CN107234851A - 高频高速覆铜板制作方法及其覆铜板 - Google Patents

高频高速覆铜板制作方法及其覆铜板 Download PDF

Info

Publication number
CN107234851A
CN107234851A CN201710485086.5A CN201710485086A CN107234851A CN 107234851 A CN107234851 A CN 107234851A CN 201710485086 A CN201710485086 A CN 201710485086A CN 107234851 A CN107234851 A CN 107234851A
Authority
CN
China
Prior art keywords
copper
ppo
resins
speed
frequency high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710485086.5A
Other languages
English (en)
Other versions
CN107234851B (zh
Inventor
李洪彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Dekai Industry Ltd By Share Ltd
Original Assignee
Chongqing Dekai Industry Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Dekai Industry Ltd By Share Ltd filed Critical Chongqing Dekai Industry Ltd By Share Ltd
Priority to CN201710485086.5A priority Critical patent/CN107234851B/zh
Publication of CN107234851A publication Critical patent/CN107234851A/zh
Application granted granted Critical
Publication of CN107234851B publication Critical patent/CN107234851B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/08Interconnection of layers by mechanical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1269Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • B32B2260/023Two or more layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0166Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明提供了一种高频高速覆铜板制作方法,将低分子量聚苯醚与双酚A型氰酸酯树脂进行共混性改,制备得到改良后的PPO/CE树脂;将改良后的PPO/CE树脂与填料、阻燃剂等按照一定比例加工混合而成,配制成生产频率高频高速覆铜板专用的胶水;再对增强材料进行预处理;然后将预处理后的NE玻璃纤维布与PPO/CE树脂在含浸机中经过预浸、含浸、排气、烘干等单元操作后制备成半固化片;制备好的半固化片交错堆叠,将叠制好的半固化片与一种高频超低轮廓度电解铜箔(VLP)组装成本后,在热机中经过高温、高压压制成型。这种方法生产出来的高频高速覆铜板在降低介电常数和介质损耗因子的条件下,也能满足覆铜板的其他性能要求,以能够适用于高频高速印制线路板的制作。

