CN107577120A - 抗蚀剂剥离液组合物、显示器基板及其制造方法 - Google Patents
抗蚀剂剥离液组合物、显示器基板及其制造方法 Download PDFInfo
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- CN107577120A CN107577120A CN201710385868.1A CN201710385868A CN107577120A CN 107577120 A CN107577120 A CN 107577120A CN 201710385868 A CN201710385868 A CN 201710385868A CN 107577120 A CN107577120 A CN 107577120A
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- Prior art keywords
- acid
- methyl
- stripping liquid
- liquid controlling
- controlling composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 40
- 239000007788 liquid Substances 0.000 title claims abstract description 30
- 239000000654 additive Substances 0.000 title claims abstract description 29
- 230000000996 additive effect Effects 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 13
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 12
- 239000000908 ammonium hydroxide Substances 0.000 claims abstract description 11
- 239000003495 polar organic solvent Substances 0.000 claims abstract description 11
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 9
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 8
- 125000001453 quaternary ammonium group Chemical group 0.000 claims abstract description 7
- 125000001118 alkylidene group Chemical group 0.000 claims abstract description 3
- -1 1- amino -2- propyl Chemical group 0.000 claims description 48
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 27
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 17
- 150000002148 esters Chemical class 0.000 claims description 14
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 13
- 229940049706 benzodiazepine Drugs 0.000 claims description 11
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 10
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 9
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N perisophthalic acid Natural products OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 8
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 7
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 6
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N n-propyl alcohol Natural products CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
- 239000002798 polar solvent Substances 0.000 claims description 6
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 4
