CN107801291A - 静电放电保护装置及静电放电的保护方法 - Google Patents
静电放电保护装置及静电放电的保护方法 Download PDFInfo
- Publication number
- CN107801291A CN107801291A CN201710029582.XA CN201710029582A CN107801291A CN 107801291 A CN107801291 A CN 107801291A CN 201710029582 A CN201710029582 A CN 201710029582A CN 107801291 A CN107801291 A CN 107801291A
- Authority
- CN
- China
- Prior art keywords
- weld pad
- input
- illusory
- electrostatic discharge
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 230000003068 static effect Effects 0.000 claims description 55
- 230000001681 protective effect Effects 0.000 claims description 23
- 230000008878 coupling Effects 0.000 claims description 17
- 238000010168 coupling process Methods 0.000 claims description 17
- 238000005859 coupling reaction Methods 0.000 claims description 17
- 230000005611 electricity Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract 4
- 101100163833 Arabidopsis thaliana ARP6 gene Proteins 0.000 description 11
- 230000009471 action Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000010276 construction Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Elimination Of Static Electricity (AREA)
- Semiconductor Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105128741A TWI596992B (zh) | 2016-09-06 | 2016-09-06 | 靜電放電保護裝置及靜電放電的保護方法 |
TW105128741 | 2016-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107801291A true CN107801291A (zh) | 2018-03-13 |
CN107801291B CN107801291B (zh) | 2020-02-28 |
Family
ID=60189034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710029582.XA Active CN107801291B (zh) | 2016-09-06 | 2017-01-16 | 静电放电保护装置及静电放电的保护方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN107801291B (zh) |
TW (1) | TWI596992B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023142989A1 (zh) * | 2022-01-29 | 2023-08-03 | 京东方科技集团股份有限公司 | 柔性印刷电路板和显示触控装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175088B1 (en) * | 1998-10-05 | 2001-01-16 | Avaya Technology Corp. | Multi-layer printed-wiring boards with inner power and ground layers |
US20010013647A1 (en) * | 1999-12-07 | 2001-08-16 | Kao-Yu Hsu | Flexible substrate based ball grid array (BGA) package |
TW200843571A (en) * | 2007-04-19 | 2008-11-01 | Novatek Microelectronics Corp | Flexible circuit board considering ESD issues |
TW201019407A (en) * | 2008-11-04 | 2010-05-16 | Mediatek Inc | Semiconductor device and method for modifying integrated circuit |
CN204721706U (zh) * | 2015-04-30 | 2015-10-21 | 伯恩光学(惠州)有限公司 | 具有防静电功能的柔性电路板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200823516A (en) * | 2006-11-21 | 2008-06-01 | Wintek Corp | Liquid crystal panel with electrostatic discharge protection effect and manufacturing method thereof |
US20080266730A1 (en) * | 2007-04-25 | 2008-10-30 | Karsten Viborg | Spark Gaps for ESD Protection |
TWI508254B (zh) * | 2012-09-04 | 2015-11-11 | Realtek Semiconductor Corp | 積體電路 |
TWI504091B (zh) * | 2014-05-06 | 2015-10-11 | Macronix Int Co Ltd | 靜電放電保護裝置 |
-
2016
- 2016-09-06 TW TW105128741A patent/TWI596992B/zh active
-
2017
- 2017-01-16 CN CN201710029582.XA patent/CN107801291B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175088B1 (en) * | 1998-10-05 | 2001-01-16 | Avaya Technology Corp. | Multi-layer printed-wiring boards with inner power and ground layers |
US20010013647A1 (en) * | 1999-12-07 | 2001-08-16 | Kao-Yu Hsu | Flexible substrate based ball grid array (BGA) package |
TW200843571A (en) * | 2007-04-19 | 2008-11-01 | Novatek Microelectronics Corp | Flexible circuit board considering ESD issues |
TW201019407A (en) * | 2008-11-04 | 2010-05-16 | Mediatek Inc | Semiconductor device and method for modifying integrated circuit |
CN204721706U (zh) * | 2015-04-30 | 2015-10-21 | 伯恩光学(惠州)有限公司 | 具有防静电功能的柔性电路板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023142989A1 (zh) * | 2022-01-29 | 2023-08-03 | 京东方科技集团股份有限公司 | 柔性印刷电路板和显示触控装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI596992B (zh) | 2017-08-21 |
CN107801291B (zh) | 2020-02-28 |
TW201811121A (zh) | 2018-03-16 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210126 Address after: Grand Cayman Islands Patentee after: Yili Technology (Cayman) Co., Ltd Address before: No.1, 10th floor, No.1, Taiyuan Second Street, Zhubei City, Xinzhu County Patentee before: ILI TECHNOLOGY Corp. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220422 Address after: Hsinchu County, Taiwan, China Patentee after: ILI TECHNOLOGY Corp. Address before: Grand Cayman, Cayman Islands Patentee before: Yili Technology (Cayman) Co.,Ltd. |