Description

高频高速覆铜板制作方法及其覆铜板
技术领域
本发明涉及覆铜板制备技术领域,具体涉及高频高速覆铜板制作方法及其覆铜板。
背景技术
在2017年3月发布的我国“十三五”信息产业发展指南中个,提出“加快推进5G研发,突破5G核心关键技术,支持标准研发和技术验证,积极推动5G国际标准研制,启动5G商用服务。使我国成为5G技术、标准、产业及应用的领先国家之一”。随着电子信息产业的高速化、高频化以及人们环保意识的调高,现有的覆铜板由于介电常数高、介电损耗大、耐高温性能差、尺寸稳定性不足等缺点已经无法满足在高频条件下使用。
发明内容
针对现有技术中的缺陷,本发明提供一种高频高速覆铜板制作方法及其覆铜板,介电常数小、介电损耗小,能够适用于高频高速印制线路板的制作。
本发明提供的一种高频高速覆铜板制作方法,包括以下步骤:
S1、改良树脂的制备:将低分子量聚苯醚PPO630与双酚A型氰酸酯树脂CEO1PO进行共混性改,制备得到PPO/CE树脂;
S2、专用胶水的配制:改良后的PPO/CE树脂与2-乙基-3-甲基咪唑、过氧化二异丙苯、4,4-二氨基二苯砜、二甲苯和阻燃剂按照比例加工混合而成,配制成生产高频高速覆铜板的专用胶水;
S3、增强材料预处理:选取NE玻璃纤维布作为增强材料,并在40℃下烧30min,然后自然冷却至室温;再将加热处理过的NE玻璃纤维布浸在处理液中10-15min,自然风干30-45min,然后将其放置在100℃的电热鼓风箱中烘干2H;
S4、半固化片的制备:将处理后的NE玻璃纤维布与PPO/CE树脂在含浸机中经过预浸、含浸、排气、烘干等单元操作后制备成半固化片;
S5、热压成型:制备好的半固化片经叠制、组合后送入热压机,在高温高压的条件下压制成型。
进一步的,S1中共混改性的具体方法为:
S11、将低分子量聚苯醚、双酚A型氰酸酯树脂和二甲苯放入容器中,在100℃下搅拌至溶液呈透明状;
S12、停止加热,将溶液降温至60℃,制备得到PPO/CE树脂。
进一步的,S2中专用胶水的配制具体方法为:
分别加入过氧化二异丙苯、2-乙基-3-甲基咪唑、4,4-二氨基二苯砜和阻燃剂到改良后的PPO/CE树脂中,在130℃下回流加热搅拌反应2H,然后冷却至室温。
进一步的,在S3中,玻璃布处理液为将硅烷偶联剂配成1%的水溶液,然后用冰醋酸调至PH=3~4,常温搅拌反应30min。
进一步的,其由树脂体系、NE玻璃纤维布和铜箔制备而成,树脂体系由以下重量百分含量的组分组成:
低分子量聚苯醚(PPO630) 12%-34%
双酚A型氰酸酯树脂(CEO1PO) 5%-16%
2-乙基-3-甲基咪唑 0.5%-2%
过氧化二异丙苯 2%-5%
4,4-二氨基二苯砜(DDS) 7%-24%
二甲苯 30%-53%
阻燃剂 4%-20%。
进一步的,阻燃剂由以下重量百分含量的组分组成:
溴化环氧树脂 10%-30%
硼酸铝晶须 5%-10%
氢氧化铝粉末 10%-30%
丙酮 25%-50%。
由上述技术方案可知,本发明的有益效果:
本发明提供了一种高频高速覆铜板制作方法,将低分子量聚苯醚与双酚A型氰酸酯树脂进行共混性改,制备得到改良后的PPO/CE树脂;然后将改良后的PPO/CE树脂与2-乙基-3-甲基咪唑、过氧化二异丙苯、4,4-二氨基二苯砜、二甲苯和阻燃剂按照一定比例加工混合而成,配制成生产高频高速覆铜板的专用胶水;再对增强材料NE型低介电常数玻璃纤维布进行预处理;然后将预处理后的NE玻璃纤维布与PPO/CE树脂在含浸机中经过预浸、含浸、排气、烘干等单元操作后制备成半固化片;制备好的半固化片以特定张数交错堆叠,然后将叠制好的半固化片与一种高频超低轮廓度电解铜箔(VLP)组装成本后,在热机中经过高温、高压压制成型。这种方法生产出来的高频高速覆铜板在降低介电常数和介质损耗因子的条件下,也能满足覆铜板的其他性能要求,以能够适用于高频高速印制线路板的制作。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍。在所有附图中,类似的元件或部分一般由类似的附图标记标识。附图中,各元件或部分并不一定按照实际的比例绘制。
图1为本发明高频高速覆铜板制作方法的流程示意图。
具体实施方式
下面将结合附图对本发明技术方案的实施例进行详细的描述。以下实施例仅用于更加清楚地说明本发明的技术方案,因此只作为示例,而不能以此来限制本发明的保护范围。
需要注意的是,除非另有说明,本申请使用的技术术语或者科学术语应当为本发明所属领域技术人员所理解的通常意义。
请参阅图1,本实施例提供的一种高频高速覆铜板制作方法,包括以下步骤:
将低分子量聚苯醚PPO630与双酚A型氰酸酯树脂CEO1PO进行共混性改得到PPO/CE树脂,并制备专用胶水:
(1)将低分子量聚苯醚、双酚A型氰酸酯树脂和二甲苯放入容器中,在100℃下搅拌至溶液呈透明状;
(2)停止加热,将溶液降温至60℃;
(3)分别加入过氧化二异丙苯、2-乙基-3-甲基咪唑、4,4-二氨基二苯砜和阻燃剂,在130℃下回流加热搅拌反应2H,然后冷却至室温。
