CN107424951A - 芯片旋转共晶焊接台 - Google Patents

芯片旋转共晶焊接台 Download PDF

Info

Publication number
CN107424951A
CN107424951A CN201710407869.1A CN201710407869A CN107424951A CN 107424951 A CN107424951 A CN 107424951A CN 201710407869 A CN201710407869 A CN 201710407869A CN 107424951 A CN107424951 A CN 107424951A
Authority
CN
China
Prior art keywords
welding
welding stage
suction nozzle
eutectic
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710407869.1A
Other languages
English (en)
Other versions
CN107424951B (zh
Inventor
代克明
曾林波
肖华平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Ruigu Optical Communications Ltd By Share Ltd
Original Assignee
Guangdong Ruigu Optical Communications Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Ruigu Optical Communications Ltd By Share Ltd filed Critical Guangdong Ruigu Optical Communications Ltd By Share Ltd
Priority to CN201710407869.1A priority Critical patent/CN107424951B/zh
Priority to KR1020187029862A priority patent/KR102165651B1/ko
Priority to JP2018556482A priority patent/JP6638090B2/ja
Priority to PCT/CN2017/106399 priority patent/WO2018218849A1/zh
Publication of CN107424951A publication Critical patent/CN107424951A/zh
Application granted granted Critical
Publication of CN107424951B publication Critical patent/CN107424951B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/81149—Aligning involving movement of a part of the bonding apparatus being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected, e.g. XY table
    • H01L2224/8115—Rotational movements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/81169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/8117—Rotational movements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开了一种芯片旋转共晶焊接台，包括底板，所述底板上固定有吸嘴移动平台和焊台移动平台，所述吸嘴移动平台上设置有一驱动旋转吸嘴在竖直面旋转吸嘴旋转电机，所述焊台移动平台上设置有一驱动共晶焊台水平旋转的焊台旋转电机，所述旋转吸嘴包括周向均匀设置的四个真空吸嘴，所述共晶焊台上至少设置有二个焊台，所述焊台的管座进料孔周向设置，所述真空吸嘴上吸附有管座。本发明具有能提高加工效率、设备占用场所面积小的优点。

