CN1073907C - 半导体片抛光设备及方法 - Google Patents

半导体片抛光设备及方法 Download PDF

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Publication number
CN1073907C
CN1073907C CN95193037A CN95193037A CN1073907C CN 1073907 C CN1073907 C CN 1073907C CN 95193037 A CN95193037 A CN 95193037A CN 95193037 A CN95193037 A CN 95193037A CN 1073907 C CN1073907 C CN 1073907C
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CN
China
Prior art keywords
polishing
semiconductor wafer
block
polishing block
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN95193037A
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English (en)
Chinese (zh)
Other versions
CN1147782A (zh
Inventor
哈罗德·J·希尔曼
罗伯特·J·沃尔什
托马斯·A·沃尔什
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SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of CN1147782A publication Critical patent/CN1147782A/zh
Application granted granted Critical
Publication of CN1073907C publication Critical patent/CN1073907C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN95193037A 1994-05-13 1995-04-19 半导体片抛光设备及方法 Expired - Lifetime CN1073907C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/242,560 1994-05-13
US08/242,560 US5605487A (en) 1994-05-13 1994-05-13 Semiconductor wafer polishing appartus and method

Publications (2)

Publication Number Publication Date
CN1147782A CN1147782A (zh) 1997-04-16
CN1073907C true CN1073907C (zh) 2001-10-31

Family

ID=22915284

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95193037A Expired - Lifetime CN1073907C (zh) 1994-05-13 1995-04-19 半导体片抛光设备及方法

Country Status (9)

Country Link
US (1) US5605487A (enExample)
EP (1) EP0758941B1 (enExample)
JP (2) JPH10501098A (enExample)
KR (1) KR100371762B1 (enExample)
CN (1) CN1073907C (enExample)
DE (1) DE69524404T2 (enExample)
MY (1) MY116349A (enExample)
TW (1) TW278211B (enExample)
WO (1) WO1995031309A1 (enExample)

