TW278211B - - Google Patents

Info

Publication number
TW278211B
TW278211B TW083110852A TW83110852A TW278211B TW 278211 B TW278211 B TW 278211B TW 083110852 A TW083110852 A TW 083110852A TW 83110852 A TW83110852 A TW 83110852A TW 278211 B TW278211 B TW 278211B
Authority
TW
Taiwan
Application number
TW083110852A
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW278211B publication Critical patent/TW278211B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW083110852A 1994-05-13 1994-12-02 TW278211B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/242,560 US5605487A (en) 1994-05-13 1994-05-13 Semiconductor wafer polishing appartus and method

Publications (1)

Publication Number Publication Date
TW278211B true TW278211B (zh) 1996-06-11

Family

ID=22915284

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110852A TW278211B (zh) 1994-05-13 1994-12-02

Country Status (9)

Country Link
US (1) US5605487A (zh)
EP (1) EP0758941B1 (zh)
JP (2) JPH10501098A (zh)
KR (1) KR100371762B1 (zh)
CN (1) CN1073907C (zh)
DE (1) DE69524404T2 (zh)
MY (1) MY116349A (zh)
TW (1) TW278211B (zh)
WO (1) WO1995031309A1 (zh)

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JPH09186116A (ja) * 1995-12-27 1997-07-15 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
TW324835B (en) * 1996-05-31 1998-01-11 Memc Electronic Materials Method for mountong semiconductor
US5931719A (en) * 1997-08-25 1999-08-03 Lsi Logic Corporation Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US6116992A (en) 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6531397B1 (en) 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
JPH11207606A (ja) * 1998-01-21 1999-08-03 Ebara Corp 研磨装置
JP3467184B2 (ja) * 1998-02-05 2003-11-17 信越半導体株式会社 ワークの研磨方法
US6712672B1 (en) * 1998-05-06 2004-03-30 Samsung Electronics Co., Ltd. Clamping wafer holder for chemica-mechanical planarization machines and method for using it
KR100306824B1 (ko) * 1998-05-06 2001-11-30 윤종용 화학적기계적평탄화기계를위한웨이퍼홀더
US6113465A (en) * 1998-06-16 2000-09-05 Speedfam-Ipec Corporation Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context
US6602380B1 (en) 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
US6488569B1 (en) 1999-07-23 2002-12-03 Florida State University Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US6325696B1 (en) 1999-09-13 2001-12-04 International Business Machines Corporation Piezo-actuated CMP carrier
US6189546B1 (en) * 1999-12-29 2001-02-20 Memc Electronic Materials, Inc. Polishing process for manufacturing dopant-striation-free polished silicon wafers
US6479386B1 (en) 2000-02-16 2002-11-12 Memc Electronic Materials, Inc. Process for reducing surface variations for polished wafer
US7048607B1 (en) 2000-05-31 2006-05-23 Applied Materials System and method for chemical mechanical planarization
US20040072225A1 (en) * 2000-08-15 2004-04-15 Incyte Corporation Microarray retrieval unit
US6540587B1 (en) * 2000-10-13 2003-04-01 Lam Research Corporation Infrared end-point detection system
WO2002042033A1 (en) * 2000-11-21 2002-05-30 Memc Electronic Materials, S.P.A. Semiconductor wafer, polishing apparatus and method
US20030064902A1 (en) * 2001-10-03 2003-04-03 Memc Electronic Materials Inc. Apparatus and process for producing polished semiconductor wafers
US6712673B2 (en) 2001-10-04 2004-03-30 Memc Electronic Materials, Inc. Polishing apparatus, polishing head and method
JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US6804579B1 (en) * 2002-10-16 2004-10-12 Abb, Inc. Robotic wash cell using recycled pure water
