JPS6357759A - Method and apparatus for surface treatment in vacuum - Google Patents

Method and apparatus for surface treatment in vacuum

Info

Publication number
JPS6357759A
JPS6357759A JP19941786A JP19941786A JPS6357759A JP S6357759 A JPS6357759 A JP S6357759A JP 19941786 A JP19941786 A JP 19941786A JP 19941786 A JP19941786 A JP 19941786A JP S6357759 A JPS6357759 A JP S6357759A
Authority
JP
Japan
Prior art keywords
mounting plate
lifting
vacuum
rotating
tilting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19941786A
Other languages
Japanese (ja)
Inventor
Fumio Sakagami
坂上 二三雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP19941786A priority Critical patent/JPS6357759A/en
Publication of JPS6357759A publication Critical patent/JPS6357759A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To permit surface treatment of works having various shapes and sizes by positioning the work in a vacuum by lifting, rotating, tilting or horizontal moving, then subjecting the treatment surface to a desired treatment while rotating or lifting the work. CONSTITUTION:Mechanisms 6, 7, 8 for rotating, lifting and tilting are mounted to a horizontally movable upper frame 3 in a vacuum vessel 2. A lifting supporting member 5 is further mounted to the bottom end of a hollow shaft 11 which is lifted by means of a motor gear 12, gear 13, screw 9 and nut 10, etc., of the lifting mechanism 6 and a mounting plate 4 for the work is freely rotatably and liftably mounted thereto. The plate 4 is driven to rotate by the rotating mechanism 7 and is further tilted by the tilting mechanism 8. The work set on the plate 4 of the surface treatment device constituted in the above- mentioned manner is positioned to an optimum position by lifting, rotating, tilting and horizontal moving according to the purpose of the treatment, shape, size, etc., and while the work is rotated or lifted at need, the work is subjected to the desired surface treatment by a vapor source A.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、真空中での表面処理力法およびその装置に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface treatment method in vacuum and an apparatus therefor.

〔従来技術とその問題点〕[Prior art and its problems]

真空中での表面処理としては、被処理物表面にイオンを
蒸着するイオンブレーティング、イオンを侵入させるイ
オン注入、あるいはこれら2つIf用するイオンビーム
ミキシングがある。
Surface treatments in vacuum include ion blating, which deposits ions on the surface of the object to be treated, ion implantation, which causes ions to penetrate, or ion beam mixing, which uses these two If.

こわらいすねの処理方法においても、膜厚の均−性およ
び処理面の拡大を図るため、被処理物を動かしながら処
理を行なっている。
In the method for treating stiff shins, the treatment is carried out while moving the object to be treated in order to ensure uniformity of the film thickness and enlargement of the treated surface.

例えば、イオンブレーティングにおいては、1・9図に
示すような運動機構を用いている。この機構は、モータ
50により回転する回転板51に多数の被処理物取付板
52を取付けて公転させ、回転板51と同−中上・を有
するリング状固定歯車53とこれに噛合する歯車54と
により、取付板52を公転に伴なって自転させる構成で
ある。
For example, in ion brating, a motion mechanism as shown in Figures 1 and 9 is used. In this mechanism, a large number of workpiece mounting plates 52 are attached to a rotary plate 51 rotated by a motor 50 and rotated, and a ring-shaped fixed gear 53 having the same center and upper part as the rotary plate 51 and a gear 54 meshing therewith. Accordingly, the mounting plate 52 is configured to rotate along with the revolution.

従来の運動機構は、このような構成であるので、イオン
蒸発源Aが下に設置されているイオンブレーティングに
おいては処理面が水平になるようにセットし、イオン注
入の場合は、水平方向からイオン営射Bされるので、処
理面が垂直になるようにセットしなければならない。さ
らに、イオンビームミキシングの場合には、前述の2万
回に対し処理面を対応させるため、処理面を傾斜させて
セットしなければならない。
Conventional movement mechanisms have this configuration, so in ion brating where ion evaporation source A is installed below, the processing surface is set horizontally, and in the case of ion implantation, it is set so that the processing surface is horizontal. Since the ion beam is projected B, the processing surface must be set vertically. Furthermore, in the case of ion beam mixing, in order to make the processing surface compatible with the above-mentioned 20,000 times, the processing surface must be set at an angle.