Description

芯片旋转共晶焊接台
技术领域
本发明涉及LD加工领域，尤其是涉及一种能同步进行上料焊接和下料焊接工作，提高了加工效率，同时设备占用场所面积小的芯片旋转共晶焊接台。
背景技术
LD(半导体激光器)具有效率高、寿命长、光束质量好、体积小、重量轻、可全固化等诸多优点，近年得到快速发展，并成为当今国际上激光领域最令人关注的研究热点。在LD的芯片制造、管芯(模组)封装和产品应用三个方面，封装工艺和设备更接近于市场，对产业的推动作用更为直接。其中，共晶焊接技术是下一代倒装大功率LD芯片封装工艺中最为关健的核心技术之一，共晶焊技术的好坏会直接影响到大功率LD模组的发光效率、寿命、散热性能和终端产品质量。自动共晶焊工序一共有3个零件，分别为管座，垫片和芯片(尺寸长＊宽＊高为1.5＊1.0＊0.6mm)，先将垫片通过共晶的方法焊接在底座上，然后再将芯片通过共晶的方法焊接在垫片，现在的共晶焊台是通过一条生产线利用多个搬运吸嘴和一个共晶焊台在管座上依次焊接垫片和芯片而成的，这种工艺是通过条形生产线将管座分次搬运到共晶焊台上，搬运吸嘴放下管座后要再次去料盒搬运，这种工艺存在加工效率低，设备占用场所面积大的问题。
发明内容
本发明目的在于提供一种能同步进行上料焊接和下料焊接工作，提高了加工效率，同时设备占用场所面积小的芯片旋转共晶焊接台。
本发明通过以下技术措施实现的，一种芯片旋转共晶焊接台，包括底板，所述底板上固定有吸嘴移动平台和焊台移动平台，所述吸嘴移动平台上设置有一驱动旋转吸嘴在竖直面旋转吸嘴旋转电机，所述焊台移动平台上设置有一驱动共晶焊台水平旋转的焊台旋转电机，所述旋转吸嘴包括周向均匀设置的四个真空吸嘴，所述共晶焊台上至少设置有二个焊台，所述焊台的管座进料孔周向设置，所述真空吸嘴上吸附有管座，所述吸嘴移动平台平动将真空吸嘴上吸附的管座从管座进料孔送入焊台内，垫片搬运吸嘴从上方将垫片送入管座的底座上进行共晶焊接，然后芯片搬运吸嘴从上方将芯片送入垫片上进行共晶焊接，最后真空吸嘴退出，焊台旋转电机驱动共晶焊台水平旋转使另一个空焊台转到焊接位。
作为一种优选方式，所述吸嘴移动平台包括固定在底板的平移轨道，所述平移轨道上水平滑动设置有由平移电机驱动的吸嘴旋转电机固定座，所述吸嘴旋转电机固定在吸嘴旋转电机固定座上。
作为一种优选方式，所述平移轨道设置有限定吸嘴旋转电机固定座位置的限位气缸。
作为一种优选方式，所述焊台移动平台包括由X向电机驱动的能在底板上X向水平滑动的X向滑台以及由Y向电机驱动的能在X向滑台上Y向水平滑动的Y向滑台，所述焊台旋转电机固定在Y向滑台上。
作为一种优选方式，所述X向滑台上设置有能检测X向滑台位置的X向位置传感器，所述Y向滑台上设置有能检测Y向滑台位置的Y向位置传感器。
作为一种优选方式，所述共晶焊台包括固定在焊台旋转电机驱动轴上的焊台安装座，所述焊台安装座的中间安装有一条形中隔热块，所述中隔热块二侧中心对称设置有左隔热块和右隔热块，所述中隔热块和左隔热块上方支撑设置有左焊台，所述中隔热块和右隔热块上方支撑设置有右焊台，所述左焊台和右焊台内分别设置有左加热片和右热片，所述左焊台和右焊台由一焊台防护盖包围，所述焊台防护盖对应左焊台和右焊台分别设置有周向的管座进料孔以及上方的芯片进料孔。
作为一种优选方式，所述焊台安装座上还对称固定有用于支撑焊台防护盖的二焊台防护盖支撑杆。
作为一种优选方式，所述左焊台和右焊台下方分别设置有焊台支撑片。
作为一种优选方式，所述左焊台和右焊台下方分别设置有伸入管座进料孔边的产品定位杆。
作为一种优选方式，所述产品定位杆固定在Z向定位块上，所述Z向定位块通过Y向定位块固定在焊台安装座上。
本发明设置有能竖直方向旋转的旋转吸嘴以及能在水平面旋转的共晶焊台，旋转吸嘴周向均匀设置的四个真空吸嘴，共晶焊台上设置有至少二个焊台，旋转吸嘴使其中一个真空吸嘴的正对其中一个焊台的管座进料孔，此时另一个空的真空吸嘴竖直朝上，旋转吸嘴水平移动将真空吸嘴上的吸附的管座从侧面送入焊台内，垫片搬运吸嘴从上方将垫片送入管座的底座上进行共晶焊接，然后芯片搬运吸嘴从上方将芯片送入垫片上进行共晶焊接，此时搬运吸嘴将管座放入竖直朝上的真空吸嘴内，另一搬运机构同时将焊台的成品搬开，最后真空吸嘴水平退出，旋转旋转吸嘴使另一个吸附有管座的真空吸嘴的正对焊台的管座进料孔，焊台旋转电机驱动共晶焊台水平旋转使另一个空焊台转到焊接位，反复进行，从而旋转吸嘴和共晶焊台可同步进行上料焊接和下料焊接的工作，提高了加工效率，同时设备占用场所面积也更小。
附图说明
图1为本发明实施例的结构示意图；
图2为本发明实施例的分解结构示意图。
具体实施方式
下面结合实施例并对照附图对本发明作进一步详细说明。
