CN107148152B - Exposure device for printed board - Google Patents
Exposure device for printed board Download PDFInfo
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- CN107148152B CN107148152B CN201710117232.9A CN201710117232A CN107148152B CN 107148152 B CN107148152 B CN 107148152B CN 201710117232 A CN201710117232 A CN 201710117232A CN 107148152 B CN107148152 B CN 107148152B
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- substrate
- base
- frame
- exposure
- exposure apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Abstract
The peripheral portion of the substrate can be pressed against the base without using the vacuum suction force of the substrate to the base or exposing the substrate to vacuum, so that the substrate can be easily handled even for substrates having different thicknesses. When a substrate (S) is sucked to a base (1) by a vacuum suction mechanism (3), a pair of peripheral sealing members (62) provided on a frame (61) having a shape that does not block exposure contact the base (1), and the frame (61) is pressed toward the base (1) by exhausting air from a sealed space formed through a frame exhaust hole (13). As a result, the substrate (S) is exposed by the exposure system (2) in a state in which the peripheral portion of the substrate (S) is pressed against the base (1) and the deformation of the substrate (S) is corrected.
Description
Technical Field
The present invention relates to an exposure apparatus for manufacturing a printed circuit board, and more particularly, to an exposure apparatus having a function of performing exposure while correcting deformation of a substrate.
Background
The printed circuit board is mounted on an electronic device such as a mobile phone or a personal computer. In order to reduce the size and weight of these electronic devices, it is required to increase the degree of integration of patterns formed on a substrate, and miniaturization of circuit elements and patterns has been advanced.
In a photolithography method for forming a pattern on a printed circuit board, there is an exposure step for forming a predetermined pattern such as a circuit pattern on a resist applied on a substrate, and an exposure apparatus is used. In order for an exposure apparatus to transfer a predetermined pattern such as a circuit pattern to a predetermined position on a substrate, the substrate needs to be disposed at a correct position with respect to an optical system that performs exposure. Therefore, a mechanism is employed in which a substrate is placed at a predetermined position on a table provided on the optical system, and the substrate is vacuum-sucked onto the table so as to hold the position during exposure.
Patent document
Japanese laid-open patent publication No. 2009-109553
Japanese patent laid-open publication No. 2011-81156
Japanese patent No. 4589198
Disclosure of Invention
In the exposure apparatus for a printed circuit board using the mechanism for vacuum-sucking the substrate onto the base as described above, it is required to perform exposure accurately even for a substrate deformed such as warp or strain. Deformation such as warpage or strain of the substrate occurs due to several factors. One example is to use a very thin substrate for the purpose of reducing the size and weight of electronic equipment. A thin flexible substrate made of polyimide, polyester, or the like may be easily affected by heat treatment in a previous step, and may be bent or waved when viewed from a lateral direction. Even in the case of a rigid substrate such as epoxy glass, when the substrate has a multilayer structure, warpage or strain tends to occur in the peripheral portion of the substrate due to repeated processing for lamination, for example, due to a difference in thermal expansion coefficient between raw materials.
In view of a user using the exposure apparatus, it is desirable that a predetermined pattern such as a circuit pattern be exposed even to a substrate deformed in this manner.
The problem in exposure of the deformed substrate as described above is an error in vacuum suction. This is an error that, when the deformed substrate is placed on a base and vacuum-sucked, vacuum leakage occurs at the deformed portion, and thus sufficient suction cannot be performed. If a suction error occurs, the substrate may be misaligned during exposure, and therefore, the operation of the apparatus is normally stopped and the exposure process is interrupted.
In view of this, several techniques have been proposed for pressing the substrate against the base during vacuum suction. Among them, patent document 1 discloses a structure in which a gasket is disposed so as to surround a substrate when the substrate is vacuum-sucked, and the gasket is used to form a closed space to evacuate the closed space. In this structure, since the mechanism for pressing the substrate against the base is removed during exposure, a vacuum suction error may occur in the substrate having a strong elasticity of warpage during exposure. Further, since the substrate is directly exposed to a vacuum, when a protective film is provided on the surface of the substrate, it is considered that the protective film is peeled off or bubbles are generated inside the protective film.
Further, it is considered that the same problem as described above occurs because the substrate is exposed to a vacuum.
The present invention has been made to solve the above problems, and an object of the present invention is to provide an exposure apparatus for a printed circuit board, which can press a peripheral portion of a substrate against a base during exposure without using a force of vacuum-sucking the substrate on the base or exposing the peripheral portion of the substrate to vacuum, and which can easily cope with substrates having different thicknesses.
