full-automatic production line needing replacing When plating source, directly taking out replacement from front console, then fetching substrate after the completion of being deposited, moved back from the inner cavity of hollow shaft motor Out, be aided with all kinds of mechanical arms, can greatly improving production efficiency, overall structure good leak tightness vacuumizes position, power supply connects The taking-up for entering position, changing evaporated source position and substrate can embody the superiority of structure, reduce the leakage of pollution.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is that the present invention removes the structural schematic diagram after end cover；
Fig. 3 is configuration schematic diagram of the invention；
Fig. 4 is local explosion structure diagram one of the invention；
Fig. 5 is local explosion structure diagram two of the invention；
Fig. 6 is the structural schematic diagram of oled substrate feeder in the present invention；
Fig. 7 is the cross-sectional view in the present invention at the fixed device of oled substrate；
Fig. 8 is the partial enlargement diagram in Fig. 7 at A；
Specific embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with Illustration illustrates basic structure of the invention, therefore it only shows the composition relevant to the invention.
A kind of OLED evaporated device with high stability oled substrate feeder of the present invention as shown in FIG. 1 to FIG. 8 Preferred embodiment, including the respectively arranged vapor deposition equipment 1 in front and back and oled substrate feeder 2 in the horizontal direction,
The vapor deposition equipment 1 has the pedestal 11 that can be moved forward and backward, and is on the pedestal 11 in the horizontal direction in "-" type It is successively arranged position limiting sealed ring 12, mounting ring, stripper loop 16, it is contemplated that convenient for manufacture and processing, while deploying various sizes of Demand, the mounting ring are arranged side by side by the first mounting ring 13, the second mounting ring 14, third mounting ring 15 and are constituted, and the One mounting ring 13, the second mounting ring 14, third mounting ring 15 side wall on be equipped with vacuum-pumping tube connector 17, also can be set The optimum position that experimental test determines rotates centered on the central axis of stripper loop 16, on its front end face equipped with several Isosceles trapezoid spacer block 18, and isosceles trapezoid spacer block 18 smaller one towards central axial direction, in two adjacent isosceles Evaporation source installation sliding rail 19 is equipped between trapezoidal spacer block 18, one end of each evaporation source installation sliding rail 19 is embedded in adjacent Between two isosceles trapezoid spacer blocks 18, by two trapezium structures, it can be smoothly caught in the radial maximum position of limitation, it is another End is fixedly connected through mounting ring and with position limiting sealed ring 12, and constitutes installation between adjacent two evaporation sources installation sliding rail 19 Chamber, is equipped with electromagnetic heater 111 in each installation cavity room, and the electromagnetic heater 111 has electromagnetic heating rod 1111, it is equipped with limit connecting flange head 1112 in the end of electromagnetic heating rod 1111, the limit connecting flange head 1112 is installed On the end face of position limiting sealed ring 12, the chamber location cleverly formed with interval setting is for placing heating device, it is clear that Heating device is not limited to electromagnetic heater, can also can be unified using the structure of other heating excitations, power supply source from limit The end face upward wiring of sealing ring 12, avoids line construction from being directly entered vacuum chamber, is equipped on evaporation source installation sliding rail 19 Along the sliding slot of axial extension, vapor deposition source device 112 is installed in sliding slot, is equipped at the center of position limiting sealed ring 12 by oil cylinder The end cover 113 of driving, the vapor deposition source device 112 connect with the inner surface of end cover 113, are needing replacing When, it directly drives end cover 113 and moves outward, take out vapor deposition source device 112 along axial,
For the standard of same device fabrication, the versatility of equipment is improved, can be pacified in the stripper loop 16 with evaporation source It fills and is equipped with T-type slippery fellow between sliding rail 19 and connects, and the T-type slippery fellow can radially move back and forth, for correcting between radial direction The size of gap, to adapt to the requirement of different process,
The oled substrate feeder 2 has seat 21 outside the core motor being fixedly connected with stripper loop 16, in hollow electricity The center of the outer seat 21 of machine is equipped with hollow rotation cup 22, and the front end of the hollow rotation cup 22 and the inner ring of stripper loop 16 rotate and connect It connects, is equipped with rotating end cap 23 at the center of hollow rotation cup 22, be equipped with the fixed device of oled substrate in the front end of rotating end cap 23 24, cleverly motionless with the outer ring of hollow shaft motor, inner ring rotation and vacant design feature will be in hollow rotation cups 22 Chamber is designed to meet the space requirement of the back-and-forth motion of oled substrate feeder 2, so that overall structure is more compact reliable,
The fixed device 24 of the oled substrate has the support rod 241 driven by telescopic oil cylinder, in the two sides of support rod 241 It is respectively equipped with steady slide rail 242, and the driving mechanism of support rod 241, steady slide rail 242 is arranged at the outer of rotating end cap 23 Side is equipped with sliding sleeve 243 between two steady slide rails 242, is equipped with stop flange 244 in the end of support rod 241, is limiting Cylindrical stent 245 is installed, centered on the central axis of cylindrical stent 245, in the outside of cylindrical stent 245 on flange 244 Edge is equipped with several along the sealing positive stop strip 246 of axial extension, is all provided between two adjacent sealing positive stop strips 246 useful In the support panel 247 of installation oled substrate, and the middle part of panel 247 is supported to connect by rotating shaft pin with cylindrical stent 245, It is equipped with fastening adjustment part 248 between two adjacent support panels 247, is cut with scissors between fastening adjustment part 248 and sliding sleeve 243 It is connected to push-pull rod 249, is equipped with cushioning supportive cylinder 250, the cylinder body of the cushioning supportive cylinder 250 at the middle part of push-pull rod 249 Part is in state obliquely and hinged with push-pull rod 249 with axial direction, and the projecting end of the cushioning supportive cylinder 250 resists The inner surface of end cover 113.
The cross section of the sealing positive stop strip 246 is in isosceles trapezoid shape, and seals what positive stop strip 246 radially extended Middle plane runs through the central axis of cylindrical stent 245, so that the gap between sealing positive stop strip 246 and support panel 247 is being steamed It combines closely when plating work, does not influence vacuum chamber, and seal the smaller side in end of positive stop strip 246 towards cylindrical stent 245 Central axis setting, there is the card adaptable with the cross section of sealing positive stop strip 246 on the end face of the fastening adjustment part 248 Slot, with the radial pushing distance for limiting push-pull rod 249,
For the ease of adjusting suitable parameter in initial link, avoid the generation of initial stage waste product, vapor deposition source device 112 with It is equipped between support panel 247 and blocks cylinder, and block cylinder to play covering when tuning parameter in the early stage through end cover 113 Effect, the removal when reaching optimised process environment do not influence the smooth realization of integrated artistic.Because at the both ends of total Jun You mobile mechanism, so in order to promote the pressure maintaining efficiency of vacuum and temperature loss, the end cover 113, rotating end cap 23 It is two-layer stratigraphic structure, is equipped with hollow thermal insulation layer inside it.
In the above-described embodiments, principal mode is that evaporation source is motionless, when evaporation material molecule forms phase in vacuum chamber When to stable cyclic annular colloid environment, with the rotation of the support panel 247 surrounded, a part of evaporation material molecule overlay film On oled substrate, another part, which can present to be similar to, flicks the state thrown away, this part evaporation material molecule can be controllable Revolving speed under, stable cyclic annular colloid environment can be constituted, to promote the uniformity coefficient of plated film, while being also possible that vapor deposition The colloid environment of material forms the stable trend around center axis thereof, the uniformity coefficient of overlay film is further promoted, not In the disconnected above-mentioned environment being repeated, evaporation material molecule will also bear oled substrate radially on impact force, mention Rise the effect of plated film, it is clear that, the vapor deposition source device 112 of equipment 1 can will also be deposited in above-described embodiment, in conjunction with sky The principle of spindle motor is arranged to the steering opposite with support panel 247, and the circulation that can further speed up the above process is realized.
The specific course of work of the present embodiment is as follows: state is as shown in Figure 1, whole device keeps close during the work time Closed state, vacuum-pumping tube connector 17 is vacuumized, and when reaching pressure requirements, starts electromagnetic heater 111, due to two-by-two The setting at interval, will be so that heating be more uniform, and transfer efficiency is also higher, overflows in the evaporation material molecule of vapor deposition source device 112 After out, with the rotation of support rod 241, entire cylindrical stent 245 is rotated with it, due to the characteristic of hollow shaft motor, Ke Yishi Existing stepless time adjustment seals positive stop strip 246 and fastening by the best curve of the control of the available rotational parameters of test of early period 248 air-tight state of adjustment part at this time by push-pull rod 249 tensional state guarantee, with vapor deposition process completion, support rod 241 to Backed off after random drives exiting for entire cylindrical stent 245, behind the inner cavity for exiting hollow rotation cup 22 completely, passes through sliding sleeve 243 Move horizontally, can control the jacking upwards of push-pull rod 249, and then fasten adjustment part 248 and be caught in sealing positive stop strip 246, then prop up It supports the rotation of panel 247 to tilt, cooperates corresponding mechanical arm at this time, complete the taking-up for the oled substrate completed to plated film, and The feeding of oled substrate to be processed, after OLED to be processed is sent into substantially, the above process is inverted, cushioning supportive cylinder 250 Play the role of support, buffering, connection in the movement of push-pull rod 249, promotes the rigidity of whole cylindrical stent 245.
When be deposited source device 112 in evaporation material totally when, sidesway goes out end cover 113 forward, is taken out of by sliding rail Source device 112 is deposited, addition is realized by mechanical arm or directly replaces, whole device is compact-sized reliable, can be disposable Muti-piece oled substrate is processed, can be realized by automation at the head and the tail both ends of technological design, be conducive to whole OLED line Capacity in Automatic Technological Design is also convenient for the spilling of control contaminated materials and the control of technological parameter, has also sufficiently used total The characteristics of, it can significantly solve the problems, such as above-mentioned to be solved.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.