增强材料预处理:选取NE玻璃纤维布作为增强材料,并在40℃下烧30min,然后自然冷却至室温;再将加热处理过的NE玻璃纤维布浸在处理液中10-15min,自然风干30-45min,然后将其放置在100℃的电热鼓风箱中烘干2H。玻璃布处理液为将硅烷偶联剂配成1%的水溶液,然后用冰醋酸调至PH=3~4,常温搅拌反应30min。
半固化片的制备:将处理后的NE玻璃纤维布与PPO/CE树脂在含浸机中经过预浸、含浸、排气、烘干等单元操作后制备成半固化片。
热压成型:制备好的半固化片经叠制、组合后送入热压机,在高温高压的条件下压制成型。
介电常数DK是电极间充以某种物质时的电容与同样构造的真空电容器的电容之比,通常表示某种材料储存电能能力的大小。通过印制板上电信号的电流方向通常是正负交替变化的,相当于对基板进行不断充电、放电的过程。在互换中,电容量会影响信号传输速度。而这种影响,在高速传送的装置中显得更为明显。当DK大时,表示储存电能能力大,电路中电信号传输速度就会变慢。当DK小时,表示储存电能能力小,充、放电过程就快,从而使传输速度加快。所以,在高频传输中,要求介电常数DK低。NE玻纤布的介电常数DK=4.4,低于常用的E型玻纤布DK=6.6,因此使用NE玻纤布可以降低材料的介电常数。
介质损耗因子Df,也叫介质损耗角正切,绝缘材料或电介质在交变电场中,由于介质电导和介质极化的滞后效应,使电介质内流过的电流向量和电压向量之间产生一定的相位差,即形成一定的相角,此相角的正切值即介质损耗因子Df,由介质电导和介质极化的滞后效应引起的能量损耗叫做介质损耗。Df越高,介质电导和介质极化滞后效应越明显,电能损耗或信号损失越多,是电介质损耗电能的能力,也是绝缘材料损失信号能力的表征物理量。
聚苯醚(PPO)树脂由于其本身优异的电气性能、机械性能、耐湿性能以及尺寸稳定性,在覆铜板制造领域有着极为广泛的应用。但聚苯醚树脂存在耐锡焊性差、耐卤代烃和芳香烃等溶剂性差等不足。因而需要对聚苯醚树脂进行改性使其能形成交联固化的热固性树脂,提高其综合性能。改性的途径可以分为以下几种。第一种是在聚苯醚分子结构中引入可交联的活性基团使之成为热固性聚合物;第二种是通过共混性或穿网络技术引入其他高性能热固性树脂,形成相容共混的热固性树脂体系。与传统的环氧覆铜板相比,环氧/氰酸酯体系具有较低的介电常数,且随着氰酸酯树脂含量的增加而减小,因为氰酸酯树脂本身具有极好的介电性能。此外,环氧/氰酸酯体系的吸水很小,氰酸酯取代了传统环氧活性氢固化剂,这也是其介电性能优良的一个重要原因。
覆铜板其由树脂体系、NE玻璃纤维布和铜箔制备而成,树脂体系由以下重量百分含量的组分组成:
低分子量聚苯醚(PPO630) 12%-34%
双酚A型氰酸酯树脂(CEO1PO) 5%-16%
2-乙基-3-甲基咪唑 0.5%-2%
过氧化二异丙苯 2%-5%
4,4-二氨基二苯砜 7%-24%
二甲苯 30%-53%
阻燃剂 4%-20%。
作为上述方案的进一步改进,阻燃剂由以下重量百分含量的组分组成:
溴化环氧树脂 10%-30%
硼酸铝晶须 5%-10%
氢氧化铝粉末 10%-30%
丙酮 25%-50%。
覆铜板的介电性能主要取决于树脂和增强材料,进行改性双马体系介电性 能测试,结果如下表:
由此可知,在阻燃剂的配比中,溴化环氧树脂含量为10%-30%,硼酸铝晶 须为5%-10%,氢氧化铝粉末为10%-30%时即能改善介电性能,又能满足阻燃要 求。
实施例1
将12%低分子量聚苯醚、10%双酚A型氰酸酯树脂和53%二甲苯放入容器中,在100℃下搅拌至溶液呈透明状;停止加热,将溶液降温至60℃;再分别加入5%过氧化二异丙苯、1%2-乙基-3-甲基咪唑、15%4,4-二氨基二苯砜、0.4%溴化环氧树脂、0.4%硼酸铝晶须、1.0%氢氧化铝粉末、2.2%丙酮,在130℃下回流加热搅拌反应2H,然后冷却至室温。测量其介电常数为3.2,满足要求。
实施例2
将20%低分子量聚苯醚、15%双酚A型氰酸酯树脂和二甲苯42%放入容器中,在100℃下搅拌至溶液呈透明状;停止加热,将溶液降温至60℃;再分别加入2%过氧化二异丙苯、0.5%2-乙基-3-甲基咪唑、12%4,4-二氨基二苯砜、1.2%溴化环氧树脂、1%硼酸铝晶须、2%氢氧化铝粉末、4.3%丙酮,在130℃下回流加热搅拌反应2H,然后冷却至室温。测量其介电常数为3.0,满足要求。
实施例3
将34%低分子量聚苯醚、10%双酚A型氰酸酯树脂和30%二甲苯放入容器中,在100℃下搅拌至溶液呈透明状;停止加热,将溶液降温至60℃;再分别加入4%过氧化二异丙苯、1.2%2-乙基-3-甲基咪唑、7%4,4-二氨基二苯砜、2%溴化环氧树脂、1%硼酸铝晶须、4.8%氢氧化铝粉末、6%丙酮,在130℃下回流加热搅拌反应2H,然后冷却至室温。测量其介电常数为3.3,满足要求。
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围,其均应涵盖在本发明的权利要求和说明书的范围当中。