In order to solve the above problem, the invention described in claim 1 of the present application is an exposure apparatus for a printed circuit board, comprising:
a base on which a substrate is placed; and
an exposure system for irradiating a substrate placed on a base with exposure light for forming a predetermined pattern,
the exposure device for the printed substrate comprises the following components:
provided with a vacuum suction mechanism for vacuum sucking the substrate onto the base and a pressing mechanism for pressing the peripheral edge of the substrate placed on the base toward the base,
the pressing mechanism includes a frame body having a shape that does not shield exposure light for forming a predetermined pattern on the substrate, and a driving portion for pressing the peripheral portion of the substrate toward the base by pressing the frame body toward the base with the peripheral portion of the substrate sandwiched between the frame body and the base,
the frame body has a structure that a closed space is formed at a position deviated from the substrate, and when the substrate is irradiated with exposure light for forming a predetermined pattern, the drive section vacuums the closed space to press the peripheral portion of the substrate against the base,
the exposure device for the printed substrate is provided with a control part for controlling the exposure system and the pressing mechanism,
the control unit also controls the operation of the drive unit of the pressing mechanism while the substrate is irradiated with the exposure light for forming a predetermined pattern.
In order to solve the above problem, the invention according to claim 2 has a configuration in which, in the configuration of claim 1, the following configuration is provided: an elastic peripheral sealing member is provided on a surface of the frame body facing the base, the surface being pressed toward the base, the peripheral sealing member being in a shape to abut against the base at a position offset from the substrate to form the closed space.
In order to solve the above problem, the invention according to claim 3 has a configuration in which, in the configuration of claim 1, the following configuration is provided: the base has a surface facing the frame to be pressed, and a peripheral sealing member having elasticity is provided on the surface facing the frame, and the peripheral sealing member is in a shape to abut against the frame at a position deviated from the substrate to form the closed space.
In order to solve the above problem, the invention according to claim 4 has a configuration as follows in the configuration according to claim 2 or 3: the peripheral sealing member is tubular.
In order to solve the above problem, the invention according to claim 5 has a configuration as described in any one of claims 1 to 4, wherein: a standby position is set, the standby position is a position where the frame is located when the substrate is carried into the base station and when the substrate is carried out from the base station,
a frame moving mechanism is provided for repeatedly moving the frame between an operating position and a standby position, wherein the operating position is a position at which the frame is pressed against the base with the peripheral portion of the substrate sandwiched therebetween.
In order to solve the above problem, the invention according to claim 6 has a configuration according to claim 5, wherein: the substrate transport mechanism is also used as the frame moving mechanism.
In order to solve the above problem, the invention according to claim 7 has a configuration as follows in the configuration according to claim 5 or 6: the frame moving mechanism is a mechanism for moving the frame while vacuum-sucking and holding the frame.
In order to solve the above problem, the invention according to claim 8 has the following configuration in the configuration according to claim 6 or 7: the substrate conveying mechanism is provided with a substrate adsorption pad for adsorbing and holding the substrate,
the frame body has a notch through which the substrate suction pad is inserted.
As described below, according to the invention described in claim 1 of the present application, the substrate is vacuum-sucked to the base and the peripheral portion of the substrate is pressed against the base via the frame during exposure. At this time, the frame is urged toward the base by the vacuum pressure of the sealed space formed. Since the vacuum pressure can be supplied by a system independent of the system for sucking the substrate to the base, even if a leak occurs between the substrate and the base, a strong pressing force can be applied to the frame. Thus, even when a substrate having high rigidity is deformed, the substrate can be reliably held on the base during exposure. Also, the closed space is formed at a position deviated from the substrate, so that the vacuum pressure therein does not directly act on the substrate.
In addition to the above-described effects, according to the invention described in claim 2 or 3, the elastic peripheral sealing member forms the closed space, and the pressing force is applied softly.
In addition to the above-described effects, according to the invention described in claim 4, since the peripheral sealing member is tubular, the pressure can be easily adjusted during pressing, and the substrate having different thicknesses can be easily pressed.
Further, according to the invention described in claim 5, in addition to the above-described effects, since the frame moving mechanism is provided, the frame can be retracted when the substrate is placed on the base and when the substrate is removed from the base, and the base does not need to be moved on a large scale, thereby simplifying the mechanism.
Further, according to the invention described in claim 6, in addition to the above-described effects, the substrate transport mechanism also serves as the frame body movement mechanism, and thus the structure and operation of the apparatus are simplified in this regard.
Further, according to the invention described in claim 7, in addition to the above-described effects, since the frame is moved while being sucked and held by the conveyor, the frame is easily peeled off and retracted by the conveyor at the time of exposure of the substrate, and the frame is easily replaced.
Further, according to the invention described in claim 8, in addition to the above-described effects, since the frame body has the notch through which the substrate suction pad is inserted, there is an effect that the substrate can be held with a sufficient suction force without complicating the structure.
Drawings
Fig. 1 is a schematic front sectional view of an exposure apparatus for a printed circuit board according to an embodiment.
Fig. 2 is a schematic plan view of a main part of the exposure apparatus of fig. 1.
Fig. 3 is a schematic perspective view of the housing.
Fig. 4 is a schematic front cross-sectional view illustrating the operation of the exposure apparatus for a printed circuit board according to the embodiment.
