CN107148152A - Printed base plate exposure device - Google Patents
Printed base plate exposure device Download PDFInfo
- Publication number
- CN107148152A CN107148152A CN201710117232.9A CN201710117232A CN107148152A CN 107148152 A CN107148152 A CN 107148152A CN 201710117232 A CN201710117232 A CN 201710117232A CN 107148152 A CN107148152 A CN 107148152A
- Authority
- CN
- China
- Prior art keywords
- substrate
- base station
- framework
- mentioned
- exposure device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Will not utilize by substrate adsorption in the vacuum adsorption force of base station or expose the substrate in vacuum, just and the periphery of substrate can be pressed to base station so that also can easily be corresponded to for the different substrate of thickness.When substrate (S) is adsorbed to base station (1) by vacuum adsorption mechanism (3), be arranged in the framework for the shape for not blocking exposure (61) a pair weeks shape sealing part (62) abutted with base station (1), the confined space formed is vented by framework steam vent (13), so that framework (61) is pressed towards base station (1).As a result, with the state that the periphery of substrate (S) is pressed against base station (1), the deformation of substrate (S) is corrected, substrate (S) is exposed by exposure system (2).
Description
Technical field
Present invention is related to the exposure device of printed base plate manufacture, more particularly to possesses while correcting the change of substrate
Shape is while the exposure device for the function being exposed.
Background technology
Printed base plate is equipped in the electronic equipments such as portable phone or personal computer.These electronic equipments are small in order to carry out
Type lightweight, it is desirable to improve the integrated level of the pattern formed on substrate, the miniaturization of circuit element and pattern is in progress.
Pattern is being carried out into the photoetching process of the formation of printed base plate, there is the resist for being coated on substrate and shape
Into the exposure process of pattern as defined in circuit pattern etc., exposure device has been used.Exposure device is in order in the defined position of substrate
The transfer for carrying out pattern as defined in circuit pattern etc. is put, it is necessary to by substrate relative to the optical system configurations being exposed correct
Position.Therefore, using loading substrate, simultaneously at the defined position on the base station (table) set relative to optical system
By the mechanism in substrate vacuum suction to base station in the way of keeping the position in exposure.
Patent document
Patent document 1
Japanese Unexamined Patent Publication 2009-109553 publications
Patent document 2
Japanese Unexamined Patent Publication 2011-81156 publications
Patent document 3
No. 4589198 publications of Japan Patent
The content of the invention
In the printed base plate exposure device for employing the mechanism as described above by substrate vacuum suction to base station,
It is required that being also correctly exposed even for the substrate that there occurs deformation as warpage or strain.The warpage of substrate or strain
It is such deformation because it is several will thus occur.First, the miniaturization for electronic equipment can be enumerated and used very thin
Substrate.There is shadow easily by the heat treatment in preceding process in the relatively thin flexible base board formed by polyimides, polyester etc.
The situation rung, bent if from laterally or bent as wave.Even also, the rigid base as expoxy glass
The situation of plate, in the case where substrate is multi-ply construction, also due to thermal coefficient of expansion between raw material not equal and with repeating
Easily in the periphery of substrate warpage or strain occur for the processing for stacking.
Using exposure device user angle, it is desirable to even the substrate being so deformed, also want to by
Pattern exposure as defined in circuit pattern etc..
Turn into problem, the mistake of vacuum suction in the exposure of the substrate after to deformation as described above.This be
Make the substrate-placing after deformation in base station enter it is vacuum adsorbed in the case of, there is vacuum leak at the position of deformation, therefore
Become unable to the mistake fully adsorbed.If producing absorption mistake, there is the situation that substrate misplaces in exposure, so logical
Often, the action of device stops, and exposure-processed is interrupted.
Thus, it is proposed that several technologies being pressed against substrate in vacuum suction on base station.Wherein, patent document 1 is public
Open when substrate is by vacuum suction as the state that pad is configured in the way of surrounding substrate and using pad as confined air
Between and make the construction that is vacuumized in confined space.In this configuration, mechanism substrate being pressed against on base station is unloaded in exposure
Remove, therefore the stronger substrate of elasticity of warpage has the situation of vacuum suction mistake occurs in exposure.Also, because substrate is straight
Connect and expose to the open air in a vacuum, so in the case of being provided with diaphragm on the surface of substrate, it is also considered that it is peeled off or in diaphragm
Side produces bubble.
Also, Patent Document 2 discloses with by by the state placement substrate of the periphery covering of the substrate of vacuum suction
Stator (polyester piece), makes the technology of the piece elastic deformation by the attraction during vacuum suction of substrate.The construction needs
Clamp system is designed according to the shape of substrate, in order that it is corresponding with a variety of substrate sizes, it is necessary to single on exposure base station
Solely design clamp system so that cost is improved.Also, need to carry out the replacing of piece in the case that the size of substrate is different, but specially
The piece of sharp document 2 is mechanically clamped, therefore replacing is not easy.
And then, it is believed that because substrate is exposed in a vacuum, thus produce it is same as described above the problem of.
Also, press substrate Patent Document 3 discloses the stationary fixture of the border shape by flexible part
The technology of periphery.In construction, the attraction of the pressing of stationary fixture is complete with attraction by substrate adsorption on base station
Identical system.Therefore, in the case of for substrate adsorption to be generated into larger leakage in the vacuum of base station, there is geometrical clamp
Have the power that is pressed against the periphery of substrate on base station die down and can not be by situation of the substrate adsorption on base station.Particularly, firm
Property higher substrate on be deformed in the case of be difficult to correction deformation.
Present invention is made to solve above-mentioned each problem, it is intended that being exposed in printed base plate
In electro-optical device, will not utilize by substrate vacuum suction in the power of base station or the periphery of substrate is exposed in vacuum and can be
Periphery is pressed to base station in exposure, and also can easily be corresponded to for the different substrate of thickness.