Claims (6)

1.一种高频高速覆铜板制作方法,其特征在于:包括以下步骤:
S1、改良树脂的制备:将低分子量聚苯醚PPO630与双酚A型氰酸酯树脂CEO1PO进行共混性改,制备得到PPO/CE树脂;
S2、专用胶水的配制:改良后的PPO/CE树脂与2-乙基-3-甲基咪唑、过氧化二异丙苯、4,4-二氨基二苯砜、二甲苯和阻燃剂按照比例加工混合而成,配制成生产高频高速覆铜板的专用胶水;
S3、增强材料预处理:选取NE玻璃纤维布作为增强材料,并在40℃下烧30min,然后自然冷却至室温;再将加热处理过的NE玻璃纤维布浸在处理液中10-15min,自然风干30-45min,然后将其放置在100℃的电热鼓风箱中烘干2H;
S4、半固化片的制备:将处理后的NE玻璃纤维布与PPO/CE树脂在含浸机中经过预浸、含浸、排气、烘干等单元操作后制备成半固化片;
S5、热压成型:制备好的半固化片经叠制、组合后送入热压机,在高温高压的条件下压制成型。
2.根据权利要求1所述的高频高速覆铜板制作方法,其特征在于:所述S1中共混改性的具体方法为:
S11、将低分子量聚苯醚、双酚A型氰酸酯树脂和二甲苯放入容器中,在100℃下搅拌至溶液呈透明状;
S12、停止加热,将溶液降温至60℃,制备得到PPO/CE树脂。
3.根据权利要求2所述的高频高速覆铜板制作方法,其特征在于:所述S2中专用胶水的配制具体方法为:
分别加入过氧化二异丙苯、2-乙基-3-甲基咪唑、4,4-二氨基二苯砜和阻燃剂到改良后的PPO/CE树脂中,在130℃下回流加热搅拌反应2H,然后冷却至室温。
4.根据权利要求3所述的高频高速覆铜板制作方法,其特征在于:在S3中,玻璃布处理液为将硅烷偶联剂配成1%的水溶液,然后用冰醋酸调至PH=3~4,常温搅拌反应30min。
5.一种覆铜板,其特征在于:其由树脂体系、NE玻璃纤维布和铜箔制备而成,所述树脂体系由以下重量百分含量的组分组成:
低分子量聚苯醚(PPO630) 12%-34%
双酚A型氰酸酯树脂(CEO1PO) 5%-16%
2-乙基-3-甲基咪唑 0.5%-2%
过氧化二异丙苯 2%-5%
4,4-二氨基二苯砜(DDS) 7%-24%
二甲苯 30%-53%
阻燃剂 4%-20%。
6.根据权利要求5所述的覆铜板,其特征在于:所述阻燃剂由以下重量百分含量的组分组成:
溴化环氧树脂 10%-30%
硼酸铝晶须 5%-10%
氢氧化铝粉末 10%-30%
丙酮 25%-50%。
CN201710485086.5A 2017-06-23 2017-06-23 高频高速覆铜板制作方法及其覆铜板 Active CN107234851B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710485086.5A CN107234851B (zh) 2017-06-23 2017-06-23 高频高速覆铜板制作方法及其覆铜板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710485086.5A CN107234851B (zh) 2017-06-23 2017-06-23 高频高速覆铜板制作方法及其覆铜板