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical class CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 claims description 4
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 4
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 claims description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 4
- 229940043237 diethanolamine Drugs 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000174 gluconic acid Substances 0.000 claims description 4
- 235000012208 gluconic acid Nutrition 0.000 claims description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000001630 malic acid Substances 0.000 claims description 4
- 235000011090 malic acid Nutrition 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 239000003586 protic polar solvent Substances 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- KQTIIICEAUMSDG-UHFFFAOYSA-N tricarballylic acid Chemical compound OC(=O)CC(C(O)=O)CC(O)=O KQTIIICEAUMSDG-UHFFFAOYSA-N 0.000 claims description 4
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 3
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 3
- 229960005137 succinic acid Drugs 0.000 claims description 3
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 claims description 3
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 claims description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical class CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims description 2
- NFJSYLMJBNUDNG-UHFFFAOYSA-N 1,3-dipropylimidazolidin-2-one Chemical class CCCN1CCN(CCC)C1=O NFJSYLMJBNUDNG-UHFFFAOYSA-N 0.000 claims description 2
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 claims description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 2
- HFVTUNMAGWBDGI-UHFFFAOYSA-N 2,6-diethyl-4-methylphenol Chemical class CCC1=CC(C)=CC(CC)=C1O HFVTUNMAGWBDGI-UHFFFAOYSA-N 0.000 claims description 2
- NAILKKRDWBJCNH-UHFFFAOYSA-N 2,6-dipropylphenol Chemical compound CCCC1=CC=CC(CCC)=C1O NAILKKRDWBJCNH-UHFFFAOYSA-N 0.000 claims description 2
- 150000000345 2,6-xylenols Chemical class 0.000 claims description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- HRWADRITRNUCIY-UHFFFAOYSA-N 2-(2-propan-2-yloxyethoxy)ethanol Chemical compound CC(C)OCCOCCO HRWADRITRNUCIY-UHFFFAOYSA-N 0.000 claims description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims description 2