In order to solve above-mentioned problem, the invention that the technical scheme 1 of the application is recorded is a kind of printed base plate exposure device,
Possess：
Load the base station of substrate；With
The exposure system of the exposure light of pattern as defined in being formed is irradiated to the substrate being positioned on base station,
Printed base plate exposure device has following composition：
Provided with by the vacuum adsorption mechanism in substrate vacuum suction to base station and by the periphery for the substrate being positioned on base station
The pressing mechanism that portion is pressed to base station,
Pressing mechanism possess do not block substrate is formed as defined in pattern exposure light shape framework and by by frame
Body with sandwiched at it between base station substrate periphery state towards base station press so as to by the periphery of substrate to base
The drive division of platform pressing,
Framework, which has, forms the construction of confined space in the position for deviateing substrate, and substrate is being carried out to be used to form rule
During the irradiation of the exposure light of fixed pattern, drive division vacuumizes the confined space, so that the periphery of substrate be pressed to base station
Pressure,
Above-mentioned printed base plate control unit of the exposure device provided with control exposure system and pressing mechanism,
Control unit also enters to exercise pressing mechanism during the irradiation of the exposure light of pattern as defined in being formed to substrate
Drive division action control.
Also, in order to solve above-mentioned problem, the invention that technical scheme 2 is recorded has in the composition of above-mentioned technical proposal 1
It is following to constitute：In the above-mentioned framework pressed towards above-mentioned base station on the face of above-mentioned base station side, provided with flexible week
Shape sealing part, all shape sealing parts form above-mentioned confined air to be connected to above-mentioned base station at the position for deviateing aforesaid substrate
Between shape.
Also, in order to solve above-mentioned problem, the invention that technical scheme 3 is recorded has in the composition of above-mentioned technical proposal 1
It is following to constitute：Above-mentioned base station on the face for the above-mentioned framework being pressed, provided with flexible all shape sealing parts, all shapes
Sealing part for deviate aforesaid substrate position at be connected to the shape that above-mentioned framework forms above-mentioned confined space.
Also, in order to solve above-mentioned problem, the invention that technical scheme 4 is recorded has in the composition of above-mentioned technical proposal 2 or 3
There is following composition：Above-mentioned all shape sealing parts are tubuloses.
Also, in order to solve above-mentioned problem, the invention that technical scheme 5 is recorded is in any one of above-mentioned technical proposal 1~4
There is following composition in composition：Be set with position of readiness, the position of readiness be feeding from aforesaid substrate to above-mentioned base station and on
Substrate is stated from the location of above-mentioned framework during the submitting of above-mentioned base station,
Provided with the framework travel mechanism for making above-mentioned framework be moved repeatedly between operating position and position of readiness, above-mentioned action
Position is the position for pressing above-mentioned framework to base station with the state for the periphery for having sandwiched aforesaid substrate.
Also, in order to solve above-mentioned problem, the invention that technical scheme 6 is recorded has in the composition of above-mentioned technical proposal 5
It is following to constitute：The conveying mechanism of aforesaid substrate is used for above-mentioned framework travel mechanism.
Also, in order to solve above-mentioned problem, the invention that technical scheme 7 is recorded has in the composition of above-mentioned technical proposal 5 or 6
There is following composition：Above-mentioned framework travel mechanism is while by above-mentioned framework vacuum suction and keeping while moving above-mentioned framework
Mechanism.
Also, in order to solve above-mentioned problem, the invention that technical scheme 8 is recorded has in the composition of above-mentioned technical proposal 6 or 7
There is following composition：The conveying mechanism of aforesaid substrate possesses the substrate absorption layer that aforesaid substrate is adsorbed and is kept,
Above-mentioned framework has the otch inserted for the substrate absorption layer.
As will be explained below, the invention recorded according to the technical scheme 1 of the application, during exposure, substrate is by vacuum
Base station is adsorbed onto, and the periphery of substrate is pressed against base station by framework.Now, formed confined air is passed through in framework
Between vacuum pressure and be applied in the power towards base station.The vacuum pressure can be by independently of for substrate to be adsorbed to base station
The system of system supply, therefore even in producing leakage between substrate and base station, also can apply stronger press to framework
Pressure.Thus, even situation about being deformed on the higher substrate of rigidity, also substrate can reliably be protected in exposure
Hold on base station.Also, confined space formation is deviateing the position of substrate, so that vacuum pressure here will not be directly acted on
Substrate.
Also, the invention recorded according to technical scheme 2 or 3, in addition to the effect above, is sealed by flexible all shapes
Gu space is closed in part formation, so that pressing force is mildly acted on.
Also, the invention recorded according to technical scheme 4, in addition to the effect above, because all shape sealing parts are tubuloses,
So the adjustment of pressure during pressing becomes easy, and also can easily it be pressed for the different substrate of thickness.
Also, the invention recorded according to technical scheme 5, in addition to the effect above, due to provided with framework travel mechanism, institute
Can keep out of the way framework when substrate is to the mounting and substrate of base station from the removal of base station, it is not necessary to base station is moved on a large scale
It is dynamic, so as to be simplified at this point in mechanism.
Also, the invention recorded according to technical scheme 6, in addition to the effect above, passes through the conveying mechanism dual-purpose of substrate
Make framework travel mechanism, so that the construction of device and action are simplified at this point.
Also, the invention recorded according to technical scheme 7, in addition to the effect above, due to conveyer belt while framework is inhaled
Attached holding is moved it on one side, easy framework is peeled off and kept out of the way and framework by conveyer belt in the exposure of substrate so having
Replacing become easy effect.
Also, the invention recorded according to technical scheme 8, in addition to the effect above, framework has substrate absorption layer
The otch of insert, so having is complicated construction and the effect of the holding of substrate can be carried out with sufficient absorption affinity.
Brief description of the drawings
Fig. 1 is the front cross-sectional skeleton diagram of the printed base plate exposure device of embodiment.
Fig. 2 is the schematic top view figure of the major part of Fig. 1 exposure device.
Fig. 3 is the perspective sketch of framework.