Publications (2)

Publication Number Publication Date
CN107234851A true CN107234851A (zh) 2017-10-10
CN107234851B CN107234851B (zh) 2019-03-26

Family

ID=59986888

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710485086.5A Active CN107234851B (zh) 2017-06-23 2017-06-23 高频高速覆铜板制作方法及其覆铜板

Country Status (1)

Country Link
CN (1) CN107234851B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109082117A (zh) * 2018-07-13 2018-12-25 航天特种材料及工艺技术研究所 一种具有低介电常数、低介电损耗并可中温固化的树脂基透波复合材料及其制备方法
CN110183840A (zh) * 2019-06-18 2019-08-30 扬州天启新材料股份有限公司 一种高速覆铜板用改性聚苯醚树脂及其制备方法
CN110733225A (zh) * 2018-10-19 2020-01-31 嘉兴学院 一种高导热高韧性覆铜板的制备方法
CN111531982A (zh) * 2020-03-31 2020-08-14 江西省航宇新材料股份有限公司 一种高速覆铜板及其制备方法
CN112358717A (zh) * 2020-11-23 2021-02-12 江苏诺德新材料股份有限公司 一种改性聚苯醚树脂组合物及其制造的高频覆铜板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2842152B2 (ja) * 1993-06-11 1998-12-24 松下電工株式会社 熱硬化性樹脂組成物、プリプレグの製造方法及び積層板の製造方法
JP5276389B2 (ja) * 2008-09-05 2013-08-28 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
CN103818054A (zh) * 2014-03-18 2014-05-28 铜陵浩荣电子科技有限公司 一种生产介电常数3.4的高频微波覆铜板的工艺
CN104804404A (zh) * 2015-05-20 2015-07-29 广州宏仁电子工业有限公司 树脂组合物及其应用
CN105385107A (zh) * 2015-12-07 2016-03-09 浙江华正新材料股份有限公司 一种高介电基板用热固性树脂组合物、层压板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2842152B2 (ja) * 1993-06-11 1998-12-24 松下電工株式会社 熱硬化性樹脂組成物、プリプレグの製造方法及び積層板の製造方法
JP5276389B2 (ja) * 2008-09-05 2013-08-28 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
CN103818054A (zh) * 2014-03-18 2014-05-28 铜陵浩荣电子科技有限公司 一种生产介电常数3.4的高频微波覆铜板的工艺
CN104804404A (zh) * 2015-05-20 2015-07-29 广州宏仁电子工业有限公司 树脂组合物及其应用
CN105385107A (zh) * 2015-12-07 2016-03-09 浙江华正新材料股份有限公司 一种高介电基板用热固性树脂组合物、层压板