一种芯片旋转共晶焊接台，参考图1和图2，包括底板30，所述底板30上固定有吸嘴移动平台和焊台移动平台，所述吸嘴移动平台上设置有一驱动旋转吸嘴10在竖直面旋转吸嘴旋转电机7，所述焊台移动平台上设置有一驱动共晶焊台水平旋转的焊台旋转电机23，所述旋转吸嘴10包括周向均匀设置的四个真空吸嘴9，所述共晶焊台上设置有二个焊台15、4，所述焊台的管座进料孔周向设置，所述真空吸嘴9上吸附有管座8，所述吸嘴移动平台平动将真空吸嘴9上吸附的管座8从管座进料孔送入焊台4内，垫片搬运吸嘴从上方将垫片送入管座8的底座上进行共晶焊接，然后芯片搬运吸嘴从上方将芯片送入垫片上进行共晶焊接，最后真空吸嘴9退出，焊台旋转电机23驱动共晶焊台水平旋转使另一个空焊台15转到焊接位。
本共晶焊接台设置有能竖直方向旋转的旋转吸嘴10以及能在水平面旋转的共晶焊台，旋转吸嘴10周向均匀设置的四个真空吸嘴9，共晶焊台上设置有二个焊台15、4，旋转吸嘴10使其中一个真空吸嘴的正对其中一个焊台的管座进料孔，此时另一个空的真空吸嘴竖直朝上，旋转吸嘴10水平移动将真空吸嘴9上的吸附的管座8从侧面送入焊台4内，垫片搬运吸嘴从上方将垫片送入管座8的底座上进行共晶焊接，然后芯片搬运吸嘴从上方将芯片送入垫片上进行共晶焊接，此时搬运吸嘴将管座放入竖直朝上的真空吸嘴内，另一搬运机构同时将焊台15的成品搬开，最后真空吸嘴9水平退出，旋转旋转吸嘴10使另一个吸附有管座的真空吸嘴的正对焊台的管座进料孔，焊台旋转电机23驱动共晶焊台水平旋转使另一个空焊台15转到焊接位，反复进行，从而旋转吸嘴10和共晶焊台可同步进行上料焊接和下料焊接的工作，提高了加工效率，同时设备占用场所面积也更小。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，吸嘴移动平台包括固定在底板的平移轨道13，所述平移轨道13上水平滑动设置有由平移电机14驱动的吸嘴旋转电机固定座12，所述吸嘴旋转电机7固定在吸嘴旋转电机固定座12上。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，平移轨道13一设置有限定吸嘴旋转电机固定座12位置的限位气缸11。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，焊台移动平台包括由X向电机驱动25的能在底板30上X向水平滑动的X向滑台29以及由Y向电机驱动26的能在X向滑台29上Y向水平滑动的Y向滑台27，所述焊台旋转电机23通过安装块24固定在Y向滑台27上。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，X向滑台29上设置有能检测X向滑台29位置的X向位置传感器31，所述Y向滑台27上设置有能检测Y向滑台27位置的Y向位置传感器28。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，共晶焊台包括固定在焊台旋转电机23驱动轴上的焊台安装座22，所述焊台安装座22的中间安装有一条形中隔热块17，所述中隔热块17二侧中心对称设置有左隔热块21和右隔热块6，所述中隔热块17和左隔热块21上方支撑设置有左焊台15，所述中隔热块17和右隔热块6上方支撑设置有右焊台4，所述左焊台15和右焊台4内分别设置有加热片3，所述左焊台15和右焊台4由一焊台防护盖1包围，所述焊台防护盖1对应左焊台15和右焊台4分别设置有周向的管座进料孔以及上方的芯片进料孔。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，焊台安装座22上还对称固定有用于支撑焊台防护盖1的二焊台防护盖支撑杆5。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，左焊台15和右焊台4下方分别设置有焊台支撑片16，上方设置有焊台防护框2。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，左焊台15和右焊台4下方分别设置有伸入管座进料孔边的产品定位杆18。
本发明的芯片旋转共晶焊接台，参考图1和图2，在前面技术方案的基础上具体是，产品定位杆18固定在Z向定位块19上，所述Z向定位块19通过Y向定位块20固定在焊台安装座22上。
以上是对本发明芯片旋转共晶焊接台进行了阐述，用于帮助理解本发明，但本发明的实施方式并不受上述实施例的限制，任何未背离本发明原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。