Fig. 4 is the front cross-sectional skeleton diagram shown on the action of the printed base plate exposure device of embodiment.
Fig. 5 is the front cross-sectional skeleton diagram shown on the action of the printed base plate exposure device of embodiment.
Fig. 6 is the front cross-sectional skeleton diagram shown on the action of the printed base plate exposure device of embodiment.
Fig. 7 is the perspective sketch shown on one of each framework of the size preparation according to substrate.
Label declaration
1 base station
100 elevating mechanisms
11 adsorption holes
12 substrate exhaust channels
13 framework steam vents
14 framework exhaust channels
2 exposure systems
3 vacuum adsorption mechanisms
41 first conveyers
42 second conveyors
51 first conveyer belts
512 substrate absorption layers
514 framework absorption layers
52 second conveyer belts
522 substrate absorption layers
6 pressing mechanisms
61 frameworks
611 otch
62 weeks shape sealing parts
63 framework blast pipes
65 pressure-regulating valves
Embodiment
Then, the form (being below embodiment) for implementing the present application is illustrated.
Fig. 1 is the front cross-sectional skeleton diagram of the printed base plate exposure device of embodiment, and Fig. 2 is the printing shown in Fig. 1
The schematic top view figure of the major part of substrate exposure device.The printed base plate exposure device of embodiment possesses mounting substrate
S base station 1 and the exposure system 2 that the exposure light for forming the patterns such as circuit is irradiated to the substrate S being placed on base station 1.Figure
2 be the schematic top view figure for the base station 1 being placed with the state of substrate S.
As shown in Fig. 2 base station 1 is the part for overlooking square mesa-shaped.The upper surface of the level of base station 1 is substrate S load
Face is put, multiple adsorption holes 11 are provided with equally spaced in mounting surface.In addition, provided with by via each adsorption hole 11 vacuumize from
And substrate S is adsorbed in the vacuum adsorption mechanism 3 of base station 1.Base station 1 is connected with blast pipe (being substrate blast pipe below) 31,
Substrate blast pipe 31 is connected by the substrate exhaust channel 12 being arranged in base station 1 with each adsorption hole 11.Substrate is arranged
Tracheae 31 is provided with open and close valve 32 and pressure-regulating valve 33.
Conveyer 41,42 is provided with the both sides of base station 1.Conveyer 41,42 is used for feeding of the substrate relative to base station 1S, sent
Go out, any side can be used as feeding, send out and use.Hereinafter, for convenience of explanation, the conveyer 41 on right side is set to first
Conveyer, second conveyor is set to by the conveyer 42 in left side.
As the part with each conveyer 41,42 cooperative actions, conveyer belt 51,52 is provided with the both sides of base station 1.On defeated
Band 51,52 is sent, any one can be also set to send into side, any one is set to send out side.Hereinafter, for convenience of explanation,
The conveyer belt 51 on right side is set to first conveyer belt, the conveyer belt 52 in left side is set to the second conveyer belt.
Each conveyer belt 51,52 possesses frame 511,521 and is installed on the substrate absorption layer 512,522 of frame 511,521.Each frame
511st, 521 it is provided with transport driving 513,523.The omissions of detail diagram of transport driving 513,523, but for that can make
Frame 511,521 is along conveying direction (left and right directions on Fig. 1 paper) rectilinear movement positioned at assigned position and along the vertical direction
Mobile mechanism.Device possesses control unit (not shown), and each transport driving 513,523 passes through control unit control (not shown)
System.
Periphery of the substrate with absorption layer 512,522 along substrate S is provided with multiple.Each substrate is connected with absorption layer 512,522
Substrate attraction source (not shown).Substrate is similarly controlled with the on-off in attraction source by control unit (not shown).
Exposure system 2 is configured in the top of base station 1.The exposure device of embodiment does not select the mode of exposure, energy especially
Any one mode enough exposed using projection exposure, contact or proximity printing and then DI (direct imaging).For example projection exposes
In the case of light, exposure system 2 is carried out on base station 1 by light source, the mask of the illuminated light from light source and by the picture of mask
The projecting lens of projection etc. constitute.In the case that DI exposes, possesses LASER Light Source and to from laser light using provided with multiple
The light in source carries out spatial modulation and spatial modulation element as forming the DMD (Digital Mirror Device) of pattern
The composition of exposing unit.
The printed base plate of this embodiment is with exposure device in order to reliably carry out suction of the vacuum adsorption mechanism to substrate S
Attached, the periphery for possessing the substrate S that will be positioned on base station 1 is pressed against pressing mechanism 6 on base station 1.Pressing mechanism 6 possesses frame
Body 61 and to press framework 61 so as to by substrate S week towards base station 1 in the state of the middle periphery for sandwiching substrate S
Edge is pressed against the drive division on base station 1.Also, provided with make framework 61 between operating position and defined position of readiness repeatedly
Mobile framework travel mechanism, the operating position is that the state for the periphery for making framework 61 to sandwich substrate S presses on base
The position of platform 1.In present embodiment, the first conveyer belt 51 and its transport driving 513 of substrate S feeding submitting are simultaneous
As framework travel mechanism.
Reference picture 3 further illustrates framework 61.Fig. 3 is the perspective sketch of framework 61.As shown in figure 3, framework 61
It is square border shape.Profile of the size of the inner edge of framework 61 than substrate S is slightly smaller.Provided with many on the facing side of inner edge
The otch 611 of individual substantially semicircle shape.The otch 611 is for avoiding the shape with the interference of substrate absorption layer 512.
As shown in figure 1, first conveyer belt 51 is provided with multiple frameworks absorption layer 514.Each framework absorption layer 514 is set
In the position that framework 61 is adsorbed in the position of more outward edge.Each framework absorption layer 514 is connected to framework absorption (not shown)
Source.
Framework 61 has away from the construction for being placed in formation confined space at the substrate S of base station 1 position.Illustrate
If, it is provided with flexible all shape sealing parts 62 in the lower surface (towards the face of the side of base station 1) of framework 61.All shape sealing part
Part 62 is arranged on the position abutted with base station 1 in the position for deviateing substrate S.
