CN107405075B - 用于光学探针的折叠柔性电路 - Google Patents

用于光学探针的折叠柔性电路 Download PDF

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CN107405075B
CN107405075B CN201680008699.3A CN201680008699A CN107405075B CN 107405075 B CN107405075 B CN 107405075B CN 201680008699 A CN201680008699 A CN 201680008699A CN 107405075 B CN107405075 B CN 107405075B
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flexible circuit
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约翰·施米特
本杰明·特里曼
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Myxinuo
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/22Secondary treatment of printed circuits
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    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/0059Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence
    • AHUMAN NECESSITIES
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    • A61B5/145Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/1455Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
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    • A61B5/00Measuring for diagnostic purposes; Identification of persons
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    • A61B5/1455Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • A61B5/14551Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
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    • A61B5/68Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/683Means for maintaining contact with the body
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    • A61B5/6833Adhesive patches
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
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    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0233Special features of optical sensors or probes classified in A61B5/00
    • A61B2562/0238Optical sensor arrangements for performing transmission measurements on body tissue
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    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16Details of sensor housings or probes; Details of structural supports for sensors
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/164Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted in or on a conformable substrate or carrier
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
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    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/166Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/18Shielding or protection of sensors from environmental influences, e.g. protection from mechanical damage
    • A61B2562/182Electrical shielding, e.g. using a Faraday cage
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/02Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/026Measuring blood flow
    • A61B5/0261Measuring blood flow using optical means, e.g. infrared light
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    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10151Sensor
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
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    • HELECTRICITY
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Abstract

描述了各种传感器和组装传感器的方法。在一些实施方式中,传感器组件包括第一端部、本体部分和第二端部。第一端部可以包括颈部部分和连接器部分,并且第二端部可以包括翼片、第一部件、颈部部分和第二部件。还描述了用于传感器折叠的方法。该方法可以包括使用具有附接的发射器和检测器的电路,其中发射器和检测器由电路的一部分分开。该方法还可以包括折叠电路的所述一部分使得通过发射器产生第一折叠,以及折叠电路的所述一部分使得产生第二折叠,使得第一折叠和第二折叠形成角度。

Description

用于光学探针的折叠柔性电路
通过引用任何优先权申请的合并
本申请根据35U.S.C.§119(e)要求于2015年2月6日提交的美国临时申请第62/112,918号和于2015年8月31日提交的美国临时申请第62/212,071号的优先权权益,上述两个美国临时申请的全部内容在此通过引用并入,并且应当被认为是本说明书的一部分。根据37 CFR 1.57,与本申请一起提交的申请资料表单中识别为针对其要求外国或本国优先权的任何和所有申请在此通过引用并入。
技术领域
本公开内容涉及低噪声、可处理的且可重复使用的光学探针,其可以用于感测通过介质的光能以确定介质的特性。
背景技术
能量可以透射通过介质或从介质反射以确定介质的特性。例如,在医疗领域中,不是从患者的身体提取物质进行测试,而是可以使光或声能量入射在患者的身体上,并且可以测量透射(或反射)的能量来确定关于能量通过的物质的信息。这种类型的非侵入性测量对于患者而言更舒适并且可以实时地执行。