- FETMDPWILVCFLL-UHFFFAOYSA-N 2-[2-(2-propan-2-yloxyethoxy)ethoxy]ethanol Chemical compound CC(C)OCCOCCOCCO FETMDPWILVCFLL-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 claims description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical group COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- ORGIXTZQPMWKGZ-UHFFFAOYSA-N 4-methyl-2,6-dipropylphenol Chemical class CCCC1=CC(C)=CC(CCC)=C1O ORGIXTZQPMWKGZ-UHFFFAOYSA-N 0.000 claims description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 2
- IQLBGVIOAUONRL-UHFFFAOYSA-N CCC(O)(NCC)COCCCC Chemical compound CCC(O)(NCC)COCCCC IQLBGVIOAUONRL-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical class CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 2
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical class CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 claims description 2
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 claims description 2
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 2
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- 235000011037 adipic acid Nutrition 0.000 claims description 2
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- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 2
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- 235000015165 citric acid Nutrition 0.000 claims description 2
- UZBQIPPOMKBLAS-UHFFFAOYSA-N diethylazanide Chemical compound CC[N-]CC UZBQIPPOMKBLAS-UHFFFAOYSA-N 0.000 claims description 2
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 2
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- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 2
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- 150000003852 triazoles Chemical class 0.000 claims description 2
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 claims description 2
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- 239000003518 caustics Substances 0.000 claims 1
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- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims 1
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- 150000002780 morpholines Chemical class 0.000 claims 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims 1
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- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 17