Fig. 5 is a schematic front cross-sectional view illustrating the operation of the exposure apparatus for a printed circuit board according to the embodiment.
Fig. 6 is a schematic front cross-sectional view illustrating the operation of the exposure apparatus for a printed circuit board according to the embodiment.
Fig. 7 is a schematic perspective view showing an example of each housing prepared according to the size of the substrate.
Description of the reference symbols
1 base station
100 lifting mechanism
11 adsorption holes
12 exhaust passage for substrate
13 exhaust hole for frame
14 exhaust passage for housing
2 Exposure system
3 vacuum adsorption mechanism
41 first conveyor
42 second conveyor
51 first conveyor belt
Adsorption pad for 512 substrate
514 adsorption pad for frame
52 second conveyor belt
522 adsorption pad for substrate
6 pressing mechanism
61 frame body
611 incision
62 peripheral sealing member
63 exhaust pipe for frame
65 pressure regulating valve
Detailed Description
Next, an embodiment (hereinafter, an embodiment) for carrying out the invention of the present application will be described.
Fig. 1 is a schematic front sectional view of an exposure apparatus for a printed circuit board according to an embodiment, and fig. 2 is a schematic plan view of a main part of the exposure apparatus for a printed circuit board shown in fig. 1. The exposure apparatus for a printed board according to the embodiment includes a base 1 on which a substrate S is placed, and an exposure system 2 that irradiates the substrate S placed on the base 1 with exposure light for forming a pattern such as a circuit. Fig. 2 is a schematic plan view of the base 1 with the substrate S placed thereon.
As shown in fig. 2, the base 1 is a square table-like member in a plan view. The horizontal upper surface of the base 1 is a mounting surface for the substrate S, and a plurality of suction holes 11 are provided at regular intervals on the mounting surface. Further, a vacuum suction mechanism 3 is provided for sucking the substrate S to the base 1 by vacuum suction through the suction holes 11. The base 1 is connected to an exhaust pipe (hereinafter, substrate exhaust pipe) 31, and the substrate exhaust pipe 31 communicates with each adsorption hole 11 through a substrate exhaust passage 12 provided in the base 1. The substrate exhaust pipe 31 is provided with an on-off valve 32 and a pressure regulating valve 33.
As means for cooperating with the conveyors 41, 42, conveyor belts 51, 52 are provided on both sides of the base 1. The conveyor belts 51 and 52 may be set to be either a feeding side or a discharging side. For convenience of description, the right conveyor belt 51 is referred to as a first conveyor belt, and the left conveyor belt 52 is referred to as a second conveyor belt.
Each of the conveyor belts 51, 52 includes a frame 511, 521 and a substrate suction pad 512, 522 attached to the frame 511, 521. Each of the frames 511 and 521 is provided with a conveyance drive mechanism 513 or 523. The conveyance driving mechanisms 513 and 523 are not shown in detail, but are mechanisms capable of moving the frames 511 and 521 in the vertical direction while being positioned at predetermined positions by moving the frames linearly in the conveyance direction (the horizontal direction on the paper surface of fig. 1). The apparatus includes a control unit, not shown, and the respective conveyance driving mechanisms 513 and 523 are controlled by the control unit, not shown.
The substrate suction pads 512 and 522 are provided in plural along the periphery of the substrate S. The substrate suction pads 512 and 522 are connected to a substrate suction source, not shown. The on/off of the substrate suction source is also controlled by a control unit, not shown.
The exposure system 2 is disposed above the base 1. The exposure apparatus according to the embodiment can adopt any one of projection exposure, contact or proximity exposure, and DI (direct imaging) exposure without particularly selecting the exposure method. For example, in the case of projection exposure, the exposure system 2 is configured by a light source, a mask to which light from the light source is irradiated, a projection lens for projecting an image of the mask onto the base 1, and the like. In the case of DI exposure, a configuration is adopted in which a plurality of exposure units are provided, each exposure unit including a laser light source and a spatial modulation element such as a dmd (digital Mirror device) that spatially modulates light from the laser light source to form a pattern.
The exposure apparatus for a printed board according to this embodiment includes a pressing mechanism 6 for pressing the peripheral edge of the substrate S placed on the base 1 against the base 1 in order to reliably perform the suction of the substrate S by the vacuum suction mechanism. The pressing mechanism 6 includes a frame 61 and a driving unit that presses the frame 61 toward the base 1 with the peripheral portion of the substrate S sandwiched therebetween, thereby pressing the peripheral portion of the substrate S against the base 1. Further, a frame moving mechanism is provided for repeatedly moving the frame 61 between an operating position where the frame 61 is pressed against the base 1 with the peripheral portion of the substrate S sandwiched therebetween and a predetermined standby position. In the present embodiment, the first conveyor belt 51 for feeding and discharging the substrate S and the conveyance drive mechanism 513 thereof are used as the frame moving mechanism.
