CN107109638A - 工件保持体及成膜装置 - Google Patents
工件保持体及成膜装置 Download PDFInfo
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Abstract
本发明的一个方面所涉及的表面处理用的工件保持体(20)具备保持器(21)和粘接片(22)。粘接片(22)具有:以第一粘接力粘接于保持器(21)的第一面(22a)(第一粘接层(221));和构成为能以比所述第一粘接力大的第二粘接力保持工件(部件主体110)的第二面(22b)(第二粘接层(222))。
Description
技术领域
本发明涉及工件保持体及成膜装置,例如用于具有保护膜的电子部件的制造。
背景技术
近年来,伴随着电子设备的小型化、高功能化,对内置的各种电子部件也要求进一步小型化、高功能化。为了响应这样的要求,例如,正在推进电子部件的进一步的高密度安装化。
以下的技术已被公知:将作为被处理物的单个或多个工件搭载于载体,将该载体向多个工序依次进行搬运,对工件进行处理。该情况下,优选的是,能够在载体上保持工件,并且能够容易地进行工件相对于载体的拆装。例如,在以下专利文献1中记载了一种载体夹具,其构成为,具备载体板和设置在该载体板上的粘接层,并且能够利用粘接层将工件拆装自如地进行粘接保持。
【现有技术文献】
【专利文献】
专利文献1:日本发明专利公开公报特开2007-329182号
发明内容
本发明要解决的技术问题
为了电子部件的高密度安装化,需要缩小各电子部件的安装空间。因此,近年来,如BGA(Ball Grid Array:球栅阵列)/CSP(Chip Size Package:芯片尺寸封装)等,多个突起电极(隆起部)以栅格状排列在部件的底面(安装面)上的表面安装部件成为主流。
若使用具有上述粘接层的载体而在工件的表面上形成保护膜,则由于成膜材料也会附着于粘接层的表面上,因此,在重复使用载体时,需要粘接层的更换作业。因此,存在如下的问题:若为了使粘接层的更换作业变得容易而降低粘接层的粘接力,则会导致对工件的保持力下降,另一方面,若为了确保工件的保持力而提高粘接层的粘接力,则会对粘接层的更换造成障碍。
鉴于上述的情况,本发明的目的是提供一种表面处理用的工件保持体及成膜装置,能够确保工件的保持力的同时容易进行粘接层的更换。
【用于解决问题的技术方案】
为了实现上述目的,本发明的一个方面所涉及的表面处理用的工件保持体具备保持器(holder)和粘接片。
上述粘接片具有:以第一粘接力粘接于上述保持器的第一面;和构成为能够以比上述第一粘接力大的第二粘接力保持工件的第二面。
在上述工件保持体中,粘接片具有以第一粘接力粘接于保持器的第一面、和以比第一粘接力大的第二粘接力保持工件的第二面,因此能够确保工件的保持力的同时容易地进行粘接片的更换。
上述粘接片也可以具有:基材;第一粘接层,其构成上述第一面并层叠于上述基材的一个面上;和第二粘接层,其构成上述第二面并层叠于上述基材的另一个面。
据此,能够容易地构成第一面和第二面的粘接力互不相同的粘接片。
上述第二面可以构成为能够随着上述工件的接合面的形状而发生变形。
据此,能够使工件的接合面与第二面紧贴,因此能够提高对工件的保持强度。另外,例如,能够阻止成膜处理中成膜材料渗入(infiltrate)接合面。
上述保持器也可以具有保持器主体、和配置于上述保持器主体与上述粘接片之间的导热片。
据此,工件的散热效率得到提高,因此还能够适用于需要等离子或热源的表面处理。
上述保持器典型的是能够将多个工件保持在同一面上的板状。
据此,能够一并处理多个工件,因此实现生产性的提高。
本发明的一个方面所涉及的成膜装置具备成膜室、成膜源、支承体、和工件保持体。
上述成膜源设置于上述成膜室。
上述支承体设置于上述成膜室,并具有能够支承工件的支承面。
