JP5377478B2 - 半導体素子のためのコンタクト構造 - Google Patents
半導体素子のためのコンタクト構造 Download PDFInfo
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- JP5377478B2 JP5377478B2 JP2010515368A JP2010515368A JP5377478B2 JP 5377478 B2 JP5377478 B2 JP 5377478B2 JP 2010515368 A JP2010515368 A JP 2010515368A JP 2010515368 A JP2010515368 A JP 2010515368A JP 5377478 B2 JP5377478 B2 JP 5377478B2
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- layer
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- substrate
- contact structure
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- 239000004065 semiconductor Substances 0.000 title claims description 29
- 239000004020 conductor Substances 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 41
- 230000004888 barrier function Effects 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 74
- 238000000034 method Methods 0.000 description 33
- 238000000151 deposition Methods 0.000 description 14
- 230000008021 deposition Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000011253 protective coating Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007585 pull-off test Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000898 sterling silver Inorganic materials 0.000 description 1
- 239000010934 sterling silver Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
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Description
2 基板
3 前面
4 背面
5 導体パス
6 バリア層
7 導体層
8 保護層
9 多層コンタクト構造
10 第1方法ステップ
11 次の方法ステップ(第1電解析出)
12 更なる方法ステップ(第2電解析出)
13 更なる方法ステップ(保護コーティング)
14 絶縁層
15 コンタクト開口部
B 幅
H 高さ
Claims (7)
- 第1面(3)と第2面(4)とを有している基板(2)と、
基板(2)の少なくとも1つの面(3、4)に配されている多層コンタクト構造(9)と
を備えている半導体素子(1)であって、
コンタクト構造(9)が、基板(2)の第1面(3)から高さH分突出している複数の導体パス(5)と、導体層(7)から基板(2)へのイオン拡散防止のために導体パス(5)の上面及び両側面を取り囲んでいるバリア層(6)と、バリア層(6)の上面に配されている導体層(7)とを有しており、
導体パス(5)の高さHが、1μm〜50μmの範囲にあり、
バリア層(6)が、少なくとも部分的に電解被覆されるコバルト及び/又はニッケルから形成され、0.1μm〜5μmの厚さを有しており、
導体層(7)が、少なくとも部分的に銅から形成されており、
導体パス(5)がアスペクト比AVLbを有し、コンタクト構造(9)がアスペクト比AVKSを有し、その数値がAVKS/AVLb≧1.5であり、
コンタクト構造(9)が、少なくとも0.1のアスペクト比AVKSを有している半導体素子(1)。 - 導体パス(5)の高さHが、5μm〜15μmの範囲にあることを特徴とする、請求項1に記載の半導体素子(1)。
- バリア層(6)が、0.2μm〜1μmの厚さを有していることを特徴とする、請求項1又は2に記載の半導体素子(1)。
- コンタクト構造(9)が、少なくとも0.2のアスペクト比AV KS を有していることを特徴とする、請求項1〜3のうちのいずれか1項に記載の半導体素子(1)。
- コンタクト構造(9)が、少なくとも0.4のアスペクト比AV KS を有していることを特徴とする、請求項1〜4のうちのいずれか1項に記載の半導体素子(1)。
- AV KS /AV Lb ≧2であることを特徴とする、請求項1〜5のうちのいずれか1項に記載の半導体素子(1)。
- AV KS /AV Lb ≧4であることを特徴とする、請求項1〜6のうちのいずれか1項に記載の半導体素子(1)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102007031958.6 | 2007-07-10 | ||
DE102007031958A DE102007031958A1 (de) | 2007-07-10 | 2007-07-10 | Kontakt-Struktur für ein Halbleiter-Bauelement sowie Verfahren zur Herstellung desselben |
PCT/EP2008/004960 WO2009006988A1 (de) | 2007-07-10 | 2008-06-19 | Kontakt-struktur für euin halbleiter-bauelement sowie verfahren zur herstellung desselben |
Publications (3)
Publication Number | Publication Date |
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JP2010532927A JP2010532927A (ja) | 2010-10-14 |
JP5377478B2 true JP5377478B2 (ja) | 2013-12-25 |
JP5377478B6 JP5377478B6 (ja) | 2014-06-11 |
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JP2010532927A (ja) | 2010-10-14 |
US20100181670A1 (en) | 2010-07-22 |
CN101743639B (zh) | 2011-11-30 |
EP2162922A1 (de) | 2010-03-17 |
CN101743639A (zh) | 2010-06-16 |
WO2009006988A1 (de) | 2009-01-15 |
DE102007031958A1 (de) | 2009-01-15 |
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