The frame body 61 is described more specifically with reference to fig. 3. Fig. 3 is a schematic perspective view of the frame 61. As shown in fig. 3, the frame 61 has a square frame shape. The inner edge of the frame 61 is slightly smaller in size than the outline of the substrate S. A plurality of substantially semicircular cutouts 611 are provided in the facing sides of the inner edge. The notch 611 has a shape for avoiding interference with the substrate suction pad 512.
As shown in fig. 1, the first conveyor belt 51 is provided with a plurality of frame suction pads 514. Each frame suction pad 514 is provided at a position where the frame 61 is sucked at a position closer to the outer edge. Each frame suction pad 514 is connected to a frame suction source, not shown.
The frame 61 has a structure in which a closed space is formed at a position away from the substrate S mounted on the base 1. Specifically, a peripheral sealing member 62 having elasticity is provided on the lower surface (the surface facing the base 1) of the frame 61. The peripheral sealing member 62 is provided at a position offset from the substrate S and in contact with the base 1.
The peripheral sealing member 62 is a tubular member in the present embodiment, and is made of a resin such as silicone rubber. As shown in fig. 2, the peripheral sealing member 62 is substantially square, and the smaller one is disposed concentrically. The shape of each peripheral sealing member 62 is substantially similar to the shape of the inner edge of the frame 61, and is substantially similar to the outline of the substrate S.
The space between the pair of large and small peripheral sealing members 62 is a sealed space and is set to a vacuum pressure. That is, the frame 61 is pressed against the base 1 with the substrate S sandwiched therebetween, as will be described later. As shown in fig. 1, a frame exhaust hole 13 is formed in a portion of the base 1 adjacent to the frame 61. The driving unit of the housing 61 is a mechanism for performing vacuum suction from the housing exhaust hole 13. The frame exhaust hole 13 is exhausted through a frame exhaust passage 14 of a system independent of the substrate suction hole 11, and a closed space formed by the pair of peripheral sealing members 62, the frame 61, and the base 1 is exhausted to a vacuum state. The closed space means a space closed except for the suction opening. The frame exhaust pipe 63 connected to the frame exhaust passage 14 is finally connected to a vacuum pump, not shown, together with the substrate exhaust pipe 31, but is a separate exhaust pipe before that, and an opening/closing valve 64 and a pressure regulating valve 65 are also provided in the frame exhaust pipe 63.
The base 1 is provided with an elevating mechanism 100. The lift mechanism 100 is driven at the time of transfer of the substrate S, and is also used for the purpose of adjusting the distance of the substrate S from the exposure system 2. The lifting mechanism 100 is constituted by a linear motion mechanism including a servo motor, and is controlled by a control unit.
Next, the operation of the exposure apparatus for a printed circuit board according to this embodiment will be described with reference to fig. 4 to 7. Fig. 4 to 6 are schematic front cross-sectional views showing the operation of the exposure apparatus for a printed circuit board according to the embodiment.
In the following description, the first conveyor 41 and the first conveyor belt 51 are used for feeding, and the second conveyor 42 and the second conveyor belt 52 are used for feeding, as an example. As an example, the first conveyor belt 51 is also used for moving the frame 61.
As shown in fig. 4(1), the first conveyor belt 51 stands by at a predetermined stand-by position on the first conveyor 41 while holding the frame 61. The second conveyor belt 52 stands by at a predetermined stand-by position above the second conveyor 42.
First, the first conveyor belt 51 carries out a feeding operation of the substrate S. That is, as shown in fig. 4(2), the first conveyor belt 51 descends. The descending distance at this time is a position where each substrate suction pad 512 abuts on the substrate S. When the lowering is completed, the substrate suction source of the first conveyor 51 operates, and the substrate S on the first conveyor 41 is sucked and held on the first conveyor 51. In this state, as shown in fig. 4(3), the conveyance drive mechanism 513 raises the first conveyor belt 51. The first conveyor belt 51 is stopped at a predetermined raised position in a state where the substrate S and the frame 61 are held.
As shown in fig. 4(4), the conveyance drive mechanism 513 moves the first conveyor belt 51 horizontally to a predetermined position above the base 1. Then, the lifting mechanism 100 is operated to lift the base 1 by a predetermined distance. As shown in fig. 5(1), this distance is a distance by which the substrate S is brought into contact with the upper surface (mounting surface) of the base 1 and the peripheral sealing members 62 of the frame 61 are also brought into contact with the base 1.
Thereafter, the control unit transmits control signals to the substrate suction source 512 and the housing suction source in the first conveyor 51, and stops the respective operations. Then, the control unit sends control signals to the on-off valve 32 of the substrate exhaust pipe 31 and the on-off valve 64 of the frame exhaust pipe 63 in the vacuum suction mechanism 3 to open them. As a result, the substrate S is vacuum-sucked by vacuuming from the substrate suction hole 11. The sealed space formed by the pair of peripheral sealing members 62 is subjected to a vacuum pressure by evacuation from the frame exhaust hole 13. As a result, the frame 61 is pressed toward the base 1 with the peripheral portion of the substrate S sandwiched between the frame and the base 1. That is, the frame 61 has a cross-sectional shape in which the inner edge is bent downward, and the tip of the bent portion abuts against the peripheral portion of the substrate S, so that the peripheral portion is pressed against the base 1. At this time, the peripheral sealing member 62 as an elastic body is slightly deformed by pressure.