Claims (10)

1.一种芯片旋转共晶焊接台，其特征在于：包括底板，所述底板上固定有吸嘴移动平台和焊台移动平台，所述吸嘴移动平台上设置有一驱动旋转吸嘴在竖直面旋转吸嘴旋转电机，所述焊台移动平台上设置有一驱动共晶焊台水平旋转的焊台旋转电机，所述旋转吸嘴包括周向均匀设置的四个真空吸嘴，所述共晶焊台上至少设置有二个焊台，所述焊台的管座进料孔周向设置，所述真空吸嘴上吸附有管座，所述吸嘴移动平台平动将真空吸嘴上吸附的管座从管座进料孔送入焊台内，垫片搬运吸嘴从上方将垫片送入管座的底座上进行共晶焊接，然后芯片搬运吸嘴从上方将芯片送入垫片上进行共晶焊接，最后真空吸嘴退出，焊台旋转电机驱动共晶焊台水平旋转使另一个空焊台转到焊接位。
2.根据权利要求1所述芯片旋转共晶焊接台，其特征在于：所述吸嘴移动平台包括固定在底板的平移轨道，所述平移轨道上水平滑动设置有由平移电机驱动的吸嘴旋转电机固定座，所述吸嘴旋转电机固定在吸嘴旋转电机固定座上。
3.根据权利要求2所述芯片旋转共晶焊接台，其特征在于：所述平移轨道设置有限定吸嘴旋转电机固定座位置的限位气缸。
4.根据权利要求1所述芯片旋转共晶焊接台，其特征在于：所述焊台移动平台包括由X向电机驱动的能在底板上X向水平滑动的X向滑台以及由Y向电机驱动的能在X向滑台上Y向水平滑动的Y向滑台，所述焊台旋转电机固定在Y向滑台上。
5.根据权利要求4所述芯片旋转共晶焊接台，其特征在于：所述X向滑台上设置有能检测X向滑台位置的X向位置传感器，所述Y向滑台上设置有能检测Y向滑台位置的Y向位置传感器。
6.根据权利要求1所述芯片旋转共晶焊接台，其特征在于：所述共晶焊台包括固定在焊台旋转电机驱动轴上的焊台安装座，所述焊台安装座的中间安装有一条形中隔热块，所述中隔热块二侧中心对称设置有左隔热块和右隔热块，所述中隔热块和左隔热块上方支撑设置有左焊台，所述中隔热块和右隔热块上方支撑设置有右焊台，所述左焊台和右焊台内分别设置有左加热片和右热片，所述左焊台和右焊台由一焊台防护盖包围，所述焊台防护盖对应左焊台和右焊台分别设置有周向的管座进料孔以及上方的芯片进料孔。
7.根据权利要求6所述芯片旋转共晶焊接台，其特征在于：所述焊台安装座上还对称固定有用于支撑焊台防护盖的二焊台防护盖支撑杆。
8.根据权利要求6所述芯片旋转共晶焊接台，其特征在于：所述左焊台和右焊台下方分别设置有焊台支撑片。
9.根据权利要求6所述芯片旋转共晶焊接台，其特征在于：所述左焊台和右焊台下方分别设置有伸入管座进料孔边的产品定位杆。
10.根据权利要求9所述芯片旋转共晶焊接台，其特征在于：所述产品定位杆固定在Z向定位块上，所述Z向定位块通过Y向定位块固定在焊台安装座上。
CN201710407869.1A 2017-06-02 2017-06-02 芯片旋转共晶焊接台 Active CN107424951B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201710407869.1A CN107424951B (zh) 2017-06-02 2017-06-02 芯片旋转共晶焊接台
KR1020187029862A KR102165651B1 (ko) 2017-06-02 2017-10-17 칩 회전 공정용접대
JP2018556482A JP6638090B2 (ja) 2017-06-02 2017-10-17 チップ回転共晶溶接台
PCT/CN2017/106399 WO2018218849A1 (zh) 2017-06-02 2017-10-17 芯片旋转共晶焊接台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710407869.1A CN107424951B (zh) 2017-06-02 2017-06-02 芯片旋转共晶焊接台

Publications (2)

Publication Number Publication Date
CN107424951A true CN107424951A (zh) 2017-12-01
CN107424951B CN107424951B (zh) 2023-08-18

Family

ID=60429346

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710407869.1A Active CN107424951B (zh) 2017-06-02 2017-06-02 芯片旋转共晶焊接台

Country Status (4)

Country Link
JP (1) JP6638090B2 (zh)
KR (1) KR102165651B1 (zh)
CN (1) CN107424951B (zh)
WO (1) WO2018218849A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109332947A (zh) * 2018-10-29 2019-02-15 广东瑞谷光网通信股份有限公司 一种共晶焊接台的旋转夹取装置
CN112192067A (zh) * 2020-09-03 2021-01-08 安徽蓝德正华电子有限公司 一种仪器仪表生产用快速焊接装置及其操作方法
CN112614804A (zh) * 2020-11-30 2021-04-06 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 加热吸盘组件以及芯片拼接装置
CN114883223A (zh) * 2022-05-23 2022-08-09 江苏新智达新能源设备有限公司 一种半导体共晶焊的封装装置
CN116072589A (zh) * 2023-03-07 2023-05-05 苏州易缆微光电技术有限公司 集成光模块封装设备
CN117798567A (zh) * 2024-02-29 2024-04-02 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种快速升降温共晶焊接台
CN117798567B (zh) * 2024-02-29 2024-06-04 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种快速升降温共晶焊接台

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110181140B (zh) * 2019-05-31 2024-02-27 广东瑞谷光网通信股份有限公司 一种ld芯片共晶焊接系统
CN110434417B (zh) * 2019-08-28 2024-04-09 苏州猎奇智能设备有限公司 一种能保持压紧力恒定的高精度共晶焊接设备
CN115870717A (zh) * 2019-10-29 2023-03-31 江苏凯尔生物识别科技有限公司 电子设备芯片的加工装置
CN111916375B (zh) * 2020-08-12 2024-03-26 深圳市诺泰芯装备有限公司 转塔式芯片无胶固晶机
CN112216632B (zh) * 2020-09-24 2024-04-19 广东海信宽带科技有限公司 一种ld芯片共晶焊接台
CN114530755B (zh) * 2020-10-30 2023-07-21 山东华光光电子股份有限公司 一种半导体激光器用管座的调距移载装置及使用方法
CN112992730B (zh) * 2021-02-04 2022-06-14 中国电子科技集团公司第二十四研究所 半密闭共晶贴片装置及共晶贴片方法
CN114171432B (zh) * 2021-11-09 2023-10-31 恩纳基智能科技无锡有限公司 一种半导体芯片焊接用加热输送机构
CN114535148B (zh) * 2022-01-17 2024-02-09 广东气派科技有限公司 一种适用于重力式分选机的压测装置
CN114538093A (zh) * 2022-03-22 2022-05-27 苏州天弘激光股份有限公司 一种旋转上料机构
CN116013805B (zh) * 2022-04-02 2023-11-21 佑光智能半导体科技(深圳)有限公司 一种共晶机
CN114799389B (zh) * 2022-04-26 2023-12-22 浙江雅晶电子有限公司 一种to管座共晶焊接机
CN115831828B (zh) * 2023-02-15 2023-05-23 山东睿芯半导体科技有限公司 一种芯片的固化封装设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243292A (ja) * 1992-02-28 1993-09-21 Nec Kyushu Ltd Ｌｏｃ用ダイボンダ
JP2004327586A (ja) * 2003-04-23 2004-11-18 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法
CN103537831A (zh) * 2013-11-14 2014-01-29 无锡联创薄板有限公司 旋转焊台
KR20140044721A (ko) * 2012-10-05 2014-04-15 삼성테크윈 주식회사 부품 실장 장치
CN103769778A (zh) * 2013-11-18 2014-05-07 深圳盛世天予科技发展有限公司 Led封装的共晶焊台
CN203696312U (zh) * 2014-01-03 2014-07-09 深圳市大族激光科技股份有限公司 多工位焊接台及其旋转夹具
CN206931583U (zh) * 2017-06-02 2018-01-26 广东瑞谷光网通信股份有限公司 芯片旋转共晶焊接台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5076108B2 (ja) * 2008-10-03 2012-11-21 アキム株式会社 溶接リングの仮付け装置、及び溶接リングの仮付け方法
CN203367253U (zh) * 2013-07-30 2013-12-25 万世扬工业股份有限公司 改良的固晶机分料系统
CN203649679U (zh) * 2013-11-18 2014-06-18 深圳盛世天予科技发展有限公司 Led封装的共晶焊台
CN104377159A (zh) * 2014-11-14 2015-02-25 江苏博普电子科技有限责任公司 一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴
CN206139958U (zh) * 2016-09-08 2017-05-03 广东瑞谷光网通信股份有限公司 一种光纤收发模块封帽设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243292A (ja) * 1992-02-28 1993-09-21 Nec Kyushu Ltd Ｌｏｃ用ダイボンダ
JP2004327586A (ja) * 2003-04-23 2004-11-18 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法
KR20140044721A (ko) * 2012-10-05 2014-04-15 삼성테크윈 주식회사 부품 실장 장치
CN103537831A (zh) * 2013-11-14 2014-01-29 无锡联创薄板有限公司 旋转焊台
CN103769778A (zh) * 2013-11-18 2014-05-07 深圳盛世天予科技发展有限公司 Led封装的共晶焊台
CN203696312U (zh) * 2014-01-03 2014-07-09 深圳市大族激光科技股份有限公司 多工位焊接台及其旋转夹具
CN206931583U (zh) * 2017-06-02 2018-01-26 广东瑞谷光网通信股份有限公司 芯片旋转共晶焊接台

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
巫建华;: "薄膜基板芯片共晶焊技术研究", 电子与封装, no. 06, pages 9 - 13 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109332947A (zh) * 2018-10-29 2019-02-15 广东瑞谷光网通信股份有限公司 一种共晶焊接台的旋转夹取装置
CN112192067A (zh) * 2020-09-03 2021-01-08 安徽蓝德正华电子有限公司 一种仪器仪表生产用快速焊接装置及其操作方法
CN112192067B (zh) * 2020-09-03 2022-05-13 安徽蓝德正华电子有限公司 一种仪器仪表生产用快速焊接装置及其操作方法
CN112614804A (zh) * 2020-11-30 2021-04-06 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 加热吸盘组件以及芯片拼接装置
CN114883223A (zh) * 2022-05-23 2022-08-09 江苏新智达新能源设备有限公司 一种半导体共晶焊的封装装置
CN114883223B (zh) * 2022-05-23 2023-09-05 江苏新智达新能源设备有限公司 一种半导体共晶焊的封装装置
CN116072589A (zh) * 2023-03-07 2023-05-05 苏州易缆微光电技术有限公司 集成光模块封装设备
CN117798567A (zh) * 2024-02-29 2024-04-02 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种快速升降温共晶焊接台
CN117798567B (zh) * 2024-02-29 2024-06-04 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种快速升降温共晶焊接台

Also Published As

Publication number Publication date
JP2019521504A (ja) 2019-07-25
KR102165651B1 (ko) 2020-10-14
JP6638090B2 (ja) 2020-01-29
KR20190002451A (ko) 2019-01-08
WO2018218849A1 (zh) 2018-12-06
CN107424951B (zh) 2023-08-18

Similar Documents

Publication Publication Date Title
CN107424951A (zh) 芯片旋转共晶焊接台
CN107195576B (zh) 芯片xy移动、角度校正、顶取机构
CN102294591B (zh) 膨胀螺栓自动组装机
CN104332439B (zh) 一种晶片盘推送装置
CN106424919A (zh) 一种管材的自动送料及切割机构
CN206393062U (zh) 一种太阳能电池片划片机
CN206931566U (zh) 高温定位加热台
CN110181140A (zh) 一种ld芯片共晶焊接系统
CN206931583U (zh) 芯片旋转共晶焊接台
CN107933992A (zh) 一种基于牙刷吸塑包装设备的牙刷包装方法
CN105014373A (zh) 一种电蚊香组件自动装配装置
CN207521776U (zh) 具有自动换刀系统的通用瓶口模具铣丝机床
CN105501534A (zh) 一种自动分盒装置
CN111617982A (zh) 一种新型工业电池加工设备及其使用方法
CN105583542B (zh) 一种滤清器内外网自动焊接装置
CN107127420A (zh) Ld芯片焊接移位机构
CN107457493A (zh) 一种多工位快速上料的数控激光切割机
CN208276336U (zh) 组件电阻焊接机
CN206306365U (zh) 一种滑台
CN216140842U (zh) 一种焊缝检测设备
CN206931834U (zh) Ld芯片共晶焊接系统
CN206931581U (zh) 芯片xy移动、角度校正、顶取机构
CN212350692U (zh) 一种插接件激光焊锡球装置
CN211810429U (zh) 带检测功能的工件自动包装装置
CN207309149U (zh) Ld芯片焊接移位机构

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant