CN107275271A - 基板搬运装置、基板处理装置以及结露抑制方法 - Google Patents
基板搬运装置、基板处理装置以及结露抑制方法 Download PDFInfo
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Abstract
提供一种能抑制结露的产生的基板搬运装置、包括该基板搬运装置的基板处理装置、以及抑制在基板搬运装置产生结露的结露抑制方法。该基板搬运装置包括:基板把持部(301a、301b),该基板把持部(301a、301b)对基板进行把持;筐体(300);驱动机构(302),该驱动机构(302)的至少一部分设于所述筐体(300)内,并使用空气对所述基板把持部(301a、301b)进行驱动。所述驱动机构(302)能向所述筐体(300)内供给空气。
Description
技术领域
本发明涉及对基板进行搬运的基板搬运装置、包括该基板搬运装置的基板处理装置、以及抑制在基板搬运装置产生结露的结露抑制方法。
背景技术
对半导体晶片等基板进行研磨的基板处理装置除了研磨单元之外,还由对研磨后的基板进行清洗的清洗单元、对清洗后的基板进行干燥的干燥单元、在单元之间搬运基板的搬运机构等构成。
然而,在基板处理装置内,为了对基板进行保湿而供给有冲洗水。当供给来的冲洗水施加于搬运机构时,恐怕会在搬运机构产生结露而导致搬运机构不能正常动作,从而给搬运造成障碍。
现有技术文献
专利文献
专利文献1:日本专利特开2001-135604号公报
专利文献2:日本专利特许第5188952号公报
发明内容
本发明是鉴于上述问题点而做出的,本发明的技术问题在于提供能对抑制结露的产生的基板搬运装置、包括该基板搬运装置的基板处理装置、以及能抑制在基板搬运装置产生结露的结露抑制方法。
根据本发明的一技术方案,提供一种基板搬运装置,该基板搬运装置包括:基板把持部,该基板把持部对基板进行把持;筐体;驱动机构,该驱动机构的至少一部分设于所述筐体内,并使用空气对所述基板把持部进行驱动,所述驱动机构能向所述筐体内供给空气。
通过向筐体内供给空气,能够抑制结露产生于筐体。
也可以采用以下结构:所述驱动机构具有配管,该配管的至少一部分设于所述筐体内,所述配管供给用于驱动所述基板把持部的空气,并向所述筐体内供给空气。
另外,也可以采用以下结构:所述基板把持部包括能打开关闭的一对支承臂,所述驱动机构具有:气缸,该气缸设于所述筐体内,并利用空气使所述一对支承臂进行打开关闭;以及配管,该配管向所述气缸供给空气。
也可以采用以下结构:所述配管包括:第一配管,该第一配管在所述基板把持部把持基板时被加压;以及第二配管,该第二配管在所述基板把持部未把持基板时被加压,从所述第二配管向所述筐体内供给空气。
也可以采用以下结构:基板搬运装置包括设于所述配管的节流孔。
也可以采用以下结构:基板搬运装置包括设于所述配管的过滤器,经由所述过滤器向所述筐体内供给空气。
根据本发明的另一技术方案,提供一种基板处理装置,该基板处理装置包括:研磨单元、清洗单元及干燥单元;以及所述基板搬运机构,所述基板搬运机构在各单元之间搬运基板。
另外,根据本发明的另一技术方案,提供一种抑制结露产生于基板搬运装置的结露抑制方法,该方法也将用于驱动对基板进行把持的基板把持部的空气供给至所述基板搬运装置的筐体。
发明的效果
通过供给空气,能够抑制结露产生。
附图说明
图1是表示基板处理装置的示意结构的图。
图2是表示一实施方式的摆动输送机12的结构的立体图。
图3是把持机构170的俯视图。
图4A是把持机构170的主视图。
图4B是把持机构170的主视图。
图5是图4A的沿A-A’的剖视图。
图6是表示开闭驱动机构302的示意结构的示意图。
图7是对使可动臂301分离的情况下的开闭驱动机构302的动作进行说明的图。
图8是对使可动臂301接近的情况下的开闭驱动机构302的动作进行说明的图。
图9A是对把持基板时的把持机构170的动作进行说明的图。
图9B是对把持基板时的把持机构170的动作进行说明的图。
图9C是对把持基板时的把持机构170的动作进行说明的图。
符号说明
3A~3D 研磨单元
190、192 清洗单元
194 干燥单元
12 摆动输送机
170 把持机构
300 筐体
301a、301b 可动臂
302 开闭驱动机构
303a、303b 支承臂
304a、304b 卡盘
41a、41b 气缸
42a、42b 空气配管
43 压力控制部
44 节流孔
45 过滤器
具体实施方式
下面,参照附图对本发明的实施方式进行具体说明。
图1是表示基板处理装置的示意结构的图。如图1所示,该基板处理装置包括一个大致矩形的外壳1,该外壳1的内部通过隔壁1a、1b被划分为装载/卸载部2、研磨部3以及清洗部4。另外,基板处理装置具有控制部5,该控制部5控制基板处理动作。
装载/卸载部2包括前装载部20,该前装载部20供储存多块基板(例如半导体晶片)的晶片盒载置。在该装载/卸载部2中沿着前装载部20的排列方向敷设有行驶机构21,该行驶机构21上设置有能沿着晶片盒的排列方向移动的一台搬运机器人(装载器)22。通过在行驶机构21上移动,搬运机器人22能够访问搭载于前装载部20的晶片盒。
研磨部3是对基板进行研磨(平坦化)的区域,研磨部3包括第一研磨单元3A、第二研磨单元3B、第三研磨单元3C、第四研磨单元3D。
清洗部4是对研磨后的基板进行清洗以及干燥的区域,清洗部4包括:第一清洗单元190及第二清洗单元192,该第一清洗单元190及第二清洗单元192对基板进行清洗;干燥单元194,该干燥单元194对清洗后的基板进行干燥;第一搬运单元191,该第一搬运单元191在第一清洗单元190以及第二清洗单元192之间搬运基板;以及第二搬运单元193,该第二搬运单元193在第二清洗单元192以及干燥单元194之间搬运基板。
接着,对基板的搬运进行说明。基板处理装置包括:第一线性输送机6及第二线性输送机7,该第一线性输送机6及第二线性输送机7在外壳1的长度方向上搬运基板;升降机11;以及摆动输送机12,该摆动输送机12具有对基板的正反面进行反转的作用,且可以摇动。
升降机11配置于后述的第一搬运位置TP1,并从搬运机器人22接收基板。即,在隔壁1a设有位于升降机11和搬运机器人22之间的闸门(未图示),当搬运基板时,闸门打开以将基板从搬运机器人22转移至升降机11。基板经由该升降机11从搬运机器人22转移至第一线性输送机6。
第一线性输送机6以与第一研磨单元3A以及第二研磨单元3B相邻的方式配置。该第一线性输送机6在沿着研磨单元3A、3B排列方向的四个搬运位置(第一搬运位置TP1、第二搬运位置TP2、第三搬运位置TP3、第四搬运位置TP4)之间搬运基板。
即,利用第一线性输送机6将基板搬运至研磨单元3A、3B。更具体而言,在第二搬运位置TP2,基板被从第一线性输送机6转移至第一研磨单元3A。另外,在第三搬运位置TP3,基板被从第一线性输送机6转移至第二研磨单元3B。
摆动输送机12配置于第一线性输送机6、第二线性输送机7、以及清洗部4之间。基板从第一线性输送机6朝第二线性输送机7的转移是利用摆动输送机12进行的。
第二线性输送机7以与第三研磨单元3C以及第四研磨单元3D相邻的方式配置。该第二线性输送机7是在沿着研磨单元3C、3D排列方向的三个搬运位置(第五搬运位置TP5、第六搬运位置TP6、第七搬运位置TP7)之间搬运基板的机构。
即,利用第二线性输送机7将基板搬运至研磨单元3C、3D。更具体而言,在第六搬运位置TP6,基板被从第二线性输送机7转移至第三研磨单元3C。另外,在第七搬运位置TP7,基板被从第二线性输送机7转移至第四研磨单元3D。
另外,研磨部3中被研磨后的基板利用摆动输送机12从第一线性输送机6(或第二线性输送机7)转移至临时载置台180,并经由第一搬运单元191而被搬运到清洗部4。在隔壁1b设有位于临时载置台180和第一搬运单元191之间的闸门(未图示),当搬运基板时,闸门打开,第一搬运单元191从临时载置台180接收基板。
图2是表示一实施方式的摆动输送机12的结构的立体图。摆动输送机12是设置于基板处理装置的框架160的基板搬运机构,摆动输送机12包括:线性导向件161,该线性导向件161沿铅垂方向延伸;摆动机构162,该摆动机构162安装于线性导向件161;以及升降驱动机构165,该升降驱动机构165使摆动机构162在铅垂方向上移动。作为该升降驱动机构165,能采用具有伺服电动机和滚珠丝杠的电动缸(日文:ロボシリンダ;英文:ROBO Cylinder)等。
在摇摆机构162经由摇摆臂166连结有反转机构167。并且,在反转机构167连结有对基板进行把持的把持机构170。在摆动输送机12的侧方配置有设置于框架160的临时载置台180。该临时载置台180位于图1的第一线性输送机6和清洗部4之间。
