JPH07168363A - Exposing machine for printed wiring board - Google Patents

Abstract

PURPOSE:To restrain a pattern film from being extended and to restrain the width of an exposed pattern from being large by improving the adhesibility of the pattern film by means of vacuum suction pressure difference in the case of irradiating a resist hardened by ultraviolet rays on the surface of a printed wiring board with the ultraviolet rays. CONSTITUTION:This machine is constituted of a transparent board 1 which vacuum-sucks the pattern film 8, and which is provided with an evacuation port 9 in the vicinity of the board end and a sealing member 10 adhering to a position surrounding the port 9, and a transparent board 1 which has rigidity capable of making the ultraviolet rays transmitted; a vertically movable close contacting board 2 abutting on the sealing member 10 and vacuum-sucking the printed wiring board 7; an aligning device 3 aligning the printed wiring board 7 on a position where the position of the pattern film 8 is previously stored; a carrying device 4 equipped with the close contacting board 2 and carrying the aligned printed wiring board 7 on the transparent board 1; a vacuum-suction device 5 vacuum-sucking the pattern film 8 on the transparent board 1; and a vacuum pressure adjusting valve 6 changing the vacuum suction pressure of the vacuum-suction device 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure machine for printed wiring boards, in which a pattern film is brought into close contact with an ultraviolet curable resist coated or laminated on the surface of the printed wiring board in the manufacturing process of the printed wiring board to irradiate it with ultraviolet rays.

[0002]

2. Description of the Related Art Conventionally, as shown in the block diagram of FIG. 3, a conventional exposure apparatus of this type has a vacuum suction of a pattern film 8 and has a vacuum suction port 9 near the edge of the plate and at a position surrounding the vacuum suction port 9. A transparent plate 1 having a bonded sealing material 10 and having rigidity to transmit ultraviolet rays, and a vertically movable contact plate 2 that abuts the sealing material 10 around the outside of the transparent plate 1 and adsorbs a printed wiring board 7. A positioning device 3 for positioning the printed wiring board 7 at a position where the position of the pattern film 8 is stored in advance.
A transport device 4 for accurately transporting the printed wiring board 7 aligned with the alignment device 3 and aligned by the alignment device 3 onto the transparent plate 1, and a vacuum suction device for vacuum-adsorbing the pattern film 8 onto the transparent plate 1. It is composed of 5.

The exposure of the printed wiring board 7 is performed as follows.

(1) The position of the pattern film 8 is stored in the alignment device 3 in advance, and the pattern film 8 is vacuum-sucked to the transparent plate 1 by the vacuum suction device 5.

(2) The printed wiring board 7 is aligned with the position of the pattern film 8 stored in (1) by the alignment device 3. The transport device 4 moves to the position alignment device 3 (position A), and the contact plate 2 is lowered and the printed wiring board 7 is adsorbed and raised. After moving to the transparent plate 1 (position B), the contact plate 2
And the printed wiring board 7 is placed on the pattern film 8.

(3) Irradiate ultraviolet rays through the transparent plate 1,
The ultraviolet curing resist on the surface of the printed wiring board 7 is exposed.

[0007]

The above-mentioned conventional exposure apparatus for printed wiring boards has the following problems.

(1) When the suction pressure between the pattern film and the contact plate is lower than the vacuum pressure between the pattern film and the transparent plate, the degree of adhesion between the pattern film and the printed wiring board is reduced, and the space between the pattern film and the printed wiring board is reduced. Ultraviolet rays enter and a pattern thicker than the pattern film is exposed on the printed wiring board.

(2) When the suction pressure between the pattern film and the contact plate is made higher than the vacuum pressure between the pattern film and the transparent plate, the vacuum pressure between the pattern film and the transparent plate when the contact plate is lowered onto the transparent plate is The pressure difference between the pattern film and the contact plate, the vacuum pressure between the pattern film and the transparent plate when the contact plate is not located on the transparent plate, and the pressure difference between the pattern film and the contact plate. And the pattern film undergoes a large dimensional change due to the difference in vacuum pressure upon repeated exposure.

[0010]