All shape sealing parts 62 are the part of tubulose in the present embodiment, are resin as silicon rubber as material
System.As shown in Fig. 2 all shape sealing parts 62 are general square shape, size smaller's the greater is arranged on in the heart.Each all shape sealing
Part 62 is shaped as the shape substantially similar with the shape of the inner edge of framework 61, is the shape substantially similar with substrate S profile
Shape.
The mutual space of all shape sealing parts 62 that a pair of this size is confined space, is vacuum pressure.That is,
Framework 61 is pressed with the state for sandwiching substrate S relative to base station 1 as described later.As shown in figure 1, closing on frame in base station 1
The position of body 61, is formed with framework steam vent 13.The drive division of framework 61 is to carry out vacuum from the framework with steam vent 13
The mechanism of attraction.Framework is entered with steam vent 13 by the framework exhaust channel 14 of the system independent with the adsorption hole 11 of substrate
Row exhaust, the confined space formed by a pair weeks shape sealing parts 62, framework 61 and base stations 1 is vented into vacuum.It is so-called closed
Space is meant, removes the space of the outer closure of the opening of attraction.In addition, the framework being connected with framework exhaust channel 14 is used
Blast pipe 63 is finally connected to vavuum pump (not shown) with substrate together with blast pipe 31, but is independent blast pipe before this,
In framework with also being provided with open and close valve 64 and pressure-regulating valve 65 on blast pipe 63.
Also, base station 1 is provided with elevating mechanism 100.In addition to elevating mechanism 100 is actuated to when in substrate S handing-over,
Also used for regulation substrate S for the purpose of the distance of exposure system 2.Elevating mechanism 100 is by containing the straight of servomotor
Motivation structure is constituted, and passes through control unit control.
Then, 4~Fig. 7 of reference picture illustrates the action of the printed base plate exposure device of this embodiment.Fig. 4~figure
6 be the front cross-sectional skeleton diagram of the action for the printed base plate exposure device for representing embodiment.
In the following description, as one, the first conveyer 41 and first conveyer belt 51 is used for feeding, make it is second defeated
The conveyer belt 52 of machine 42 and second is sent to be used to send out.Also, as one, first conveyer belt 51 is used for the shifting of framework 61
It is dynamic.
As shown in Fig. 4 (1), first conveyer belt 51 is standby on the first conveyer 41 with the state that remain framework 61
Defined position of readiness.Also, the standby defined position of readiness on second conveyor 42 of the second conveyer belt 52.
First, first conveyer belt 51 carries out substrate S feeding action.That is, as shown in Fig. 4 (2), under first conveyer belt 51
Drop.Dropping distance now is the position for making each substrate absorption layer 512 be connected to substrate S.If decline terminates, the first conveying
Acted with 51 substrate with attraction source, the substrate S on the first conveyer 41 is adsorbed to be maintained in first conveyer belt 51.The state
Under, such as shown in Fig. 4 (3), transport driving 513 rises first conveyer belt 51.First conveyer belt 51 with remain substrate S with
And the state of framework 61 stops at defined lifting position.
In addition, as shown in Fig. 4 (4), transport driving 513 moves horizontally first conveyer belt 51, is located at base station 1
Top assigned position.Then, elevating mechanism 100 is acted, and base station 1 rises predetermined distance.As shown in Fig. 5 (1), the distance is
Substrate S is set to be connected to the upper surface (mounting surface) of base station 1, each all shape sealing parts 62 of framework 61 is also connected to base station 1
Distance.
Afterwards, substrate of the control unit into first conveyer belt 51 is sent with absorption source 512 and framework absorption source and controlled
Signal, stops each action.On this basis, opening on substrate blast pipe 31 of the control unit into vacuum adsorption mechanism 3
Valve closing 32, framework send control signal with the open and close valve 64 on blast pipe 63, them is respectively become open mode.As a result,
By being vacuumized from substrate adsorption hole 11, substrate S is by vacuum suction.Also, by a pair weeks shape sealing parts 62 formed it is close
Space is closed due to turning into vacuum pressure from vacuumizing for framework steam vent 13.As a result, framework 61 is by with itself and base
The state that substrate S periphery is sandwiched in the middle of platform 1 is pressed towards base station 1.That is, edge of the framework 61 as inner side is downward
The section shape of side's bending, the front end of the part being bent is connected to substrate S periphery, as the periphery is pressed on
The state of base station 1.In addition, now turning into such state that is somewhat crushed out of shape as all shape sealing parts 62 of elastomer.
While the attraction of the releasing of the absorption based on above-mentioned each absorption layer, substrate S vacuum suction and framework 61,
Control unit sends control signal to elevating mechanism 100 and elevating mechanism 100 is declined predetermined distance.As a result, base station 1 such as Fig. 5
(2) initial height is returned to shown in like that.The height is the height as set exposure distance.In addition, feed drive
Mechanism 513 returns to first conveyer belt 51 initial position of readiness.Under the state, such as shown in Fig. 5 (3), exposure system 2 is moved
Make, irradiate the light of defined pattern for the substrate S on base station 1 and be exposed.
If the end exposure of stipulated time, such as shown in Fig. 5 (4), control unit sends control letter to transport driving 513
Number, the first conveyer belt 51 in position of readiness is moved to behind the assigned position of the top of base station 1, make its decline regulation away from
From the framework absorption layer 514 as first conveyer belt 51 is connected to the state of framework 61.
First conveyer belt 51 is after the position is dropped to, and control unit makes the framework of first conveyer belt 51 be acted with absorption source.
