CN203284464U - PECVD (plasma enhanced chemical vapor deposition) film coating system - Google Patents
PECVD (plasma enhanced chemical vapor deposition) film coating system Download PDFInfo
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- CN203284464U CN203284464U CN2013202374043U CN201320237404U CN203284464U CN 203284464 U CN203284464 U CN 203284464U CN 2013202374043 U CN2013202374043 U CN 2013202374043U CN 201320237404 U CN201320237404 U CN 201320237404U CN 203284464 U CN203284464 U CN 203284464U
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Abstract
The utility model discloses a PECVD coating system, which comprises a process system, a loading and unloading system and a valve mechanism; the process system comprises a process cavity and a process reaction chamber; the process reaction chamber is arranged in the process cavity; the loading and unloading system comprises a loading and unloading cavity and a transmission manipulator; the transmission manipulator is arranged between the loading and unloading cavity and the process cavity in a sliding manner; the valve mechanism is arranged between the process cavity and the loading and unloading cavity and is used for communicating or isolating the process cavity and the loading and unloading cavity, the transmission manipulator can reciprocate between the cavities through the valve mechanism, and the mutual communication between the cavities and the mutual independence of a vacuum environment are ensured; the loading and unloading cavity simultaneously has the functions of a loading cavity and a transfer transmission cavity, and can meet the functions of loading and unloading substrates and mutual transmission between the cavities; because only two cavities are arranged, the structure is simpler, the equipment cost is low, the installation and the maintenance are simple and convenient, the transmission structure is simple, convenient and easy, and the requirement on the mechanical precision is low.
Description
Technical field
The utility model relates to field of vacuum coating, relates in particular to a kind of PECVD coating system.
Background technology
Plasma activated chemical vapour deposition (Plasma enhanced Chemical Vapor Depositon, hereinafter referred to as PECVD) technology is to utilize glow discharge to produce the process that plasma body carries out chemical vapour deposition.The radio frequency discharge technology that adopt more, utilize additional radio-frequency power supply to accelerate electronics, these high-energy electrons and process gas bump, produce decomposition, chemical combination, excite and the process such as ionization, produce a large amount of charged ions, free radical and active group, these have very highly active chemical group in the sample surfaces generation series of chemical that is positioned on electrode, generate solid film.This technology is low because having working temperature, and sedimentation rate is fast, and film compactness is good, the advantages such as good process repeatability; This technology is the beginning of the seventies in last century, be to adapt to the modern semiconductors industrial expansion, obtains the deielectric-coating of high-quality and the novel process that grows up, starts afterwards progressively to be applied to the photovoltaic industry.Flourish along with the photovoltaic industry in recent years, in order to improve the efficiency of conversion of solar cell, the antireflective coating of depositing high-quality, amorphous silicon membrane, the PECVD technology has obtained large-scale application especially.
The main structure type of PECVD system has at present: 1, in-line type, the type equipment is applied to the manufacturing line that TFT-LCD produces the earliest, and the substrate monolithic enters in process cavity successively, and each layer of film prepares successively, this will cause productive temp long, and production cost is too high; Secondly, be erected in chamber during the substrate film forming, while preparing rete, diffraction problems occur easily,, along with the increase diffraction problems of substrate size is more serious, by the equipment of other types, replaced at present.2, batch type, it is to process simultaneously multi-piece substrate in a process cavity that the type equipment adopts, production efficiency is high; But, because the discharge electrode of substrate can interfere each other, cause plasma unstable, so cause the membrane uniformity of substrate and consistence poor.3, cluster type, this kind equipment adopt the monolithic thin film-forming method, and each process cavity shares a central transmission chamber, and independent separately, and when any plated film chamber broke down, other chambers were unaffected.
Growing along with technology, develop novel PECVD system on the basis that combines aforesaid device characteristics, the cluster formula PECVD system of the multi-chamber Alternative chamber of the PECVD system of Alternative chamber, single chamber and the development of some offshore companies occurred.Existing a kind of PECVD system, employing is provided with the structural pattern of a plurality of chambers in same chamber, vacuum chamber and chamber connect respectively independent vacuum system, carry out deposition film forming separately between each chamber, guaranteed the quality of substrate rete, do not affect again productive temp, meet the needs of production.But there is following deficiency in this system,, because whole system only has a chamber, when needs deposit multiple rete on substrate when, can produce cross infection, thereby affect coating quality.And the PECVD system of offshore company's design is comprised of 6 vacuum chambers, it is respectively 2 and loads chamber, 3 reaction chambers, a pre-treatment chamber, a transfer transmission chamber, substrate carries out loading and unloading by loading chamber, and be provided with transport sector in the transfer transmission chamber, be mainly realize substrate between chamber and chamber shift-in or shift out, and be provided with a plurality of reaction boxes in reaction chamber, there is movable valve to connect between each chamber and transfer transmission chamber, make the vacuum environment of each chamber keep independent, can regulate separately its cavity pressure size.Because this system is comprised of a plurality of reaction chambers, while carrying out multiple film layer deposition on substrate when needs, can by the transfer transmission chamber, substrate be transferred to another chamber after a chamber deposition is completed a kind of rete and deposit the second tunic, thereby avoided the cross infection of rete, guaranteed film quality.Yet this PECVD system is owing to several vacuum chambers, consisting of, and device structure is complicated and involve great expense, and maintenance of the equipment difficulty and cost are high; While, because fast reliable operation is high to its mechanical precision requirement, has increased the Equip-ment manufacture and installation debugging difficulty, and substrate transmits the stuck or substrate clashing and breaking phenomenon of easy appearance while turning round in chamber.