- 230000007797 corrosion Effects 0.000 description 13
- 238000005260 corrosion Methods 0.000 description 13
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- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
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Abstract
本发明提供抗蚀剂剥离液组合物、显示器基板及其制造方法,所述抗蚀剂剥离液组合物的特征在于,包含(a)具有下述化学式1的结构的氨基烷基硅烷系化合物、(b)烷醇胺、和(c)极性有机溶剂,且不包含氢氧化铵和季铵碱。下述化学式1中,R1、R2和R3各自独立地为碳原子数1~4的烷基,R4为碳原子数1~5的亚烷基,及R5和R6各自独立地为氢原子、碳原子数1~5的烷基、羟基或碳原子数1~4的烷氧基,在R5为羟基或烷氧基的情况下,R6为氢原子或烷基,在R6为羟基或烷氧基的情况下,R5为氢原子或烷基。[化学式1]
Description
技术领域
本发明涉及应用防电偶及缝隙腐蚀能力优异的氨基烷基硅烷系化合物的抗蚀剂剥离液组合物,使用其制造的显示器基板的制造方法及由其制造的显示器基板。
背景技术
近年来,随着显示器基板的高分辨率呈现要求增加,持续进行着使每单位面积的像素数增加的努力。根据这样的趋势,要求配线宽度的减小。为了应对于此,导入干式蚀刻工序等工序条件也变得越来越苛刻。此外,由于平板显示装置的大型化,也要求配线中的信号速度加快,因此电阻率比铝低的铜被用作配线材料。受此影响,对于作为抗蚀剂去除工序的剥离工序中所使用的剥离液的需求性能也变高。具体而言,对于针对金属配线的腐蚀抑制力等,要求相当高水平的剥离特性。特别是,除了铝以外,也要求对于铜的腐蚀抑制能力,为了确保价格竞争力,也要求基板的处理张数增加之类的经济性。应对如上所述的业界的需求,公开了新技术。
比如,韩国注册专利10-1557778中公开了包含烷醇胺、有机溶剂等的抗蚀剂剥离液组合物,但没有改善针对包含钼等金属的下部金属膜或金属配线等的防腐蚀力。
现有技术文献
专利文献
专利文献1:韩国注册专利第10-1557778号
发明内容
所要解决的课题
本发明是用于解决如上问题的发明,其目的在于,提供对于包含钼的下部金属膜或金属配线的防腐蚀力优异,且表现出高剥离力的抗蚀剂剥离液组合物,使用其制造的显示器基板的制造方法及由其制造的显示器基板。
解决课题的方法
为了达成上述目的,本发明提供一种抗蚀剂剥离液组合物,其特征在于,包含:(a)具有下述化学式1的结构的氨基烷基硅烷系化合物、(b)烷醇胺、和(c)极性有机溶剂,但不包含氢氧化铵和季铵碱(quaternary ammonium hydroxide)。
本发明提供一种显示器基板的制造方法,其包括使用上述抗蚀剂剥离液组合物来清洗显示器基板的工序。
此外,本发明提供由上述制造方法制造的显示器基板。
发明效果
本发明的抗蚀剂剥离液组合物使用在去离子水及极性溶剂中溶解力优异的氨基烷基硅烷系化合物,因而不会使铝、铜、钨、钼、钛及包含它们的下部金属膜或金属配线发生腐蚀,且具有表现高剥离力的效果。
具体实施方式
本发明涉及抗蚀剂剥离液组合物、使用其制造的显示器基板的制造方法及由该方法制造的显示器基板。
本发明的抗蚀剂剥离液组合物的特征在于,包含(a)氨基烷基硅烷系化合物、(b)烷醇胺和(c)极性有机溶剂,且不包含氢氧化铵,特别是由于使用在去离子水及极性溶剂中溶解力优异的氨基烷基硅烷系化合物,因而不会使铝、铜、钨、钼、钛及包含它们的下部金属膜或金属配线发生腐蚀,具有表现高剥离力的效果。本发明的抗蚀剂剥离液组合物可以进一步包含(d)防腐蚀剂。
以下,按构成详细说明本发明的内容。
(a)氨基烷基硅烷系化合物
本发明中使用的(a)氨基烷基硅烷系化合物具有下述化学式1的结构。
[化学式1]
上述化学式1中,
R1、R2和R3各自独立地为碳原子数1~4的烷基,
R4为碳原子数1~5的亚烷基,
R5和R6各自独立地为氢原子、碳原子数1~5的烷基、羟基或碳原子数1~4的烷氧基,在R5为羟基或烷氧基的情况下,R6为氢原子或烷基,在R6为羟基或烷氧基的情况下,R5为氢原子或烷基。
上述碳原子数1~4的烷基在具有3个以上碳原子的情况下,可以为直链或支链状。
作为化学式1所表示的(a)氨基烷基硅烷系化合物的种类,优选可以举出(2-氨基乙基)三乙氧基硅烷、(3-氨基丙基)三甲氧基硅烷、(3-氨基丙基)三乙氧基硅烷等,它们可以单独或将两种以上混合使用。
此外,本发明中,上述(a)氨基烷基硅烷系化合物中可以进一步添加(3-氨基丙基)硅烷三醇等化合物而使用。
本发明的(a)氨基烷基硅烷系化合物防止抗蚀剂剥离中可能发生的金属的腐蚀的能力优异,尤其通过实验确认到在包含铝、钼、以及铜和钼的合金中所发生的电偶腐蚀及缝隙腐蚀的防腐蚀力优异。
相对于组合物总重量,上述化学式1所表示的(a)氨基烷基硅烷系化合物的含量优选为0.001重量%~3.0重量%,更优选为0.005重量%~1.0重量%。如果低于0.001重量%,则在剥离或利用去离子水的冲洗工序中金属配线可能发生腐蚀,在超过3.0重量%的情况下,无法获得防腐蚀剂含量增加所带来的腐蚀防止效果的提高,因而在经济方面不佳。
(b)烷醇胺