Substrate is failure to actuate with absorption source, and substrate S is not adsorbed to first conveyer belt 51.With framework with the action in absorption source simultaneously, control
Portion processed closes open and close valve 64 of the framework on blast pipe 63, opens atmospheric open valve (not shown).As a result, being sealed by a pair weeks shapes
Gu the pressure in the confined space that part 62 is produced returns to atmospheric pressure, the periphery to substrate S that is produced by framework 61 is pressed
Pressure is released from.In addition, the open and close valve 32 of substrate blast pipe 31 is stayed open, substrate S vacuum suction is not released from.
Under the state, control unit sends control signal to transport driving 513, first conveyer belt 51 is increased, afterwards,
It is moved horizontally, such as initial position of readiness is returned to shown in Fig. 6 (1).First conveyer belt 51 ensures to inhale at position of readiness
The attached state that remain framework 61.
Afterwards, control unit sends control signal to transport driving 523, and base station 1 is moved to making the second conveyer belt 52
Top assigned position after its is declined predetermined distance, shown in such as Fig. 6 (2), the substrate as the second conveyer belt 52 is adsorbed
Pad 522 is connected to substrate S state.Under the state, control unit makes the substrate of the second conveyer belt 52 be acted and adsorbed with absorption source
Substrate S.In addition, the open and close valve 32 of substrate blast pipe 31 is closed and liberates adsorption hole 11 to air by control unit, by base station 1
On substrate S vacuum suction release.Thus, substrate S vacuum suction is switched to the second conveyer belt 52 from base station 1.Now,
Also have and provide the feelings that malleation and promoting is recovered from vacuum pressure to atmospheric pressure to the moment of adsorption hole 11 via substrate blast pipe 31
Condition.In addition, transport driving 523 makes after the rising of the second conveyer belt 52, it is moved horizontally, as shown in Fig. 6 (3), returned to
Initial position of readiness.Afterwards, transport driving 523 makes the second conveyer belt 52 decline predetermined distance, as Fig. 6 (4) is shown as
The state of second conveyor 42 is placed in for substrate S.In addition, control unit makes substrate the moving with absorption source of the second conveyer belt 52
After work stops, the second conveyer belt 52 is set to rise and return to position of readiness.
Thus, the state terminated as a series of processing to one piece of substrate S.Second conveyor 42, which enters, is about to handle
Into the actions that are conveyed to ensuing process of substrate S, and ensuing substrate S is admitted to the first conveyer 41.In addition, right
Identical action is repeated in ensuing substrate S.In addition, understanding according to the above description, the one side of framework 61 is in the first conveying
Press on and reciprocated between the position of base station 1 with the periphery by substrate S on 51 position of readiness and base station 1, one
While being recycled in substrate S exposure-processed.
Understand according to the above description, by the printed base plate exposure device of embodiment, in exposure, substrate S is true
Suction invests base station 1, and substrate S periphery is pressed against base station 1 by framework 61.Now, framework 61 is by by a pair
The vacuum pressure of the confined space of all shape sealing parts 62 formation and be applied in the power towards base station 1.Thus, the adjustment of pressing force
It is easy.That is, it is easy to be set to appropriate pressure by the pressure-regulating valve 65 being arranged on framework blast pipe 63.
, also can be by control unit come automatic pressure control according to occasion.
Also, as shown in Fig. 1 etc., the space for the vacuum pressure of the pressing towards base station 1 of framework 61 is and substrate S
The space of residing space isolation, substrate S will not be directly exposed to vacuum pressure here.So as to substrate S diaphragm
Peeling off the problem of gentle life that is soaked is such will not occur in the present embodiment.
Also, due to forming confined space by flexible all shape sealing parts 62, therefore pressing force is for substrate S
The mode of effect become soft.Even by not being that the material of elastomeric element forms confined space and carries out the structure of vacuum exhaust
Make, can also produce pressing framework 61 degree pressure, but embodiment be configured to mildly apply pressing force.
Also, in present embodiment, shape sealing part 62 turns into tubulose within a pair weeks.This point has the tune of pressure when making pressing
It is whole to become easy meaning, and have the meaning that also can be easily pressed for the different substrate S of thickness.It is used as all shapes
Sealing part 62, can be the elastomer rather than tubulose (internal tamper) of wire or rope form.For example, can also use rubber
Glue rope form person or spongy person.But, as described above, all shape sealing parts 62 by vacuum exhaust with while compression
Ensure sealing state and make elasticity work to resist the framework 61 produced from vacuum pressure to substrate S press pressure
Adjust the function of press pressure.If substrate S thickness is thickening, using the sectional area of all shape sealing parts 62 it is larger (section
Height is higher) person, if but conversely want to press relatively thin substrate S, in order that frame body 61 is connected to substrate S periphery
Portion is, it is necessary to which suitable compression, having framework 61 to be connected to substrate S periphery or allow to abut also causes by elasticity
The problem of screen resilience of generation is superfluous.Therefore, the need for needing that all shape sealing parts 62 are changed according to substrate S thickness are produced
Will.On the other hand, if the part of tubulose, even if being then set to the bore answered with thicker substrate S-phase, it can also make from thicker base
Plate S is compressed to relatively thin substrate S effects than more uniform screen resilience.Therefore, can not for the different substrate S of thickness yet
Used with need to changing.
In addition, all shape sealing parts 62 can also be situation not for a pair.For example, using a section be concavity and with
The part of all continuous shapes of shape, also can equally be carried out.
Also, due to provided with framework travel mechanism, therefore, it is possible in mounting from substrate S to base station 1 or substrate S from base station 1
Keep out of the way framework 61 when removing.In the case where the position of framework 61 is fixes, it is desirable to have base station 1 is moved downwards temporarily
The travel mechanism of such large-scale base station 1 is laterally moved after dynamic, but need not such machine in the composition of embodiment
It is simplified on structure, therefore mechanism.
In addition, understanding according to the above description, absorption keeps substrate S and carries out the hand (hand) of conveying action while also having
The standby function that framework 61 is adsorbed to holding, is also used as framework travel mechanism by substrate S conveying mechanism.This point also has and will filled
The construction and the simplified meaning of action put.In the implementation of the present application, with absorption substrate S hand can also be kept only
Vertical hand keeps framework 61 and moving the independent hand by travel mechanism to adsorb.But, if so do if construction and
Action becomes complicated, the problem of having installation cost rising or elongated actuation time.If being also used as the hand of substrate to carry out
The composition that the absorption of framework 61 is kept, then do not have problems that.