摇摆臂166通过摆动机构162的未图示的电动机的驱动而以该电动机的转轴为中心进行回旋。由此,反转机构167以及把持机构170一体地进行回旋运动,把持机构170在第四搬运位置TP4、第五搬运位置TP5、以及临时载置台180之间移动。
图3以及图4A、图4B分别是把持机构170的俯视图和主视图。另外,图5是图4的沿A-A’的剖视图。把持机构170具有:筐体300;一对可动臂301a、301b,这一对可动臂301a、301b从筐体300的侧面朝两侧延伸;开闭驱动机构302(图5),该开闭驱动机构302使可动臂301a、301b移动;以及支承臂303a、303b,该支承臂303a、303b安装于可动臂301的前端,并分别沿着与可动臂301a、301b正交的方向延伸。可动臂301a、301b以及支承臂303a、303b构成基板把持部。
支承臂303a、303b能获得打开状态(图4B)和关闭状态(图4A),在关闭状态下把持基板。在支承臂303a、303b设有卡盘304a、304b,该卡盘304a、304b从上述支承臂303a、303b的两端向下方突出,并用于支承基板的周缘部。
可动臂301a、301b由具有气动卡盘41的开闭驱动机构302驱动,并向彼此接近(图4A)以及远离(图4B)的方向移动。另外,能利用图2所示的升降驱动机构165使摆动机构162在铅垂方向上移动。由此,反转机构167以及把持机构170一体地进行升降运动,把持机构170在第四搬运位置TP4、第五搬运位置TP5、以及临时载置台180之间进行升降移动。
图6是表示开闭驱动机构302的大致结构的示意图。开闭驱动机构302使用空气对支承臂303a、303b进行打开或关闭,开闭驱动机构302包括:气动卡盘41;配管42a、42b;以及压力控制部43。气动卡盘41具有:外壳410;以及能左右滑动的气缸41a、41b。配管42a、42b分别使气缸滑动。
气缸41a、41b设于外壳410内,该外壳410设于筐体300内,可动臂301a、301b分别安装于气缸41a、41b。即,可动臂301a贯穿筐体300以及外壳410,可动臂301a的一端安装于气缸41a,另一端安装有支承臂303a(图6中未图示)。而且,可动臂301b贯穿筐体300,可动臂301b的一端安装于气缸41b,另一端安装有支承臂303b(图6中未图示)。
在图6中标有点的配管42a的一端与压力控制部43连接。并且,配管42a在外壳410内分支,一方的前端部421a与气缸41a的左侧面连接,另一方的前端部422a与气缸41b的右侧面连接。
在图6中标有斜线的配管42b的一端与压力控制部43连接。并且,配管42b在外壳410内分支,一方的前端部421b与气缸41b的左侧面连接,另一方的前端部422b与气缸41a的右侧面连接。
压力控制部43向配管42a、42b供给空气并加压或对配管42a、42b进行排气。虽然压力控制部43可以位于筐体300内,但也可以位于筐体300外,在这种情况下,配管42a、42b的一部分位于筐体300外。
图7是对使可动臂301分离的情况下的开闭驱动机构302的动作进行说明的图。压力控制部43对配管42a进行排气,并对配管42b进行加压。配管42a的排气可以是暂时的直至配管42a内的空气排光为止,另一方面,继续进行配管42b的加压(空气供给)。由此,配管42b的前端部421b使气缸41b向右侧移动,前端部422b使气缸41a向左侧移动。由此,气缸41a、41b分离,从而使安装于气缸41a、41b的可动臂301a、301b分离。其结果是,支承臂303a、303b打开。也就是说,配管42a、42b能够供给用于驱动支承臂303a、303b的空气。
图8是对使可动臂301接近的情况下的开闭驱动机构302的动作进行说明的图。压力控制部43对配管42b进行排气,并对配管42a进行加压。配管42b的排气可以是暂时的直至在配管42b内的空气排光为止,另一方面,继续进行对配管42a的加压(空气供给)。由此,配管42a的前端部421a使气缸41a向右侧移动,前端部422a使气缸41b向左侧移动。由此,气缸41a、41b接近,从而使安装于气缸41a、41b的可动臂301a、301b接近。其结果是,支承臂303a、303b关闭。
对通过以上说明了的摆动输送机12而进行的基板搬运进行说明。
如图4B所示,在未把持基板的待机时间,可动臂301a、301b彼此分离。
图9A~9C是对把持基板时的把持机构170的动作进行说明的图。示出了由第一线性输送机6(未图示)搬运来的基板W在第四搬运位置TP4转移至把持机构170情况。
如图9A所示,摆动输送机12的把持机构170移动至载置于第一线性输送机6的基板W的上方。此时,可动臂301a、301b彼此分离,支承臂303a、303b打开。
接下去,如图9B所示,把持机构170由升降驱动机构165(图2)驱动而以卡盘304a、304b位于基板W的侧方的方式下降。
接着,如图9C所示,利用开闭驱动机构302使可动臂301a、301b彼此接近,从而使支承臂303a、303b关闭。由此,基板W的周缘把持于卡盘304a、304b。之后,把持机构170由升降驱动机构165驱动而上升。
为了使基板W从第一线性输送机6移动到第二线性输送机7,如下所示,这种摆动输送机12将载置于第四搬运位置TP4的基板W搬运到第五搬运位置TP5。
首先,摆动输送机12在支承臂303a、303b打开的状态下移动到第四搬运位置TP4(图9A)。接着,把持机构170下降(图9B),支承臂303a、303b对载置于第四搬运位置TP4的基板W进行把持(图9C)。之后,把持机构170在支承着基板W的同时上升,把持机构170由摇摆机构162驱动而摇动,并移动到第五搬运位置TP5的上方。接着,把持机构170下降,支承臂303a、303b打开并将基板W载置于第五搬运位置TP5。
另外,为了使基板W从第四搬运位置TP4(或者第五搬运位置TP5)移动到清洗部4并使该基板W反转,如下所示,摆动输送机12将载置于第五搬运位置TP5的基板W搬运到临时载置台180。
首先,摆动输送机12在支承臂303a、303b打开的状态下移动到第五搬运位置TP5的上方(图9A)。接着,把持机构170下降(图9B),支承臂303a、303b对载置于第五搬运位置TP5的基板W进行把持(图9C)。之后,把持机构170在支承着基板W的同时上升,反转机构167将基板W反转,接着,把持机构170由摇摆机构162驱动而摇动,并移动到临时载置台180的上方。然后,把持机构170下降,支承臂303a、303b打开而将基板W载置到临时载置台180。
此处,图1所示的基板处理装置内的湿度较高,因此,湿度较高的空气也可能流入到筐体300。另外,为了对基板进行保湿,基板处理装置在未处理基板的待机时间也从各处供给有冲洗水。根据情况,可能会出现摆动输送机12淋水而导致筐体300被冷却的状况。假如摆动输送机12的筐体300的内部(例如其天井面)产生结露,会给筐体300内的气缸41a、41b的动作带来坏影响,很有可能会对基板搬运造成障碍。
因此,本实施方式中设有抑制结露的结构。
如图6所示,把持机构170的开闭驱动机构302使设于筐体300内的配管42b在外壳410的外侧分支,并将空气从前端部423b供给到筐体300内并使该空气循环。优选的是,开闭驱动机构302具有节流孔44,以不对气缸41a、41b等其他部件带来影响的方式一点点地向筐体300内供给空气。另外,优选的是,开闭驱动机构302具有过滤器45,通过该过滤器45向筐体300内供给干净的空气。通过这样向筐体300的内部供给空气,产生空气循环而使温度变化变小,从而能抑制结露的发生。
而且,既可以仅使配管42b分支并供给空气,也可以仅使配管42a分支并供给空气,还可以从配管42a、42b双方向筐体300供给空气。不过,更优选的是,使在可动臂301分离时(也就是未保持基板W时)被加压的配管42b分支。由此,其原因是,能在未保持基板W的时候向筐体300内供给空气。
这样,本实施方式中,向筐体300内供给空气,因而能够抑制筐体300内结露的发生。另外,使用用于驱动可动臂301a、301b的空气,因而能够使追加的部件停留在最小限度。
上述实施方式是以具有本发明所属的技术领域中的通常知识的一般技术人员能实施本发明为目的而加以记载的。上述实施方式的种种变形例,只要是本领域的技术人员,自然能够做出,本发明的技术思想也能够适用于其他实施方式。因此,本发明并不限定于所记载的实施方式,而应是按照由专利权利要求书所定义的技术思想所得出的最大范围。
Claims (10)
1.一种基板搬运装置,其特征在于,包括:
基板把持部,该基板把持部对基板进行把持;
筐体;以及
驱动机构,该驱动机构的、至少一部分设于所述筐体内,并使用空气对所述基板把持部进行驱动,
所述驱动机构能向所述筐体内供给空气。
2.如权利要求1所述的基板搬运装置,其特征在于,
所述驱动机构具有配管,该配管的至少一部分设于所述筐体内,所述配管供给用于驱动所述基板把持部的空气,并向所述筐体内供给空气。
3.如权利要求1所述的基板搬运装置,其特征在于,
所述基板把持部包括能打开关闭的一对支承臂,
所述驱动机构具有:
气缸,该气缸设于所述筐体内,并利用空气使所述一对支承臂打开关闭;以及
配管,该配管向所述气缸供给空气。
4.如权利要求2所述的基板搬运装置,其特征在于,
所述配管包括:
第一配管,该第一配管在所述基板把持部把持基板时被加压;以及
第二配管,该第二配管在所述基板把持部未把持基板时被加压,
从所述第二配管向所述筐体内供给空气。
5.如权利要求3所述的基板搬运装置,其特征在于,
所述配管包括:
第一配管,该第一配管在所述基板把持部把持基板时被加压;以及
第二配管,该第二配管在所述基板把持部未把持基板时被加压,
从所述第二配管向所述筐体内供给空气。
6.如权利要求2至5中任一项所述的基板搬运装置,其特征在于,
包括设于所述配管的节流孔。
7.如权利要求2至5中任一项所述的基板搬运装置,其特征在于,
包括设于所述配管的过滤器,
经由所述过滤器向所述筐体内供给空气。
8.如权利要求6所述的基板搬运装置,其特征在于,
包括设于所述配管的过滤器,
经由所述过滤器向所述筐体内供给空气。
9.一种基板处理装置,其特征在于,包括:
研磨单元、清洗单元及干燥单元;以及
在各单元之间搬运基板的权利要求1至8中任一项所述的基板搬运装置。
10.一种结露抑制方法,抑制在基板搬运装置产生结露,其特征在于,
也将用于驱动基板把持部的空气供给至所述基板搬运装置的筐体,所述基板把持部构成为对基板进行把持。
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JP4197103B2 (ja) | 2002-04-15 | 2008-12-17 | 株式会社荏原製作所 | ポリッシング装置 |
KR101958874B1 (ko) | 2008-06-04 | 2019-03-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법 |
JP2015114966A (ja) * | 2013-12-13 | 2015-06-22 | アドバンス電気工業株式会社 | 流量制御弁及びこれを用いた流量制御装置 |
JP2017175072A (ja) * | 2016-03-25 | 2017-09-28 | 川崎重工業株式会社 | 基板搬送ハンド及びロボット |
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JPH10180678A (ja) * | 1996-12-27 | 1998-07-07 | Mitsubishi Electric Corp | 耐環境型産業用ロボット |
US20020157692A1 (en) * | 2001-04-25 | 2002-10-31 | Akira Ishihara | Substrate dual-side processing apparatus |
CN101390197B (zh) * | 2006-02-22 | 2011-02-23 | 株式会社荏原制作所 | 基板处理装置、基板搬运装置、基板把持装置以及药液处理装置 |
JP2013086241A (ja) * | 2011-10-21 | 2013-05-13 | Ihi Corp | チャック装置およびチャック方法 |
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CN107275271B (zh) | 2023-04-14 |
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US10816259B2 (en) | 2020-10-27 |
KR102190187B1 (ko) | 2020-12-11 |
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