本发明的烷醇胺发挥如下作用:在干式或湿式蚀刻、灰化(ashing)或离子注入工序(ion implant processing)等各种工序条件下,有效地渗透至被改性或被交联的抗蚀剂(resist)的高分子基体中,破坏存在于分子内或分子间的结合。此外,在残留于基板上的抗蚀剂内的结构上脆弱的部分形成空隙,使抗蚀剂改性为无定形的高分子凝胶(gel)块状态,从而能够使附着于基板上部的抗蚀剂被容易地去除。
上述烷醇胺可以举出单乙醇胺、二乙醇胺、三乙醇胺、单丙醇胺、2-氨基乙醇、2-(乙基氨基)乙醇、2-(甲基氨基)乙醇、N-甲基二乙醇胺、N,N-二甲基乙醇胺、N,N-二乙基氨基乙醇、2-(2-氨基乙基氨基)-1-乙醇、1-氨基-2-丙醇、2-氨基-1-丙醇、3-氨基-1-丙醇、4-氨基-1-丁醇、二丁醇胺、(甲氧基甲基)二乙醇胺、(羟基乙基氧基甲基)二乙基胺、甲基(甲氧基甲基)氨基乙醇、甲基(丁氧基甲基)氨基乙醇、2-(2-氨基乙氧基)乙醇、1-(2-羟基乙基)哌嗪、1-(2-羟基乙基)甲基哌嗪、N-(2-羟基乙基)吗啉、N-(3-羟基丙基)吗啉等,它们可以单独或将两种以上混合使用。但是,本发明可以不包含氢氧化铵和/或季铵碱。在包含氢氧化铵和/或季铵碱的情况下,可能会对Mo或Mo合金膜质产生侵蚀(Attack),季铵碱具体可以举出四甲基氢氧化铵(TMAH)、四乙基氢氧化铵、四丙基氢氧化铵、四丁基氢氧化铵、四甲基-2-羟基乙基氢氧化铵(胆碱)、三甲基-3-羟基丙基氢氧化铵、三甲基-3-羟基丁基氢氧化铵、三甲基-4-羟基丁基氢氧化铵、三乙基-2-羟基乙基氢氧化铵、三丙基-2-羟基乙基氢氧化铵、三丁基-2-羟基乙基氢氧化铵、二甲基乙基-2-羟基乙基氢氧化铵、二甲基二(2-羟基乙基氢氧化铵、单甲基三(2-羟基乙基)氢氧化铵、单甲基三乙基氢氧化铵、单甲基三乙基氢氧化铵、单甲基三丁基氢氧化铵、单乙基三甲基氢氧化铵、单乙基三丁基氢氧化铵、二甲基二乙基氢氧化铵和二甲基二丁基氢氧化铵等,尤其优选不包含四甲基氢氧化铵。
相对于整体组合物总重量,本发明的(b)烷醇胺的含量优选为0.1~20.0重量%,更优选为0.5~10.0重量%。如果低于0.1重量%,则可能发生抗蚀剂去除力降低,如果超过20.0重量%,则无法获得烷醇胺含量增加所来的抗蚀剂去除力提高的效果而不经济,而且可能发生使针对金属膜质的腐蚀水平提高的问题。
(c)极性有机溶剂
本发明中使用的(c)极性有机溶剂可以举出质子性极性溶剂和非质子性极性溶剂,它们可以单独或将两种以上混合使用。作为上述质子性极性溶剂的优选的例子,可以举出乙二醇单甲基醚、乙二醇单乙基醚、乙二醇单异丙基醚、乙二醇单丁基醚、二乙二醇单甲基醚、二乙二醇单乙基醚、二乙二醇单异丙基醚、二乙二醇单丁基醚、三乙二醇单甲基醚、三乙二醇单乙基醚、三乙二醇单异丙基醚、三乙二醇单丁基醚、聚乙二醇、聚丙二醇、聚乙二醇单甲基醚、聚乙二醇单丁基醚、丙二醇单甲基醚、二丙二醇单甲基醚、三丙二醇单甲基醚等亚烷基二醇单烷基醚、丙二醇单甲基醚乙酸酯和四氢糠醇等,它们可以单独或将两种以上混合使用。
作为上述非质子性极性溶剂的优选的例子,可以举出N-甲基吡咯烷酮(NMP)、N-乙基吡咯烷酮等吡咯烷酮化合物;1,3-二甲基-2-咪唑烷酮、1,3-二丙基-2-咪唑烷酮等咪唑烷酮化合物;γ-丁内酯等内酯化合物;二甲基亚砜(DMSO)、环丁砜等亚砜化合物;磷酸三乙酯、磷酸三丁酯等磷酸酯化合物;碳酸二甲酯、碳酸亚乙酯等碳酸酯化合物;甲酰胺、N-甲基甲酰胺、N-乙基甲酰胺、N,N-二甲基甲酰胺、N,N-二乙基甲酰胺、乙酰胺、N-甲基乙酰胺、N,N-二甲基乙酰胺、N-(2-羟基乙基)乙酰胺、N,N-二甲基丙酰胺、3-甲氧基-N,N-二甲基丙酰胺、3-(2-乙基己基氧基)-N,N-二甲基丙酰胺、3-丁氧基-N,N-二甲基丙酰胺等酰胺化合物,它们可以单独或将两种以上混合使用。
上述(c)极性有机溶剂发挥使凝胶化的抗蚀剂高分子溶解的作用,此外在抗蚀剂剥离之后去离子水的冲洗过程中使利用水的剥离液的去除顺利进行,从而使剥离液以及所溶解的抗蚀剂的再吸附/再附着最小化。为了适当的剥离力,优选上述(c)极性有机溶剂的沸点既不过高也不过低,且可以混合使用。上述极性有机溶剂可以根据剥离工序中所追加要求的性能而追加。
相对于整体组合物总重量,上述(c)极性有机溶剂的含量为75.0~99.8重量%是适当的。如果低于75.0重量%,则可能发生溶解力降低,在利用去离子水的冲洗工序中可能发生抗蚀剂的再吸附/再附着。此外,如果超过99.8重量%,则(b)烷醇胺的含量相对减少而剥离力可能降低。
(d)防腐蚀剂
本发明的组合物可以进一步包含(d)防腐蚀剂,具体而言,本发明的防腐蚀剂可以举出:甲酸、乙酸、丙酸之类的单羧酸;草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、马来酸、富马酸、戊烯二酸之类的二羧酸;偏苯三酸、丙三羧酸之类的三羧酸;羟基乙酸、乳酸、水杨酸、苹果酸、酒石酸、柠檬酸、葡糖酸和羟基羧酸等有机酸类;琥珀酸酰胺酯、苹果酸酰胺酯、马来酸酰胺酯、富马酸酰胺酯、草酸酰胺酯、丙二酸酰胺酯、戊二酸酰胺酯、乙酸酰胺酯、乳酸酰胺酯、柠檬酸酰胺酯、酒石酸酰胺酯、葡糖酸酰胺酯、甲酸酰胺酯和尿酸酰胺酯等有机酸酰胺酯类;苯并三唑、甲苯基三唑、甲基甲苯基三唑、2,2'-[[[苯并三唑]甲基]亚氨基]双乙醇、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双甲醇、2,2'-[[[乙基-1氢-苯并三