An exposing machine for a printed wiring board according to the present invention includes a sealing material which is vacuum-sucked on a pattern film, has a vacuum suction port near the edge of the plate, and is adhered to a position surrounding the vacuum suction port. A transparent plate having rigidity that transmits ultraviolet rays, and a vertically movable contact plate that abuts a sealing material on the transparent plate and adsorbs a printed wiring board having an ultraviolet curing resist,
A positioning device that positions the printed wiring board to the position where the pattern film position is stored in advance, and a contact plate that is provided to accurately transfer the printed wiring board that is positioned by this positioning device onto the transparent plate An apparatus, a vacuum suction device that vacuum-adsorbs the pattern film on the transparent plate, and a vacuum pressure control valve that changes the vacuum pressure between the pattern film and the transparent plate by causing a vacuum leak between the vacuum suction device and the transparent plate. ing.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram of an exposure machine for a printed wiring board according to an embodiment of the present invention, and FIG. 2 is an enlarged view of the periphery of the transparent plate 1. In FIG. 1, the exposure apparatus for a printed wiring board according to the present embodiment has a pattern film 8 which is vacuum-sucked, has a vacuum suction port 9 near the plate edge, and has a sealing material 10 bonded at a position surrounding the vacuum suction port 9. A transparent plate 1 having rigidity to transmit ultraviolet rays, a vertically movable contact plate 2 that abuts a sealing material 10 around the outside of the transparent plate 1 and adsorbs a printed wiring board 7, and a pattern film 8 in advance. An alignment device 3 for aligning the printed wiring board 7 to a position in which the position is stored, and a printed wiring board 7 that is equipped with the contact plate 2 and aligned by the alignment device 3 are accurately conveyed onto the transparent plate 1. The transport device 4, the vacuum suction device 5 that changes the vacuum pressure for vacuum-sucking the pattern film 8 to the transparent plate 1, the vacuum suction device 5, and the transparent plate 1.
And a vacuum pressure adjusting valve 6 that changes the vacuum pressure between the pattern film 8 and the transparent plate 1 by causing a vacuum leak. Further, an ultraviolet curing resist 12 is applied or laminated on the surface of the printed wiring board 7 on which the circuit 11 is formed.

Next, the operation of the exposure apparatus for a printed wiring board according to this embodiment will be described. In advance, the pattern film 8 is adsorbed to the transparent plate 1 in a semi-vacuum state by opening the vacuum pressure adjusting valve 6 and using the vacuum suction device 5. The printed wiring board 7 is aligned with the position of the pattern film 8 stored by the alignment device 3. Next, the transport device 4 moves to the upper part of the alignment device 3 (position A), and the contact plate 2 is moved down to cause the printed wiring board 7 to move.
Adsorb and rise. The transport device 4 is moved to the upper portion of the pattern film 8 (position B) and the contact plate 2 is lowered to move the printed wiring board 7
And the pattern film 8 are closely attached. At the same time, the vacuum pressure adjusting valve 6 is closed, and the vacuum pressure of the pattern film 8 and the transparent plate 1 is set to the full vacuum. The printed wiring board 7 is exposed to ultraviolet rays. After exposure, the vacuum adjustment valve 6 is opened and the pattern film 8
The vacuum pressure between the transparent plate 1 and the transparent plate 1 is set to a semi-vacuum. This operation is sequentially repeated to perform exposure.

[0014]

As described above, according to the present invention, the vacuum pressure between the pattern film and the transparent plate and the contact plate and the pattern are set by setting the suction pressure between the pattern film and the contact plate to be a full vacuum at the time of exposure. It is possible to reduce the difference between the pressure difference between the suction pressure of the film and the pressure difference between the vacuum pressure between the pattern film and the transparent plate except during exposure and the atmospheric pressure on the pattern film. Since it does not exist, the dimensional change of the pattern film can be suppressed even after repeated exposure. Furthermore, since the vacuum pressure between the transparent plate and the pattern film becomes a full vacuum at the time of exposure, it is possible to increase the adsorption pressure of the printed wiring board of the contact plate, and the adhesion between the printed wiring board and the pattern film increases, making the pattern thicker than the pattern film. Has the effect of not being printed.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

FIG. 2 is an enlarged view of the periphery of the transparent plate of FIG.

FIG. 3 is a configuration diagram showing a conventional exposure apparatus for a printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent plate 2 Adhesion plate 3 Positioning device 4 Conveying device 5 Vacuum suction device 6 Vacuum pressure adjustment valve 7 Printed wiring board 8 Pattern film 9 Vacuum suction port 10 Sealing material 11 Circuit 12 Ultraviolet curing resist

Claims (1)

[Claims] 1. An exposure machine for printed wiring boards, wherein a pattern film is brought into close contact with an ultraviolet curable resist coated or laminated on the surface of a printed wiring board on which a circuit is formed, and the pattern film is vacuum-sucked to a plate. A transparent plate having a vacuum suction port near the end and having a sealing material adhered to a position surrounding the vacuum suction port and having rigidity to transmit ultraviolet rays, and adsorbs the printed wiring board by abutting the sealing material. A vertically movable contact plate, an alignment device for aligning the printed wiring board to a position in which the position of the pattern film is stored in advance, and the printing device provided with the contact plate and aligned by the alignment device. A transport device that transports the wiring board onto the transparent plate, a vacuum suction device that vacuum-sucks the pattern film to the transparent plate, the vacuum suction device, and the vacuum suction device. An exposure machine for a printed wiring board, comprising: a vacuum pressure adjusting valve for changing the vacuum pressure between the pattern film and the transparent plate by causing a vacuum leak to reach the transparent plate.