CN107709021B - 配线基板和热敏头 - Google Patents
配线基板和热敏头 Download PDFInfo
- Publication number
- CN107709021B CN107709021B CN201680038164.0A CN201680038164A CN107709021B CN 107709021 B CN107709021 B CN 107709021B CN 201680038164 A CN201680038164 A CN 201680038164A CN 107709021 B CN107709021 B CN 107709021B
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive layer
- wiring substrate
- glassy layer
- glassy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 91
- 238000010304 firing Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 34
- 239000011521 glass Substances 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000001259 photo etching Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 3
- 238000013508 migration Methods 0.000 description 16
- 230000005012 migration Effects 0.000 description 16
- 238000005530 etching Methods 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 239000000203 mixture Substances 0.000 description 10
- 238000007639 printing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 206010027476 Metastases Diseases 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000009401 metastasis Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electronic Switches (AREA)
- Wire Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015131533A JP6364383B2 (ja) | 2015-06-30 | 2015-06-30 | 配線基板、およびサーマルヘッド |
| JP2015-131533 | 2015-06-30 | ||
| PCT/JP2016/067117 WO2017002566A1 (ja) | 2015-06-30 | 2016-06-08 | 配線基板およびサーマルヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107709021A CN107709021A (zh) | 2018-02-16 |
| CN107709021B true CN107709021B (zh) | 2019-09-13 |
Family
ID=57608110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680038164.0A Active CN107709021B (zh) | 2015-06-30 | 2016-06-08 | 配线基板和热敏头 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6364383B2 (ja) |
| CN (1) | CN107709021B (ja) |
| WO (1) | WO2017002566A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107160862B (zh) * | 2017-06-20 | 2018-10-19 | 山东华菱电子股份有限公司 | 热敏打印头用发热基板及其制造方法 |
| JP6754335B2 (ja) * | 2017-08-08 | 2020-09-09 | アオイ電子株式会社 | サーマルヘッド |
| US20210331488A1 (en) * | 2018-07-11 | 2021-10-28 | Hewlett-Packard Development Company, L.P. | Gaps in resistors for thermal imaging |
| JP7438714B2 (ja) | 2019-10-30 | 2024-02-27 | 旭化成株式会社 | 染色斑が目立ち難く、しっとり感と緻密感を有する人工皮革及びその製法 |
| WO2023210426A1 (ja) * | 2022-04-28 | 2023-11-02 | ローム株式会社 | サーマルプリントヘッドおよびサーマルプリンタ |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0768817A (ja) * | 1993-06-22 | 1995-03-14 | Mitsubishi Materials Corp | グレーズドＡｌＮ基板およびその製造方法 |
| JPH07201384A (ja) * | 1993-12-28 | 1995-08-04 | Rohm Co Ltd | コネクタピンと基板との接続構造 |
| CN1746034A (zh) * | 2004-09-08 | 2006-03-15 | 阿尔卑斯电气株式会社 | 热敏头及其制造方法 |
| CN102555516A (zh) * | 2010-12-10 | 2012-07-11 | 罗姆股份有限公司 | 热敏打印头 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4540193B2 (ja) * | 2000-07-31 | 2010-09-08 | 京セラ株式会社 | 配線基板の製造方法 |
| JP4480283B2 (ja) * | 2001-01-30 | 2010-06-16 | 京セラ株式会社 | 配線基板 |
| JP2008030992A (ja) * | 2006-07-28 | 2008-02-14 | Canon Inc | 基板の製造方法、配線基板の製造方法、配線基板、電子デバイス、電子源および画像表示装置 |
-
2015
- 2015-06-30 JP JP2015131533A patent/JP6364383B2/ja active Active
-
2016
- 2016-06-08 CN CN201680038164.0A patent/CN107709021B/zh active Active
- 2016-06-08 WO PCT/JP2016/067117 patent/WO2017002566A1/ja active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0768817A (ja) * | 1993-06-22 | 1995-03-14 | Mitsubishi Materials Corp | グレーズドＡｌＮ基板およびその製造方法 |
| JPH07201384A (ja) * | 1993-12-28 | 1995-08-04 | Rohm Co Ltd | コネクタピンと基板との接続構造 |
| CN1746034A (zh) * | 2004-09-08 | 2006-03-15 | 阿尔卑斯电气株式会社 | 热敏头及其制造方法 |
| CN102555516A (zh) * | 2010-12-10 | 2012-07-11 | 罗姆股份有限公司 | 热敏打印头 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6364383B2 (ja) | 2018-07-25 |
| JP2017013334A (ja) | 2017-01-19 |
| CN107709021A (zh) | 2018-02-16 |
| WO2017002566A1 (ja) | 2017-01-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |