JP5114805B2 - ロボット及びその教示方法 - Google Patents
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- JP5114805B2 JP5114805B2 JP2010519599A JP2010519599A JP5114805B2 JP 5114805 B2 JP5114805 B2 JP 5114805B2 JP 2010519599 A JP2010519599 A JP 2010519599A JP 2010519599 A JP2010519599 A JP 2010519599A JP 5114805 B2 JP5114805 B2 JP 5114805B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1615—Programme controls characterised by special kind of manipulator, e.g. planar, scara, gantry, cantilever, space, closed chain, passive/active joints and tendon driven manipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/42—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40006—Placing, palletize, un palletize, paper roll placing, box stacking
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45063—Pick and place manipulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Orthopedic Medicine & Surgery (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
[特許文献1] 米国特許6,242,879号明細書
Claims (7)
- 先端部にエンドエフェクタが設けられたロボットアームと、前記ロボットアームを少なくとも上下方向に変位駆動するアーム駆動手段と、板状部材を保持するために前記エンドエフェクタに設けられた保持手段と、前記保持手段により前記板状部材が保持されているか否かを検出する保持状態検出手段と、前記アーム駆動手段及び前記保持手段を制御するロボット制御手段と、を備え、
前記ロボット制御手段は、前記エンドエフェクタ上に前記板状部材を載せた状態で、前記保持手段をオフにして、前記アーム駆動手段を制御して前記エンドエフェクタを予め与えられた暫定の載置位置よりも高い初期位置から前記暫定の載置位置の方向に向けて所定距離だけ降下させ、前記エンドエフェクタを停止させた状態で、前記保持手段をオフからオンに切り替え、前記保持状態検出手段によって、前記板状部材が前記保持手段により保持されているか否かの判定を行い、前記板状部材が前記保持手段により保持されていると判定された場合には、前記保持手段をオフにすると共に前記エンドエフェクタを更に前記所定距離だけ降下させ、前記エンドエフェクタを停止させた状態で再び前記判定を行い、一方、前記板状部材が前記保持手段により保持されていないと判定された場合には、その時点での前記エンドエフェクタの位置を正規の載置位置として検出するように構成されていることを特徴とするロボット。 - 前記保持手段は、前記板状部材を吸着する真空吸着手段を有し、
前記保持状態検出手段は、前記真空吸着手段により真空状態が達成されていることを検出する真空センサを有する請求項1記載のロボット。 - 前記保持手段は、前記板状部材の縁部に解放可能に係合する可動係合部と、前記可動係合部を進退駆動するプランジャと、を含むエッジグリップ手段を有し、
前記保持状態検出手段は、前記プランジャの位置を検出する位置センサを有する請求項1記載のロボット。 - 前記正規の載置位置は、複数の前記板状部材を収容するカセットの内側に上下方向に等ピッチで配設された複数の載置棚の位置であり、
前記初期位置は、上下方向に隣接する一対の前記載置棚同士の上下方向中央位置である請求項1乃至3のいずれか一項に記載のロボット。 - 前記ロボットアームは、前記上下方向に対応するZ軸方向への自由度に加えて、X軸方向及びY軸方向への自由度を有して変位駆動されるように構成されている請求項1乃至4のいずれか一項に記載のロボット。
- 請求項1乃至5のいずれか一項に記載のロボットに前記板状部材の前記正規の載置位置を教示する方法であって、
前記エンドエフェクタ上に前記板状部材を載せた状態で、前記保持手段をオフにして、前記アーム駆動手段を制御して前記エンドエフェクタを予め与えられた暫定の載置位置よりも高い初期位置から前記暫定の載置位置の方向に向けて所定距離だけ降下させる降下工程と、
前記降下工程に続いて、前記エンドエフェクタを停止させた状態で、前記保持手段をオフからオンに切り替える切替工程と、
前記切替工程に続いて、前記保持状態検出手段によって、前記板状部材が前記保持手段により保持されているか否かを判定する判定工程であって、前記板状部材が前記保持手段により保持されていると判定された場合には前記降下工程に戻る、判定工程と、
前記判定工程において、前記板状部材が前記保持手段により保持されていないと判定された場合には、その時点での前記エンドエフェクタの位置を正規の載置位置として検出する検出工程と、を備えたことを特徴とするロボットの教示方法。 - 前記正規の載置位置は、複数の前記板状部材を収容するカセットの内側に上下方向に等ピッチで配設された複数の載置棚の位置であり、
前記初期位置は、上下方向に隣接する一対の前記載置棚同士の上下方向中央位置であり、
最初の前記降下工程に先立って、前記エンドエフェクタに保持された前記板状部材を前記カセットの内部の前記初期位置に挿入する挿入工程を更に備えた請求項6記載のロボットの教示方法。
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PCT/JP2008/062491 WO2010004636A1 (ja) | 2008-07-10 | 2008-07-10 | ロボット及びその教示方法 |
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JPWO2010004636A1 JPWO2010004636A1 (ja) | 2011-12-22 |