唑-1-基]甲基]亚氨基]双乙醇、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双乙醇、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双羧酸、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双甲胺和2,2'-[[[胺-1氢-苯并三唑-1-基]甲基]亚氨基]双乙醇、4-甲基-1-氢-苯并三唑、6-甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、4-甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、5-甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、5,6-二甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、4,6-二甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑和5-甲基-1-氢-苯并三唑之类的唑系化合物;2,6-二甲基苯酚、2,4,6-三甲基苯酚、2,6-二乙基苯酚、2,6-二乙基-4-甲基苯酚、2,6-二丙基苯酚、2,6-二丙基-4-甲基苯酚、2,6-二叔丁基苯酚、2,4,6-三叔丁基苯酚和2,6-二-叔丁基-4-甲基苯酚之类的对称型酚系化合物;等,但不限定于此。它们可以单独或将两种以上混合使用。
相对于组合物总重量,本发明的(d)防腐蚀剂的含量可以为0.001~1.0重量%。在防腐蚀剂的含量低于0.001重量%的情况下,存在铜表面发生微腐蚀的问题,在含量超过1.0重量%的情况下,无法获得含量增加所带来的防腐蚀效果而不经济。
本发明的抗蚀剂剥离液组合物可以在半导体或电子产品、尤其显示器用抗蚀剂的去除工序中有效地使用。
即,本发明包含显示器基板的制造方法及由上述制造方法制造的显示器基板,该显示器基板的制造方法包括利用本发明的抗蚀剂剥离液组合物来清洗显示器基板的工序。
以下,通过实施例更详细说明本发明。然而,下述实施例仅用于更具体地说明本发明,本发明的范围不受下述实施例的限定。下述实施例可以在本发明的范围内被本领域的技术人员合理地修改、变更。
<实施例及比较例>抗蚀剂剥离液组合物的制造
将下述表1中记载的成分以相应的混合比进行混合而制造实施例及比较例的抗蚀剂剥离液组合物。
[表1]
注)APTES:(3-氨基丙基)三乙氧基硅烷
APSTO:(3-氨基丙基)硅烷三醇
AEE:2-(2-氨基乙氧基)-1-乙醇
MAE:2-(甲基氨基)乙醇
MDEA:N-甲基二乙醇胺
IME:咪唑烷乙醇
NMF:N-甲基甲酰胺
NEF:N-乙基甲酰胺
NMP:N-甲基吡咯烷酮
MDG:二乙二醇单甲基醚
EDG:二乙二醇单乙基醚
BDG:二乙二醇单丁基醚
MTG:三乙二醇单甲基醚
TTA:甲苯基三唑
MTBT:6-甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑
TMAH(25):四甲基氢氧化铵溶液(H2O中25wt.%)
<实验例1>剥离液的光致抗蚀剂剥离力评价
为了确认抗蚀剂剥离液组合物的剥离效果,在玻璃基板上涂布1.7μm的正型光致抗蚀剂(DWG-520:本公司PR)后,在170℃在加热板(Hot plate)上实施10分钟后烘(Hardbake)而准备基板。将抗蚀剂剥离液组合物以50℃恒定维持温度后,将上述基板以30秒的间隔浸渍而评价剥离力。之后,为了去除残留在基板上的剥离液,利用去离子水(DIW;Deilonized water)实施1分钟清洗,为了去除清洗后残留在基板上的DIW,利用氮气将基板完全干燥。用肉眼确认完成评价的基板,测定抗蚀剂被完全去除的时间,并将该结果示于下述表2中。可以认为时间越短,剥离效果越优异。
<实验例2>剥离液金属配线防腐蚀力评价
为了进行抗蚀剂剥离液组合物对于金属配线的腐蚀防止能力评价,根据通常的方法,使用薄膜溅射法在玻璃基板上形成Mo/Al、Cu/X层(X:Ti、Mo、MoTi、MoW、MoNb)。之后,形成光致抗蚀剂图案,通过湿式蚀刻方式分别准备将金属膜蚀刻的基板。使用简易剥离喷洒(Strip Spray)评价设备,使剥离液组合物以60℃恒定维持温度,对于上述基板以2kgf/cm2压力进行2分钟喷洒剥离,然后使用简易DIW清洗喷洒设备将上述完成剥离的基板在常温下以2kgf/cm2压力实施3分钟喷洒清洗。关于完成清洗的基板,使用N2实施干燥,将上述剥离工序中实现DIW清洗和干燥的工序反复实施3次,利用电子显微镜(SEM,Hitachi S-4700)评价该基板。将该结果示于下述表2中,根据各金属腐蚀程度,在未观察到腐蚀时表示为◎,在观察到少许腐蚀但应用于膜质应用时没有问题时表示为○,在观察到腐蚀且应用于膜质时很可能出现问题时表示为△,在观察到严重腐蚀且无法应用于膜质时表示为×。
[表2]
参照上述实验结果可以确认到,由于本发明的抗蚀剂剥离液组合物使用在去离子水及极性溶剂中溶解力优异的氨基烷基硅烷系化合物,因而不会使铝、铜、钨、钼、钛及包含它们的金属配线发生腐蚀,且具有高剥离力效果。此外,可以确认到,在包含氢氧化铵、即四甲基氢氧化铵的比较例7和8的情况下,侵蚀(attack)Mo或Mo合金膜质而发生了严重的腐蚀。
Claims (13)