经常需要对身体功能进行非侵入性生理监测。例如,在手术期间,经常监测血压和身体的可用氧气供应或者血氧饱和度。诸如这些的测量经常利用非侵入性技术来执行,在该非侵入性技术中,通过测量入射的光与通过身体部位例如诸如手指的指头或耳垂或额头透射(或反射)的光之比来进行评估。
对被适当地构造成提供要输出至信号处理器的低噪声信号以便确定介质的特性的可处理的且可重复使用的光学探针的需求已经增加。在低成本地提供这种光学探针时遇到了与运动引起的噪声有关的许多难题。因此,存在对低成本、低噪声的光学探针以及高效制造这种探针的方法的需要。
发明内容
本公开内容公开了一种用于在非侵入性光学测量中使用的探针。本公开内容的一个方面是用于介质特性的非侵入性测量的光学探针,其中,探针具有发射光辐射的发射器和被配置成检测由发射器发射的光辐射的检测器。探针还具有柔性电路组件,该柔性电路组件具有用于与发射器和检测器连接的电路路径。
本公开内容描述了一种低成本传感器以及用于针对柔性印刷电路和其它传感器材料的使用优化材料使用的精简组装方法。在一些实施方式中,传感器的配置旨在使所使用的材料的量最大化,以保持材料成本最小。
在一个有利的实施方式中,制造的柔性电路可以折叠成许多不同的配置,同时保持原始柔性电路的性质和完整性。以这种方式,可以使用相同的精简组装方法来制造具有多种配置的柔性电路。
附图说明
图1A示出了用于在传感器组件中使用的柔性电路的实施方式的顶视图。
图1B示出了用于在传感器组件中使用的柔性电路的实施方式的底视图。
图2A示出了柔性印刷电路板阵列的一个实施方式的顶视图。
图2B至图2C示出了传感器组件的一个端部的顶视图和底视图。
图3A示出了传感器组件的实施方式的分解视图。
图3B示出了包括形成图2中所示的柔性印刷电路板阵列的一部分的多个嵌套顶板屏蔽件的片材的一个实施方式。
图3C示出了包括形成图2中所示的柔性印刷电路板阵列的一部分的顶板覆盖膜的片材的一个实施方式。
图3D示出了包括形成图2中所示的柔性印刷电路板阵列的一部分的多个嵌套迹线的“片材”的一个实施方式。
图3E示出了包括形成图2中所示的柔性印刷电路阵列的一部分的多个嵌套底覆盖膜的片材的一个实施方式。
图3F示出了包括形成图2中所示的柔性印刷电路阵列的一部分的多个嵌套底板屏蔽件的片材的一个实施方式。
图4A示出了在传感器组件的一个实施方式中使用的屏蔽栅格的第一实施方式的顶视图。
图4B示出了在传感器组件的一个实施方式中使用的屏蔽栅格的第二实施方式的顶视图。
图4C示出了在传感器组件的一个实施方式中使用的屏蔽栅格的第三实施方式的顶视图。
图4D示出了在传感器组件的一个实施方式中使用的屏蔽栅格的第四实施方式的顶视图。
图4E示出了在传感器组件的一个实施方式中使用的屏蔽栅格的第五实施方式的顶视图。
图5A至图5D示出了传感器组件的一个实施方式。
图6A示出了说明传感器折叠方法的实施方式的流程图。
图6B示出了传感器折叠方法中的在传感器折叠之前的传感器组件的实施方式。
图6C示出了传感器折叠方法中的第一步骤,其中,传感器的颈部在第一方向上弯曲。
图6D示出了传感器折叠方法中的第二步骤,其中,传感器的颈部在第二方向上弯曲。
具体实施方式
本公开内容提供了一种低成本传感器以及组装和制造该低成本传感器的方法。在一些实施方式中,传感器电路被配置成使得用于多个传感器中的每个传感器的柔性电路中的每个柔性电路在其被制造时彼此镶嵌或嵌套。在一些实施方式中,该配置使可以由一组材料制造和组装的电路的数量最大化。这样的配置还使浪费的材料量最小化。
本公开内容还描述了一种用于由直传感器组装L形传感器或弯曲传感器的方法。用于L形传感器的先前的制造方法产生了巨大的浪费,因为L形传感器的轮廓阻止了柔性电路以交错的形式印刷以最大化基板材料的使用。通过由直传感器组装L形传感器,使柔性电路的轮廓最小化,因此使浪费的量最小化。下面描述的折叠方法使得能够由直传感器制造多种不同的传感器形状。
图1至图2示出了传感器组件的柔性电路100的各种视图。图1A至图1B示出了传感器的柔性电路100的一个实施方式。图1A示出了柔性电路100的顶视图。柔性电路100具有检测器端部110和连接器端部120。图1B示出了柔性电路100以及相应的检测器端部110和连接器端部120的底视图。可以看出,柔性电路100通常是线性的并且具有最小轮廓,这可以有助于使可以印刷在基板材料上的柔性电路的数量最大化。
在一些实施方式中,柔性电路100的配置可以被配置成使所使用的基板材料最大化并且使浪费最小化。图2A示出了柔性印刷电路板阵列200,其包括与第二行柔性电路204嵌套的第一行柔性电路202。在一些示例中,第一行柔性电路202和第二行柔性电路204可以相同。