The control unit sends a control signal to the lift mechanism 100 to lower the lift mechanism 100 by a predetermined distance, based on the release of the suction by the suction pads, the vacuum suction of the substrate S, and the suction of the frame 61. As a result, the base 1 returns to the original height as shown in fig. 5 (2). This height is a height that becomes the set exposure distance. Further, the conveyance drive mechanism 513 returns the first conveyor belt 51 to the initial standby position. In this state, as shown in fig. 5(3), the exposure system 2 operates to expose the substrate S on the base 1 by irradiating the substrate S with light having a predetermined pattern.
When the exposure for the predetermined time period is completed, as shown in fig. 5(4), the control unit sends a control signal to the conveyance drive mechanism 513, moves the first conveyance belt 51 at the standby position to a predetermined position above the base 1, and then lowers the first conveyance belt 51 by a predetermined distance, so that the frame suction pads 514 of the first conveyance belt 51 come into contact with the frame 61.
After the first conveyor belt 51 has descended to this position, the control unit operates the frame adsorption source of the first conveyor belt 51. The substrate suction source is not operated, and the substrate S is not sucked to the first conveyor 51. Simultaneously with the operation of the housing adsorption source, the control unit closes the on-off valve 64 in the housing exhaust pipe 63, and opens the atmosphere opening valve, not shown. As a result, the pressure in the sealed space generated by the pair of peripheral sealing members 62 returns to the atmospheric pressure, and the pressing of the peripheral portion of the substrate S by the frame 61 is released. The opening/closing valve 32 of the substrate exhaust pipe 31 is kept open, and the vacuum suction of the substrate S is not released.
In this state, the control unit sends a control signal to the conveyance drive mechanism 513 to raise the first conveyor belt 51, and then horizontally moves the first conveyor belt to return to the initial standby position as shown in fig. 6 (1). The first conveyor belt 51 securely holds the frame 61 by suction at the standby position.
Then, the control unit sends a control signal to the conveyance driving mechanism 523, moves the second conveyance belt 52 to a predetermined position above the base 1, and then lowers the second conveyance belt by a predetermined distance, so that the substrate suction pads 522 of the second conveyance belt 52 come into contact with the substrate S, as shown in fig. 6 (2). In this state, the control unit operates the substrate adsorption source of the second conveyor 52 to adsorb the substrate S. The controller closes the opening/closing valve 32 of the substrate exhaust pipe 31 to release the suction hole 11 from the atmosphere, thereby releasing the vacuum suction of the substrate S on the base 1. Thereby, the vacuum suction of the substrate S is switched from the base 1 to the second conveyor belt 52. At this time, a positive pressure may be instantaneously supplied to the suction holes 11 through the substrate exhaust pipe 31 to promote the return from the vacuum pressure to the atmospheric pressure. After the second conveyor belt 52 is lifted by the conveyor driving mechanism 523, it is horizontally moved and returned to the initial standby position as shown in fig. 6 (3). Thereafter, the second conveyor belt 52 is lowered by a predetermined distance by the conveyance drive mechanism 523, and as shown in fig. 6(4), the substrate S is placed on the second conveyor 42. After stopping the operation of the substrate adsorption source of the second conveyor 52, the control unit raises the second conveyor 52 and returns it to the standby position.
This completes a series of processing on one substrate S. The second conveyor 42 performs an operation of conveying the processed substrate S to the next process, and the next substrate S is carried into the first conveyor 41. The same operation is repeated for the next substrate S. As is apparent from the above description, the frame 61 is repeatedly used for the exposure process of the substrate S while reciprocating between the standby position of the first conveyor 51 and the position on the base 1 where the peripheral portion of the substrate S is pressed against the base 1.
As is clear from the above description, according to the exposure apparatus for a printed circuit board of the embodiment, the substrate S is vacuum-sucked to the base 1 and the peripheral portion of the substrate S is pressed against the base 1 through the frame 61 at the time of exposure. At this time, the frame 61 is urged toward the base 1 by the vacuum pressure of the sealed space formed by the pair of peripheral sealing members 62. This facilitates adjustment of the pressing force. That is, it is easy to set an appropriate pressure by the pressure regulating valve 65 provided in the casing exhaust pipe 63. In some cases, the pressure can be automatically controlled by the control unit.
As shown in fig. 1 and the like, the space of the vacuum pressure for pressing the frame 61 toward the base 1 is isolated from the space where the substrate S is located, and the substrate S is not directly exposed to the vacuum pressure. Therefore, the problems of peeling of the protective film of the substrate S and the occurrence of bubbles do not occur in the present embodiment.