1.一种抗蚀剂剥离液组合物,其特征在于,包含:
(a)具有下述化学式1的结构的氨基烷基硅烷系化合物、
(b)烷醇胺、和
(c)极性有机溶剂,
且不包含氢氧化铵和季铵碱,
化学式1
所述化学式1中,
R1、R2和R3各自独立地为碳原子数1~4的烷基,
R4为碳原子数1~5的亚烷基,及
R5和R6各自独立地为氢原子、碳原子数1~5的烷基、羟基或碳原子数1~4的烷氧基,在R5为羟基或烷氧基的情况下,R6为氢原子或烷基,在R6为羟基或烷氧基的情况下,R5为氢原子或烷基。
2.根据权利要求1所述的抗蚀剂剥离液组合物,其特征在于,进一步包含(d)防腐蚀剂。
3.根据权利要求2所述的抗蚀剂剥离液组合物,其特征在于,所述(d)防腐蚀剂为Cu防腐蚀剂。
4.根据权利要求1所述的抗蚀剂剥离液组合物,其特征在于,所述(a)氨基烷基硅烷系化合物为(2-氨基乙基)三乙氧基硅烷、(3-氨基丙基)三甲氧基硅烷和(3-氨基丙基)三乙氧基硅烷中的一种以上。
5.根据权利要求1~4中任一项所述的抗蚀剂剥离液组合物,其特征在于,所述(b)烷醇胺为单乙醇胺、二乙醇胺、三乙醇胺、单丙醇胺、2-氨基乙醇、2-(乙基氨基)乙醇、2-(甲基氨基)乙醇、N-甲基二乙醇胺、N,N-二甲基乙醇胺、N,N-二乙基氨基乙醇、2-(2-氨基乙基氨基)-1-乙醇、1-氨基-2-丙醇、2-氨基-1-丙醇、3-氨基-1-丙醇、4-氨基-1-丁醇、二丁醇胺、(甲氧基甲基)二乙醇胺、(羟基乙基氧基甲基)二乙基胺、甲基(甲氧基甲基)氨基乙醇、甲基(丁氧基甲基)氨基乙醇、2-(2-氨基乙氧基)乙醇、1-(2-羟基乙基)哌嗪、1-(2-羟基乙基)甲基哌嗪、N-(2-羟基乙基)吗啉和N-(3-羟基丙基)吗啉中的一种以上。
6.根据权利要求1~4中任一项所述的抗蚀剂剥离液组合物,其特征在于,所述(c)极性有机溶剂为质子性极性溶剂和非质子性极性溶剂中的一种以上。
7.根据权利要求6所述的抗蚀剂剥离液组合物,其特征在于,所述质子性极性溶剂为乙二醇单甲基醚、乙二醇单乙基醚、乙二醇单异丙基醚、乙二醇单丁基醚、二乙二醇单甲基醚、二乙二醇单乙基醚、二乙二醇单异丙基醚、二乙二醇单丁基醚、三乙二醇单甲基醚、三乙二醇单乙基醚、三乙二醇单异丙基醚、三乙二醇单丁基醚、聚乙二醇单甲基醚、聚乙二醇单丁基醚、丙二醇单甲基醚、二丙二醇单甲基醚、三丙二醇单甲基醚、丙二醇单甲基醚乙酸酯和四氢糠醇中的一种以上。
8.根据权利要求6所述的抗蚀剂剥离液组合物,其特征在于,所述非质子性极性溶剂为N-甲基吡咯烷酮、N-乙基吡咯烷酮、1,3-二甲基-2-咪唑烷酮、1,3-二丙基-2-咪唑烷酮、γ-丁内酯、二甲基亚砜、环丁砜、磷酸三乙酯、磷酸三丁酯、碳酸二甲酯、碳酸亚乙酯、甲酰胺、N-甲基甲酰胺、N,N-二甲基甲酰胺、乙酰胺、N-甲基乙酰胺、N,N-二甲基乙酰胺、N-(2-羟基乙基)乙酰胺、3-甲氧基-N,N-二甲基丙酰胺、3-(2-乙基己基氧基)-N,N-二甲基丙酰胺和3-丁氧基-N,N-二甲基丙酰胺中的一种以上。
9.根据权利要求2所述的抗蚀剂剥离液组合物,其特征在于,(d)防腐蚀剂为甲酸、乙酸、丙酸、草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、马来酸、富马酸、戊烯二酸、偏苯三酸、丙三羧酸、羟基乙酸、乳酸、水杨酸、苹果酸、酒石酸、柠檬酸、葡糖酸、羟基羧酸、琥珀酸酰胺酯、苹果酸酰胺酯、马来酸酰胺酯、富马酸酰胺酯、草酸酰胺酯、丙二酸酰胺酯、戊二酸酰胺酯、乙酸酰胺酯、乳酸酰胺酯、柠檬酸酰胺酯、酒石酸酰胺酯、葡糖酸酰胺酯、甲酸酰胺酯、尿酸酰胺酯、苯并三唑、甲苯基三唑、甲基甲苯基三唑、2,2'-[[[苯并三唑]甲基]亚氨基]双乙醇、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双甲醇、2,2'-[[[乙基-1氢-苯并三唑-1-基]甲基]亚氨基]双乙醇、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双乙醇、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双羧酸、2,2'-[[[甲基-1氢-苯并三唑-1-基]甲基]亚氨基]双甲胺、2,2'-[[[胺-1氢-苯并三唑-1-基]甲基]亚氨基]双乙醇、4-甲基-1-氢-苯并三唑、6-甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、4-甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、5-甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、5,6-二甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、4,6-二甲基-4,5,6,7-四氢-1H-苯并[1,2,3]三唑、5-甲基-1-氢-苯并三唑、2,6-二甲基苯酚、2,4,6-三甲基苯酚、2,6-二乙基苯酚、2,6-二乙基-4-甲基苯酚、2,6-二丙基苯酚、2,6-二丙基-4-甲基苯酚、2,6-二叔丁基苯酚、2,4,6-三叔丁基苯酚和2,6-二叔丁基-4-甲基苯酚中的一种以上。
10.根据权利要求1所述的抗蚀剂剥离液组合物,相对于组合物总重量,包含:
(a)氨基烷基硅烷系化合物0.001~3.0重量%、
(b)烷醇胺化合物0.1~20.0重量%、和