如图2A所示,第一行柔性电路202和第二行柔性电路204可以包括连接器端部208和检测器端部206。在一些实施方式中,第一行柔性电路202和第二行柔性电路204被配置成使得:在柔性印刷电路板阵列200的一端,第一行柔性电路202的连接器端部208邻近于第二行柔性电路204的检测器端部206,而在另一端,第二行柔性电路202的连接器端部208邻近于第一行柔性电路204的检测器端部206。
除了嵌套配置以外,每个柔性电路100具有沿其长度均匀的本体部分232,这可以提供高效的加工。如图2所示,均匀的本体部分232使得多个柔性电路100能够成行地对准。同样地,本体部分232的直线需要单次直线切割以将每个柔性电路100与相邻的柔性电路100分离。
如上所指出的,第一和第二行柔性电路的嵌套配置通过每基板片材产生更高的产量而显著减少了基板材料的浪费并且提高了生产速度。在一些示例中,用于形成每个柔性电路100的原始基板材料的百分比大于80%,并且可以高达95%以及其间的任何百分比。在一些实施方式中,浪费的百分比低达5%至20%或其间的任何百分比。在其他示例中,柔性印刷电路板阵列200的高达95%的材料可以用于形成每个柔性电路100。
在一些实施方式中,每个柔性电路100可以由多个层形成。图3A示出了提供柔性电路100的构造视图的分解柔性电路100的透视图。在一些实施方式中,柔性电路100包括印刷在底覆盖膜218上的迹线(trace)216。迹线216可以包括铜涂层,而底覆盖膜218可以包括聚酰亚胺材料。在一些示例中,顶板覆盖膜214可以层叠在印刷有迹线216的底覆盖膜218的上方。顶板覆盖膜可以用作216上方的保护层。如下面将更详细地讨论的,顶板覆盖膜可以包括关键开口以暴露下方迹线216,从而形成柔性电路100的表面上的电连接。
柔性电路还可以包括在柔性电路100的顶表面和底表面上的屏蔽层以保护迹线216的完整性并且将迹线216与外部因素如无线电波、电磁场和静电场隔离。如图3A所示,柔性电路100可以包括层叠在顶板覆盖膜214上方的顶板屏蔽件212和层叠在底覆盖膜218下方的底板屏蔽件220。
上述层中的每个层可以具有嵌套构造以形成图2中所示的柔性印刷电路板阵列200。例如,图3B示出了包括多个嵌套的顶板屏蔽件212的片材。图3C示出了包括顶板覆盖膜214的片材。图3D示出了包括多个嵌套的迹线216的“片材”。图3E示出了包括多个嵌套的底覆盖膜218的片材。最后,图3F示出了包括多个嵌套的底板屏蔽件220的片材。
柔性电路100可以被配置成附接至多个部件。在一些示例中,柔性电路包括电阻器222、电可擦除可编程只读存储器(“EEPROM”)224、检测器228和发射器226。在一些示例中,发射器226可以是LED。
为了向柔性电路100上的多个电气部件提供电连接,柔性电路的每个层可以包括用于露出迹线216的下方暴露的迹线217的关键开口。例如,顶板覆盖膜214可以包括多个窗口215并且顶板屏蔽件212可以包括窗口213以暴露迹线216的部分。电阻器222和EEPROM224可以在窗口213处附接至柔性电路100,以提供电阻器222与暴露的迹线217之间的电连接以及EEPROM224与暴露的迹线217之间的电连接。
类似地,如图2和图3A所示,柔性电路100可以包括检测器窗口229和发射器开口227以分别容纳检测器228和发射器226。首先转到发射器开口227,柔性电路100可以包括钩状部分以形成发射器窗口227,同时保持柔性电路100的减小的轮廓。如在图2中可以看到的,发射器开口227的配置使得每个柔性电路100能够嵌套在相邻的柔性电路之间以形成镶嵌或嵌套图案。如上所讨论的,这可以使在制造柔性电路100时对基板材料的使用最大化。发射器226可以附接至发射器开口227,使得发射器226可以与迹线216的钩状部分形成电连接。同样地,钩状配置提供了使得由发射器226产生的光能够被发射的圆形开口。
图2B至图2C示出了具有附接的检测器228和发射器226的柔性电路100的检测器端部206的放大视图。图2B示出了柔性电路100的检测器端部206的顶侧面,并且图2C示出了柔性电路100的检测器端部206的底侧面。如上所讨论的,在一些实施方式中,发射器开口227由钩状配置形成,该钩状配置的一端没有机械耦接至柔性电路100的其余部分。发射器开口227的钩状部分可以包括顶部部分227a、第一长度227b和第二长度227d。上述三个部分被配置成形成开口227c。顶部部分227a和第一长度227b形成发射器226可附接到的钩状部分。在一些实施方式中,第二长度227d比第一长度227b长。同样地,在一些实施方式中,顶部部分227a与第二长度227d之间存在距离。在一些实施方式中,为了保持柔性电路100的低轮廓配置,柔性电路的检测器端部206包括使检测器端部206沿柔性电路100的长度居中的有角度部分227e和长度227f。如图2C所示,第一长度227b和第二长度227d形成用于放置发射器226的开口227c。然后,柔性电路100可以包括使柔性电路100的检测器端部206居中的有角度部分227e。
