CN107534026A - 密封树脂片 - Google Patents

密封树脂片 Download PDF

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Publication number
CN107534026A
CN107534026A CN201680026858.2A CN201680026858A CN107534026A CN 107534026 A CN107534026 A CN 107534026A CN 201680026858 A CN201680026858 A CN 201680026858A CN 107534026 A CN107534026 A CN 107534026A
Authority
CN
China
Prior art keywords
sealing resin
resin piece
piece
weight
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680026858.2A
Other languages
English (en)
Chinese (zh)
Inventor
饭野智绘
志贺豪士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN107534026A publication Critical patent/CN107534026A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201680026858.2A 2015-05-13 2016-04-18 密封树脂片 Pending CN107534026A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-097852 2015-05-13
JP2015097852A JP6735071B2 (ja) 2015-05-13 2015-05-13 封止樹脂シート
PCT/JP2016/062192 WO2016181761A1 (fr) 2015-05-13 2016-04-18 Feuille de résine d'étanchéité

Publications (1)

Publication Number Publication Date
CN107534026A true CN107534026A (zh) 2018-01-02

Family

ID=57248946

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680026858.2A Pending CN107534026A (zh) 2015-05-13 2016-04-18 密封树脂片

Country Status (6)

Country Link
JP (1) JP6735071B2 (fr)
KR (1) KR20180006930A (fr)
CN (1) CN107534026A (fr)
SG (1) SG11201708796UA (fr)
TW (1) TW201708487A (fr)
WO (1) WO2016181761A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018104649A (ja) * 2016-12-28 2018-07-05 日東電工株式会社 樹脂シート
JP6815293B2 (ja) 2017-08-16 2021-01-20 信越化学工業株式会社 半導体封止用熱硬化性エポキシ樹脂シート、半導体装置、及びその製造方法
WO2022070846A1 (fr) * 2020-09-30 2022-04-07 日鉄ケミカル＆マテリアル株式会社 Mélange précurseur de résine époxyde thermoplastique de type polymérisation in situ, composition de résine époxyde, feuille de composition de résine époxyde, préimprégné et plastique renforcé par des fibres thermoplastiques de type polymérisation in situ l'utilisant
JP2023076872A (ja) 2021-11-24 2023-06-05 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物及び熱硬化性エポキシ樹脂シート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009074084A (ja) * 2007-08-29 2009-04-09 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及びこれを用いて封止された素子を備えてなる電子部品装置
CN102222633A (zh) * 2010-04-16 2011-10-19 日东电工株式会社 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法
JP2012046576A (ja) * 2010-08-25 2012-03-08 Sumitomo Bakelite Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2014029958A (ja) * 2012-07-31 2014-02-13 Ajinomoto Co Inc 半導体装置の製造方法
JP2014131016A (ja) * 2012-11-29 2014-07-10 Nitto Denko Corp 熱硬化性樹脂シート及び電子部品パッケージの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216636A (ja) * 2010-03-31 2011-10-27 Murata Mfg Co Ltd 電子部品内蔵基板、電子回路モジュール、および電子部品内蔵基板の製造方法
JP5617495B2 (ja) * 2010-09-29 2014-11-05 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009074084A (ja) * 2007-08-29 2009-04-09 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及びこれを用いて封止された素子を備えてなる電子部品装置
CN102222633A (zh) * 2010-04-16 2011-10-19 日东电工株式会社 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法
JP2012046576A (ja) * 2010-08-25 2012-03-08 Sumitomo Bakelite Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2014029958A (ja) * 2012-07-31 2014-02-13 Ajinomoto Co Inc 半導体装置の製造方法
JP2014131016A (ja) * 2012-11-29 2014-07-10 Nitto Denko Corp 熱硬化性樹脂シート及び電子部品パッケージの製造方法

Also Published As

Publication number Publication date
SG11201708796UA (en) 2017-11-29
JP6735071B2 (ja) 2020-08-05
KR20180006930A (ko) 2018-01-19
WO2016181761A1 (fr) 2016-11-17
JP2016213391A (ja) 2016-12-15
TW201708487A (zh) 2017-03-01

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