The utility model content
Technical problem to be solved in the utility model is, a kind of PECVD coating system is provided, and can avoid the cross infection between rete, guarantees film quality, and simple in structure, cost is low, and installation and maintenance are simple and convenient.
In order to solve the problems of the technologies described above, embodiment of the present utility model provides a kind of PECVD coating system, comprises process system, loading and unloading system, reaches valve mechanism;
Described process system comprises process cavity and at least one process reaction chamber; Described process reaction chamber is arranged in process cavity, is used for substrate is carried out plated film; Described process reaction chamber has an opening towards described loading and unloading cavity, and the opening part of described process reaction chamber is equipped with hermatic door, is used for being communicated with or isolation of process reaction chamber and process cavity;
Described loading and unloading system comprises loading and unloading cavity and transmission manipulator; Transmission manipulator is slidably arranged between loading and unloading cavity and process cavity, is used for loading and unloading and the transmission of substrate;
Described valve mechanism is arranged between described process cavity and described loading and unloading cavity, is used for process cavity and loads and unloads being communicated with or isolation between cavity.
Wherein, described process reaction chamber, described process cavity and described loading and unloading cavity are connected with respectively independent vacuum system, carry out respectively vacuum-treat.
Wherein, described process system also comprises the remote hydrogen plasma clean system of for the inwall to described process reaction chamber, cleaning, and described remote hydrogen plasma clean system is connected to described process reaction chamber.
Wherein, described process reaction chamber is two or more, separate and stacked setting between described process reaction chamber; Each described process reaction chamber is equipped with described hermatic door;
Described process system also comprises the linkage assembly of controlling described hermatic door switch, described linkage assembly comprises connecting rod and power set, described connecting rod is along the stacked arragement direction setting of described process reaction chamber, each described hermatic door all is connected to described connecting rod, described connecting rod is connected to described power set, and described power set is arranged in described process cavity and is used for driving described connecting rod and moves and make described hermatic door switch.
Wherein, described linkage assembly also comprises active rotating shaft and the driven spindle that is parallel to each other, and axially equal axial perpendicular to described connecting rod of described active rotating shaft and described driven spindle; The two ends of described connecting rod are hinged with respectively crank and rocking bar, described crank and rocking bar are fixedly attached to respectively described active rotating shaft and described driven spindle, described driven spindle is connected to described power set, rotate under the driving of described power set, and drive described connecting rod and move the switch of realizing described hermatic door.
Wherein, described process reaction chamber is two or more, the separate and stacked setting of arranging between described process reaction chamber; Described valve mechanism comprises retaining plate, cavity hermatic door, reaches the valve power device that is used for switch cavity hermatic door, described retaining plate is provided with and the opening of described process reaction chamber valve hole one to one, and described cavity hermatic door and described valve hole be corresponding matching and be connected to valve power device one by one;
Described valve power device comprises linkage unit and valve driving part; Described linkage unit comprises driving lever, follower lever, the first web member, the second web member and stage clip, the axial stacked arragement direction that all is parallel to described process reaction chamber of described driving lever and follower lever; Described driving lever is connected to described valve driving part, and under the driving of described valve driving part along self axial translation; One end of described the first web member is hinged to described driving lever, the other end is hinged to described follower lever, and an end of described the second web member is hinged to described follower lever, and the other end is hinged to described retaining plate; The rotating shaft of described the first web member and described second each pin joint of web member is parallel to each other; Described cavity hermatic door is connected to described follower lever by described stage clip.
Wherein, described transmission manipulator comprise bracing frame and at least one deck be used for the carrying arm layer of carrying substrates, described carrying arm layer comprises at least two carrying arms, described carrying arm is long strip shape, and along the opening direction setting of described process reaction chamber, its end away from described process cavity is fixedly connected with support frame as described above; Support frame as described above slides and is arranged at described loading and unloading cavity; Be provided with the transmission power set that is connected to support frame as described above in described loading and unloading cavity, be used for driving described transmission manipulator straight reciprocating motion.
Wherein, be provided with on the side inner walls of described loading and unloading cavity for the substrate locating mechanism that substrate is positioned; Described substrate locating mechanism comprises support, reaches the actuator that drives the support translation;
The translation direction of described support be level to and perpendicular to the length direction of described carrying arm; Be provided with guide layer on described support, described guide layer is corresponding one by one with described carrying arm layer, and described guide layer comprises at least two the first locating dowels; The axially parallel of described the first locating dowel is in the translation direction of support, and the one end is fixed to support; The other end is provided with leading sheave; The rotation axis of described leading sheave to for vertically to; Leading sheave on each described first locating dowel is arranged on same straight line;
Described carrying arm layer is provided with at least two the second locating dowels of along straight line, arranging, and the straight line of arranging of each described leading sheave is mutually vertical with the straight line of arranging of described the second locating dowel, forms a shaping positioning limit right-angle line that is used for substrate.
Wherein, described transmission power set comprises that motor reaches for the rotation of described motor is converted to straight-line transmission rig, and described motor is in transmission connection to described transmission manipulator by described transmission rig.
Wherein, also be provided with feeding gate on described loading and unloading cavity, described feeding gate is positioned at a side of described transmission manipulator slip direction.
PECVD coating system provided by the utility model has the dual chamber structure, and loading and unloading cavity and process cavity are both realized isolation mutually or connection by valve mechanism, thereby makes the transmission manipulator can to-and-fro movement between cavity; Guaranteed simultaneously interconnecting and vacuum environment separate between cavity; The opening of process reaction chamber, towards the loading and unloading cavity, is convenient to the transmission manipulator substrate operation indoor to technological reaction.The loading and unloading cavity possesses the function in load chamber and transfer transmission chamber, the function that can meet the substrate loading and unloading and mutually transmit between cavity simultaneously; Owing to only having two cavitys, structure is more simple, makes equipment cost low, and installation and maintenance are simple and convenient, and transmission structure is simply easy, to mechanical precision, requires low.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The structural representation of the PECVD coating system that Fig. 1 provides for the utility model preferred embodiment;
The diagrammatic cross-section of the process system that Fig. 2 provides for the utility model preferred embodiment;
The structural representation of the linkage assembly that Fig. 3 provides for the utility model preferred embodiment;
The structural representation of the valve mechanism that Fig. 4 provides for the utility model preferred embodiment;
The structural representation of the transmission manipulator that Fig. 5 provides for the utility model preferred embodiment;
The diagrammatic cross-section of the loading and unloading system that Fig. 6 provides for the utility model preferred embodiment;
The substrate locating mechanism that Fig. 7 provides for the utility model preferred embodiment and the structural representation of the corresponding cooperation of transmission manipulator;
The schematic perspective view of the loading and unloading system that Fig. 8 provides for the utility model preferred embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.
Referring to Fig. 1 to Fig. 8, be a kind of PECVD coating system that the utility model preferred embodiment provides, comprise process system 1, loading and unloading system 2, reach valve mechanism 3.Process system 1 comprises process cavity 10 and at least one process reaction chamber 11.Loading and unloading system 2 comprises loading and unloading cavity 20 and transmission manipulator 21.Valve mechanism 3 is arranged between process cavity 10 and loading and unloading cavity 20, is used for process cavity 10 and loads and unloads being communicated with or isolation between cavity 20.Transmission manipulator 21 is slidably arranged between loading and unloading cavity 20 and process cavity 10, and when isolating between process cavity 10 and loading and unloading cavity 20, transmission manipulator 21 is positioned at loading and unloading cavity 20.
In the present embodiment, as shown in Figure 2, the number of process reaction chamber 11 is four, and is separate between process reaction chamber 11.Certainly the number of process reaction chamber 11 can be determined as required, can also be for one, two or other numbers, all in the scope of technical solutions of the utility model.Stacked setting between process reaction chamber 11, in the present embodiment,, along vertically to stacked setting, simultaneously, there is gap in process reaction chamber 11 between adjacent two process reaction chambers 11, influences each other avoiding.Be provided with the carriage 12 for supporting process reaction chamber 11 in process cavity 10.Process reaction chamber 11 is fixed in carriage 12.
Process reaction chamber 11 is arranged in process cavity 10, is used for substrate 100 is carried out plated film.Each process reaction chamber 11 all has an opening (in figure indicate) towards loading and unloading cavity 20, and the opening part of each process reaction chamber 11 is equipped with hermatic door 13, and hermatic door 13 is used for being communicated with or isolation of process reaction chamber 11 and process cavity 10; Utilize opening can be convenient to the turnover of substrate 100.Process reaction chamber 11 integral body are square flat-shaped, and are parallel to horizontal plane, so that accommodating substrate 100.Opening is arranged on process reaction chamber 11 on the sidewall of loading and unloading cavity 20, and opening is bar shaped, and the opening of each process reaction chamber 11 is parallel to each other.Correspondingly, hermatic door 13 is also bar shaped and is parallel to each other.
Process reaction chamber 11 inner bottom surfaces are provided with the thimble (not shown), thimble is connected to hoisting appliance, when transmission manipulator 21 transmission substrates 100 advance process reaction chamber 11, thimble is lifted and jack-up substrate 100 by hoisting appliance, transmission manipulator 21 is withdrawn from, thimble descends, and substrate 100 is placed in the predetermined position of process reaction chamber 11; While spreading out of substrate 100, thimble lifts, and transmission manipulator 21 enters process reaction chamber 11 and holds substrate 100, and after thimble descends, transmission manipulator 21 is asking substrate 100 to spread out of, and realizes the turnover of substrate 100 in process reaction chamber 11.Thimble is be arranged in array a plurality of, in order to substrate 100 is supported reposefully.
As shown in Figures 1 and 3, process system 1 also comprises the linkage assembly 14 of controlling hermatic door 13 switches, and linkage assembly 14 comprises connecting rod 141 and power set 142.Connecting rod 141 is along the stacked arragement direction setting of process reaction chamber 11, in the present embodiment, connecting rod 141 axially for vertically to.Each hermatic door 13 all is connected to connecting rod 141, and connecting rod 141 is connected to power set 142, and power set 142 is arranged in process cavity 10 and for drivening rod 141 and moves and make hermatic door 13 switches.More specifically, connecting rod 141 is two that are parallel to each other, and the two ends of each hermatic door 13 are fixedly attached to respectively two connecting rods 141.Linkage assembly 14 also comprises active rotating shaft 143 and the driven spindle 144 that is parallel to each other, axially equal axial perpendicular to connecting rod 141 of active rotating shaft 143 and driven spindle 144, in the present embodiment, active rotating shaft 143 and driven spindle 144 all are horizontally disposed with and are parallel to the length direction of hermatic door 13.The two ends of connecting rod 141 are hinged with respectively crank 145 and rocking bar 146, crank 145 and rocking bar 146 are fixedly attached to respectively active rotating shaft 143 and driven spindle 144, crank 145, connecting rod 141 and rocking bar 146 form the first crank and rocker mechanism, driven spindle 144 is connected to power set 142, rotate under the driving of power set 142, and drivening rod 141 moves and realizes hermatic door 13 switches.For the stability that guarantees that connecting rod 141 moves, also be connected with two the second crank and rocker mechanisms 147 between active rotating shaft 143 and driven spindle 144, be separately positioned on the two ends of active rotating shaft 143 and driven spindle 144.
When connecting rod 141 was positioned at first location, hermatic door 13 was closed; When the drive of power set 142 was moved to the second position, a side of process reaction chamber 11 arragement directions is opened and moved to hermatic door 13 when connecting rod 141.Connecting rod 141 can drive the displacement that hermatic doors 13 produce on both directions, namely as the movement of figure X-direction and Y-direction.X-direction is the direction of process reaction chamber 11 openings, Y-direction be process reaction chamber 11 arragement direction namely vertically to, the movement of hermatic door 13 on X-direction realizes the switch of hermatic door 13, hermatic door 13 moves the opening that can make hermatic door 13 stagger process reaction chamber 11 in Y-direction, be the side that hermatic door 13 can move to process reaction chamber 11 arragement directions, be convenient to 21 pairs of substrates 100 of transmission manipulator and transmit.
As preferably, power set 142 is servomotor, and in other embodiments, power set 142 also can be rotary cylinder, direct-drive motor etc.
As shown in Figure 2, process system 1 also comprises remote plasma source (the Remote Plasma Source that cleans for the inwall to process reaction chamber 11, be called for short RPS) cleaning system (hereinafter to be referred as the RPS cleaning system) 15, the RPS cleaning system is connected to process reaction chamber 11.While carrying out the complex process such as multiple film layer deposition at same substrate 100 when needs,, for fear of when depositing second layer film, rete being caused cross infection, remain in the granule dust of the interior surplus materials of process reaction chamber 11 and locular wall while needing to use RPS cleaning system 15 to remove upper track technique.In the present embodiment, RPS cleaning system 15 is communicated to the chamber of each process reaction chamber 11 simultaneously by air-channel system, can clean a plurality of process reaction chambers 11 simultaneously, and cost is low; Utilize air-channel system to make both and be communicated with, can make the RPS cleaning system be arranged on outside process cavity 10, to save internal space.Certainly, in other attainable embodiments, each process reaction chamber 11 also can adopt separately independent RPS cleaning system 15.
As shown in Figures 1 and 2, process reaction chamber 11 and process cavity 10 are connected with respectively independent vacuum system 4, carry out respectively vacuum-treat.Vacuum system 4 mainly by vacuum-lines, valve, and vacuum pump form, its vacuum pump adopts advanced dry vacuum pump group, stops, to the pollution that vacuum chamber causes, to have guaranteed the degree of cleaning of process environments because vacuum pump returns oil.Be provided with advanced butterfly valve in technique air-bleed system pipeline, chamber pressure size while for control technique, preparing.
Close after hermatic door 13 makes process cavity 10 and process reaction chamber 11 isolation,, because the vacuum system 4 of process reaction chamber 11 and process cavity 10 is separate, connect separately independent vacuum system 4, can independently regulate the pressure of each chamber by Controlling System big or small.When carrying out coating process, process reaction chamber 11 pressure, greater than process cavity 10 pressure, have been avoided environmental gas, the particulate of process cavity 10 or the interference that dust enters 11 pairs of coating process of process reaction chamber, guarantee film quality; While carrying out the RPS cleaning, process reaction chamber 11 pressure are less than process cavity 10 pressure, can avoid the particle such as F ion to enter into 10 pairs of cavitys of process cavity and cause corrosion or pollute; The pressure of process cavity 10, less than normal atmosphere, can avoid purge gas to flow into atmospheric influence environment and operator's safety.In the present embodiment, as preferably, each process reaction chamber 11 is connected to same vacuum system, namely utilizes a vacuum system to process a plurality of process reaction chambers 11 simultaneously, to reduce costs.Certainly, in other attainable embodiments, each process reaction chamber 11 also can adopt separately independently vacuum system.
As shown in Figure 1, process cavity 10 is provided with technique Access Door 16.In the present embodiment, the technique Access Door is arranged on the chamber wall of process cavity 10 away from loading and unloading cavity 20, utilizes the technique Access Door can open process cavity 10, is convenient to installation, debugging and maintenance to process reaction chamber 11.
In the present embodiment, process cavity 10 and loading and unloading cavity 20 are square casing formula structure, and by stainless steel plate, are welded, and its inside can utilize space large, is convenient to the setting of process reaction chamber 11 and transmission manipulator 21.
As Fig. 1 and shown in Figure 4, valve mechanism 3 is arranged between process cavity 10 and loading and unloading cavity 20, it comprises retaining plate 31, cavity hermatic door 32, reaches the valve power device 33 that is used for switch cavity hermatic door 32, retaining plate 31 is provided with and the opening of process reaction chamber 11 valve hole 30 one to one, its number is identical with the number of process reaction chamber 11, is four.Cavity hermatic door 32 and valve hole 30 be corresponding matching one by one, is also four, and all is connected to valve power device 33.The opening of process reaction chamber 11 is bar shaped, and valve hole 30 also is bar shaped with cavity hermatic door 32.
Valve power device 33 comprises linkage unit 331 and valve driving part 332.Linkage unit 331 comprises driving lever 331a, follower lever 331b, the first web member 331c, the second web member 331d and stage clip 331e.The stacked arragement direction that axially all is parallel to process reaction chamber 11 of driving lever 331a and follower lever 331b, be vertically to.Driving lever 331a is connected to valve driving part 332, and under the driving of valve driving part 332 along self axial translation.For the stability of the translation that guarantees driving lever 331a, retaining plate 31 is provided with typing seat 311, and driving lever 331a is slidably connected to this typing 311.In the present embodiment, driving lever 331a is slidably connected to two typing seats 311 simultaneously, further to guarantee the stability of its translation.