Also, conveyer belt adsorbs holding framework 61 while framework 61 is moved this point easy when substrate S exposes
The meaning for making conveyer belt separate framework 61 and being kept out of the way.During the implementation of the present application or framework 61 relative to
What conveyer belt was not loaded and unloaded but fixed.But in this case, because such conveyer belt and its travel mechanism are located at substrate S exposure
The vicinity of base station 1 in light, it is therefore desirable to which being set to not block becomes complicated on exposure, construction.On the other hand, adsorbed in conveyer belt
In the construction for keeping framework 61, conveyer belt, which will be adsorbed, to be released and can keep out of the way arbitrary position, therefore becomes simple on construction.
In the printed base plate exposure device of above-mentioned embodiment, framework 61 according to substrate S to be processed size
And suitably change.Hereinafter, reference picture 7 illustrates this point.Fig. 7 is one of each framework 61 on the size preparation according to substrate S
Example and the perspective sketch that shows.
As shown in fig. 7, in present embodiment, having prepared different frameworks 61, but each framework 61 according to substrate S each size
The profile in outside be identical size shape.In addition, the size shape of opening is different.That is, it is open as than substrate S to be processed
Slightly smaller size shape.In addition, in each framework 61, being again provided with being provided with multiple otch 611 at the facing edge of opening.Otch
611 be for avoiding the otch 611 with the interference of substrate absorption layer 512,522.
In the case that the substrate S different to size is handled, make the first conveying that remain previously used framework 61
Band 51 declines predetermined distance, after framework 61 is placed on the first conveyer 41, disconnects framework absorption source.In addition,
The first conveyer 41 is kept out of the way rear removal framework 61 upward, the framework 61 of the different substrate of size is positioned in the first conveying
On machine 41.In addition, declining first conveyer belt 51, framework absorption layer 514 is connected to after framework 61 adsorbs framework
Source acts and adsorbed.On this basis, first conveyer belt 51 is made to increase, and it is standby in position of readiness.
In addition, when above-mentioned framework 61 is changed, suitably carrying out the contraposition of the absorption holding position of framework 61.For example, can be with
Consider that the mark of the absorption position by each framework absorption layer 514 is represented is arranged on the upper surface of framework 61, marks this in advance
The method for being denoted as being aligned for mark.
Also, it is above-mentioned so handle various sizes of substrate S in the case of, each substrate is with absorption layer 512,522 in difference
Position by substrate S adsorb keep so that each substrate with absorption layer 512,522 change or change of location.For example, it may be considered that
The construction that each substrate is installed on keeper, changed according to keeper with absorption layer 512,522.It can use with keeper
With absorption layer 512,522 it is unit with each substrate for being fixed on keeper, is changed the unit relative to each conveyer belt
Construction.
In addition, the conveyer belt of substrate, which is used for the movement of framework 61 this point, the meaning of above-mentioned such simplified construction,
But now, the otch 611 shown in Fig. 3 and Fig. 7, which also has, does not make construction complicate and can carry out substrate S's with sufficient absorption affinity
The meaning of holding.That is, framework 61 pins substrate S periphery, so that the edge of opening is located at periphery than substrate S in the inner part
Position.Now, in the composition for the movement that substrate absorption layer 512,522 is used for into framework 61, it can produce anyway
Conveyer belt absorption keeps adsorbing the action for keeping substrate S with absorption layer 512,522 by substrate in the state of framework 61, and substrate is inhaled
Simultaneously sorbing substrate S construction is had to turn into opening Jing Guo framework 61 and extended to attached pad 512,522.In this case, due to not
Absorption holding can be carried out in substrate S circuitry forming part but absorption holding is carried out to surplus (margin) part on periphery,
Therefore have to turn into if without otch 611 and multiple very small absorption layers are set keep substrate S construction to adsorb.But
It is that the construction is non-practical, and absorption affinity can not be substantially ensured that.If there is otch 611, to a certain degree big can be used
Small absorption layer carries out substrate S absorption, on the other hand.It can ensure that framework 61 has to substrate S with area to a certain degree
The part of pressing effect.
In addition, in above-mentioned embodiment, in substrate S periphery, facing a pair of absorption layer 512,522 of substrate
On the periphery on side, sorbing substrate S position is arranged on, but also has the position that sorbing substrate S is arranged on the periphery on four sides
Situation.It is preferred that this is kept on this aspect in the absorption for reliably carrying out substrate S.Absorption keeps base on the periphery of an opposite side
It is tabular for keeping the frame 511,521 of each substrate absorption layer 512,522 in the case of plate S, but on the periphery on four sides
In the case of keeping substrate S, frame 511,521 is square frame-shaped.
In the above-described embodiment, first conveyer belt 51, the first conveyer 41 are that feeding is used, the second conveyer belt 52, second
Conveyer 42 is to send out to use, but the relation can also be opposite, and each also can be used to send into the both sides sent out.That is, make
First conveyer belt 51 carries out substrate S feeding action and during performing exposure, the second conveyer belt 52 keeps other bases
Plate S and it is standby, after initial substrate S end exposure, first conveyer belt 51 by substrate S send out after, the second conveyer belt 52 will
Other substrate S feedings.It is also possible that the feeding for alternately making each conveyer belt carry out substrate S is sent out.In this case, framework 61
It is configured for each conveyer belt, each conveyer belt, which is adsorbed, keeps framework 61 while the feeding submitting action for carrying out substrate S.
Also, during the implementation of the present application, conveyer belt is also enough even if only one.Can also be that absorption remains frame
Substrate S is picked up and is placed in base station 1 by one conveyer belt of body 61 from the first conveyer 41, after end exposure by substrate S with
Framework 61 is together from the composition that base station 1 is picked up to be sent out to second conveyor 42.In this case, can also use only has in one side
The composition of conveyer.