上述工件保持体具有:构成为相对于上述支承面能够拆装的保持器;和粘接片。上述粘接片具有:第一面,其以第一粘接力粘接于上述保持器;和第二面,其构成为能够以比上述第一粘接力大的第二粘接力对上述工件进行粘接保持。
在上述成膜装置中,粘接片具有以第一粘接力粘接于保持器的第一面、和以比第一粘接力大的第二粘接力对工件进行粘接保持的第二面,因此能够确保工件的保持力的同时,容易地进行粘接片的更换。据此,能够在确保对工件的适当的成膜处理的同时,实现生产性的提高。
也可以,上述支承体具有能够冷却上述支承面的冷却机构,上述保持器具有保持器主体、和配置于上述保持器主体与上述粘接片之间的导热片。
据此,能够将工件冷却到规定温度,因此还能够应用于需要等离子或热源的成膜处理。
上述支承体也可以包括旋转鼓,所述旋转鼓构成为能够在上述成膜室内旋转,并且在周面上形成有所述支承面。
据此,能够对多个工件一并进行成膜处理,因此能够实现生产性的提高。
【发明的效果】
如上所述,根据本发明,能够在确保工件的保持力的同时,容易地进行粘接层的更换。
附图说明
图1是表示作为工件的电子部件的结构的概略侧视图。
图2是本实施方式所涉及的工件保持体的分解侧剖视图。
图3是概略表示电子部件(部件主体)的立体图和侧视图。
图4是上述工件保持体的概略俯视图。
图5是安装于上述工件保持体上的部件主体的情形的主要部分的概略侧剖视图。
图6是说明针对上述部件主体的成膜处理的主要部分的概略侧剖视图。
图7是上述成膜处理中使用的成膜装置的概略结构图。
图8是说明粘接片的更换工序的、上述工件保持体的主要部分的概略侧剖视图。
具体实施方式
下面,参照附图说明本发明的实施方式。在本实施方式中,以图1所示的制造电子部件时所利用的工件保持体和成膜装置为例,进行说明。
[电子部件]
图1是表示制造对象即电子部件100的结构的概略侧视图。
如图1所示,电子部件100由BGA/CSP类型的半导体封装部件构成。电子部件100具有:半导体芯片101;与半导体芯片101电连接的配线基板102;以栅格状排列于配线基板102的背面上的多个隆起部(突起电极)103;密封半导体芯片101的树脂体104;和覆盖树脂体104的上表面和侧周面的保护膜105。
此外,为了容易理解,隆起部103略微夸张地示出,其数量、大小、形状等可能与实际的隆起部不同(以下的各图中也是同样的)。
[工件保持体]
图2是本实施方式所涉及的工件保持体20的分解侧剖视图。
如图2所示,工件保持体20具有保持器21和粘接片22。工件保持体20在电子部件100的一个制造工序即保护膜105的成膜工序中使用,如下所述,在将成膜对象即工件(形成保护膜105之前的电子部件)粘接保持于粘接片22上的状态下装填于成膜装置。
保持器21由保持器主体211和导热片212的层叠体构成。保持器21为能够将多个工件保持于同一面上的板状。
保持器主体211例如由铝板、铜板、不锈钢板等矩形的金属板构成。导热片212形成为与保持器主体211相同的形状、大小,并粘贴在保持器主体211的上表面上。导热片212由含有导热性填充物的硅类、丙烯酸类的树脂片构成。导热片212典型的(具有代表性的)是使用电绝缘性的部件,但是也可以使用导电性的部件。
粘接片22形成为与保持器21相同的形状和大小,并且可剥离地粘贴于保持器21的表面(导热片212的表面)上。粘接片22具有:第一面22a,其以第一粘接力粘接于保持器21的表面上;及第二面22b,其构成为能够以大于所述第一粘接力的第二粘接力保持工件。
(粘接片22)典型的是由双面粘接胶带构成。粘接片22具有基材220、覆盖基材220的一个面(图2中下表面)的第一粘接层221、和覆盖基材220的另一个面(图2中上表面)的第二粘接层222。
基材220典型的是由PET(聚对苯二甲酸乙二醇酯)膜、PI(聚酰亚胺)膜等树脂膜构成,但是,除此以外,也可以由纸、无纺布、玻璃纤维等其他的材料构成。