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109082117A (zh) * 2018-07-13 2018-12-25 航天特种材料及工艺技术研究所 一种具有低介电常数、低介电损耗并可中温固化的树脂基透波复合材料及其制备方法
CN109082117B (zh) * 2018-07-13 2021-03-23 航天特种材料及工艺技术研究所 一种具有低介电常数、低介电损耗并可中温固化的树脂基透波复合材料及其制备方法
CN110733225A (zh) * 2018-10-19 2020-01-31 嘉兴学院 一种高导热高韧性覆铜板的制备方法
CN110733225B (zh) * 2018-10-19 2021-07-09 嘉兴学院 一种高导热高韧性覆铜板的制备方法
CN110183840A (zh) * 2019-06-18 2019-08-30 扬州天启新材料股份有限公司 一种高速覆铜板用改性聚苯醚树脂及其制备方法
CN111531982A (zh) * 2020-03-31 2020-08-14 江西省航宇新材料股份有限公司 一种高速覆铜板及其制备方法
CN112358717A (zh) * 2020-11-23 2021-02-12 江苏诺德新材料股份有限公司 一种改性聚苯醚树脂组合物及其制造的高频覆铜板

Also Published As

Publication number Publication date
CN107234851B (zh) 2019-03-26

Similar Documents

Publication Publication Date Title
CN107234851A (zh) 高频高速覆铜板制作方法及其覆铜板
CN108189520B (zh) 一种改性聚四氟乙烯覆铜板的制作方法
CN104672495B (zh) 一种有机‑无机复合导热填料及其制备方法及其应用
CN109762436B (zh) 一种适用于超导绝缘材料的耐低温导热绝缘树脂漆及其制备方法和应用
CN111546722B (zh) 一种加强型高导热云母带及其制备方法
CN101917080B (zh) 环氧耐电晕聚酰亚胺薄膜玻璃粉云母带及其制作的风力发电机转子线棒的制备方法
CN105315454B (zh) 有机硅改性制备含硅双羟基聚苯醚的方法及产物的应用
CN111485456B (zh) 一种高强度复合云母纸及其制备方法
CN108257710B (zh) 一种石墨烯导电浆料及其制备方法
CN110228239A (zh) 一种低介电聚全氟乙丙烯覆铜板及其制备方法
CN113943473B (zh) 一种高韧性环氧树脂组合物及其制备工艺
CN114214867A (zh) 一种耐电晕的芳纶/云母绝缘纸及其制备方法
CN117082718A (zh) 一种防静电多层线路板及其制备方法
CN114103305B (zh) 一种高Tg高导热的金属基覆铜板及其加工工艺
CN105199619A (zh) 铝基覆铜板用高导热胶膜制备方法
CN113844129A (zh) 一种无卤、低介电损耗、高耐热覆铜板的制备方法
CN102320168A (zh) 杂萘联苯聚芳醚高性能热塑性树脂基覆铜板及其制备方法
CN108456387A (zh) 一种无玻纤型聚四氟乙烯胶片、制作方法及其应用
CN109370497B (zh) 一种生产高速覆铜板的胶水的制备方法及其产品
CN111777541A (zh) 一种高Tg低介电活性酯固化剂、制备方法及应用
CN114395353A (zh) 一种填料分散均匀的环氧树脂胶液及其制备的覆铜板
CN107385681B (zh) 一种静电纺丝制备均匀透明导电薄膜的方法
CN114103306B (zh) 一种无卤无铅高Tg覆铜板及其加工工艺
CN105295302A (zh) 一种耐高温、抗老化的电缆绝缘层
CN114987005A (zh) 一种氧化铝填充的环氧树脂基覆铜板及其制备方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant