CN107680997A - Lateral double diffusion metal oxide semiconductor FET with adjustable type field plate - Google Patents

Lateral double diffusion metal oxide semiconductor FET with adjustable type field plate Download PDF

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Publication number
CN107680997A
CN107680997A CN201711032851.4A CN201711032851A CN107680997A CN 107680997 A CN107680997 A CN 107680997A CN 201711032851 A CN201711032851 A CN 201711032851A CN 107680997 A CN107680997 A CN 107680997A
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adjustable type
field plate
type field
electric capacity
oxide semiconductor
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CN201711032851.4A
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CN107680997B (en
Inventor
张春伟
岳文静
李阳
付小倩
李志明
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University of Jinan
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University of Jinan
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Priority to CN201711032851.4A priority Critical patent/CN107680997B/en
Publication of CN107680997A publication Critical patent/CN107680997A/en
Priority to PCT/CN2018/112150 priority patent/WO2019085835A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816Lateral DMOS transistors, i.e. LDMOS transistors
    • H01L29/7824Lateral DMOS transistors, i.e. LDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-LDMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402Field plates
    • H01L29/404Multiple field plate structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816Lateral DMOS transistors, i.e. LDMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42364Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
    • H01L29/42368Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

The present invention proposes a kind of lateral double diffusion metal oxide semiconductor FET with adjustable type field plate, including:Field oxide and the drift region below field oxide, some adjustable type field plates are set on the surface of the field oxide, setpoint distance is spaced between two neighboring adjustable type field plate;Each adjustable type field plate is all connected with adjusting electric capacity;By the size for the positive and negative electrode for adjusting adjustable type field plate and regulation electric capacity, charge inducing amount and the induced potential on adjustable type field plate can be adjusted so that uniform surface transverse electric field distribution is obtained in drift region.The structure devices can improve device drift region surface transverse electric field distribution, have the conducting resistance of very high horizontal voltage endurance capability and very little.