したがって、従来の運動機構では、処理方法により被処
理物の取付は位置の方向を変えなければならず、単一処
理のみしか行なえない問題点があった。さらに、小型で
同一形状のものを多量同時処理することを目的としてい
るので、異形状や大型物に対しては適用しにくいという
問題点があった。
Therefore, in the conventional movement mechanism, the attachment of the object to be processed must change the direction of the position depending on the processing method, and there is a problem in that only a single process can be performed. Furthermore, since the purpose of this method is to simultaneously process a large number of small objects of the same shape, there is a problem in that it is difficult to apply to irregularly shaped or large objects.

この発明は、このような問題点を解消すべく提案された
もので、その目的は、一つの装置で前述の種々の処理を
容易に行なうことができるとともに、種々の形状および
大きさの被処理物の表面処理を行なえる真空中での表面
処理方法およびその装置を提供することにある。
This invention was proposed to solve these problems, and its purpose is to be able to easily perform the various processes described above with one device, and to process objects of various shapes and sizes. An object of the present invention is to provide a method and apparatus for surface treatment in vacuum that can perform surface treatment on objects.

〔問題点を解決するだめの手段・作用〕この発明に係る
表面処理方法は、真空中で被処理物を、処理目的、被処
理物の形状・大きさに応じて昇降、回転、傾斜あるいは
水平移動させて最適位置に位置決めし、被処理物を回転
あるいは昇降させつつ被処理物の処理面にイオンブレー
ティング、イオン注入あるいはイオンビームミキシング
を施し、一つの装置で前述の拙々の処理を容易に行なえ
るとともに、神々の形状および大きさの被処理物の表面
処理を行なえるようにしたものである。
[Means and effects for solving the problem] The surface treatment method according to the present invention is capable of lifting, rotating, tilting, or horizontally processing a workpiece in a vacuum depending on the purpose of treatment and the shape and size of the workpiece. Move and position the workpiece to the optimal position, rotate or raise and lower the workpiece, and perform ion blating, ion implantation, or ion beam mixing on the processing surface of the workpiece, making the aforementioned clumsy processing easier with one device. In addition, it is possible to perform surface treatment on objects of divine shape and size.

この発明に係る表面処理装置は、水平移動可能とされた
真空槽上部と、真空槽内に配置され、被処理物が取付け
られる取付板と、この取付板が回転自在かつ傾動自在に
取付けられる昇降支持部材と、真空槽上部から昇降支持
部材に垂設され、昇降支持部材を昇降させる昇降機構と
、真空槽上部から昇降支持部材に垂設され、昇降支持部
材の昇降に伴なって伸縮しつつ上部の1駆動諒からの回
転力を取付板に伝達し、取付板を回転・傾動させる回転
機構・傾動機構とからなり、処理目的、被処理物の形状
・大きさに応じて被処理物を昇降、回転、傾斜あるいは
水平移動させて最適位置に位置決めし、回転あるいは昇
降させつつ被処理物の表面に必要な処理を施すようにし
たものである。
The surface treatment apparatus according to the present invention includes an upper part of a vacuum chamber that is horizontally movable, a mounting plate that is placed in the vacuum chamber and to which a workpiece is attached, and an elevator on which the mounting plate is rotatably and tiltably mounted. a support member, an elevating mechanism that is vertically provided from the top of the vacuum chamber to the elevating support member and that raises and lowers the elevating support member; It consists of a rotating mechanism and a tilting mechanism that transmit rotational force from one drive shaft on the top to the mounting plate, and rotate and tilt the mounting plate. The device is moved up and down, rotated, tilted, or horizontally moved to position it at an optimal position, and rotated or moved up and down to perform the necessary treatment on the surface of the object to be processed.

〔実 施 例〕〔Example〕

以下、この発明を図示する実施例に基づいて説明する。 The present invention will be described below based on illustrated embodiments.

牙6図ないし牙8図に示すように、被処理物1を真空槽
2内で昇降、回転、傾動、水平移動可能となし、処理目
的、被処理物の形状・大きさに応じて、前記4つの運動
を適宜組合わせて被処理物1を最適位置に位置決めし、
被処理物1を回転あるいは昇降させつつイオンブレーテ
ィング、イオン注入あるいはイオンビームミキシングを
行なう。
As shown in Figures 6 to 8, the workpiece 1 can be moved up and down, rotated, tilted, and horizontally moved within the vacuum chamber 2, and the above-mentioned changes can be made depending on the processing purpose and the shape and size of the workpiece. The workpiece 1 is positioned at the optimal position by appropriately combining the four movements,
Ion blating, ion implantation, or ion beam mixing is performed while rotating or raising and lowering the object 1 to be processed.

牙6図は、平板の表面にイオンブレーティングを行なう
場合で、平板を昇降させてイオン蒸発源への蒸発面に対
し水平な最適位置となるようにセットし、平板を回転さ
せつつイオン蒸着を行ない、膜厚の均一化を図っている
Figure 6 shows a case where ion blating is performed on the surface of a flat plate.The flat plate is raised and lowered and set at the optimal position horizontal to the evaporation surface of the ion evaporation source, and the ion evaporation is performed while rotating the flat plate. The aim is to make the film thickness uniform.

牙4図は棒状の長尺材の先端面にイオンブレーティング
を行なう場合で、長尺材処理面と蒸発面が所定の間隔と
なるように長尺材を昇降させてセットし、回転させる。
Fig. 4 shows a case where ion blating is performed on the tip surface of a long rod-shaped material, and the long material is raised and lowered, set, and rotated so that the treated surface of the long material and the evaporation surface are at a predetermined distance.

牙5図は棒状の長尺材の側面にイオンブレーティングを
行なう場合で、水平移動、昇降および傾斜させることに
より蒸発面と処理面がほぼ等距離となるようにセットし
、回転させてイオン蒸着を行なう。
Figure 5 shows the case where ion blating is performed on the side surface of a long rod-shaped material, and the ion evaporation is performed by horizontally moving, raising and lowering, and tilting the material so that the evaporation surface and the treatment surface are approximately equidistant, and then rotating the material. Do the following.

牙6図は平板にイオンビームミキシングを行なう場合で
、水平移動・昇降させるとともに平板を45°に傾斜さ
せ、下部よりの蒸着および側面よりのイオン注入に対応
させ、回転させてミキシングを行なう。
Fig. 6 shows a case where ion beam mixing is performed on a flat plate, and the flat plate is moved horizontally and raised and lowered, and the flat plate is tilted at 45° to correspond to vapor deposition from the bottom and ion implantation from the side, and mixing is performed by rotating.

牙7図は長尺材の側面にイオン注入する場合であり、処
理面がイオンビーム8幅よりも広いので、上下方向に繰
り返し昇降させるとともに回転させてイオン注入を行な
う。
Figure 7 shows the case where ions are implanted into the side surface of a long material, and since the surface to be treated is wider than the width of the ion beam 8, the ion implantation is performed by repeatedly raising and lowering the beam in the vertical direction and rotating it.

牙8図は平板にイオン注入する場合であり、昇降させる
とともに垂直となるように傾動させてセントし、回転さ
せてイオン注入する。
Figure 8 shows the case where ions are implanted into a flat plate, and the plate is raised and lowered, tilted vertically, centered, and rotated for ion implantation.

次に、以上のような種々の表面処理を行なうのに好適な
装置について説明する。
Next, an apparatus suitable for performing the various surface treatments described above will be described.

〕・1図、牙2図に示すように、この装置は真空槽2の
上部に設けられ、−X2槽本体に対して水平移動可能に
設置された上部フレーム3と、被処理物1が取付けられ
る取付板4と、取付板4が回転自在かつ傾動自在に取付
けられる昇降支持部材5と、昇降支持部材5を昇降させ
る昇降機構6と、取付板4を回転させる回転機構7と、
取付板4を傾動させる傾動機構8からなる。
]・As shown in Figure 1 and Figure 2, this device is installed on the top of a vacuum chamber 2, and has an upper frame 3 installed to be horizontally movable with respect to the -X2 tank body, and a workpiece 1 attached to it. a mounting plate 4 that is attached to the mounting plate 4; a lifting support member 5 to which the mounting plate 4 is rotatably and tiltably mounted; a lifting mechanism 6 that lifts and lowers the lifting support member 5; and a rotation mechanism 7 that rotates the mounting plate 4.
It consists of a tilting mechanism 8 that tilts the mounting plate 4.