JP2006524142A (ja) * 2003-04-21 2006-10-26 イノプラ インコーポレーテッド 一つ以上の研磨面を使用して半導体ウェーハを研磨するための装置及び方法
ATE468941T1 (de) 2003-11-13 2010-06-15 Applied Materials Inc Haltering mit geformter fläche
US11260500B2 (en) * 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US20050157308A1 (en) * 2004-01-15 2005-07-21 Andrei Brunfeld Apparatus and method for measuring thickness variation of wax film
JP2006237492A (ja) * 2005-02-28 2006-09-07 Dainippon Screen Mfg Co Ltd ウエハ処理装置
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
US20090067959A1 (en) * 2006-02-22 2009-03-12 Nobuyuki Takahashi Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus
CN100400233C (zh) * 2006-05-26 2008-07-09 中国科学院上海技术物理研究所 Ⅱ-ⅵ族半导体材料保护侧边缘的表面抛光方法
WO2008005325A2 (en) * 2006-06-30 2008-01-10 Entegris, Inc. Wafer carrier docking station
DE102009030292B4 (de) * 2009-06-24 2011-12-01 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
CN101712130B (zh) * 2009-12-22 2012-11-14 中国电子科技集团公司第四十五研究所 应用于硅片化学机械抛光设备中的定位转换装置
JP5099111B2 (ja) * 2009-12-24 2012-12-12 信越半導体株式会社 両面研磨装置
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
CN102615583A (zh) * 2011-01-28 2012-08-01 鸿富锦精密工业（深圳）有限公司 研磨装置
JP5821210B2 (ja) * 2011-02-22 2015-11-24 セイコーエプソン株式会社 水平多関節ロボット及び水平多関節ロボットの制御方法
JP5817142B2 (ja) * 2011-02-22 2015-11-18 セイコーエプソン株式会社 水平多関節ロボット
KR101838109B1 (ko) * 2011-12-06 2018-03-14 삼성전자주식회사 컨택터 및 이를 포함하는 반도체 테스트 장치
WO2013119261A1 (en) * 2012-02-09 2013-08-15 Duescher Wayne O Coplanar alignment apparatus for rotary spindles
ES1078824Y (es) * 2013-02-08 2013-06-10 Matriruiz S L Conjunto de medios mecánicos incorporables a un robot delta para realización de engomado de tapas
KR101446721B1 (ko) * 2013-07-09 2014-10-06 주식회사 엘지실트론 연마용 블록에 웨이퍼를 마운팅하는 방법
US9382801B2 (en) 2014-02-26 2016-07-05 General Electric Company Method for removing a rotor bucket from a turbomachine rotor wheel
US10654145B2 (en) * 2015-06-30 2020-05-19 Globalwafers Co., Ltd. Methods and systems for polishing pad control
CN108584321A (zh) * 2018-04-09 2018-09-28 浙江理工大学 一种滑触线的安装装置和方法
CN108705438A (zh) * 2018-07-18 2018-10-26 四川三虎家居有限公司重庆分公司 一种家具板材用抛光装置
CN109623658B (zh) * 2018-12-26 2024-07-23 浙江杰奈尔新材料有限公司 一种研磨机用清洗装置
CN109877694B (zh) * 2019-03-04 2023-08-08 天通日进精密技术有限公司 晶圆边缘抛光装置及晶圆边缘抛光方法
CN110328606A (zh) * 2019-06-27 2019-10-15 浙江晶盛机电股份有限公司 一种全自动一体式单片单面研磨减薄设备
KR102262803B1 (ko) * 2019-07-10 2021-06-09 주식회사 에스피에스테크 웨이퍼용 cmp 시스템
KR102258721B1 (ko) * 2019-08-28 2021-05-28 에스케이실트론 주식회사 웨이퍼 마운팅 장치 및 그 동작 방법
CN113059453B (zh) * 2019-12-31 2024-06-18 浙江芯晖装备技术有限公司 一种抛光设备
CN111673607B (zh) * 2020-04-28 2021-11-26 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
JP2023518650A (ja) * 2020-06-29 2023-05-08 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のための蒸気発生の制御
CN115741453B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种多传感器融合的智能双面研磨机
CN116854467A (zh) * 2023-07-12 2023-10-10 江西兆驰半导体有限公司 一种生瓷复合材料及用其制备晶圆搬运臂的制备方法
CN117457548B (zh) * 2023-12-22 2024-03-22 北京特思迪半导体设备有限公司 晶圆贴片装置及晶圆无蜡抛光上料设备

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Also Published As

Publication number Publication date
CN1073907C (zh) 2001-10-31
JP2006237647A (ja) 2006-09-07
KR970703222A (ko) 1997-07-03
WO1995031309A1 (en) 1995-11-23
DE69524404T2 (de) 2002-04-11
JPH10501098A (ja) 1998-01-27
US5605487A (en) 1997-02-25
EP0758941A1 (en) 1997-02-26
KR100371762B1 (ko) 2003-04-11
JP4012927B2 (ja) 2007-11-28
DE69524404D1 (de) 2002-01-17
CN1147782A (zh) 1997-04-16
EP0758941A4 (en) 1997-07-30
EP0758941B1 (en) 2001-12-05
MY116349A (en) 2004-01-31

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