Description

Lateral double diffusion metal oxide semiconductor FET with adjustable type field plate
Technical field
The present invention relates to power semiconductor field, is to be related to a kind of band suitable for high-voltage applications in particular There is the lateral double diffusion metal oxide semiconductor FET (LDMOS) of adjustable type field plate.
Background technology
Lateral double diffusion metal oxide semiconductor FET (LDMOS) is double-diffused metal oxide semiconductor field effect Answer a kind of transversary of tube device (DMOS).Have the advantages that high pressure, gain are big, easily drive, and be more easy to and CMOS works Skill is compatible, therefore is widely used in smart-power IC.Lateral double diffusion metal oxide semiconductor at present The emphasis of FET (LDMOS) design is how rationally to relax the contradiction between breakdown voltage and conducting resistance, and is ensured It has higher stability.Jiao that current people are studied lateral double diffusion metal oxide semiconductor FET (LDMOS) Point is concentrated mainly on the design of its drift region concentration, reduces device surface electric-field intensity (Reducd by buried regions technology Sfurace Field, abbreviation RESURF), and the technology such as resistance field plate, Super Junction, drift region gradient doping To realize the compromise of breakdown voltage and conducting resistance.
Traditional lateral double diffusion metal oxide semiconductor field-effect tube structure is as shown in figure 1, to make LDMOS device exist Preferably effect is played in chip, improve the breakdown voltage of device and conducting resistance tradeoff be LDMOS designs a weight Want research topic.Field plate techniques can improve the breakdown voltage and conducting resistance tradeoff of LDMOS device, however, traditional field Plate is connected with the source electrode of device, has a fixed current potential, and device current potential on drift region surface under resistance to pressure condition be along Device length direction change, therefore, charge inducing of traditional field plate under the resistance to pressure condition of device divides on device length direction Cloth is uneven so that influenceed at the diverse location of device drift region by field plate it is of different sizes, so traditional field plate can not make device Part drift region obtains uniform transverse electric field (i.e. length direction electric field) distribution.
The content of the invention
The purpose of the present invention is exactly to solve the above problems, it is proposed that the lateral double diffused metal with adjustable type field plate Oxide semiconductor field effect pipe, the big I of effect of each field plate is adjusted by device architecture parameter designing in the device, The problem of drift region transverse electric field distribution is uneven is improved, device has higher horizontal voltage endurance capability and smaller electric conduction Resistance.
To achieve these goals, the present invention adopts the following technical scheme that:
The invention discloses a kind of lateral double diffusion metal oxide semiconductor FET with adjustable type field plate, bag Include:Source metal, field oxide and the drift region below field oxide, on the surface of the field oxide, setting is some can Tune type field plate, setpoint distance is spaced between two neighboring adjustable type field plate;
Each adjustable type field plate is all connected with adjusting electric capacity;The adjustable type field plate is connected with adjusting the positive electrode of electric capacity Connect, regulation electric capacity negative electrode is set above the regulation electric capacity positive electrode;The negative electrode of all regulation electric capacity is mutual by metal Line is connected with source metal;
By setting the size of the positive and negative electrode of adjustable type field plate and regulation electric capacity, the sense on adjustable type field plate can be adjusted Answer the quantity of electric charge so that uniform surface transverse electric field distribution is obtained in drift region.
Further, the positive and negative electrode of the regulation electric capacity is equal in magnitude, perfectly aligned.
Further, on the direction of source metal to drain metal, between the positive and negative electrode of the regulation electric capacity mutually The area of covering successively decreases successively.
Further, the space between the source metal and drain metal is filled using insulating medium layer.
Further, the length and/or width of the adjustable type field plate and regulation electric capacity are designed according to being actually needed.
Further, the adjustable type field plate is discontinuously set in the width direction, by the adjustable type field plate point on width Into several adjustable type field plate units, each adjustable type field plate unit is all connected with adjusting capacitor cell accordingly.
The present invention further discloses a kind of driving chip applied on printer, motor or flat-panel monitor, Using the above-mentioned lateral double diffusion metal oxide semiconductor FET with adjustable type field plate.
The present invention further discloses a kind of printer, using above-mentioned driving chip.
The present invention further discloses a kind of motor, using above-mentioned driving chip.
The present invention further discloses a kind of flat-panel monitor, using above-mentioned driving chip.
Beneficial effect of the present invention:
(1) traditional structure device each field plate in the case where turning off resistance to pressure condition have with source electrode identical current potential, and device floats The current potential for moving area surface is alongst constantly changing, therefore field plate is to the influence size at the diverse location of device drift region Difference, cause device drift region inner surface transverse electric field distribution uneven.And in structure of the present invention, by adjusting adjustable type field plate The size of parasitic capacitance and tunable capacitor between drift region, the field plate of different lateral positions can be made to be turned off in device There is different current potentials under resistance to pressure condition, so that device obtains uniform surface transverse electric field distribution in whole drift region, And then cause structure devices of the present invention that there is higher horizontal voltage endurance capability.
(2) breakdown voltage of traditional structure device increases and reduced with the concentration of drift region.In structure devices of the present invention Field plate effect size is adjustable, therefore,, can be with by the current potential of adjusting means adjustable type field plate after the concentration increase of drift region Change the effect size of field plate, device can be made to continue to keep uniform surface transverse electric field distribution in drift region, so that device The breakdown voltage of part will not reduce.So structure devices of the present invention can increase the concentration of drift region and retainer member breakdown potential Press constant so that device has smaller conducting resistance.
(3) structure of the present invention and traditional handicraft are completely compatible, it is only necessary on conventional preparation techniques carry out domain change be It can be achieved, it is not necessary to increase extra processing step, the increase of process costs will not be brought.
Figure of description
Fig. 1 is the schematic three dimensional views of traditional lateral double diffusion metal oxide semiconductor field-effect tube structure;
Fig. 2 is the lateral double diffusion metal oxide semiconductor FET knot provided by the invention with adjustable type field plate The schematic three dimensional views of structure;
Fig. 3 is schematic cross-section of the structure devices of the present invention along its length with thickness direction;
Fig. 4 is schematic cross-section of the structure devices of the present invention in the width direction with length direction;
Wherein, 1.P types Semiconductor substrate, 2. buries oxide layers, 3.N types drift region, 4.P type traps, 5.P types contact zone, 6.N types Source region, 7. source metals, 8. field oxides, 9.N types drain region, 10. drain metals, 11. gate oxides, 12. polysilicon gates, 131. First adjustable type field plate, 132. second adjustable type field plates, 133. the 3rd adjustable type field plates, 141. first regulation electric capacity positive electrodes, 142. second regulation electric capacity positive electrodes, 143. the 3rd regulation electric capacity positive electrodes, 151. first regulation electric capacity negative electrodes, 152. second Adjust electric capacity negative electrode, 153. the 3rd regulation electric capacity negative electrodes, 16. metal interconnecting wires.
Embodiment
The invention will be described further with specific embodiment below in conjunction with the accompanying drawings.
The invention discloses a kind of lateral double diffusion metal oxide semiconductor FET with adjustable type field plate, bag Include:P-type semiconductor substrate 1, buries oxide layer 2 is provided with P-type semiconductor substrate 1, N-type drift region 3 is provided with buries oxide layer 2 With p-type trap 4, p-type contact zone 5 and N-type source region 6 are provided with p-type trap 4, is connected on p-type contact zone 5 and N-type source region 6 active Pole metal 7, field oxide 8 and N-type drain region 9 are provided with N-type drift region 3, drain metal 10 is connected with N-type drain region 9, Part N-type drift region 3 and the top of part p-type trap 4 are provided with gate oxide 11, and one end of gate oxide 11 and the side of N-type source region 6 Boundary is offseted, and the border of the other end and field oxide 8 of gate oxide 11 offsets, and polysilicon gate is provided with above gate oxide 11 12, and polysilicon gate 12 extends to the top of field oxide 8, and some adjustable type field plates are set on the surface of field oxide 8, it is adjacent Setpoint distance is spaced between two adjustable type field plates.
Adjustable type field plate is be arranged in parallel with source metal 7 in the direction of the width, and adjustable type field plate is spaced in the longitudinal direction Setpoint distance.
It should be noted that the quantity of adjustable type field plate is configured according to being actually needed in the present invention.
In the present embodiment, the quantity of adjustable type field plate is three, as shown in Figures 2 and 3, is respectively:First adjustable type field Plate 131, the second adjustable type field plate 132 and the 3rd adjustable type field plate 133;
The first regulation electric capacity positive electrode 141 is connected with first adjustable type field plate 131, is connected on the second adjustable type field plate 132 The second regulation electric capacity positive electrode 142 is connected to, the 3rd regulation electric capacity positive electrode 143 is connected with the 3rd adjustable type field plate 133;
The top of first regulation electric capacity positive electrode 141 is provided with the first regulation electric capacity negative electrode 151, the second regulation electric capacity positive electrode 142 tops are provided with the second regulation electric capacity negative electrode 152, and the top of the 3rd regulation electric capacity positive electrode 143 is provided with the 3rd regulation electric capacity and born Electrode 153, it is logical that the first regulation electric capacity negative electrode 151, second adjusts the regulation electric capacity negative electrode 153 of electric capacity negative electrode 152 and the 3rd Metal interconnecting wires 16 are crossed with source metal 7 to be connected.
As preferable scheme, the first regulation electric capacity positive electrode 141 is arranged above the first tune in the embodiment of the present invention Negative electrode 151 is held in economize on electricity, and the first regulation electric capacity positive electrode 141 and first adjusts the equal in magnitude of electric capacity negative electrode 151, completely right Together.
As shown in figure 4, the area that the 3rd regulation electric capacity negative electrode 153 and the 3rd regulation electric capacity positive electrode 143 mutually cover The area mutually covered less than the second regulation electric capacity negative electrode 152 and the second regulation electric capacity positive electrode 142;Second regulation electric capacity is born Electrode 152 and second adjusts the area that electric capacity positive electrode 142 mutually covers and is less than the first regulation electric capacity negative electrode 151 and the first tune The area that positive electrode 141 mutually covers is held in economize on electricity.
As a kind of embodiment, the present invention is imitated the lateral double diffusion metal oxide semiconductor field with adjustable type field plate Insulating medium layer can be filled by answering in the space on tube device surface.
It should be noted that in the present invention, the first regulation electric capacity positive electrode 141, second adjusts electric capacity positive electrode 142, the Three regulation electric capacity positive electrodes 143, first adjust electric capacity negative electrode 151, second and adjust the regulation electric capacity of electric capacity negative electrode 152 and the 3rd The length and width of negative electrode 153 can need to be designed according to device.
As a kind of embodiment, by the upper discontinuously setting in the width direction of adjustable type field plate, the adjustable type of each segmentation Field plate unit is all connected with adjusting the positive plate of electric capacity, and the positive plate of the adjacent two regulation electric capacity being segmented is also to disconnect accordingly , adjusting the negative plate of electric capacity can disconnect and can also not turn off.Adjustable type field plate and drift can be adjusted through the above way The size of parasitic capacitance between the size of parasitic capacitance between area and the positive/negative plate of regulation electric capacity.Structure of the present invention In, there is parasitic capacitance between the first adjustable type field plate 131 and N-type drift region 3, be named as C131, the first regulation electric capacity positive electricity Pole 141 and first has parasitic capacitance between adjusting electric capacity negative electrode 151, C141 is named as, due to the first adjustable type field plate 131 Be connected with the first regulation electric capacity positive electrode 141, parasitic capacitance C131 and C141 formation series relationship, when device be off it is pressure-resistant During state, the first regulation electric capacity negative electrode 151 is in low potential, and N-type drift region 3 is in high potential, according to series capacitance Partial pressure relationship can show that the current potential of the first adjustable type field plate 131 is between the current potential of N-type drift region 3 and the first regulation electric capacity negative electricity Between the current potential of pole 151, and the current potential of the first adjustable type field plate 131 is influenceed by parasitic capacitance C131 and C141 size.
Therefore, born by designing the first adjustable type field plate 131, first regulation electric capacity positive electrode 141 and the first regulation electric capacity The length and width of electrode 151, parasitic capacitance C131 and C141 size can be adjusted, and then adjust the first adjustable type field plate 131 current potential, the current potential by adjusting the first adjustable type field plate 131 can adjust the induced electricity on the first adjustable type field plate 131 Lotus amount, and then adjust the effect size of the first adjustable type field plate 131 so that the N-type drift region of the lower section of the first adjustable type field plate 131 3 obtain uniform surface laterally (i.e. length direction) Electric Field Distribution.
Similarly, the regulation electrode negative electrode of electric capacity positive electrode 142 and second is adjusted by the second adjustable type field plate 132, second 152 length and width design, the current potential of the second adjustable type field plate 132 can be adjusted, so that the second adjustable type field plate 132 The N-type drift region 33 of lower section obtains uniform surface transverse electric field distribution, and electricity is adjusted by the 3rd adjustable type field plate the 133, the 3rd Hold length and width design that positive electrode 143 and the 3rd adjusts electrode negative electrode 153, the 3rd adjustable type field plate can be adjusted 133 current potential, so that the N-type drift region 3 of the lower section of the 3rd adjustable type field plate 133 obtains uniform surface transverse electric field distribution.
So the field plate of the different lateral positions in structure devices of the present invention has not in the case where device turns off resistance to pressure condition Same current potential, device can obtain uniform surface transverse electric field distribution in whole drift region so that structure devices of the present invention With higher horizontal voltage endurance capability.
It is it should be noted that above-mentioned for the lateral double diffusion metal oxide semiconductor field-effect with adjustable type field plate The description of pipe is that the structure for being directed to N-type device is carried out, equally can be using the adjustable of the present invention for the structure of P-type device Type field plate structure, embodiment are same as above, and will not be repeated here.
The present invention further discloses a kind of driving chip applied on printer, motor or flat-panel monitor, The lateral double diffusion metal oxide semiconductor FET with adjustable type field plate of the present invention is employed in the chip.
The present invention further discloses a kind of printer, motor or flat-panel monitor, said apparatus, which uses, to be included The driving chip of lateral double diffusion metal oxide semiconductor FET disclosed by the invention with adjustable type field plate.
Although above-mentioned the embodiment of the present invention is described with reference to accompanying drawing, model not is protected to the present invention The limitation enclosed, one of ordinary skill in the art should be understood that on the basis of technical scheme those skilled in the art are not Need to pay various modifications or deformation that creative work can make still within protection scope of the present invention.

Claims (10)

1. the lateral double diffusion metal oxide semiconductor FET with adjustable type field plate, including:Source metal, field oxidation Layer and the drift region below field oxide, it is characterised in that on the surface of the field oxide, some adjustable type fields are set Plate, setpoint distance is spaced between two neighboring adjustable type field plate;
Each adjustable type field plate is all connected with adjusting electric capacity;The adjustable type field plate is connected with adjusting the positive electrode of electric capacity, Regulation electric capacity negative electrode is set above the regulation electric capacity positive electrode;It is all regulation electric capacity negative electrodes by metal interconnecting wires with Source metal connects;
By setting the size of the positive and negative electrode of adjustable type field plate and regulation electric capacity, the induced electricity on adjustable type field plate can be adjusted Lotus amount and induced potential so that uniform surface transverse electric field distribution is obtained in drift region.
2. the lateral double diffusion metal oxide semiconductor FET of adjustable type field plate is carried as claimed in claim 1, its It is characterised by, the positive and negative electrode of the regulation electric capacity is equal in magnitude, perfectly aligned.
3. the lateral double diffusion metal oxide semiconductor FET of adjustable type field plate is carried as claimed in claim 1, its It is characterised by, on the direction of source metal to drain metal, the face that mutually covers between the positive and negative electrode of the regulation electric capacity Product is successively decreased successively.
4. the lateral double diffusion metal oxide semiconductor FET of adjustable type field plate is carried as claimed in claim 1, its It is characterised by, the space between the source metal and drain metal is filled using insulating medium layer.
5. the lateral double diffusion metal oxide semiconductor FET of adjustable type field plate is carried as claimed in claim 1, its It is characterised by, the length and/or width of the positive and negative electrode of the adjustable type field plate and regulation electric capacity are set according to being actually needed Meter.
6. the lateral double diffusion metal oxide semiconductor FET of adjustable type field plate is carried as claimed in claim 1, its It is characterised by, the adjustable type field plate is discontinuously set in the width direction, and the adjustable type field plate on width is divided into several Adjustable type field plate unit, each adjustable type field plate unit are all connected with adjusting capacitor cell accordingly.
7. a kind of driving chip applied on printer, motor or flat-panel monitor, it is characterised in that will using right Seek any lateral double diffusion metal oxide semiconductor FET with adjustable type field plate described in 1-6.
8. a kind of printer, it is characterised in that using the driving chip described in claim 7.
9. a kind of motor, it is characterised in that using the driving chip described in claim 7.
10. a kind of flat-panel monitor, it is characterised in that using the driving chip described in claim 7.
CN201711032851.4A 2017-10-30 2017-10-30 Lateral double-diffusion metal oxide semiconductor field effect transistor with adjustable field plate Active CN107680997B (en)