发射器开口227的配置的另一方面是能够使发射器开口227的一部分弯曲。发射器开口227的配置使得柔性电路227能够在第二长度227d处弯曲,使得在发射器开口227处存在弯曲。这可以使得直柔性电路100能够弯曲以形成弯曲柔性电路或L形柔性电路。如将在下面更详细地讨论的,发射器开口227的钩状配置提供了机械解耦,使得柔性电路能够容易地弯曲而不影响附接的发射器226。
接下来转到检测器窗口229,检测器窗口229可以形成在顶板覆盖膜214的表面上以使得来自光源如发射器226的光能够通过检测器窗口229传输至检测器228。在一些实施方式中,检测器窗口229暴露下方迹线216。检测器228可以附接至检测器窗口229,使得检测器228与迹线216形成电连接。
如下面在图4A至图4E中将讨论的,检测器窗口229可以在形状和配置两者上变化,以提供来自光源的变化量的光进入检测器228。每种栅格形状的配置和结构可以允许传输不同量的光以提供柔性电路100的不同功能。
在一些实施方式中,柔性电路100可以包括屏蔽翼片230。在一些实施方式中,柔性电路100的检测器端部206可以形成屏蔽翼片230。在一些实施方式中,屏蔽翼片280可以是由铜片制成的蚀刻的铜屏蔽件。检测器端部206的屏蔽翼片230可以被配置成折叠在检测器228上方以形成法拉第笼。法拉第笼可以提供另外的屏蔽以阻挡外部静电场。
图4A至图4E示出了检测器窗口229的各种实施方式的放大视图。各种屏蔽栅格(shield grid)被设计成保护电路免受电磁噪声干扰,同时允许尽可能多的光通过栅格窗口。图4A至图4E分别示出了第一检测器窗口形状410、第二检测器窗口420、第三检测器窗口形状430、第四检测器窗口形状440和第五检测器窗口形状450。图4A示出了位于柔性电路100的迹线416层的检测器端部303上的第一检测器窗口形状410。第一检测器窗口屏蔽栅格形状410包括具有圆形中心窗口412和多个弧形窗口413的屏蔽栅格本体411以及在窗口的任一侧的电侧接触件414。在第一检测器窗口形状410所示的配置中,圆形中心窗口412位于一对侧接触件414之间的屏蔽栅格本体411的底部的中心。在该配置中,第一检测器窗口形状410还包括围绕圆形中心窗口412间隔开的四个弧形窗口413。在一些实施方式中,第一检测器窗口形状410的圆形中心窗口412允许大部分光通过至检测器,同时仍阻挡电磁干扰。
图4B示出了位于柔性电路100的迹线426层的检测器端部303上的第二检测器窗口形状420。第二检测器窗口形状420包括具有多个窄的圆矩形窗口422的屏蔽栅格本体421以及在多个窄的圆矩形窗口422的任一侧的侧接触件424。在第二检测器窗口形状420所示的配置中,窄的圆矩形窗口422具有四个窄的圆矩形窗口422,该四个窄的圆矩形窗口422位于在屏蔽栅格本体421的任一侧的两个侧接触件424之间的屏蔽栅格本体421上。
图4C示出了位于柔性电路100的迹线436层的检测器端部303上的第三检测器窗口形状430。第三检测器窗口形状430包括屏蔽栅格本体431、中心窗口432、多个矩形窗口433以及在中心窗口的任一侧的侧接触件434。在第三检测器窗口形状430所示的配置中,中心窗口432和多个矩形窗口433位于两个侧接触件434之间的屏蔽栅格本体431的底部的中心。在一些实施方式中,两个矩形窗口433位于中心窗口432的上方和下方。
图4D示出了位于柔性电路100的迹线446的检测器端部303上的第四检测器窗口形状440。第四检测器窗口形状440包括屏蔽栅格本体441、中心窗口442、多个窄矩形窗口443以及在中心窗口442的任一侧的侧接触件444。在第四检测器窗口形状440所示的配置中,窄矩形窗口443和中心窗口442位于两个侧接触件444之间的屏蔽栅格本体441的底部的中心。在一些实施方式中,两个窄矩形窗口443位于中心窗口442的上方和下方。
最后,图4E示出了位于柔性电路100的迹线456的检测器端部303上的第五检测器窗口形状450。第五检测器窗口形状450包括屏蔽栅格本体451、中心窗口452、多个侧接触件454以及在中心窗口452的任一侧的侧接触件454。在第五检测器窗口形状450所示的配置中,中心窗口452和多个梯形窗口453位于屏蔽栅格本体451的底部上。在一些实施方式中,多个梯形窗口453中的每一个位于中心窗口452的一侧,使得梯形窗口的较短端部邻近于中心窗口452的一侧。
两片柔性印刷电路板阵列300的配置提供了要同时组装的较大数量的传感器。当所有部件已经附接并且组装在传感器组件中的每一个上时,传感器组件644中的每一个可以被密封在保护材料中。如图5A至5D所示,在一些实施方式中,传感器组件可以包括顶部部分646和底部部分646。例如,在一些实施方式中,传感器组件644可以用泡沫646层在顶部和底部覆盖。泡沫覆盖物覆盖柔性电路和迹线并且形成从发射器和检测器组件延伸至柔性电路的连接器端部的线缆覆盖物。在一些实施方式中,顶部泡沫646和底部泡沫646可以密封在一起以将柔性电路夹在中间,使得传感器组件完全被泡沫覆盖。
在一些实施方式中,每个传感器组件644可以包括附接成覆盖每个单独的传感器的顶头带(head tape)636和底头带636。在一些实施方式中,顶头带636的大小可以与底头带636的大小相同。在一些实施方式中,顶头带636可以具有印刷在其顶表面上的设计如传感器图案或标志。在一些实施方式中,在将底头带636和顶头带636附接至传感器组件之后,可以层压传感器组件。
每个传感器组件还可以包括底连接器袢扣(tab)和顶连接器袢扣。连接器袢扣为传感器组件644提供了使得传感器644能够附接至连接器的结构。图5A示出了附接有连接器袢扣的传感器组件644的示例。在一些实施方式中,底连接器加强件656可以包括柔性电路配合区域658。在一些实施方式中,传感器644的电阻器端部被放置成使得图2中所讨论的暴露的迹线位于近端舌片657的表面上。柔性电路配合区域658可以被配置成与连接器组件的顶部部分连接。在将传感器644放置在底连接器加强件656上之前,可以对底连接器加强件656施加结合剂如胶或环氧树脂。一旦施加,则可以将传感器644以部件侧朝上的方式放置在底连接器加强件656上。在图5A所示的实施方式中,底连接器加强件656的柔性电路配合区域658部分位于传感器644的任一侧。一旦传感器644附件至底连接器加强件656,则附接连接器袢扣的顶部部分以固定传感器644。在一些实施方式中,顶连接器加强件662的底面具有与柔性电路配合区域658对应的配合区域,使得顶连接器加强件662和柔性电路配合区域658固定在一起。在一些实施方式中,使用锁定机构或紧固件来固定顶连接器加强件662和柔性电路配合区域658。顶连接器加强件662和底连接器加强件656可以通过压配合、过盈配合、卡扣配合等固定在一起。图5B示出了具有组装到传感器644的连接器端部上的连接器加强件652的传感器644。
最后,传感器组件644可以可选地包括印刷衬垫和涂布带(applicator tape)。图5C至图5D示出了具有添加的印刷衬垫和涂布带的传感器644的顶部透视图。图5C提供了传感器644的顶视图以及添加有印刷衬垫664的传感器644的顶视图和透视图。印刷衬垫664可以印刷有各种设计和/或颜色。如在图5C中可以看到的,印刷衬垫664可以足够长以配合传感器组件644的头带636部的长度。图5D示出了具有印刷衬底664和添加的涂布带668的传感器组件644的顶视图和透视图。涂布带668可以具有各种形状和大小。在一些实施方式中,668具有可以配合到印刷衬垫664上的长度和宽度。
如上所述,柔性电路设计的本配置的另一益处是能够由上述线性柔性电路组装弯曲传感器。图6A示出了描述传感器折叠方法500的实施方式的流程图。图6B至图6D示出了与图6中所示的流程图的步骤相对应的传感器折叠方法800。如前所述,尽管图6A至图6D描述了“L形”传感器的形成,但所描述的步骤可以应用于将柔性电路折叠成以大于或小于90度的角度弯曲的传感器。
传感器折叠方法500可以包括块510,块510描述了通过发射器的中心线折叠柔性电路,使得检测器面向第二方向。图6B示出了折叠之前的传感器。如在先前的图中看到的,传感器644包括检测器640、发射器650以及将检测器640与发射器650连接的颈部630。如上所讨论的,颈部630由第二长度227d、有角度部分227e和另一长度227f形成,其中另一长度227f被配置成保持柔性电路100的笔直配置。如上所述,第二长度227d最初与一侧成角度以形成容纳发射器226的开口227c。