第一粘接层221和第二粘接层222分别由具有粘着性的粘接材料构成。第一粘接层221形成粘接片22的第一面22a,并以上述第一粘接力粘接于保持器20。另一方面,第二粘接层222形成粘接片22的第二面22b,并构成为以上述第二粘接力保持工件。
第一粘接层221的粘接力(第一粘接力)的大小被设定为:一方面能够保持充分的粘接力,使粘接片22在保持器21上下翻转时自不待言,而且在保持器21被移动(hand ling)时或在成膜时不会因产生的加速度等而从保持器20脱离;另一方面能够从保持器20比较容易地剥离第一粘接层221。更具体地,上述第一粘接力的大小换算成使用宽度25mm的胶带状样本时的剥离强度时的值,例如,可列举出0.2N/25mm~3.5N/25mm的范围内的值。
另一方面,第二粘接层222的粘接力(第二粘接力)可根据工件的接合面的大小、形状等适当设定,同样地,换算成使用宽度25mm的胶带状样本时的剥离强度时的值,例如,可列举出6.5N/25mm~12N/25mm的范围内的值。若上述第二粘接力过小,则难以适当地保持工件,反之,若上述第二粘接力过大,则难以从粘接片22剥离工件。
作为构成第一粘接层221和第二粘接层222的材料,例如,可例举出硅类粘接性树脂材料、丙烯酸类粘接性树脂材料等。尤其是,硅类粘接性树脂由于能够在较宽的范围(例如,0.2N/25mm~9N/25mm)内调整粘接力,并且耐热性较高,因此具有对于高温处理也能够充分应对这样的优点。
第一粘接层221和第二粘接层222的厚度没有特别限定,可在如上所述能够确保设为目标的粘接力或保持力的范围内适当设定。
特别优选的是,构成工件保持面即上述第二面22b的第二粘接层222被构成为能够随着工件的接合面的形状而发生变形。为了获得这样的特性,例如,第二粘接层222可以形成得较厚,也可以对基材220使用可变形性(deformability)好的材料。或者,也可以利用导热片212的弹性来体现第二面22b的变形功能。
[电子部件的制造方法]
接下来,对使用如上所述构成的工件保持体20的电子部件100的制造方法(保护膜105的成膜方法)进行说明。
图3的A~C分别是表示形成保护膜105之前的电子部件(以下,称作部件主体110)的俯视立体图、仰视立体图及侧视图。
如图3的A~C所示,部件主体110被形成为大致长方体形状,部件主体110具有:底面111,其设有多个隆起部103;底面111的相反侧的顶面112;和侧周面113,其设于底面111和顶面112之间。底面111相当于配线基板102的背面,顶面112相当于树脂体104的上表面,侧周面113相当于树脂体104和配线基板102各自的四个侧面。
这种部件主体110典型的是在保护膜105的成膜工序之前被预先制造,但是部件主体110也可以是在外部制造的产品,也可以是市场销售的产品。部件主体110的大小没有特别限定,例如,采用平面形状为3mm~25mm的四方的部件主体。
在本实施方式中,多个上述结构的部件主体110同时向成膜装置装填,针对这些多个部件主体110一并进行保护膜105的成膜。工件保持体20用于将这些部件主体110以多个为单位进行移动。
图4是概略表示部件主体110向工件保持体20安装的安装工序的俯视图。图5是表示安装于工件保持体20上的部件主体110的情形的主要部分的概略侧剖视图。
如图4所示,部件主体110被隔开规定间隔以每次多个的方式沿纵向和横向向工件保持体20逐次搭载。其数量没有特别限定,根据部件主体110、工件保持体20的大小适当设定,例如,设为几十至几百个。
如图5所示,各部件主体110的底面111被粘接保持于工件保持体20的粘接片22的表面(第二面22b)上。此时,粘接片22的第二粘接层222被突出设置于底面111上的多个隆起部103按压而局部变形的同时进入隆起部103之间,从而与底面111紧贴。如此,第二粘接层222的表面(第二面22b)随着部件主体110的接合面(底面111)的形状而发生变形,由此第二粘接层222以覆盖底面111的整个区域的方式对部件主体110进行粘接保持。
