SG11201708796UA - Sealing resin sheet - Google Patents
Sealing resin sheetInfo
- Publication number
- SG11201708796UA SG11201708796UA SG11201708796UA SG11201708796UA SG11201708796UA SG 11201708796U A SG11201708796U A SG 11201708796UA SG 11201708796U A SG11201708796U A SG 11201708796UA SG 11201708796U A SG11201708796U A SG 11201708796UA SG 11201708796U A SG11201708796U A SG 11201708796UA
- Authority
- SG
- Singapore
- Prior art keywords
- resin sheet
- sealing resin
- sealing
- sheet
- resin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015097852A JP6735071B2 (en) | 2015-05-13 | 2015-05-13 | Sealing resin sheet |
PCT/JP2016/062192 WO2016181761A1 (en) | 2015-05-13 | 2016-04-18 | Sealing resin sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201708796UA true SG11201708796UA (en) | 2017-11-29 |
Family
ID=57248946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201708796UA SG11201708796UA (en) | 2015-05-13 | 2016-04-18 | Sealing resin sheet |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6735071B2 (en) |
KR (1) | KR20180006930A (en) |
CN (1) | CN107534026A (en) |
SG (1) | SG11201708796UA (en) |
TW (1) | TW201708487A (en) |
WO (1) | WO2016181761A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018104649A (en) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | Resin sheet |
JP6815293B2 (en) | 2017-08-16 | 2021-01-20 | 信越化学工業株式会社 | Thermosetting epoxy resin sheet for semiconductor encapsulation, semiconductor device, and its manufacturing method |
WO2022070846A1 (en) * | 2020-09-30 | 2022-04-07 | 日鉄ケミカル&マテリアル株式会社 | Precursor mixture of in situ polymerization type thermoplastic epoxy resin, epoxy resin composition, epoxy resin composition sheet, prepreg, and in situ polymerization type thermoplastic fiber-reinforced plastic using same |
JP2023076872A (en) | 2021-11-24 | 2023-06-05 | 信越化学工業株式会社 | Thermosetting epoxy resin composition and thermosetting epoxy resin sheet |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5176075B2 (en) * | 2007-08-29 | 2013-04-03 | 日立化成株式会社 | Epoxy resin molding material for sealing and electronic component device provided with element sealed using the same |
JP2011216636A (en) * | 2010-03-31 | 2011-10-27 | Murata Mfg Co Ltd | Substrate with built-in electronic component, electronic circuit module, and method for manufacturing of substrate with built-in electronic component |
JP4976522B2 (en) * | 2010-04-16 | 2012-07-18 | 日東電工株式会社 | Thermosetting die bond film, dicing die bond film, and semiconductor device manufacturing method |
JP2012046576A (en) * | 2010-08-25 | 2012-03-08 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing and electronic component apparatus |
JP5617495B2 (en) * | 2010-09-29 | 2014-11-05 | 住友ベークライト株式会社 | Semiconductor device manufacturing method and semiconductor device |
JP6171280B2 (en) * | 2012-07-31 | 2017-08-02 | 味の素株式会社 | Manufacturing method of semiconductor device |
JP5943898B2 (en) * | 2012-11-29 | 2016-07-05 | 日東電工株式会社 | Method for manufacturing thermosetting resin sheet and electronic component package |
-
2015
- 2015-05-13 JP JP2015097852A patent/JP6735071B2/en active Active
-
2016
- 2016-04-18 SG SG11201708796UA patent/SG11201708796UA/en unknown
- 2016-04-18 KR KR1020177033812A patent/KR20180006930A/en unknown
- 2016-04-18 CN CN201680026858.2A patent/CN107534026A/en active Pending
- 2016-04-18 WO PCT/JP2016/062192 patent/WO2016181761A1/en active Application Filing
- 2016-05-12 TW TW105114773A patent/TW201708487A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201708487A (en) | 2017-03-01 |
JP6735071B2 (en) | 2020-08-05 |
JP2016213391A (en) | 2016-12-15 |
CN107534026A (en) | 2018-01-02 |
WO2016181761A1 (en) | 2016-11-17 |
KR20180006930A (en) | 2018-01-19 |
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