CN107251211B - 衬底搬送机械手及其运转方法 - Google Patents

衬底搬送机械手及其运转方法 Download PDF

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Publication number
CN107251211B
CN107251211B CN201580075959.4A CN201580075959A CN107251211B CN 107251211 B CN107251211 B CN 107251211B CN 201580075959 A CN201580075959 A CN 201580075959A CN 107251211 B CN107251211 B CN 107251211B
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China
Prior art keywords
substrate
end effector
holding
robot
detection sensor
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CN201580075959.4A
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English (en)
Chinese (zh)
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CN107251211A (zh
Inventor
菅原润一
吉田雅也
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Kawasaki Heavy Industries Ltd
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Kawasaki Heavy Industries Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201580075959.4A 2015-02-13 2015-02-13 衬底搬送机械手及其运转方法 Active CN107251211B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/053970 WO2016129102A1 (fr) 2015-02-13 2015-02-13 Robot de transport de substrat et son procédé de fonctionnement

Publications (2)

Publication Number Publication Date
CN107251211A CN107251211A (zh) 2017-10-13
CN107251211B true CN107251211B (zh) 2020-10-23

Family

ID=56614447

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580075959.4A Active CN107251211B (zh) 2015-02-13 2015-02-13 衬底搬送机械手及其运转方法

Country Status (6)

Country Link
US (2) US10933532B2 (fr)
JP (1) JP6511074B2 (fr)
KR (1) KR102050149B1 (fr)
CN (1) CN107251211B (fr)
TW (1) TWI696537B (fr)
WO (1) WO2016129102A1 (fr)

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* Cited by examiner, † Cited by third party
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JP6545519B2 (ja) * 2015-04-27 2019-07-17 川崎重工業株式会社 基板搬送ロボットおよび基板検出方法
JP6723055B2 (ja) * 2016-04-04 2020-07-15 株式会社荏原製作所 基板処理装置および基板有無確認方法
JP6804146B2 (ja) * 2016-11-10 2020-12-23 株式会社ディスコ 搬送装置、加工装置及び搬送方法
JP6782180B2 (ja) * 2017-01-31 2020-11-11 川崎重工業株式会社 基板把持ハンド及び基板搬送装置
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
JP7001439B2 (ja) * 2017-11-24 2022-01-19 川崎重工業株式会社 監視方法
JP7049909B2 (ja) * 2018-05-11 2022-04-07 川崎重工業株式会社 基板搬送ロボット及び基板保持ハンドの光軸ずれ検出方法
CN110668188B (zh) * 2018-07-03 2021-07-30 日本电产三协株式会社 工业用机器人
JP2020077699A (ja) * 2018-11-06 2020-05-21 川崎重工業株式会社 ロボットハンド及びそれを備えるロボット
US11427412B2 (en) * 2019-05-09 2022-08-30 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying method
KR102322129B1 (ko) * 2019-06-07 2021-11-04 블루테크코리아 주식회사 반도체 로봇용 엔드이펙터
CN114025925A (zh) * 2019-06-27 2022-02-08 川崎重工业株式会社 基板扫描映射装置、其扫描映射方法及扫描映射示教方法
JP7045353B2 (ja) * 2019-10-02 2022-03-31 株式会社アルバック 基板搬送装置、および、基板搬送方法
US20210257241A1 (en) * 2020-02-05 2021-08-19 Brooks Automation, Inc. Substrate processing apparatus
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP2022042122A (ja) * 2020-09-02 2022-03-14 東京エレクトロン株式会社 基板処理システム及び状態監視方法
JP2022059947A (ja) * 2020-10-02 2022-04-14 日本電産サンキョー株式会社 産業用ロボットのハンド、産業用ロボット
CN114378826B (zh) * 2022-01-24 2023-05-12 航天科工空间工程发展有限公司 一种适用于卫星批量生产的总装方法及装配系统

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JPH11176907A (ja) * 1997-12-05 1999-07-02 Toshiba Ceramics Co Ltd ウエハ移載装置
JP2002110769A (ja) * 2000-09-26 2002-04-12 Shinko Electric Co Ltd ウェハ移載装置
CN101375386A (zh) * 2006-02-20 2009-02-25 琳得科株式会社 搬送装置和搬送方法
CN102163571A (zh) * 2010-02-04 2011-08-24 东京毅力科创株式会社 基板输送装置和基板输送方法
CN102349144A (zh) * 2009-03-13 2012-02-08 川崎重工业株式会社 具备末端执行器的机器人及其运行方法
TW201230236A (en) * 2010-10-22 2012-07-16 Lam Res Corp Dual sensing end effector with single sensor
JP2015026752A (ja) * 2013-07-29 2015-02-05 株式会社日立ハイテクマニファクチャ＆サービス 搬送システム

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JP5114805B2 (ja) * 2008-07-10 2013-01-09 川崎重工業株式会社 ロボット及びその教示方法
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JP5516482B2 (ja) 2011-04-11 2014-06-11 東京エレクトロン株式会社 基板搬送方法、基板搬送装置、及び塗布現像装置
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
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Publication number Priority date Publication date Assignee Title
JPH11176907A (ja) * 1997-12-05 1999-07-02 Toshiba Ceramics Co Ltd ウエハ移載装置
JP2002110769A (ja) * 2000-09-26 2002-04-12 Shinko Electric Co Ltd ウェハ移載装置
CN101375386A (zh) * 2006-02-20 2009-02-25 琳得科株式会社 搬送装置和搬送方法
CN102349144A (zh) * 2009-03-13 2012-02-08 川崎重工业株式会社 具备末端执行器的机器人及其运行方法
CN102163571A (zh) * 2010-02-04 2011-08-24 东京毅力科创株式会社 基板输送装置和基板输送方法
TW201230236A (en) * 2010-10-22 2012-07-16 Lam Res Corp Dual sensing end effector with single sensor
JP2015026752A (ja) * 2013-07-29 2015-02-05 株式会社日立ハイテクマニファクチャ＆サービス 搬送システム

Also Published As

Publication number Publication date
TWI696537B (zh) 2020-06-21
JP6511074B2 (ja) 2019-05-15
US20180029237A1 (en) 2018-02-01
CN107251211A (zh) 2017-10-13
KR102050149B1 (ko) 2019-11-28
US11518038B2 (en) 2022-12-06
JPWO2016129102A1 (ja) 2017-11-24
KR20170113666A (ko) 2017-10-12
WO2016129102A1 (fr) 2016-08-18
US20210138658A1 (en) 2021-05-13
TW201628805A (zh) 2016-08-16
US10933532B2 (en) 2021-03-02

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