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CN201711032851.4A CN107680997B (en) 2017-10-30 2017-10-30 Lateral double-diffusion metal oxide semiconductor field effect transistor with adjustable field plate
PCT/CN2018/112150 WO2019085835A1 (en) 2017-10-30 2018-10-26 Super field plate structure adapted for power semiconductor device, and application thereof

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108365009A (en) * 2018-02-13 2018-08-03 扬州江新电子有限公司 The LDMOS device of ring structure is shielded with array multilayer faraday
CN109411540A (en) * 2018-10-31 2019-03-01 电子科技大学 With the low lateral high-voltage device than conducting resistance
WO2019085835A1 (en) * 2017-10-30 2019-05-09 济南大学 Super field plate structure adapted for power semiconductor device, and application thereof
CN110416301A (en) * 2018-04-28 2019-11-05 中芯国际集成电路制造(上海)有限公司 Lateral double-diffused transistor and forming method thereof
CN110718585A (en) * 2018-09-05 2020-01-21 成都芯源系统有限公司 LDMOS device and manufacturing method thereof
CN111063732A (en) * 2018-11-07 2020-04-24 成都芯源系统有限公司 LDMOS device and manufacturing method thereof

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CN1649168A (en) * 2004-01-26 2005-08-03 三菱电机株式会社 Semiconductor device
US20090039424A1 (en) * 2007-08-10 2009-02-12 Chao-Yuan Su High-voltage mos transistor device
CN103515438A (en) * 2012-06-20 2014-01-15 株式会社东芝 Semiconductor device
CN106653830A (en) * 2015-10-28 2017-05-10 无锡华润上华半导体有限公司 Semiconductor device voltage-withstanding structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1487594A (en) * 2002-09-30 2004-04-07 东南大学 High-voltage P-type metal oxide semiconductor transistor
CN1649168A (en) * 2004-01-26 2005-08-03 三菱电机株式会社 Semiconductor device
US20090039424A1 (en) * 2007-08-10 2009-02-12 Chao-Yuan Su High-voltage mos transistor device
CN103515438A (en) * 2012-06-20 2014-01-15 株式会社东芝 Semiconductor device
CN106653830A (en) * 2015-10-28 2017-05-10 无锡华润上华半导体有限公司 Semiconductor device voltage-withstanding structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019085835A1 (en) * 2017-10-30 2019-05-09 济南大学 Super field plate structure adapted for power semiconductor device, and application thereof
CN108365009A (en) * 2018-02-13 2018-08-03 扬州江新电子有限公司 The LDMOS device of ring structure is shielded with array multilayer faraday
CN108365009B (en) * 2018-02-13 2020-10-30 扬州江新电子有限公司 LDMOS device with array type multilayer Faraday shielding ring structure
CN110416301A (en) * 2018-04-28 2019-11-05 中芯国际集成电路制造(上海)有限公司 Lateral double-diffused transistor and forming method thereof
CN110718585A (en) * 2018-09-05 2020-01-21 成都芯源系统有限公司 LDMOS device and manufacturing method thereof
CN109411540A (en) * 2018-10-31 2019-03-01 电子科技大学 With the low lateral high-voltage device than conducting resistance
CN111063732A (en) * 2018-11-07 2020-04-24 成都芯源系统有限公司 LDMOS device and manufacturing method thereof

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