Claims (2)

1. a kind of OLED evaporated device with high stability oled substrate feeder, it is characterised in that: including along level side Respectively arranged vapor deposition equipment (1) and oled substrate feeder (2) forwards, backwards,
The oled substrate feeder (2) has the outer seat (21) of the core motor being fixedly connected with stripper loop (16), described The center of the outer seat (21) of core motor is equipped with hollow rotation cup (22), the front end and stripper loop (16) of hollow rotation cup (22) Inner ring rotation connection, it is described it is hollow rotation cup (22) center be equipped with rotating end cap (23), in the rotating end cap (23) To be equipped with oled substrate fixed device (24) for front end,
The oled substrate fixed device (24) has the support rod (241) driven by telescopic oil cylinder, in the support rod (241) Two sides be respectively equipped with steady slide rail (242), and the driving mechanism of the support rod (241), steady slide rail (242) is arranged at The outside of rotating end cap (23) is equipped with sliding sleeve (243) between two steady slide rails (242), in the support rod (241) End is equipped with stop flange (244), is equipped with cylindrical stent (245), on the stop flange (244) with the cylindrical stent (245) centered on central axis, the cylindrical stent (245) outer ledge be equipped with several along axial extension sealing Positive stop strip (246) is equipped with the support panel for installing oled substrate between two adjacent sealings positive stop strip (246) (247), and the middle part of support panel (247) is connect by rotating shaft pin with cylindrical stent (245), in two adjacent branch It supports and is equipped with fastening adjustment part (248) between panel (247), it is hinged between the fastening adjustment part (248) and sliding sleeve (243) There are push-pull rod (249), is equipped with cushioning supportive cylinder (250) at the middle part of the push-pull rod (249), the cushioning supportive cylinder (250) cylinder part and axial direction in state obliquely and with push-pull rod (249) hingedly, the cushioning supportive cylinder (250) projecting end resists the inner surface of end cover (113),
The cross section of sealing positive stop strip (246) is in isosceles trapezoid shape, and the sealing positive stop strip (246) is radially prolonged The middle plane of exhibition runs through the central axis of cylindrical stent (245), and the smaller side direction in end of sealing positive stop strip (246) The central axis of cylindrical stent (245) is arranged, and has on the end face of fastening adjustment part (248) and sealing positive stop strip (246) The adaptable card slot in cross section.
2. a kind of OLED evaporated device with high stability oled substrate feeder as described in claim 1, feature Be: the vapor deposition equipment (1) has vapor deposition source device (112), in the vapor deposition source device (112) and support panel (247) it is equipped between and blocks cylinder, and the cylinder that blocks can run through end cover (113).
CN201811204519.6A 2017-12-08 2017-12-08 A kind of OLED evaporated device with high stability oled substrate feeder Pending CN109112487A (en)

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CN201811204504.XA Active CN109023245B (en) 2017-12-08 2017-12-08 High stability OLED evaporation equipment
CN201711291603.1A Active CN107805784B (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device
CN201811205201.XA Withdrawn CN109182975A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device for capableing of quick-replaceable evaporation source
CN201811204495.4A Withdrawn CN109207928A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with quick oled substrate conveying capacity
CN201811204514.3A Active CN109023246B (en) 2017-12-08 2017-12-08 High-efficient OLED evaporation equipment
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CN201811205201.XA Withdrawn CN109182975A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device for capableing of quick-replaceable evaporation source
CN201811204495.4A Withdrawn CN109207928A (en) 2017-12-08 2017-12-08 A kind of OLED evaporated device with quick oled substrate conveying capacity
CN201811204514.3A Active CN109023246B (en) 2017-12-08 2017-12-08 High-efficient OLED evaporation equipment
CN201811204513.9A Active CN109023288B (en) 2017-12-08 2017-12-08 OLED evaporation equipment with high-efficient evaporation equipment

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CN109023246B (en) 2020-08-14
CN109023245A (en) 2018-12-18
CN109182975A (en) 2019-01-11
CN109023288A (en) 2018-12-18
CN109207928A (en) 2019-01-15
CN109023288B (en) 2020-10-13
CN107805784A (en) 2018-03-16
CN109023246A (en) 2018-12-18
CN109023245B (en) 2020-04-03

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Application publication date: 20190101