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JP3467184B2 (ja) * 1998-02-05 2003-11-17 信越半導体株式会社 ワークの研磨方法
KR100306824B1 (ko) * 1998-05-06 2001-11-30 윤종용 화학적기계적평탄화기계를위한웨이퍼홀더
US6712672B1 (en) * 1998-05-06 2004-03-30 Samsung Electronics Co., Ltd. Clamping wafer holder for chemica-mechanical planarization machines and method for using it
US6113465A (en) * 1998-06-16 2000-09-05 Speedfam-Ipec Corporation Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context
US6602380B1 (en) 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
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US6325696B1 (en) 1999-09-13 2001-12-04 International Business Machines Corporation Piezo-actuated CMP carrier
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US20040072225A1 (en) * 2000-08-15 2004-04-15 Incyte Corporation Microarray retrieval unit
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CN1461251A (zh) * 2000-11-21 2003-12-10 Memc电子材料有限公司 半导体晶片,抛光装置和方法
US20030064902A1 (en) * 2001-10-03 2003-04-03 Memc Electronic Materials Inc. Apparatus and process for producing polished semiconductor wafers
US6712673B2 (en) 2001-10-04 2004-03-30 Memc Electronic Materials, Inc. Polishing apparatus, polishing head and method
JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US6804579B1 (en) * 2002-10-16 2004-10-12 Abb, Inc. Robotic wash cell using recycled pure water
WO2004095516A2 (en) * 2003-04-21 2004-11-04 Inopla Inc. Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
US11260500B2 (en) * 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
CN1910012B (zh) * 2003-11-13 2012-03-21 应用材料公司 具有成型表面的固定环
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US20050157308A1 (en) * 2004-01-15 2005-07-21 Andrei Brunfeld Apparatus and method for measuring thickness variation of wax film
JP2006237492A (ja) * 2005-02-28 2006-09-07 Dainippon Screen Mfg Co Ltd ウエハ処理装置
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
KR101075053B1 (ko) * 2006-02-22 2011-10-21 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판반송장치, 기판파지장치, 및 약액처리장치
CN100400233C (zh) * 2006-05-26 2008-07-09 中国科学院上海技术物理研究所 Ⅱ-ⅵ族半导体材料保护侧边缘的表面抛光方法
WO2008005325A2 (en) * 2006-06-30 2008-01-10 Entegris, Inc. Wafer carrier docking station
DE102009030292B4 (de) * 2009-06-24 2011-12-01 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
CN101712130B (zh) * 2009-12-22 2012-11-14 中国电子科技集团公司第四十五研究所 应用于硅片化学机械抛光设备中的定位转换装置
JP5099111B2 (ja) * 2009-12-24 2012-12-12 信越半導体株式会社 両面研磨装置
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
CN102615583A (zh) * 2011-01-28 2012-08-01 鸿富锦精密工业（深圳）有限公司 研磨装置
JP5821210B2 (ja) * 2011-02-22 2015-11-24 セイコーエプソン株式会社 水平多関節ロボット及び水平多関節ロボットの制御方法
JP5817142B2 (ja) * 2011-02-22 2015-11-18 セイコーエプソン株式会社 水平多関節ロボット
KR101838109B1 (ko) * 2011-12-06 2018-03-14 삼성전자주식회사 컨택터 및 이를 포함하는 반도체 테스트 장치
WO2013119261A1 (en) * 2012-02-09 2013-08-15 Duescher Wayne O Coplanar alignment apparatus for rotary spindles
ES1078824Y (es) * 2013-02-08 2013-06-10 Matriruiz S L Conjunto de medios mecánicos incorporables a un robot delta para realización de engomado de tapas
KR101446721B1 (ko) * 2013-07-09 2014-10-06 주식회사 엘지실트론 연마용 블록에 웨이퍼를 마운팅하는 방법
US9382801B2 (en) 2014-02-26 2016-07-05 General Electric Company Method for removing a rotor bucket from a turbomachine rotor wheel
US10654145B2 (en) 2015-06-30 2020-05-19 Globalwafers Co., Ltd. Methods and systems for polishing pad control
CN108584321A (zh) * 2018-04-09 2018-09-28 浙江理工大学 一种滑触线的安装装置和方法
CN108705438A (zh) * 2018-07-18 2018-10-26 四川三虎家居有限公司重庆分公司 一种家具板材用抛光装置
CN109623658B (zh) * 2018-12-26 2024-07-23 浙江杰奈尔新材料有限公司 一种研磨机用清洗装置
CN109877694B (zh) * 2019-03-04 2023-08-08 天通日进精密技术有限公司 晶圆边缘抛光装置及晶圆边缘抛光方法
CN110328606A (zh) * 2019-06-27 2019-10-15 浙江晶盛机电股份有限公司 一种全自动一体式单片单面研磨减薄设备
KR102262803B1 (ko) * 2019-07-10 2021-06-09 주식회사 에스피에스테크 웨이퍼용 cmp 시스템
KR102258721B1 (ko) * 2019-08-28 2021-05-28 에스케이실트론 주식회사 웨이퍼 마운팅 장치 및 그 동작 방법
CN113059453B (zh) * 2019-12-31 2024-06-18 浙江芯晖装备技术有限公司 一种抛光设备
CN111673607B (zh) * 2020-04-28 2021-11-26 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
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KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
WO2024004535A1 (ja) * 2022-06-29 2024-01-04 株式会社フジキン コントロール弁のシートリーク検知方法
CN115741453B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种多传感器融合的智能双面研磨机
KR102860594B1 (ko) * 2023-06-17 2025-09-17 주식회사 문성엠에스케이 반도체 웨이퍼 제조용 파츠 가공장치
CN116854467B (zh) * 2023-07-12 2024-10-29 江西兆驰半导体有限公司 一种生瓷复合材料及用其制备晶圆搬运臂的制备方法
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CN117457548B (zh) * 2023-12-22 2024-03-22 北京特思迪半导体设备有限公司 晶圆贴片装置及晶圆无蜡抛光上料设备
KR102702556B1 (ko) * 2024-06-10 2024-09-04 (주) 티로보틱스 진공 챔버 내에서 기판을 이송하는 기판 이송 장치

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US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
US5256599A (en) * 1992-06-01 1993-10-26 Motorola, Inc. Semiconductor wafer wax mounting and thinning process

Also Published As

Publication number Publication date
DE69524404T2 (de) 2002-04-11
KR100371762B1 (ko) 2003-04-11
JP4012927B2 (ja) 2007-11-28
EP0758941A4 (en) 1997-07-30
WO1995031309A1 (en) 1995-11-23
DE69524404D1 (de) 2002-01-17
JP2006237647A (ja) 2006-09-07
EP0758941B1 (en) 2001-12-05
TW278211B (enExample) 1996-06-11
EP0758941A1 (en) 1997-02-26
KR970703222A (ko) 1997-07-03
CN1147782A (zh) 1997-04-16
MY116349A (en) 2004-01-31
US5605487A (en) 1997-02-25
JPH10501098A (ja) 1998-01-27

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Expiration termination date: 20150419

Granted publication date: 20011031