In addition, base station 1 makes the composition that base station 1 is lifted when being and possessing elevating mechanism 100 and the mounting in substrate S, but
It can also be carried out by the lifting of hand, base station 1 can not also possess elevating mechanism 100.Also, except base station 1 has
Beyond standby elevating mechanism 100, if each conveyer possesses elevating mechanism, transport driving 513,523, which need not have, to be made respectively
The function that conveyer belt 51,52 is lifted.
In above-mentioned embodiment, all shape sealing parts 62 are installed in framework 61, but it is also possible to installed in the side of base station 1.
That is, setting all shape sealing in position in the upper surface of base station 1, facing to the framework 61 gradually closed on to press
Part, can also be similarly formed confined space, can equally act.
Also, together with the substrate blast pipe 31 of vacuum adsorption mechanism 3 is finally changed to framework blast pipe 63, but also may be used
To be completely independent system (independent) exhaust channel and be the construction being vented by respective pump.In addition, to framework
The framework being exhausted in 61 confined spaces formed is formed on base station 1 in the above-described embodiment with steam vent 13, but
It can also be formed in framework 61.But, in the construction, on the flexible pipe of the winding exhaust of framework 61, therefore numerous and diverse and construction
Become complicated.In the case of having framework steam vent 13 on base station 1, in the absence of it is such the problem of.
Framework 61 needs the periphery for making a part be connected to substrate S that substrate S is pressed on into base station 1, but is formed closed
The part in space can not be in face of the part of base station 1.That is, there are other parts of frame-shaped, all shape sealing on the periphery of base station 1
Part 62 can abut with other parts and form confined space.
Claims (9)
1. a kind of printed base plate exposure device, possesses：
Load the base station of substrate；With
The exposure system of the exposure light of pattern as defined in being formed is irradiated to the substrate being positioned on base station,
Characterized in that,
It is provided with：By the vacuum adsorption mechanism in substrate vacuum suction to base station；With the periphery for the substrate that will be positioned on base station
The pressing mechanism pressed to base station,
Pressing mechanism possesses：The framework of the shape of the exposure light of pattern as defined in being formed to substrate is not blocked；With by by framework
With sandwiched at it between base station substrate periphery state towards base station press so as to by the periphery of substrate to base station
The drive division of pressing,
Framework has forms the construction of confined space in the position for deviateing substrate, and substrate is being carried out forming defined pattern
Exposure light irradiation when, drive division vacuumizes the confined space, so that the periphery of substrate be pressed to base station,
Above-mentioned printed base plate control unit of the exposure device provided with control exposure system and pressing mechanism,
Control unit also enters to exercise the drive of pressing mechanism during the irradiation of the exposure light of pattern as defined in being formed to substrate
The control of dynamic portion's action.
2. the printed base plate exposure device recorded such as claim 1, it is characterised in that
In the above-mentioned framework pressed towards above-mentioned base station on the face of above-mentioned base station side, provided with flexible all shape sealing
Part, all shape sealing parts for deviate aforesaid substrate position at be connected to the shape that above-mentioned base station forms above-mentioned confined space
Shape.
3. the printed base plate exposure device recorded such as claim 1, it is characterised in that
Above-mentioned base station on the face for the above-mentioned framework being pressed, provided with flexible all shape sealing parts, all shape sealing
Part for deviate aforesaid substrate position at be connected to the shape that above-mentioned framework forms above-mentioned confined space.
4. the printed base plate exposure device recorded such as claim 2, it is characterised in that
Above-mentioned all shape sealing parts are tubuloses.
5. the printed base plate exposure device recorded such as claim 3, it is characterised in that
Above-mentioned all shape sealing parts are tubuloses.
6. the printed base plate exposure device recorded such as any one of Claims 1 to 5, it is characterised in that
Position of readiness is set with, the position of readiness is feeding from aforesaid substrate to above-mentioned base station and aforesaid substrate from above-mentioned base station
Submitting when the location of above-mentioned framework,
Provided with the framework travel mechanism for making above-mentioned framework be moved repeatedly between operating position and position of readiness, above-mentioned operating position
It is the position for pressing above-mentioned framework to base station with the state for the periphery for having sandwiched aforesaid substrate.
7. the printed base plate exposure device recorded such as claim 6, it is characterised in that
The conveying mechanism of aforesaid substrate is used for above-mentioned framework travel mechanism.
8. the printed base plate exposure device recorded such as claim 6, it is characterised in that
Above-mentioned framework travel mechanism is while by above-mentioned framework vacuum suction and keeping while making the mechanism of above-mentioned framework movement.