The end of the first web member 331c is hinged to driving lever 331a, the other end is hinged to follower lever 331b, and the end of the second web member 331d is hinged to follower lever 331b, and the other end is hinged to retaining plate 31.The rotating shaft of the first web member 331c and second each pin joint of web member 331d is parallel to each other.For the stability that guarantees that follower lever 331b moves, the first web member 331c and the second web member 331d are two, are arranged at respectively the two ends of follower lever 331b.
Further, linkage unit 331 is two groups, is separately positioned on the two ends of cavity hermatic door 32.Rotate and be provided with universal driving shaft 34 on retaining plate 31, be connected to follower lever 331b one end, the end of the second web member 331d is fixed to universal driving shaft 34, and by this universal driving shaft 34, is hinged to retaining plate 31, be connected to the end of the second web member of the follower lever 331b the other end can be directly and retaining plate 31 hinged.The second web member 331d of two groups of linkage units 331 is connected to respectively the two ends of universal driving shaft 34, the interlock between two groups of linkage units 331 can be realized both by universal driving shaft 34.Two groups of linkage units 331 that utilization is separately positioned on cavity hermatic door 32 two ends can guarantee the stability of cavity hermatic door 32 switches, can avoid the impact on transmission manipulator 21 actions simultaneously.
Cavity hermatic door 32 is connected to follower lever 331b by stage clip 331e, utilizes stage clip 331e can guarantee the reliability of sealing between cavity hermatic door 32 and retaining plate 31.Under the drive of valve driving part 332 during translation, follower lever 331b drives cavity hermatic door 32 and moves, thereby realizes the switch of cavity hermatic door 32 as driving lever 331a.Similar to the functional effect of aforementioned linkage 14, linkage unit 331 can drive the movement of cavity hermatic door 32 on both direction, cavity hermatic door 32 can be moved to a side in valve hole 30 when cavity hermatic door 32 is opened, avoid its impact on transmission manipulator 21.
In the present embodiment, as shown in Figure 1, valve driving part 332 is straight line cylinder, to drive driving lever 331a translation.Certainly, in other embodiments, valve driving part 332 also can be servomotor, and by ball screw, is connected to driving lever 331a, drives driving lever 331a translation.
Utilize this valve power device 33 can control simultaneously the switch of a plurality of cavity hermatic doors 32, be convenient to control, and save space.Herein, as other embodiment, valve power device 33 also can adopt aforementioned linkage assembly 14 for controlling process reaction chamber 11 hermatic doors, and simultaneously, the linkage assembly 14 of controlling process reaction chamber 11 hermatic doors also can adopt this valve power device 33.
Herein, when the physical dimension of loading and unloading cavity 20 and process cavity 10 hour, loading and unloading cavity 20 can be selected standard valve mechanism comparatively ripe on market with the valve mechanism 3 between process cavity 10, its sealing property is better, the while also can be reduced the device fabrication cost.
Loading and unloading system 2 is mainly realized loading and unloading and the transfer function of substrate 100, loads and unloads simultaneously cavity 20 and also can be used for the pre-treatment of substrate 100, as carry out vacuum annealing, and is cooling etc.In technological reaction, loading and unloading cavity 20 can also be realized substrate 100 buffer memory effects, for example when carry out on substrate 100 multiple film layer technique while preparing substrate 100 can return to loading and unloading cavity 20 buffer memorys, utilize simultaneously the RPS cleaning system to clean the process reaction chamber 11 in process cavity 10.Substrate 100 is buffered in loading and unloading cavity 20, make substrate 100 when carrying out cleaning still be under vacuum environment, this avoided substrate 100 take out process cavity 10 be exposed to atmosphere in the time pollution that rete is caused, simultaneously because substrate 100 is to be under vacuum state, its temperature is scattered and disappeared and can be dropped to minimumly, reduces while doing down one technique again to work such as substrate 100 heat; This not only can guarantee the quality of plating film, also can save simultaneously whole processing procedure required time, enhances productivity greatly.
As shown in Figures 1 and 5, transmission manipulator 21 is slidably arranged between loading and unloading cavity 20 and process cavity 10, is used for loading and unloading and the transmission of substrate 100.Transmission manipulator 21 comprises carrying arm layer 211 and bracing frame 212.Carrying arm layer 211 is four groups, can realize simultaneously the transmission of four substrates 100, with four process reaction chambers 11 of corresponding matching.The number of carrying arm layer 211 can be determined as required, also can be individual layer, bilayer or other numbers.
Each carries arm layer 211 and comprises at least two carrying arm 211a.The number of carrying arm 211a can be determined according to the size of self structure intensity and substrate 100.In the present embodiment, carrying arm layer 211 comprises four carrying arm 211a.Carrying arm 211a is long strip shape, and along the opening direction setting of process reaction chamber 11, its end away from process cavity 10 is fixedly connected with bracing frame 212, can be convenient to carry arm 211a and pass in and out process reaction chamber 11 in bracing frame 212 moving process.A plurality of carrying arm 211a are along level to the setting of arranging.But the demand of the structure actual process of carrying arm 211a is determined to adjust, and is convenient, flexible, applied widely.
As shown in Figure 7, the upper surface of carrying arm 211a is provided with a plurality of salient point of carrying for supporting substrate 100 211b,, to reduce the contact area of substrate 100 and carrying arm 211a, avoid carrying the interference that arm 211a causes to the pollution of substrate 100 with because of thermal conduction.
As shown in Figures 1 and 5, bracing frame 212 slides and is arranged at loading and unloading cavity 20.Bracing frame 212 comprises back up pad 212a and the horizontally disposed slip blade 212b of vertical setting, and back up pad 212a is fixed in slip blade 212b.In the present embodiment, bracing frame 212 is connected to the bottom surface of loading and unloading cavity 20 by rail plate 213, to guarantee the stability of its slip.Particularly, rail plate 213 is arranged between the bottom surface of slip blade 212b and loading and unloading cavity 20.Preferably, rail plate 213 is two groups that are parallel to each other.Rail plate 213 is dustless guide rail, to avoid the pollution to substrate 100.
Each major parts of transmission manipulator 21 is aluminum alloy material as carrying arm 211a, bracing frame 212 etc., thereby makes whole transmission manipulator 21 overall weight lighter; Simultaneously can carry out the arc optimization design to the structure of carrying arm 211a, not only guarantee that it is lightweight but also met the requirement of its physical strength.
In conjunction with Fig. 1, Fig. 5, shown in Figure 6, loading and unloading cavity 20 also is provided with the transmission power set 22 that is connected to bracing frame 212, is used for driving transmission manipulator 21 straight reciprocating motions.In the present embodiment, transmission power set 22 comprises transmission direct-drive motor 221 and rotation is changed into straight-line pulley transmission mechanism 222.Direct driving motor 221 claims again DD(direct driver) motor, it is as the propulsion source of transmission manipulator 21, the belt of pulley transmission mechanism 222 is fixedly connected with slip blade 212b by bolt, thereby can change into traveling priority by the rotation that pulley transmission mechanism 222 will transmit drive-motor 221, make transmission manipulator 21 to move back and forth along rail plate 213 in cavity 20 in loading and unloading, thereby realize substrate 100 shift-in or straight reciprocating motion of shifting out between chamber.Belt in pulley transmission mechanism 222 can adopt Stainless Steel Band or the banded material of other alloy materials, can avoid the pollution to substrate 100.
Herein, as other embodiment, direct-drive motor 221 is also replaceable is other motors such as servomotor, stepper-motor, and pulley transmission mechanism 222 is also replaceable, and other can be converted into rotation the transmission rig of traveling priority for ball screw, crank block etc.; In addition, transmission power set 22 also can adopt straight line cylinder isoline drive unit, directly drives transmission manipulator 21 straight reciprocating motions.
As shown in Figure 6, Figure 7, be provided with substrate locating mechanism 23 on the side inner walls of loading and unloading cavity 20.Substrate locating mechanism 23 comprises support 231, reaches the Locating driver spare 232 that drives support 231 translations.The translation direction of support 231 be level to and perpendicular to the length direction of carrying arm 211a.In the present embodiment, Locating driver spare 232 is for driving cylinder, and as other embodiment, Locating driver spare 232 also can be motor, by ball screw, with support 231, is connected the translation that realizes support 231.In order to guarantee the stability of support 231 translations, be fixed with guidepost 24 on the side inner walls of loading and unloading cavity 20, support 231 is slidably connected to guidepost 24 by sliding surface bearing 241.In the present embodiment, guidepost 24 is four, is distributed in the surrounding of Locating driver spare 232, and the number of guidepost 24 is not limited to this certainly, can determine according to the structure size of support 231 the concrete number of guidepost 24.
Be provided with guide layer 233 on support 231, guide layer 233 is corresponding one by one with carrying arm layer 211, is also four layers.As shown in Figure 7, every layer of guide layer 233 comprises at least two the first locating dowel 233a, and in the present embodiment, every layer of guide layer 233 comprises three the first locating dowel 233a.The axially parallel of the first locating dowel 233a is in the translation direction of support 231, and the one end is fixed to support 231; The other end is provided with leading sheave 233b.The rotation axis of leading sheave 233b to for vertically to.Leading sheave 233b on each first locating dowel 233a is arranged on same straight line.
Carrying arm layer 211 is provided with at least two the second locating dowel 211c that arrange along same straight line, in the present embodiment, every layer of carrying arm layer 211 is provided with four the second locating dowel 211c, corresponding one by one with the carrying arm 211a of this layer, the straight line of arranging of the second locating dowel 211c is perpendicular to the length direction that carries arm 211a, and translation direction parallel and support 231.
The straight line of arranging of each leading sheave 233b is mutually vertical with the straight line of arranging of the second locating dowel 211c, article two, straight line forms a shaping positioning limit right-angle line that is used for substrate 100, guarantee substrate 100 held stationary in operational process, not there will be substrate 100 slips, stuck or collision phenomenon.The position fixing process of substrate 100 is as follows, substrate 100 is prevented after carrying on arm 211a, Locating driver spare 232 drives support 231 near carrying arm 211a direction, moving, leading sheave 233b is moved to predeterminated position, this moment, each layer leading sheave 233b and each layer locating dowel formed a spacing right-angle line, thereby realized the shaping location of substrate 100, after action is completed, support 231 returns to home position, avoids affecting substrate 100 positions in substrate 100 transmitting procedures.
As shown in Figure 8, also be provided with feeding gate 25 on loading and unloading cavity 20, feeding gate 25 is positioned at a side of transmission manipulator 21 slip directions.In the present embodiment, loading and unloading cavity 20 comprises top board 201 and 202, two the relative side plates 203 of base plate, 204 that are oppositely arranged, and backboard 205.Top board 201 is positioned at the top of transmission manipulator 21, and base plate 202 is positioned at the below of transmission manipulator 21, two relative side plates 203,204 both sides that lay respectively on transmission manipulator 21 slip directions.Backboard 205 is oppositely arranged with process cavity 10.Two side plates 203,204, top board 201 are connected with base plate and all in process cavity 10 is corresponding, are connected, and two side plates 203,204, top board 201, base plate 202 and backboard 205 connect and compose described loading and unloading cavity 20.Feeding gate 25 is arranged on one of them side plate 203,204, makes feeding gate 25 be positioned at a side of transmission manipulator 21 slip directions, in order to place substrate 100 on transmission manipulator 21.
Feeding gate 25 is oppositely arranged with substrate locating mechanism 23, is separately positioned on two side plates 203,204, makes feeding gate 25 be arranged on chamber wall relative with substrate locating mechanism 23 in loading and unloading cavity 20.Herein, when native system only had a process reaction chamber 11, transmission manipulator 21 only had one deck carrying arm layer 211, and feeding gate 25 can be arranged on the top of loading and unloading cavity 20, namely is arranged on top board 201.Feeding gate 25 is provided with viewing window 250, is used for observing substrate 100 and the operation conditions of transmission manipulator 21 in loading and unloading cavity 20.
As preferably, feeding gate 25 is connected with one and controls the charging power set of feeding gate 25 switches, thereby makes feeding gate 25 can realize auto-switch, and then improves the automatism of native system, also can increase the usefulness of producing line simultaneously, saves the production time.The charging power set can be rotary cylinder or electro-motor etc.
As shown in Figure 1, on loading and unloading cavity 20, the sidewall relative with process cavity 10 is provided with loading and unloading Access Door 26, namely loading and unloading Access Door 26 is arranged on backboard 205, when loading and unloading system 2 being carried out installation and debugging and safeguards, open loading and unloading Access Door 26, can utilize dolly that transmission manipulator 21 is pulled out cavity 20 from loading and unloading, namely convenient, laborsaving quick again, the maintenance time of economy system greatly.
In PECVD coating system of the present utility model, loading and unloading cavity 20 also is connected with independent vacuum system 4,, to carry out separately vacuum-treat, avoids the impact on processing chamber.
PECVD coating system provided by the utility model has the dual chamber structure: loading and unloading cavity 20 and process cavity 10, connect by valve mechanism 3 between loading and unloading cavity 20 and process cavity 10, existence due to valve mechanism 3, but make process cavity 10 mutually isolate or be communicated with the realization of loading and unloading cavity 20 light and flexible, thereby make the transmission manipulator 21 can to-and-fro movement between cavity; Guaranteed simultaneously interconnecting and vacuum environment separate between cavity; Loading and unloading cavity 20 possesses the function in load chamber and transfer transmission chamber, the function that can meet substrate 100 loading and unloading and mutually transmit between chamber simultaneously; System has possessed the function of multi-chamber cluster formula system, and simultaneously owing to only having two cavitys, structure is more simple, makes equipment cost low, and installation and maintenance are simple and convenient, and transmission structure is simply easy, to mechanical precision, requires low.The PECVD coating system that the utility model provides can be applicable to the technique preparation of the films such as TFT-LCD, solar film battery, semi-conductor chip, wafer and produces.
Above-described embodiment, do not form the restriction to this technical scheme protection domain.The modification of doing within any spirit at above-mentioned embodiment and principle, be equal to and replace and improvement etc., within all should being included in the protection domain of this technical scheme.
Claims (10)
1. a PECVD coating system, is characterized in that, comprises process system, loading and unloading system, reaches valve mechanism;
Described process system comprises process cavity and at least one process reaction chamber; Described process reaction chamber is arranged in process cavity, is used for substrate is carried out plated film; Described process reaction chamber has an opening towards described loading and unloading cavity, and the opening part of described process reaction chamber is equipped with hermatic door, is used for being communicated with or isolation of process reaction chamber and process cavity;
Described loading and unloading system comprises loading and unloading cavity and transmission manipulator; Transmission manipulator is slidably arranged between loading and unloading cavity and process cavity, is used for loading and unloading and the transmission of substrate;
Described valve mechanism is arranged between described process cavity and described loading and unloading cavity, is used for process cavity and loads and unloads being communicated with or isolation between cavity.
2. PECVD coating system according to claim 1, is characterized in that, described process reaction chamber, described process cavity and described loading and unloading cavity are connected with respectively independent vacuum system, carry out respectively vacuum-treat.
3. PECVD coating system according to claim 1, it is characterized in that, described process system also comprises the remote hydrogen plasma clean system of for the inwall to described process reaction chamber, cleaning, and described remote hydrogen plasma clean system is connected to described process reaction chamber.
4. PECVD coating system according to claim 1, is characterized in that, described process reaction chamber is two or more, separate and stacked setting between described process reaction chamber; Each described process reaction chamber is equipped with described hermatic door;
Described process system also comprises the linkage assembly of controlling described hermatic door switch, described linkage assembly comprises connecting rod and power set, described connecting rod is along the stacked arragement direction setting of described process reaction chamber, each described hermatic door all is connected to described connecting rod, described connecting rod is connected to described power set, and described power set is arranged in described process cavity and is used for driving described connecting rod and moves and make described hermatic door switch.
5. PECVD coating system according to claim 4, is characterized in that, described linkage assembly also comprises active rotating shaft and the driven spindle that is parallel to each other, and axially equal axial perpendicular to described connecting rod of described active rotating shaft and described driven spindle; The two ends of described connecting rod are hinged with respectively crank and rocking bar, described crank and rocking bar are fixedly attached to respectively described active rotating shaft and described driven spindle, described driven spindle is connected to described power set, rotate under the driving of described power set, and drive described connecting rod and move the switch of realizing described hermatic door.
6. PECVD coating system according to claim 1, is characterized in that, described process reaction chamber is two or more, the separate and stacked setting of arranging between described process reaction chamber; Described valve mechanism comprises retaining plate, cavity hermatic door, reaches the valve power device that is used for switch cavity hermatic door, described retaining plate is provided with and the opening of described process reaction chamber valve hole one to one, and described cavity hermatic door and described valve hole be corresponding matching and be connected to valve power device one by one;
Described valve power device comprises linkage unit and valve driving part; Described linkage unit comprises driving lever, follower lever, the first web member, the second web member and stage clip, the axial stacked arragement direction that all is parallel to described process reaction chamber of described driving lever and follower lever; Described driving lever is connected to described valve driving part, and under the driving of described valve driving part along self axial translation; One end of described the first web member is hinged to described driving lever, the other end is hinged to described follower lever, and an end of described the second web member is hinged to described follower lever, and the other end is hinged to described retaining plate; The rotating shaft of described the first web member and described second each pin joint of web member is parallel to each other; Described cavity hermatic door is connected to described follower lever by described stage clip.
7. PECVD coating system according to claim 1, it is characterized in that, described transmission manipulator comprise bracing frame and at least one deck be used for the carrying arm layer of carrying substrates, described carrying arm layer comprises at least two carrying arms, described carrying arm is long strip shape, and along the opening direction setting of described process reaction chamber, its end away from described process cavity is fixedly connected with support frame as described above; Support frame as described above slides and is arranged at described loading and unloading cavity; Be provided with the transmission power set that is connected to support frame as described above in described loading and unloading cavity, be used for driving described transmission manipulator straight reciprocating motion.
8. PECVD coating system according to claim 7, is characterized in that, is provided with on the side inner walls of described loading and unloading cavity for the substrate locating mechanism that substrate is positioned; Described substrate locating mechanism comprises support, reaches the actuator that drives the support translation;
The translation direction of described support be level to and perpendicular to the length direction of described carrying arm; Be provided with guide layer on described support, described guide layer is corresponding one by one with described carrying arm layer, and described guide layer comprises at least two the first locating dowels; The axially parallel of described the first locating dowel is in the translation direction of support, and the one end is fixed to support; The other end is provided with leading sheave; The rotation axis of described leading sheave to for vertically to; Leading sheave on each described first locating dowel is arranged on same straight line;
Described carrying arm layer is provided with at least two the second locating dowels of along straight line, arranging, and the straight line of arranging of each described leading sheave is mutually vertical with the straight line of arranging of described the second locating dowel, forms a shaping positioning limit right-angle line that is used for substrate.
9. PECVD coating system according to claim 7, it is characterized in that, described transmission power set comprises motor and for the rotation of described motor is converted to straight-line transmission rig, described motor is in transmission connection to described transmission manipulator by described transmission rig.
10. PECVD coating system according to claim 1, is characterized in that, also is provided with feeding gate on described loading and unloading cavity, and described feeding gate is positioned at a side of described transmission manipulator slip direction.
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| CN2013202374043U CN203284464U (en) | 2013-05-06 | 2013-05-06 | PECVD (plasma enhanced chemical vapor deposition) film coating system |
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| CN2013202374043U CN203284464U (en) | 2013-05-06 | 2013-05-06 | PECVD (plasma enhanced chemical vapor deposition) film coating system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103276369A (en) * | 2013-05-06 | 2013-09-04 | 南方科技大学 | PECVD (plasma enhanced chemical vapor deposition) film coating system |
| CN104752291A (en) * | 2013-12-31 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Transmitting device and plasma processing apparatus |
| CN104752304A (en) * | 2013-12-31 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and plasma processing device |
| EP3561343A1 (en) * | 2018-04-24 | 2019-10-30 | Beijing Juntailnnovation Technology Co., Ltd. | Isolation equipment for precipitation chamber |
| CN111763925A (en) * | 2020-07-04 | 2020-10-13 | 刘永 | Horizontal drive's substrate preprocessing device |
| CN116864423A (en) * | 2023-08-31 | 2023-10-10 | 苏州腾晖光伏技术有限公司 | Solar cell grading system and application method thereof |
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2013
- 2013-05-06 CN CN2013202374043U patent/CN203284464U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103276369A (en) * | 2013-05-06 | 2013-09-04 | 南方科技大学 | PECVD (plasma enhanced chemical vapor deposition) film coating system |
| CN103276369B (en) * | 2013-05-06 | 2016-02-17 | 南方科技大学 | PECVD (plasma enhanced chemical vapor deposition) film coating system |
| CN104752291A (en) * | 2013-12-31 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Transmitting device and plasma processing apparatus |
| CN104752304A (en) * | 2013-12-31 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and plasma processing device |
| CN104752291B (en) * | 2013-12-31 | 2018-05-08 | 北京北方华创微电子装备有限公司 | A kind of transmitting device and plasma processing device |
| CN104752304B (en) * | 2013-12-31 | 2018-08-24 | 北京北方华创微电子装备有限公司 | A kind of reaction chamber and plasma processing device |
| EP3561343A1 (en) * | 2018-04-24 | 2019-10-30 | Beijing Juntailnnovation Technology Co., Ltd. | Isolation equipment for precipitation chamber |
| CN111763925A (en) * | 2020-07-04 | 2020-10-13 | 刘永 | Horizontal drive's substrate preprocessing device |
| CN116864423A (en) * | 2023-08-31 | 2023-10-10 | 苏州腾晖光伏技术有限公司 | Solar cell grading system and application method thereof |
| CN116864423B (en) * | 2023-08-31 | 2023-12-01 | 苏州腾晖光伏技术有限公司 | Solar cell grading system and application method thereof |
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