接下来,工件保持体20被装填到成膜装置,在各部件主体110的表面(顶面112和侧周面113)上形成保护膜105。图6是表示在工件保持体20上的部件主体110上形成保护膜105的情形的主要部分的概略侧剖视图。
如图6的双点划线所示,在各部件主体110的顶面112和侧周面113的整个区域上形成保护膜105。保护膜105的厚度没有特别限定,例如,设为3μm~7μm。构成保护膜105的材料也没有特别限定,典型的是适合使用铝、钛、铬、铜、锌、钼、镍、钨、钽及它们的氧化物或氮化物等。
此时,粘接片22的第二粘接层222通过与部件主体110的底面111紧贴,起到从部件主体110的周围遮蔽多个隆起部103的作用。因此,防止成膜时成膜材料渗入部件主体110的底面111,并且防止成膜材料附着于隆起部103。
上述成膜装置典型的是使用溅射装置、真空蒸镀装置。作为成膜装置,优选能够收纳多块保持多个部件主体110的工件保持体20的批量式成膜装置。另外,为了在工件保持体20上的所有的部件主体110的表面(顶面112和侧周面113)上适当地形成保护膜105,优选地,构成为使工件保持体20能够在成膜室内相对于溅射阴极等成膜源进行旋转、摆动等相对移动。作为这种成膜装置,例如,可适用转盘式溅射装置。
上述成膜装置中也可以设置对工件的表面进行前处理的处理部。作为前处理,可列举出离子束照射处理、等离子处理、蚀刻处理等,例如,以去除工件表面的油脂、杂质来提高与保护膜的紧贴性为目的实施。
图7是表示转盘式溅射装置的一例的概略剖视图。
在图7所示的溅射装置50中,构成成膜室的真空腔1的大致中央部配置有作为支承体的旋转鼓2,沿着旋转鼓2的旋转方向依次设置有第一成膜区3、第二成膜区4、前处理区5。
旋转鼓2的周面2a构成对多个工件保持体20以可拆装的方式进行支承的支承面,并具备夹持器等适当的固定机构。旋转鼓2的内部具有能够将周面2a冷却到规定温度以下的冷却源。该冷却源典型的是由冷却水等制冷剂的循环流路构成。
第一成膜区3具备:包含2个电极的溅射阴极6;配置于溅射阴极6的旋转鼓2侧的靶7;用于对溅射阴极6施加交流电压的AC电源8;用于导入Ar气体等的Ar气体导入系统9等。
同样地,第二成膜区4具备:包含2个电极的溅射阴极10;配置于溅射阴极10的旋转鼓2侧的靶11;用于对溅射阴极10施加交流电压的AC电源12;和用于导入Ar气体等的Ar气体导入系统13等。
靶7、11由形成保护膜105的材料构成。在第一成膜区3和第二成膜区4中,在靶7、11与旋转鼓2之间分别设置有开闭自如的闸门(shutter)17、18。
前处理区5设置于第一成膜区3和第二成膜区4之间的适当的位置,并包括离子束源15和对离子束源15供电的电源16。
此外,溅射阴极6、10、靶7、11和交流电源8、12构成用于形成保护膜105的成膜源。溅射阴极6、10均由AC溅射源构成,但也可以溅射阴极6和10的任一者或双方由DC溅射源构成。另外,也可以设置用于在靶7、11的表面形成磁场的磁控管磁路(Magnetron magneticcircuit)。
在使用了成膜装置50的保护膜105的成膜工序中,分别对多个部件主体110进行粘接保持的多个工件保持体20沿旋转鼓2的旋转方向排列配置于旋转鼓2的周面2a。然后,使旋转鼓2向图7中箭头所示的方向以一定速度旋转的同时,依次实施前处理区5中的离子束照射处理、第一和第二成膜区3、4中的成膜处理。据此,在各工件保持体20上的各部件主体110的表面(顶面112、侧周面113)上形成保护膜105。
在本实施方式中,工件保持体20具备配置于保持器主体211和粘接片22之间的导热片212。据此,能够将部件主体110冷却到规定温度以下,因此能够在保护部件主体110,抑制等离子体的热对其的影响的同时,进行保护膜105的成膜。