9. the printed base plate exposure device recorded such as claim 7, it is characterised in that
The conveying mechanism of aforesaid substrate possesses the substrate absorption layer that aforesaid substrate is adsorbed and is kept,
Above-mentioned framework has the otch inserted for the substrate absorption layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016039453A JP6663252B2 (en) | 2016-03-01 | 2016-03-01 | Exposure equipment for printed circuit boards |
| JP2016-039453 | 2016-03-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107148152A true CN107148152A (en) | 2017-09-08 |
| CN107148152B CN107148152B (en) | 2021-01-12 |
Family
ID=59783754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710117232.9A Active CN107148152B (en) | 2016-03-01 | 2017-03-01 | Exposure device for printed board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6663252B2 (en) |
| KR (1) | KR102126456B1 (en) |
| CN (1) | CN107148152B (en) |
| TW (1) | TWI694540B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111913363A (en) * | 2019-05-09 | 2020-11-10 | 株式会社阿迪泰克工程 | Direct writing type exposure device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI709190B (en) * | 2019-06-14 | 2020-11-01 | 財團法人國家實驗研究院 | Structure and exposure method applied to exposure machine |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270486A (en) * | 2001-03-09 | 2002-09-20 | Orc Mfg Co Ltd | Substrate exposure apparatus and method of using the same |
| JP2007052137A (en) * | 2005-08-16 | 2007-03-01 | Fujifilm Holdings Corp | Work conveying device, image forming apparatus equipped with same, and method for conveying work |
| JP2007171621A (en) * | 2005-12-22 | 2007-07-05 | Adtec Engineeng Co Ltd | Contact exposure device |
| JP2009109553A (en) * | 2007-10-26 | 2009-05-21 | Adtec Engineeng Co Ltd | Exposure apparatus and correcting device for substrate |
| JP2011011156A (en) * | 2009-07-02 | 2011-01-20 | Konica Minolta Holdings Inc | Pattern drawing method, wiring pattern drawing method and method for manufacturing thin film transistor substrate |
| JP2011081156A (en) * | 2009-10-07 | 2011-04-21 | Orc Manufacturing Co Ltd | Exposure apparatus |
| JP2015038981A (en) * | 2013-07-18 | 2015-02-26 | Ｎｓｋテクノロジー株式会社 | Contact exposure device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3098272B2 (en) * | 1991-04-04 | 2000-10-16 | イビデン株式会社 | Printed circuit board automatic exposure equipment |
| JP2001022087A (en) * | 1999-07-05 | 2001-01-26 | Canon Inc | Exposure device |
| CH695405A5 (en) * | 1999-12-14 | 2006-04-28 | Esec Trading Sa | Semiconductor die and wire bonder holding curved substrate flat and level at processing station, includes plate with resting surface and suction units |
| JP2006276084A (en) * | 2005-03-28 | 2006-10-12 | Orc Mfg Co Ltd | Exposure table and exposure device |
| CN101194210B (en) * | 2005-06-21 | 2010-06-16 | 三荣技研股份有限公司 | Exposing method and device |
| JP4627538B2 (en) * | 2007-07-18 | 2011-02-09 | 日立ビアメカニクス株式会社 | Exposure equipment |
| JP5472616B2 (en) * | 2010-01-27 | 2014-04-16 | ウシオ電機株式会社 | Light irradiation device |
-
2016
- 2016-03-01 JP JP2016039453A patent/JP6663252B2/en active Active
-
2017
- 2017-02-15 TW TW106104924A patent/TWI694540B/en active
- 2017-02-27 KR KR1020170025603A patent/KR102126456B1/en active IP Right Grant
- 2017-03-01 CN CN201710117232.9A patent/CN107148152B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270486A (en) * | 2001-03-09 | 2002-09-20 | Orc Mfg Co Ltd | Substrate exposure apparatus and method of using the same |
| JP2007052137A (en) * | 2005-08-16 | 2007-03-01 | Fujifilm Holdings Corp | Work conveying device, image forming apparatus equipped with same, and method for conveying work |
| JP2007171621A (en) * | 2005-12-22 | 2007-07-05 | Adtec Engineeng Co Ltd | Contact exposure device |
| JP2009109553A (en) * | 2007-10-26 | 2009-05-21 | Adtec Engineeng Co Ltd | Exposure apparatus and correcting device for substrate |
| JP2011011156A (en) * | 2009-07-02 | 2011-01-20 | Konica Minolta Holdings Inc | Pattern drawing method, wiring pattern drawing method and method for manufacturing thin film transistor substrate |
| JP2011081156A (en) * | 2009-10-07 | 2011-04-21 | Orc Manufacturing Co Ltd | Exposure apparatus |
| JP2015038981A (en) * | 2013-07-18 | 2015-02-26 | Ｎｓｋテクノロジー株式会社 | Contact exposure device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111913363A (en) * | 2019-05-09 | 2020-11-10 | 株式会社阿迪泰克工程 | Direct writing type exposure device |
| CN111913363B (en) * | 2019-05-09 | 2024-05-17 | 株式会社阿迪泰克工程 | Direct-writing type exposure device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6663252B2 (en) | 2020-03-11 |
| KR20170102431A (en) | 2017-09-11 |
| JP2017156525A (en) | 2017-09-07 |
| KR102126456B1 (en) | 2020-06-24 |
| TW201836060A (en) | 2018-10-01 |
| TWI694540B (en) | 2020-05-21 |
| CN107148152B (en) | 2021-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102229484B1 (en) | Work stage and exposure apparatus | |
| JP2010076929A (en) | Substrate conveying arm | |
| CN107148152A (en) | Printed base plate exposure device | |
| TW201250392A (en) | Work stage and exposure device using the same | |
| TWI427441B (en) | Exposure device and substrate correction device | |
| TWI402171B (en) | Pressing device and pressing method thereof | |
| WO2018149378A1 (en) | Plastic packaging material transferring apparatus and method | |
| KR20160148446A (en) | Film transporting device, film transporting method and resin molding device | |
| JP2007178557A (en) | Exposure apparatus | |
| JP6894034B2 (en) | Work suction holding method, work stage and exposure equipment | |
| JP5433736B2 (en) | Film-like resin laminating equipment | |
| TWI744517B (en) | Manufacturing device and manufacturing method of flexible element | |
| JP4420507B2 (en) | Substrate exposure method and apparatus | |
| JP6789368B2 (en) | Exposure equipment for printed circuit boards | |
| TWI795734B (en) | Laminator | |
| TWI856530B (en) | Laminator | |
| JP2006013073A (en) | Bonding apparatus, bonding method and method of manufacturing semiconductor device | |
| TWI836431B (en) | Substrate processing device and substrate processing method | |
| TWI694315B (en) | Double stage exposure machine | |
| WO2020226179A1 (en) | Film processing device | |
| JPH07168363A (en) | Exposing machine for printed wiring board | |
| KR20240013347A (en) | Micro led bonding apparatus and bonding method using the same | |
| TWI651252B (en) | Method and device for spacing apart electronic components arranged in a matrix structure | |
| JP2001154202A (en) | Method of sticking glass substrate for liquid crystal panel together and device for it | |
| JPH08333038A (en) | Sheet material peeling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |