CN107148152B - 印刷基板用曝光装置 - Google Patents

印刷基板用曝光装置 Download PDF

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Publication number
CN107148152B
CN107148152B CN201710117232.9A CN201710117232A CN107148152B CN 107148152 B CN107148152 B CN 107148152B CN 201710117232 A CN201710117232 A CN 201710117232A CN 107148152 B CN107148152 B CN 107148152B
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China
Prior art keywords
substrate
base
frame
exposure
exposure apparatus
Prior art date
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CN201710117232.9A
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English (en)
Chinese (zh)
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CN107148152A (zh
Inventor
原贵之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
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Ushio Denki KK
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Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Publication of CN107148152A publication Critical patent/CN107148152A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
CN201710117232.9A 2016-03-01 2017-03-01 印刷基板用曝光装置 Active CN107148152B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-039453 2016-03-01
JP2016039453A JP6663252B2 (ja) 2016-03-01 2016-03-01 プリント基板用露光装置

Publications (2)

Publication Number Publication Date
CN107148152A CN107148152A (zh) 2017-09-08
CN107148152B true CN107148152B (zh) 2021-01-12

Family

ID=59783754

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710117232.9A Active CN107148152B (zh) 2016-03-01 2017-03-01 印刷基板用曝光装置

Country Status (4)

Country Link
JP (1) JP6663252B2 (ja)
KR (1) KR102126456B1 (ja)
CN (1) CN107148152B (ja)
TW (1) TWI694540B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709190B (zh) * 2019-06-14 2020-11-01 財團法人國家實驗研究院 應用於曝光機之結構及其曝光方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270486A (ja) * 2001-03-09 2002-09-20 Orc Mfg Co Ltd 基板露光装置およびその使用方法
JP2007052137A (ja) * 2005-08-16 2007-03-01 Fujifilm Holdings Corp ワーク搬送装置とそれを備えた画像形成装置並びにワーク搬送方法
JP2007171621A (ja) * 2005-12-22 2007-07-05 Adtec Engineeng Co Ltd 密着型露光装置
JP2009109553A (ja) * 2007-10-26 2009-05-21 Adtec Engineeng Co Ltd 露光装置及び基板の矯正装置
JP2011011156A (ja) * 2009-07-02 2011-01-20 Konica Minolta Holdings Inc パターン描画方法、配線パターン描画方法及び薄膜トランジスタ基板の製造方法
JP2011081156A (ja) * 2009-10-07 2011-04-21 Orc Manufacturing Co Ltd 露光装置
JP2015038981A (ja) * 2013-07-18 2015-02-26 Ｎｓｋテクノロジー株式会社 密着露光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3098272B2 (ja) * 1991-04-04 2000-10-16 イビデン株式会社 プリント基板自動露光装置
JP2001022087A (ja) * 1999-07-05 2001-01-26 Canon Inc 露光装置
CH695405A5 (de) * 1999-12-14 2006-04-28 Esec Trading Sa Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats.
JP2006276084A (ja) * 2005-03-28 2006-10-12 Orc Mfg Co Ltd 露光テーブルおよび露光装置
KR101435123B1 (ko) * 2005-06-21 2014-08-27 상에이 기켄 가부시키가이샤 노광방법 및 노광장치
JP4627538B2 (ja) * 2007-07-18 2011-02-09 日立ビアメカニクス株式会社 露光装置
JP5472616B2 (ja) * 2010-01-27 2014-04-16 ウシオ電機株式会社 光照射装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270486A (ja) * 2001-03-09 2002-09-20 Orc Mfg Co Ltd 基板露光装置およびその使用方法
JP2007052137A (ja) * 2005-08-16 2007-03-01 Fujifilm Holdings Corp ワーク搬送装置とそれを備えた画像形成装置並びにワーク搬送方法
JP2007171621A (ja) * 2005-12-22 2007-07-05 Adtec Engineeng Co Ltd 密着型露光装置
JP2009109553A (ja) * 2007-10-26 2009-05-21 Adtec Engineeng Co Ltd 露光装置及び基板の矯正装置
JP2011011156A (ja) * 2009-07-02 2011-01-20 Konica Minolta Holdings Inc パターン描画方法、配線パターン描画方法及び薄膜トランジスタ基板の製造方法
JP2011081156A (ja) * 2009-10-07 2011-04-21 Orc Manufacturing Co Ltd 露光装置
JP2015038981A (ja) * 2013-07-18 2015-02-26 Ｎｓｋテクノロジー株式会社 密着露光装置

Also Published As

Publication number Publication date
JP2017156525A (ja) 2017-09-07
TWI694540B (zh) 2020-05-21
CN107148152A (zh) 2017-09-08
TW201836060A (zh) 2018-10-01
JP6663252B2 (ja) 2020-03-11
KR102126456B1 (ko) 2020-06-24
KR20170102431A (ko) 2017-09-11

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