按照以上的方式,制造部件主体110的表面上形成有保护膜105的电子部件100。成膜工序完成后,将工件保持体20从旋转鼓2卸下,并向成膜装置20的外部搬出。然后,从工件保持体20的粘接片22上回收电子部件100。
回收方法没有特别限定,典型的是使用弹性夹头(Collet)等部件吸附用具将各电子部件从粘接片22剥离取下。
此外,第二粘接层22也可以由粘接力会因规定温度以上的加热处理或紫外线的照射处理而下降的粘接性树脂材料构成,该情况下,具有容易回收电子部件100这样的优点。
[粘接片的更换]
图8的A~C是说明粘接片22的更换工序的工件保持体20的概略侧剖视图。
如图8的A所示,电子部件100被拆除后的粘接片22的表面上存在保护膜105、因多个隆起部103形成的按压痕107等,因此大多不能经受重复使用。
因此,在本实施方式中,如图8的B所示,将使用完的粘接片22从保持器21(导热片212)剥离取下,之后,如图8的C所示,将新的(未使用的)粘接片22向保持器21(导热片212)粘贴。据此,能够确保粘接片22的第二面22b(第二粘接层)的粘接力(第二粘接力),还能够确保对工件(部件主体110)的适当的粘接保持力。
另外,根据本实施方式,由于能够用粘接片22保护保持器21的导热片212,因此能够不更换导热片212而重复使用保持器21。因此,通过将比较廉价的粘接片22设为更换对象部件,能够实现生产成本的降低。
另外,根据本实施方式,粘接片22构成为,粘接于保持器21上的第一面22a(第一粘接层221)的第一粘接力比保持器件主体110的第二面(第二粘接层222)的第二粘接力小,因此即使对于较大面积的保持器21也能够容易地剥离粘接片22。据此,能够在不损害作业性的情况下进行粘接片22的更换。
如上所述,根据本实施方式的工件保持体20,能够在确保部件主体110的保持力的同时容易地进行粘接片22的更换。据此,能够在适当地进行对部件主体110表面的成膜处理的同时,通过工件保持体20的再生作业的高效化来实现生产性的提高。
以上,对本发明的实施方式进行了说明,但是,不言而喻,本发明不是仅限于上述的实施方式,可施加各种变更。
例如,在以上的实施方式中,作为工件,以作为半导体封装部件的部件主体110(电子部件100)为例进行了说明,但不限于此,对半导体晶片、玻璃基板那样的板状的工件也可以适用本发明。
另外,在以上的实施方式中,主要以供成膜处理使用的工件保持体为例进行了说明,但不限于此,对于供蚀刻处理或等离子体处理、电子束或离子束等带电粒子照射处理、以及喷砂处理或气体的喷射处理等表面处理使用的工件保持体,也可适用本发明。
【附图标记的说明】
1…真空腔(成膜室)
2…旋转鼓(支承体)
7、11…靶
20…工件保持体
21…保持器
211…保持器主体
212…导热片
22…粘接片
22a…第一面
22b…第二面
220…基材
221…第一粘接层
222…第二粘接层
50…成膜装置
100…电子部件
103…隆起部
105…保护膜
110…部件主体
Claims (8)
1.一种工件保持体,其用于表面处理,具备保持器和粘接片,其中所述粘接片具有:
第一面,其以第一粘接力粘接于所述保持器;和
第二面,其被构成为能以比所述第一粘接力大的第二粘接力保持工件。
2.根据权利要求1所述的工件保持体,其中,
所述粘接片具有:
基材;
第一粘接层,其构成所述第一面且层叠于所述基材的一个面;和
第二粘接层,其构成所述第二面且层叠于所述基材的另一个面。
3.根据权利要求1或2所述的工件保持体,其中,
所述第二面被构成为能随着所述工件的接合面的形状而发生变形。
4.根据权利要求1至3中任一项所述的工件保持体,其中,
所述保持器具有:
保持器主体;和
导热片,其被配置于所述保持器主体与所述粘接片之间。
5.根据权利要求1至4中任一项所述的工件保持体,其中,
所述保持器具有能将多个工件保持在同一面上的板状。
6.一种成膜装置,具备成膜室、成膜源、支承体和工件保持体,其中:
所述成膜源被设置于所述成膜室;
所述支承体被设置于所述成膜室,且所述支承体具有能支承工件的支承面;
所述工件保持体具有保持器和粘接片,其中,所述保持器被构成为在所述支承面上可拆装,所述粘接片具有:
以第一粘接力粘接于所述保持器的第一面;和
被构成为能以比所述第一粘接力大的第二粘接力保持工件的第二面。
7.根据权利要求6所述的成膜装置,其中,
所述支承体具有能冷却所述支承面的冷却机构,
所述保持器具有:
保持器主体;和
被配置于所述保持器主体与所述粘接片之间的导热片。
8.根据权利要求7所述的成膜装置,其中,
所述支承体包括旋转鼓,其中所述旋转鼓被构成为能在所述成膜室内旋转,且所述旋转鼓的周面上形成有所述支承面。
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PCT/JP2016/073974 WO2017038466A1 (ja) | 2015-09-02 | 2016-08-17 | ワーク保持体および成膜装置 |
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JP (1) | JP6439054B2 (zh) |
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CN110656316A (zh) * | 2019-10-31 | 2020-01-07 | 中山凯旋真空科技股份有限公司 | 夹具及具有其的镀膜设备 |
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US10633736B2 (en) * | 2016-12-13 | 2020-04-28 | Shibaura Mechatronics Corporation | Film formation apparatus |
JP7012475B2 (ja) * | 2017-07-18 | 2022-01-28 | 芝浦メカトロニクス株式会社 | 電子部品の製造装置及び電子部品の製造方法 |
JP7320932B2 (ja) * | 2017-11-10 | 2023-08-04 | 芝浦メカトロニクス株式会社 | 成膜装置及び部品剥離装置 |
JP7051379B2 (ja) * | 2017-11-15 | 2022-04-11 | 芝浦メカトロニクス株式会社 | 成膜装置及び埋込処理装置 |
KR102399748B1 (ko) * | 2018-10-01 | 2022-05-19 | 주식회사 테토스 | 입체형 대상물 표면의 금속막 증착 장치 |
KR102267001B1 (ko) * | 2019-02-01 | 2021-06-18 | 도레이첨단소재 주식회사 | 전자부품 제조용 점착테이프 |
JP7132198B2 (ja) * | 2019-09-27 | 2022-09-06 | 芝浦メカトロニクス株式会社 | 成膜装置及び埋込処理装置 |
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TWI713128B (zh) | 2020-12-11 |
US20180274085A1 (en) | 2018-09-27 |
JP6439054B2 (ja) | 2018-12-19 |
CN107109638B (zh) | 2019-05-28 |
KR20180048440A (ko) | 2018-05-10 |
TW201719777A (zh) | 2017-06-01 |
JPWO2017038466A1 (ja) | 2017-10-26 |
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