(c)极性有机溶剂75.0~99.8重量%。
11.根据权利要求10所述的抗蚀剂剥离液组合物,其进一步包含(d)防腐蚀剂0.001~1.0重量%。
12.一种显示器基板的制造方法,其包括使用权利要求1~11中任一项所述的抗蚀剂剥离液组合物来清洗显示器基板的工序。
13.一种显示器基板,其由权利要求12所述的制造方法来制造。
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004018394A (ja) * | 2002-06-12 | 2004-01-22 | Daikin Ind Ltd | 含フッ素両親媒性化合物 |
CN103064263A (zh) * | 2011-08-22 | 2013-04-24 | 东友Fine-Chem股份有限公司 | 抗蚀剂剥离液组合物及利用该组合物的抗蚀剂剥离方法 |
CN103424999A (zh) * | 2012-05-24 | 2013-12-04 | 东友Fine-Chem股份有限公司 | 抗蚀剂剥离液组合物及使用其制造tft阵列基板的方法 |
KR20130138681A (ko) * | 2012-06-11 | 2013-12-19 | 도오꾜오까고오교 가부시끼가이샤 | 리소그래피용 세정액 및 배선 형성 방법 |
KR20130139482A (ko) * | 2012-06-13 | 2013-12-23 | 동우 화인켐 주식회사 | 레지스트 박리액 조성물 |
WO2014149286A1 (en) * | 2013-03-15 | 2014-09-25 | International Business Machines Corporation | Wet strip process for an antireflective coating layer |
CN105143984A (zh) * | 2013-03-07 | 2015-12-09 | 株式会社Lg化学 | 用于去除光阻剂的剥离剂组合物及使用其剥离光阻剂的方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103365121B (zh) * | 2012-03-29 | 2018-10-02 | 东友精细化工有限公司 | 抗蚀剂剥离组合物及利用该抗蚀剂剥离组合物剥离抗蚀剂的方法 |
KR101557778B1 (ko) | 2014-02-28 | 2015-10-06 | 주식회사 이엔에프테크놀로지 | 포토레지스트 박리액 조성물 |
KR20150122955A (ko) * | 2014-04-24 | 2015-11-03 | 동우 화인켐 주식회사 | 레지스트 박리액 조성물 |
KR20150128349A (ko) * | 2014-05-09 | 2015-11-18 | 동우 화인켐 주식회사 | 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법 |
-
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-
2017
- 2017-05-05 TW TW106114964A patent/TWI705969B/zh active
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004018394A (ja) * | 2002-06-12 | 2004-01-22 | Daikin Ind Ltd | 含フッ素両親媒性化合物 |
CN103064263A (zh) * | 2011-08-22 | 2013-04-24 | 东友Fine-Chem股份有限公司 | 抗蚀剂剥离液组合物及利用该组合物的抗蚀剂剥离方法 |
CN103424999A (zh) * | 2012-05-24 | 2013-12-04 | 东友Fine-Chem股份有限公司 | 抗蚀剂剥离液组合物及使用其制造tft阵列基板的方法 |
KR20130138681A (ko) * | 2012-06-11 | 2013-12-19 | 도오꾜오까고오교 가부시끼가이샤 | 리소그래피용 세정액 및 배선 형성 방법 |
KR20130139482A (ko) * | 2012-06-13 | 2013-12-23 | 동우 화인켐 주식회사 | 레지스트 박리액 조성물 |
CN105143984A (zh) * | 2013-03-07 | 2015-12-09 | 株式会社Lg化学 | 用于去除光阻剂的剥离剂组合物及使用其剥离光阻剂的方法 |
WO2014149286A1 (en) * | 2013-03-15 | 2014-09-25 | International Business Machines Corporation | Wet strip process for an antireflective coating layer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113614646A (zh) * | 2019-03-25 | 2021-11-05 | 松下知识产权经营株式会社 | 抗蚀剂剥离液 |
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