CN107251211B - 衬底搬送机械手及其运转方法 - Google Patents

衬底搬送机械手及其运转方法 Download PDF

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Publication number
CN107251211B
CN107251211B CN201580075959.4A CN201580075959A CN107251211B CN 107251211 B CN107251211 B CN 107251211B CN 201580075959 A CN201580075959 A CN 201580075959A CN 107251211 B CN107251211 B CN 107251211B
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China
Prior art keywords
substrate
end effector
holding
robot
detection sensor
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CN201580075959.4A
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English (en)
Chinese (zh)
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CN107251211A (zh
Inventor
菅原润一
吉田雅也
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Kawasaki Heavy Industries Ltd
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Kawasaki Heavy Industries Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201580075959.4A 2015-02-13 2015-02-13 衬底搬送机械手及其运转方法 Active CN107251211B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/053970 WO2016129102A1 (fr) 2015-02-13 2015-02-13 Robot de transport de substrat et son procédé de fonctionnement

Publications (2)

Publication Number Publication Date
CN107251211A CN107251211A (zh) 2017-10-13
CN107251211B true CN107251211B (zh) 2020-10-23

Family

ID=56614447

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580075959.4A Active CN107251211B (zh) 2015-02-13 2015-02-13 衬底搬送机械手及其运转方法

Country Status (6)

Country Link
US (2) US10933532B2 (fr)
JP (1) JP6511074B2 (fr)
KR (1) KR102050149B1 (fr)
CN (1) CN107251211B (fr)
TW (1) TWI696537B (fr)
WO (1) WO2016129102A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6545519B2 (ja) * 2015-04-27 2019-07-17 川崎重工業株式会社 基板搬送ロボットおよび基板検出方法
JP6723055B2 (ja) * 2016-04-04 2020-07-15 株式会社荏原製作所 基板処理装置および基板有無確認方法
JP6804146B2 (ja) * 2016-11-10 2020-12-23 株式会社ディスコ 搬送装置、加工装置及び搬送方法
JP6782180B2 (ja) * 2017-01-31 2020-11-11 川崎重工業株式会社 基板把持ハンド及び基板搬送装置
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
JP7001439B2 (ja) * 2017-11-24 2022-01-19 川崎重工業株式会社 監視方法
JP7049909B2 (ja) * 2018-05-11 2022-04-07 川崎重工業株式会社 基板搬送ロボット及び基板保持ハンドの光軸ずれ検出方法
CN110668188B (zh) * 2018-07-03 2021-07-30 日本电产三协株式会社 工业用机器人
JP2020077699A (ja) * 2018-11-06 2020-05-21 川崎重工業株式会社 ロボットハンド及びそれを備えるロボット
US11427412B2 (en) * 2019-05-09 2022-08-30 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying method
KR102322129B1 (ko) * 2019-06-07 2021-11-04 블루테크코리아 주식회사 반도체 로봇용 엔드이펙터
WO2020261698A1 (fr) * 2019-06-27 2020-12-30 川崎重工業株式会社 Dispositif de cartographie de substrat, procédé de cartographie associé et procédé d'apprentissage de cartographie
JP7045353B2 (ja) * 2019-10-02 2022-03-31 株式会社アルバック 基板搬送装置、および、基板搬送方法
US20210257241A1 (en) * 2020-02-05 2021-08-19 Brooks Automation, Inc. Substrate processing apparatus
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP2022042122A (ja) * 2020-09-02 2022-03-14 東京エレクトロン株式会社 基板処理システム及び状態監視方法
JP2022059947A (ja) * 2020-10-02 2022-04-14 日本電産サンキョー株式会社 産業用ロボットのハンド、産業用ロボット
CN114378826B (zh) * 2022-01-24 2023-05-12 航天科工空间工程发展有限公司 一种适用于卫星批量生产的总装方法及装配系统

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176907A (ja) * 1997-12-05 1999-07-02 Toshiba Ceramics Co Ltd ウエハ移載装置
JP2002110769A (ja) * 2000-09-26 2002-04-12 Shinko Electric Co Ltd ウェハ移載装置
CN101375386A (zh) * 2006-02-20 2009-02-25 琳得科株式会社 搬送装置和搬送方法
CN102163571A (zh) * 2010-02-04 2011-08-24 东京毅力科创株式会社 基板输送装置和基板输送方法
CN102349144A (zh) * 2009-03-13 2012-02-08 川崎重工业株式会社 具备末端执行器的机器人及其运行方法
TW201230236A (en) * 2010-10-22 2012-07-16 Lam Res Corp Dual sensing end effector with single sensor
JP2015026752A (ja) * 2013-07-29 2015-02-05 株式会社日立ハイテクマニファクチャ＆サービス 搬送システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2829367B2 (ja) 1996-03-08 1998-11-25 国際電気株式会社 ウェーハ移載方法
EP1084509A1 (fr) 1998-05-27 2001-03-21 Varian Semiconductor Equipment Associates Inc. Effecteur terminal de lot pour la manipulation de plaquettes semi-conductrices
JP2000068359A (ja) * 1998-08-24 2000-03-03 Hitachi Techno Eng Co Ltd ウエハ搬送装置
JP2000124289A (ja) * 1998-10-19 2000-04-28 Mecs Corp 薄型基板搬送ロボットのハンド
JP4028814B2 (ja) * 2003-04-21 2007-12-26 川崎重工業株式会社 マッピング装置
JP4285204B2 (ja) 2003-11-04 2009-06-24 株式会社安川電機 ウェハ位置教示方法およびウェハ搬送ロボット
NL1036673A1 (nl) * 2008-04-09 2009-10-12 Asml Holding Nv Robot Position Calibration Tool (RPCT).
WO2010004636A1 (fr) * 2008-07-10 2010-01-14 川崎重工業株式会社 Robot et son procédé d'enseignement
JP5571902B2 (ja) * 2009-03-17 2014-08-13 川崎重工業株式会社 ロボット、及びオートゼロイング方法
JP5516482B2 (ja) * 2011-04-11 2014-06-11 東京エレクトロン株式会社 基板搬送方法、基板搬送装置、及び塗布現像装置
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
JP2014130899A (ja) 2012-12-28 2014-07-10 Olympus Corp 基板搬送装置、基板検査装置及び基板搬送方法
JP6088243B2 (ja) * 2012-12-28 2017-03-01 川崎重工業株式会社 エンドエフェクタ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176907A (ja) * 1997-12-05 1999-07-02 Toshiba Ceramics Co Ltd ウエハ移載装置
JP2002110769A (ja) * 2000-09-26 2002-04-12 Shinko Electric Co Ltd ウェハ移載装置
CN101375386A (zh) * 2006-02-20 2009-02-25 琳得科株式会社 搬送装置和搬送方法
CN102349144A (zh) * 2009-03-13 2012-02-08 川崎重工业株式会社 具备末端执行器的机器人及其运行方法
CN102163571A (zh) * 2010-02-04 2011-08-24 东京毅力科创株式会社 基板输送装置和基板输送方法
TW201230236A (en) * 2010-10-22 2012-07-16 Lam Res Corp Dual sensing end effector with single sensor
JP2015026752A (ja) * 2013-07-29 2015-02-05 株式会社日立ハイテクマニファクチャ＆サービス 搬送システム

Also Published As

Publication number Publication date
CN107251211A (zh) 2017-10-13
JPWO2016129102A1 (ja) 2017-11-24
US20180029237A1 (en) 2018-02-01
KR102050149B1 (ko) 2019-11-28
US20210138658A1 (en) 2021-05-13
US11518038B2 (en) 2022-12-06
WO2016129102A1 (fr) 2016-08-18
TWI696537B (zh) 2020-06-21
TW201628805A (zh) 2016-08-16
US10933532B2 (en) 2021-03-02
KR20170113666A (ko) 2017-10-12
JP6511074B2 (ja) 2019-05-15

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