Further, since the elastic peripheral sealing member 62 forms a sealed space, the mode of the pressing force acting on the substrate S becomes flexible. Even in the structure in which the sealed space is formed of a material other than the elastic member and vacuum evacuation is performed, a pressure of a degree to press the frame body 61 can be generated, but the structure of the embodiment can apply a pressing force softly.
In the present embodiment, the pair of circumferential sealing members 62 are tubular. This is significant in that the adjustment of the pressure during pressing is facilitated, and the pressing can be easily performed even for substrates S having different thicknesses. The peripheral sealing member 62 may be a thread-like or string-like elastic body instead of a tube-like (internally packed one). For example, a rubber string-like or sponge-like material can be used. However, as described above, the peripheral sealing member 62 has a function of securing a sealed state while being compressed by vacuum evacuation, and adjusting a pressing pressure against the pressing pressure of the frame body 61 to the substrate S by the vacuum pressure by elastically acting. When the thickness of the substrate S is increased, the cross-sectional area of the peripheral sealing member 62 is large (the height of the cross-section is high), but when the thin substrate S is pressed, a considerable compression is required to bring the frame 61 into contact with the peripheral portion of the substrate S, and there is a problem that the frame 61 cannot be brought into contact with the peripheral portion of the substrate S or the repulsive force due to elasticity is excessive even if the frame can be brought into contact. Therefore, the peripheral sealing member 62 needs to be replaced according to the thickness of the substrate S. On the other hand, in the case of a tubular member, even if the diameter is set to a diameter corresponding to the thick substrate S, the resilient force is applied relatively uniformly from the thick substrate S to the thin substrate S, and the substrate S is compressed. Therefore, the substrates S having different thicknesses can be used without replacement.
The circumferential sealing members 62 may not be a pair. For example, the same can be performed using a member having a shape in which the cross section is concave and the circumference is continuous.
Further, since the frame moving mechanism is provided, the frame 61 can be retracted when the substrate S is placed on the base 1 or when the substrate S is removed from the base 1. When the position of the frame 61 is fixed, a large-scale moving mechanism of the base 1 is necessary, which moves the base 1 in the lateral direction after moving it downward once, but this mechanism is not necessary in the configuration of the embodiment, and the mechanism is simplified.
As is clear from the above description, the hand (hand) that performs the conveyance operation by holding the substrate S by suction also has the function of holding the frame 61 by suction, and the conveyance mechanism for the substrate S also serves as the frame moving mechanism. This also has the meaning of simplifying the construction and operation of the device. In the practice of the present invention, the frame 61 may be suction-held by a hand independent from the hand for suction-holding the substrate S, and the independent hand may be moved by the moving mechanism. However, this complicates the structure and operation, and causes problems such as an increase in the cost of the apparatus and a long operation time. This problem is not caused if the frame body 61 is configured to be sucked and held by using the hand for the substrate.
Further, the fact that the conveyor belt moves the frame 61 while holding the frame 61 by suction means that the conveyor belt is easily separated from the frame 61 and retracted when the substrate S is exposed. In the practice of the present invention, the frame 61 may be fixed to the conveyor belt without being attached to or detached from the conveyor belt. However, in this case, since the conveyor and the moving mechanism thereof are located near the base 1 during exposure of the substrate S, it is necessary to prevent exposure from being blocked, which makes the structure complicated. On the other hand, in the structure of the conveyor suction holding frame body 61, the conveyor releases the suction and can be retracted to an arbitrary position, and therefore the structure is simplified.
In the exposure apparatus for a printed circuit board according to the above embodiment, the frame 61 is replaced as appropriate according to the size of the substrate S to be processed. This point will be described below with reference to fig. 7. Fig. 7 is a schematic perspective view showing an example of each frame 61 prepared according to the size of the substrate S.
As shown in fig. 7, in the present embodiment, different frames 61 are prepared for each size of the substrate S, but the outline of the outer side of each frame 61 is the same size and shape. Further, the size and shape of the openings are different. That is, the opening is formed in a slightly smaller size than the substrate S to be processed. In each frame 61, a plurality of notches 611 are also provided at the edges facing the opening. The notch 611 is for avoiding interference with the substrate suction pads 512 and 522.
When processing substrates S having different sizes, the first conveyor belt 51 holding the frame 61 used up to that time is lowered by a predetermined distance, and after the frame 61 is placed on the first conveyor 41, the frame adsorption source is turned off. After the first conveyor 41 is retracted upward, the frame 61 is removed, and the frame 61 for the substrate having a different size is placed on the first conveyor 41. Further, the first conveyor belt 51 is lowered to bring the frame suction pad 514 into contact with the frame 61, and then the frame suction source is operated to perform suction. Then, the first conveyor belt 51 is raised and stands by at the standby position.
When the housing 61 is replaced, the suction holding position of the housing 61 is appropriately aligned. For example, a method may be considered in which marks indicating the suction positions of the respective housing suction pads 514 are provided on the upper surface of the housing 61 in advance, and the marks are used as symbols to perform alignment.
When the substrates S of different sizes are processed as described above, the substrate suction pads 512 and 522 attract and hold the substrates S at different positions, and the positions of the substrate suction pads 512 and 522 are changed or changed. For example, a structure may be considered in which the substrate suction pads 512 and 522 are attached to the holder and replaced with the holder. The holder and the substrate suction pads 512 and 522 fixed to the holder can be replaced with each other in a unit.
In addition, although the structure is simplified in that the conveying belt for the substrate is also used for moving the frame 61 as described above, the notch 611 shown in fig. 3 and 7 also has a meaning that the substrate S can be held with a sufficient suction force without complicating the structure. That is, the frame 61 presses the peripheral portion of the substrate S so that the edge of the opening is positioned inward of the peripheral portion of the substrate S. In this case, in the configuration in which the substrate suction pads 512 and 522 are used for the movement of the frame 61, the substrate suction pads 512 and 522 perform a suction holding operation of the substrate S in a state in which the frame 61 is sucked and held by the conveyor belt, and the substrate suction pads 512 and 522 have to have a structure in which the substrate S is sucked by extending through the opening of the frame 61. In this case, since the circuit forming portion of the substrate S cannot be sucked and held, but the margin (margin) portion in the periphery is sucked and held, a plurality of very small suction pads have to be provided to suck and hold the substrate S without the notch 611. However, this structure is not practical, and the suction force cannot be sufficiently secured. If the notch 611 is present, the substrate S can be sucked by using a suction pad having a certain size. A portion of the frame body 61 that presses the substrate S can be secured with a certain area.
In the above embodiment, the substrate suction pads 512 and 522 are provided at positions to suck the substrate S on the peripheral edges of the pair of opposing sides among the peripheral edges of the substrate S, but may be provided at positions to suck the substrate S on the peripheral edges of the four sides. This is preferable in that the suction holding of the substrate S is reliably performed. The frames 511 and 521 for holding the substrate suction pads 512 and 522 are plate-shaped when the substrate S is suction-held on the peripheral edges of a pair of sides, but the frames 511 and 521 are square frames when the substrate S is held on the peripheral edges of four sides.
In the above embodiment, the first conveyor belt 51 and the first conveyor 41 are for carrying in, and the second conveyor belt 52 and the second conveyor 42 are for carrying out, but the relationship may be reversed, and each may be used for both carrying in and carrying out. That is, while the first conveyor belt 51 is performing the feeding operation of the substrate S and the exposure is performed, the second conveyor belt 52 stands by holding another substrate S, and after the exposure of the first substrate S is completed, the first conveyor belt 51 feeds out the substrate S, and then the second conveyor belt 52 feeds in another substrate S. The substrate S may be fed to and discharged from the respective conveyor belts alternately. In this case, the frame 61 is provided for each conveyor, and each conveyor performs the loading and unloading operation of the substrate S while holding the frame 61 by suction.
In addition, in the practice of the invention of the present application, only one conveyor belt is sufficient. The substrate S may be picked up from the base 1 by one of the conveyor belts that sucks and holds the frame 61 from the first conveyor 41 and placed on the base 1, and after the exposure is completed, the substrate S may be picked up from the base 1 together with the frame 61 and sent out to the second conveyor 42. In this case, a configuration in which the conveyor is provided only on one side may be employed.
The base 1 is configured to be provided with the elevating mechanism 100 and to elevate the base 1 when the substrate S is placed, but this may be performed by elevating or lowering a hand, and the base 1 may not be provided with the elevating mechanism 100. Further, if the conveyors are provided with elevating mechanisms other than the elevating mechanism 100 in the base 1, the conveyor driving mechanisms 513 and 523 do not need to have a function of elevating the conveyor belts 51 and 52.
In the above embodiment, the peripheral sealing member 62 is attached to the frame 61, but may be attached to the base 1. That is, even if the peripheral sealing member is provided on the upper surface of the base 1 at a portion facing the frame 61 which is gradually adjacent to the upper surface for pressing, the sealed space can be formed in the same manner, and the same operation can be performed.
Further, although the substrate exhaust pipe 31 of the vacuum adsorption mechanism 3 is finally integrated with the housing exhaust pipe 63, it may be a completely independent exhaust passage (independent) and may be configured to exhaust the substrate by a pump. Further, although the frame body exhaust hole 13 for exhausting the air in the closed space formed by the frame body 61 is formed in the base 1 in the above embodiment, it may be formed in the frame body 61. However, in this structure, the frame 61 is complicated and complicated in structure because the flexible tube for exhaust is led around. When the housing vent hole 13 is provided in the base 1, such a problem does not arise.
The frame 61 needs to press the substrate S against the base 1 by bringing a part thereof into contact with the peripheral edge of the substrate S, but the part forming the closed space may not be a part facing the base 1. That is, another frame-shaped member is provided around the base 1, and the peripheral sealing member 62 can abut against the other frame-shaped member to form a sealed space.
Claims (9)
1. An exposure apparatus for a printed board includes:
a base on which a substrate is placed; and
an exposure system for irradiating a substrate placed on a base with exposure light for forming a predetermined pattern,
it is characterized in that the preparation method is characterized in that,
is provided with: a vacuum adsorption mechanism for vacuum adsorbing the substrate onto the base; and a pressing mechanism for pressing the peripheral edge of the substrate placed on the base toward the base,
the pressing mechanism is provided with: a frame body having a shape that does not shield exposure light for forming a predetermined pattern on a substrate; and a drive unit for pressing the peripheral portion of the substrate against the base by pressing the frame body against the base with the peripheral portion of the substrate sandwiched between the frame body and the base,
the frame body has a structure forming a closed space at a position separated from the substrate, and when the substrate is irradiated with exposure light for forming a predetermined pattern, the drive part vacuumizes the closed space to press the peripheral part of the substrate to the base,
the exposure device for the printed substrate is provided with a control part for controlling the exposure system and the pressing mechanism,
the control unit also controls the operation of the drive unit of the pressing mechanism while the substrate is irradiated with the exposure light for forming a predetermined pattern.
2. The exposure apparatus for a printed board according to claim 1, wherein,
an elastic peripheral sealing member is provided on a surface of the frame body facing the base, the surface being pressed toward the base, the peripheral sealing member being in a shape to come into contact with the base at a position spaced apart from the substrate to form the sealed space.
3. The exposure apparatus for a printed board according to claim 1, wherein,
the base has a surface facing the frame to be pressed, and a peripheral sealing member having elasticity is provided on the surface facing the frame, and the peripheral sealing member is in a shape to abut against the frame at a position spaced apart from the substrate to form the closed space.
4. The exposure apparatus for a printed board according to claim 2, wherein,
the peripheral sealing member is tubular.
5. The exposure apparatus for a printed board according to claim 3, wherein,
the peripheral sealing member is tubular.
6. The exposure apparatus for a printed board according to any one of claims 1 to 5, wherein,
a standby position is set, the standby position is a position where the frame is located when the substrate is carried into the base station and when the substrate is carried out from the base station,
a frame moving mechanism is provided for repeatedly moving the frame between an operating position and a standby position, wherein the operating position is a position at which the frame is pressed against the base with the peripheral portion of the substrate sandwiched therebetween.
7. The exposure apparatus for a printed board according to claim 6, wherein,
the substrate transport mechanism is also used as the frame moving mechanism.
8. The exposure apparatus for a printed board according to claim 6, wherein,
the frame moving mechanism is a mechanism for moving the frame while vacuum-sucking and holding the frame.
9. The exposure apparatus for a printed board according to claim 7, wherein,
the substrate conveying mechanism is provided with a substrate adsorption pad for adsorbing and holding the substrate,
the frame body has a notch through which the substrate suction pad is inserted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016039453A JP6663252B2 (en) | 2016-03-01 | 2016-03-01 | Exposure equipment for printed circuit boards |
| JP2016-039453 | 2016-03-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107148152A CN107148152A (en) | 2017-09-08 |
| CN107148152B true CN107148152B (en) | 2021-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710117232.9A Active CN107148152B (en) | 2016-03-01 | 2017-03-01 | Exposure device for printed board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6663252B2 (en) |
| KR (1) | KR102126456B1 (en) |
| CN (1) | CN107148152B (en) |
| TW (1) | TWI694540B (en) |
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|---|---|---|---|---|
| JP7239388B2 (en) * | 2019-05-09 | 2023-03-14 | 株式会社アドテックエンジニアリング | Direct exposure system |
| TWI709190B (en) * | 2019-06-14 | 2020-11-01 | 財團法人國家實驗研究院 | Structure and exposure method applied to exposure machine |
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- 2017-02-27 KR KR1020170025603A patent/KR102126456B1/en active IP Right Grant
- 2017-03-01 CN CN201710117232.9A patent/CN107148152B/en active Active
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| JP2002270486A (en) * | 2001-03-09 | 2002-09-20 | Orc Mfg Co Ltd | Substrate exposure apparatus and method of using the same |
| JP2007052137A (en) * | 2005-08-16 | 2007-03-01 | Fujifilm Holdings Corp | Work conveying device, image forming apparatus equipped with same, and method for conveying work |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201836060A (en) | 2018-10-01 |
| CN107148152A (en) | 2017-09-08 |
| KR102126456B1 (en) | 2020-06-24 |
| TWI694540B (en) | 2020-05-21 |
| JP2017156525A (en) | 2017-09-07 |
| JP6663252B2 (en) | 2020-03-11 |
| KR20170102431A (en) | 2017-09-11 |
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