在图6B的配置中,检测器640和发射器650两者均面向第一方向,使得检测器窗口和发射器开口两者均面向第二方向。图6C示出了具有通过发射器650的中心线的第一折叠610的传感器644。在该实施方式中,第一折叠610与传感器644的剩余长度成45度角。在其他实施方式中,第一折叠610的角度可以在0度至180度的范围内。第一折叠610在颈部发射器开口中产生折叠,使得检测器640面向第二方向,其中检测器窗口面向第一方向。
一旦形成第一折叠,传感器折叠方法500还可以包括块520,块520描述了第二次折叠柔性电路,使得两个折叠——第一折叠和第二折叠——形成45度角并且检测器现在面向第一方向。图6D示出了L形传感器660的第二折叠620。第二折叠620和第一折叠部610形成折叠角α。在一些实施方式中,折叠角α为45度角。第二折叠620还使检测器640转向,使得检测器640面向第一方向并且检测器窗口面向第二方向。以此方式,检测器640和检测器窗口的方向与其在折叠之前面向相同的方向。在折叠之后,可以添加头带、涂布带和衬垫,以完成与上述传感器相似的传感器。此外,传感器柔性电路的折叠可以在制造过程期间的任何时间发生,并且不限于传感器构造的任何特定顺序。
最后,以上讨论的所有传感器可以被再处理或翻新。对生理传感器的再处理或翻新涉及重复使用现有传感器的大部分。因此,再处理或翻新的传感器具有明显低于制造全新的传感器的材料成本。在一个示例中,可以通过更换传感器的粘合部分并且重复使用感测部件来实现传感器的再处理或翻新。在其他示例中,用于再处理或翻新传感器的过程涉及更换传感器的感测部件。在转让给加利福尼亚州尔弯市的迈心诺公司的、标题为“Reprocessing of a physiological sensor(生理传感器的再处理)”的第8,584,345号美国专利中描述了一个这样的示例,该美国专利通过引用并入本文。
尽管在某些优选实施方式和示例的背景下公开了本公开内容,但本领域技术人员将理解的是,本公开内容超出具体公开的实施方式延伸到本公开内容的其他替选实施方式和/或使用以及其明显的修改和等同方案。另外,尽管已经详细地示出和描述了本公开内容的许多变型,但是基于本公开内容,在本公开内容的范围内的其它修改对于本领域技术人员而言将是明显的。还预期到可以进行实施方式的具体特征和方面的各种组合或子组合,并且其仍落入本公开内容的范围内。因此,应当理解,所公开的实施方式的各种特征和方面可以彼此组合或替代,以便形成所公开的实施方式的变化模式。

Claims (11)

1.一种高效柔性电路生理传感器制造方法,所述方法包括:
提供柔性电路基板材料的片材;
在所述柔性电路基板材料上印刷多个嵌套的导体;以及
切割所述柔性电路基板材料的片材以形成多个柔性电路,
其中,所述多个柔性电路中的每一个具有连接器端部和检测器端部,
其中,所述多个柔性电路在所述柔性电路基板材料的片材上被对准,使得所述多个柔性电路中的一个柔性电路嵌套到相邻的柔性电路之间以形成镶嵌图案,
其中,所述多个柔性电路中的一个柔性电路的连接器端部邻近于所述多个柔性电路中的另一个柔性电路的检测器端部。
2.根据权利要求1所述的高效柔性电路生理传感器制造方法,其中,所述多个柔性电路中的每一个还包括:
本体部分;以及
传感器放置部分,
其中,所述传感器放置部分包括翼片、第一部件、颈部部分和第二部件。
3.根据权利要求2所述的高效柔性电路生理传感器制造方法,还包括在所述第一部件的上方折叠所述翼片。
4.根据权利要求2所述的高效柔性电路生理传感器制造方法,其中,所述第一部件是检测器。
5.根据权利要求4所述的高效柔性电路生理传感器制造方法,其中,所述第二部件是发射器。
6.根据权利要求4所述的高效柔性电路生理传感器制造方法,还包括由所述颈部部分和附接至所述颈部部分的弯曲部分形成钩状结构。
7.根据权利要求1所述的高效柔性电路生理传感器制造方法,其中,所形成的多个柔性电路包括所述柔性电路基板材料的片材的80%至95%。
8.根据权利要求1所述的高效柔性电路生理传感器制造方法,还包括:
使用包括具有附接至远端的检测器和发射器的电路的传感器,其中,所述发射器和所述检测器通过所述电路的一部分分开;
将所述电路的所述一部分至少折叠一次,使得产生第一折叠以与所述传感器的除了所述电路以外的部分形成角度。
9.根据权利要求8所述的高效柔性电路生理传感器制造方法,还包括:折叠所述电路的所述一部分,使得产生第二折叠,其中,所述第一折叠和第二折叠形成角度。
10.根据权利要求8至9中任一项所述的高效柔性电路生理传感器制造方法,其中,所述第一折叠形成L形。
11.根据权利要求10所述的高效柔性电路生理传感器制造方法,其中,所述角度为45度角。
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