昇降機構6は、上部フレーム3から昇降支持部材5に垂
設され、上部フレーム3に回転自在に支持された昇降駆
動用スクリュー9、スクリュー9に噛合する昇降伝達用
ナツト10、ナツト10と昇降支持部材5を接続する昇
降伝達中量シャフト11を有し、昇降用モータ軸歯車1
2、歯車13の回転により、スクリュー9を回転させ、
ナラ) 10を上下動させる。これにより昇降支持部材
5丁なわち取付板4が所定ストロークで昇降する。この
昇降に際して、後述する両側の回転機構7および傾動機
構8がナツト10等の回転を阻止するとともにガイドと
なっている。
The elevating mechanism 6 is vertically installed from the upper frame 3 to the elevating support member 5, and includes an elevating drive screw 9 rotatably supported by the upper frame 3, an elevating transmission nut 10 that meshes with the screw 9, and the nut 10 and elevating support. It has a lifting transmission intermediate shaft 11 that connects the member 5, and a lifting motor shaft gear 1.
2. Rotate the screw 9 by rotating the gear 13,
Oak) Move 10 up and down. As a result, the five lifting support members, that is, the mounting plate 4, move up and down with a predetermined stroke. During this elevation, a rotation mechanism 7 and a tilting mechanism 8 on both sides, which will be described later, prevent the rotation of the nut 10 and the like and serve as a guide.

取付板4は、その回転軸14により傾動フレーム15に
回転自在に取付けられ、この傾動フレーム15が昇降支
持部材5に傾動自在に支持されている。
The mounting plate 4 is rotatably attached to a tilting frame 15 by its rotation shaft 14, and the tilting frame 15 is supported by the lifting support member 5 so as to be tiltable.

回転機構7は、上部フレーム3から昇降支持部材5に垂
設され、上部フレーム3に回転自在に支持された回転、
駆動シャフト16、上端部17 Aが回転、駆動シャフ
ト16に係合し、下端が昇降支持部材5に軸受18を介
して回転自在に取付けられた回転伝達中空シャフト17
と、中空シャフト17の回転を取付板40回転軸14に
伝達する伝達歯車19および水平伝達勅題を有し、回転
用モータ軸歯車21、歯車乙の回転により、回転駆動シ
ャフト16を回転させ、シャフト17、伝達歯車19、
水平伝達勅題、回転軸14を介して取付板4が回転する
The rotation mechanism 7 is vertically installed from the upper frame 3 to the elevating support member 5, and is rotatably supported by the upper frame 3.
Drive Shaft 16, Upper End 17 A rotates and engages with the drive shaft 16, and the lower end is rotatably attached to the lifting support member 5 via a bearing 18. A rotation transmitting hollow shaft 17.
It has a transmission gear 19 that transmits the rotation of the hollow shaft 17 to the mounting plate 40 and the rotating shaft 14, and a horizontal transmission gear. 17, transmission gear 19,
During horizontal transmission, the mounting plate 4 rotates via the rotation axis 14.

ここで、回転駆動シャフト16は、断面が例えば角形と
し、中空シャフト17の上端部17 Aの係合孔もこれ
に係合する角形とし、中空シャフト17へ回転力を伝達
しつつ上下方向には自由に中空シャフト17が移動でき
ろようにされている。
Here, the rotary drive shaft 16 has a rectangular cross section, for example, and the engagement hole of the upper end 17A of the hollow shaft 17 has a rectangular shape that engages with the engagement hole. The hollow shaft 17 is allowed to move freely.

これにより昇降支持部材5の昇降に伴なって伸縮しつつ
回転力が取付板4に伝達される。
As a result, rotational force is transmitted to the mounting plate 4 while expanding and contracting as the lifting support member 5 moves up and down.

傾動機構8も回転機構7と同様に垂設され、回転駆動シ
ャフト16、中空シャフト17の構造も回転機構7と同
様であり、傾動用モータ軸歯車乙の回転を犬歯車送で回
転量を下げ、回転駆動シャフト16を回転させる。回転
力は、中空シャフト17、回転伝達歯車5を介して伝達
され、傾動フレーム15に接続された傾動軸26を回転
させ、これにより取付板4が傾動する。
The tilting mechanism 8 is also vertically installed like the rotating mechanism 7, and the structures of the rotary drive shaft 16 and the hollow shaft 17 are also similar to the rotating mechanism 7. , rotates the rotary drive shaft 16. The rotational force is transmitted via the hollow shaft 17 and the rotation transmission gear 5 to rotate the tilting shaft 26 connected to the tilting frame 15, thereby causing the mounting plate 4 to tilt.

ここで、傾動軸26の中心すなわち傾動中心と、水平伝
達軸20の中心を一致させておき、回転機構70回転力
伝達と傾動が支障なく行なえるようにする。
Here, the center of the tilting shaft 26, that is, the center of tilting, and the center of the horizontal transmission shaft 20 are made to coincide with each other, so that rotational force transmission and tilting of the rotating mechanism 70 can be performed without any trouble.

また、上部フレーム3は、図示しない適宜の手段により
水平移動可能とされている。
Further, the upper frame 3 is horizontally movable by appropriate means not shown.

以上のような構成において、各機構ン単独であるいは適
宜組合わせて牙3図ないし牙8図に示すように、取付板
4すなわち被処理物1を最適位置に位置決めして、被処
理物1を回転あるいは昇降させつつイオンブレーティン
グ、イオン注入するいはイオンビームミキシングを行な
う。
In the above configuration, the mounting plate 4, that is, the workpiece 1, is positioned at the optimum position by each mechanism alone or in appropriate combination as shown in Figs. Ion blating, ion implantation, or ion beam mixing is performed while rotating or moving up and down.

〔発明の効果〕〔Effect of the invention〕

前述のとおり、この発明によれば、被処理物を真空槽内
で昇降、回転、傾動、水平移動可能とし、処理目的、被
処理物の形状・大きさに応じて、前記4つの運動を適宜
組合わせて、被処理物を最適位置に位置決めし、被処理
物を回転あるいは昇降させつつイオンブレーティング、
イオン注入あるいはイオンビームミキシングを行なうよ
うにしたため、次のような効果を奏する。
As described above, according to the present invention, the object to be processed can be moved up and down, rotated, tilted, and moved horizontally within the vacuum chamber, and the above four movements can be adjusted as appropriate depending on the purpose of processing and the shape and size of the object to be processed. In combination, the object to be treated is positioned at the optimum position, and the object to be treated is rotated or raised and lowered while ion brating,
Since ion implantation or ion beam mixing is performed, the following effects are achieved.

(1)一つの装置でイオンブレーティング、イオン注入
、イオンビームミキシングを行ナよる。
(1) One device performs ion brating, ion implantation, and ion beam mixing.

(11)  被処理物の太きさや形状の制限が従来型に
比べて大幅に拡大する。
(11) Restrictions on the thickness and shape of objects to be processed are significantly expanded compared to conventional methods.

(iii)  各種形状の被処理物に対し、処理面を最
適位置に簡単にセットできる。
(iii) The processing surface can be easily set at the optimum position for objects to be processed of various shapes.

(iv)  4つの運動機構により処理面積が大幅に広
がる。
(iv) Four movement mechanisms greatly expand the processing area.

【図面の簡単な説明】[Brief explanation of drawings]

A□ 1図はこの発明に係る表面処理装置を示す縦断面
図、周・2図は牙1図の■−■線断面図、牙6図ないし
オ・8図は本発明の表面処理方法の種々の態様を示す概
略図、牙9図は従来の表面処理装置の一例を示す概略図
である。 1・・・・・・被処理物、2・・・・・・真空槽、3・
・・・・・上部フレーム、4・・・・・・取付板、5・
・・・・・昇降支持部材、6・・・・・・昇降機構、7
・・・・・・回転機構、8・・・・・・傾動機構、9・
・・・・・昇降駆動用スクリュー、10・・・・・・昇
降伝達用ナツト、11・・・・・・昇降伝達中空シャフ
ト、12・・・・・・昇降用モータ軸歯車、13・・・
・・・歯車、14・・・・・・回転軸、15・・・・・
・傾動フレーム、16・・・・・・回転駆動シャフト、
17・・・・・・回転伝達中空シャフト、17 A・・
・・・・上端部、18・・・・・・軸受、19・・・・
・・伝達歯車、氏・・・・・・水平伝達軸、21・・・
・・・回転用モータ軸歯車、n・・・・・・歯車、厳・
・・・・・傾動用モータ軸歯車、24・・・・・・歯車
、5・・・・・・伝達歯車、26・・・・・・傾動軸
A□ Figure 1 is a longitudinal sectional view showing the surface treatment apparatus according to the present invention, Figure 2 is a sectional view taken along the line ■-■ of Figure 1, Figures 6 to 8 are views of the surface treatment method of the present invention. Schematic diagrams showing various aspects, Figure 9 is a schematic diagram showing an example of a conventional surface treatment apparatus. 1... Workpiece, 2... Vacuum chamber, 3.
...Upper frame, 4...Mounting plate, 5.
... Lifting support member, 6... Lifting mechanism, 7
...Rotating mechanism, 8...Tilt mechanism, 9.
... Screw for lifting and lowering drive, 10 ... Nut for lifting and lowering transmission, 11 ... Lifting and lowering transmission hollow shaft, 12 ... Motor shaft gear for lifting and lowering, 13 ...・
... Gear, 14 ... Rotating shaft, 15 ...
・Tilt frame, 16... Rotation drive shaft,
17... Rotation transmission hollow shaft, 17 A...
...Top end, 18...Bearing, 19...
...Transmission gear, Mr....Horizontal transmission shaft, 21...
...Rotating motor shaft gear, n...Gear, strict...
...Motor shaft gear for tilting, 24...Gear, 5...Transmission gear, 26...Tilting shaft

Claims (2)

【特許請求の範囲】[Claims] (1)真空中で被処理物を、処理目的、被処理物の形状
・大きさに応じて昇降、回転、傾斜あるいは水平移動さ
せて最適位置に位置決めし、被処理物を回転あるいは昇
降させつつ被処理物の処理面にイオンプレーティング、
イオン注入あるいはイオンビームミキシングを施すこと
を特徴とする真空中での表面処理方法。
(1) In a vacuum, the object to be processed is moved up and down, rotated, tilted, or horizontally moved depending on the processing purpose and the shape and size of the object to be positioned at the optimal position, and while the object is rotated or raised and lowered. Ion plating on the processing surface of the processed object,
A surface treatment method in vacuum characterized by performing ion implantation or ion beam mixing.
(2)水平移動可能とされた真空槽上部と、真空槽内に
配置され、被処理物が取付けられる取付板と、 この取付板が回転自在かつ傾動自在に取付けられる昇降
支持部材と、 前記真空槽上部から前記昇降支持部材に垂設され、昇降
支持部材を昇降させる昇降機構と、 前記真空槽上部から前記昇降支持部材に垂設され、昇降
支持部材の昇降に伴なつて伸縮しつつ上部の回転、駆動
源からの回転力を前記取付板に伝達し、取付板を回転さ
せる回転機構と、 前記真空槽上部から前記昇降支持部材に垂設され、昇降
支持部材の昇降に伴なつて伸縮しつつ上部の傾動、駆動
源からの回転力を前記取付板に伝達し、取付板を傾動さ
せる傾動機構とを備えていることを特徴とする真空中で
の表面処理装置。
(2) an upper part of the vacuum chamber that is horizontally movable; a mounting plate that is placed in the vacuum chamber and to which the workpiece is attached; an elevation support member to which the mounting plate is rotatably and tiltably mounted; and the vacuum chamber. an elevating mechanism that is vertically installed from the upper part of the vacuum tank to the elevating support member and raises and lowers the elevating support member; a rotation mechanism that transmits rotational force from a rotational drive source to the mounting plate and rotates the mounting plate; and a rotation mechanism that is vertically disposed from the upper part of the vacuum chamber to the lifting support member and that expands and contracts as the lifting support member moves up and down. 1. A surface treatment apparatus in a vacuum, comprising: a tilting mechanism that transmits rotational force from a drive source to the mounting plate and tilts the mounting plate;
JP19941786A 1986-08-26 1986-08-26 Method and apparatus for surface treatment in vacuum Pending JPS6357759A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19941786A JPS6357759A (en) 1986-08-26 1986-08-26 Method and apparatus for surface treatment in vacuum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19941786A JPS6357759A (en) 1986-08-26 1986-08-26 Method and apparatus for surface treatment in vacuum

Publications (1)

Publication Number Publication Date
JPS6357759A true JPS6357759A (en) 1988-03-12

Family

ID=16407454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19941786A Pending JPS6357759A (en) 1986-08-26 1986-08-26 Method and apparatus for surface treatment in vacuum

Country Status (1)

Country Link
JP (1) JPS6357759A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004269988A (en) * 2003-03-10 2004-09-30 Canon Inc Sputtering apparatus
CN107805784A (en) * 2017-12-08 2018-03-16 常州市知豆信息科技有限公司 A kind of OLED evaporated devices
CN111705302A (en) * 2020-08-18 2020-09-25 上海陛通半导体能源科技股份有限公司 Vapor deposition equipment capable of realizing stable lifting of wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004269988A (en) * 2003-03-10 2004-09-30 Canon Inc Sputtering apparatus
CN107805784A (en) * 2017-12-08 2018-03-16 常州市知豆信息科技有限公司 A kind of OLED evaporated devices
CN107805784B (en) * 2017-12-08 2018-12-21 泉州市派腾新材料科技有限公司 A kind of OLED evaporated device
CN111705302A (en) * 2020-08-18 2020-09-25 上海陛通半导体能源科技股份有限公司 Vapor deposition equipment capable of realizing stable lifting of wafer

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