JP5114805B2 true JP5114805B2 (ja) | 2013-01-09 |
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US (1) | US8641351B2 (ja) |
EP (1) | EP2324968B1 (ja) |
JP (1) | JP5114805B2 (ja) |
KR (1) | KR101291495B1 (ja) |
WO (1) | WO2010004636A1 (ja) |
Cited By (1)
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JPWO2016129102A1 (ja) * | 2015-02-13 | 2017-11-24 | 川崎重工業株式会社 | 基板搬送ロボットおよびその運転方法 |
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JP5235376B2 (ja) * | 2007-10-05 | 2013-07-10 | 川崎重工業株式会社 | ロボットのターゲット位置検出装置 |
MX2014014397A (es) | 2012-05-25 | 2015-02-05 | Dow Global Technologies Llc | Produccion de paneles de espuma de poliisocianurato. |
KR101439748B1 (ko) * | 2013-03-05 | 2014-09-12 | 이종희 | 교시 시스템을 갖는 로봇 및 이의 교시 방법 |
CN105556654B (zh) * | 2013-09-26 | 2019-07-26 | 应用材料公司 | 用于传送基板的气动终端受动器装置、基板传送系统与方法 |
JP6438189B2 (ja) * | 2013-10-01 | 2018-12-12 | 川崎重工業株式会社 | ロボット及びロボットの制御方法 |
WO2016077387A1 (en) | 2014-11-10 | 2016-05-19 | Brooks Automation, Inc. | Tool auto-teach method and apparatus |
KR101725406B1 (ko) * | 2016-03-31 | 2017-04-11 | 로체 시스템즈(주) | 이송 로봇의 오토 티칭 시스템 |
CN111065497B (zh) * | 2017-09-06 | 2023-01-31 | 株式会社富士 | 工件输送机器人 |
TWI672762B (zh) * | 2018-06-14 | 2019-09-21 | 旺矽科技股份有限公司 | 晶圓取放方法 |
JP7101102B2 (ja) * | 2018-11-15 | 2022-07-14 | 東京エレクトロン株式会社 | 搬送ロボットシステム、教示方法、及びウエハ収容容器 |
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JP2004296484A (ja) * | 2003-03-25 | 2004-10-21 | Hitachi Kokusai Electric Inc | 基板処理装置 |
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- 2008-07-10 JP JP2010519599A patent/JP5114805B2/ja active Active
- 2008-07-10 WO PCT/JP2008/062491 patent/WO2010004636A1/ja active Application Filing
- 2008-07-10 EP EP08778039.1A patent/EP2324968B1/en active Active
- 2008-07-10 US US13/002,998 patent/US8641351B2/en active Active
- 2008-07-10 KR KR1020117002497A patent/KR101291495B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6242879B1 (en) * | 2000-03-13 | 2001-06-05 | Berkeley Process Control, Inc. | Touch calibration system for wafer transfer robot |
JP2004296484A (ja) * | 2003-03-25 | 2004-10-21 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2006185960A (ja) * | 2004-12-24 | 2006-07-13 | Tokyo Electron Ltd | 基板処理装置及びその搬送位置合わせ方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2016129102A1 (ja) * | 2015-02-13 | 2017-11-24 | 川崎重工業株式会社 | 基板搬送ロボットおよびその運転方法 |
Also Published As
Publication number | Publication date |
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EP2324968B1 (en) | 2018-11-21 |
KR101291495B1 (ko) | 2013-08-01 |
EP2324968A1 (en) | 2011-05-25 |
US20110160897A1 (en) | 2011-06-30 |
KR20110039309A (ko) | 2011-04-15 |
WO2010004636A1 (ja) | 2010-01-14 |
JPWO2010004636A1 (ja) | 2011-12-22 |
US8641351B2 (en) | 2014-02-04 |
EP2324968A4 (en) | 2015-02-25 |
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