CN106904960B - 一种Mg2SiO4-Li2TiO3复合体系LTCC材料及其制备方法 - Google Patents
一种Mg2SiO4-Li2TiO3复合体系LTCC材料及其制备方法 Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000005245 sintering Methods 0.000 claims abstract description 27
- 229910007848 Li2TiO3 Inorganic materials 0.000 claims abstract description 18
- 229910052839 forsterite Inorganic materials 0.000 claims abstract description 15
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
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- 239000002994 raw material Substances 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 11
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- 229910052906 cristobalite Inorganic materials 0.000 claims description 5
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052682 stishovite Inorganic materials 0.000 claims description 5
- 229910052905 tridymite Inorganic materials 0.000 claims description 5
- 229910010252 TiO3 Inorganic materials 0.000 claims description 4
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Abstract
本发明属于微波电子陶瓷材料及其制造领域,具体涉及一种Mg2SiO4‑Li2TiO3复合体系LTCC材料及其制备方法。本发明提供的LTCC材料,基于Mg2SiO4和Li2TiO3复合体系,通过固相法获得;实现烧结温度800~950℃低于960℃(Ag熔点),εr=9.0~18.0,且具有50,000~250,000GHz的高Qf值和近零τf=‑15~15ppm/℃,在LTCC技术领域具有很高的应用前景和价值。可广泛应用于LTCC基板、叠层微波器件和模块中。
Description
技术领域
本发明属于微波电子陶瓷材料及其制造领域,涉及一种具有谐振频率温度系数近零(τf~ 0ppm/℃)和高Qf值特性的低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)材料及其制备方法,具体为一种Mg2SiO4-Li2TiO3复合体系LTCC材料及其制备方法。
背景技术
随着微电子技术的发展,LTCC技术受到广泛关注。LTCC技术广泛用于国防军工、汽车及信息资讯产品中。其最大的特点是LTCC材料能在低烧结温度(<960℃)下烧结。
随着微波通信技术和雷达系统的发展,可利用的通信频率从微波扩展到毫米波。微波通信频率的高端化及大的信息传输量要求开发高Qf值和趋于零的τf值。高Qf值是为了降低能量散失和增强频率选择性,趋于零的τf值是为了保证频率的稳定性。
Mg2SiO4微波介电陶瓷由于具有高Qf值被广泛研究。Ohsato等(Ohsato H,TsunookaT, Sugiyama T,et al.Forsterite ceramics for millimeterwave dielectrics[J].Journal of Electroceramics, 2006,17(2):445-450)对Mg2SiO4介电性能进行了研究,研究发现Mg2SiO4微波介电陶瓷具有高Qf值(~270,000GHz)。但其烧结温度高(~1450℃),且谐振频率温度系数τf偏离零较大 (~-67ppm/℃)。使其不能满足LTCC应用需求。
Li2TiO3微波介电陶瓷具有较低烧结温度和谐振频率正温度系数。Bian等(Bian JJ,Dong Y F.New high Q microwave dielectric ceramics with rock saltstructures:(1-x)Li2TiO3+xMgO system(0≤x≤0.5)[J].Journal of the EuropeanCeramic Society,2010,30(2):325-330)研究发现Li2TiO3在1300℃下烧结,其介电性能:εr~22,Qf~65,000GHz,τf~20ppm/℃。同样由于其烧结温度高,且谐振频率温度系数τf偏离零较大使其不能满足于LTCC应用需求。将两种正负τf的微波介电材料进行复合,可得到近零τf的微波介电复合陶瓷。再添加一定的助烧剂可实现低温烧结,同时获得高Qf值和温度稳定型的LTCC材料。
发明内容
针对上述存在问题或不足,本发明提供了一种Mg2SiO4-Li2TiO3复合体系LTCC材料及其制备方法,该材料能在低温(800~950℃)烧结实现致密化,且介电常数在9~18间可调,使其在LTCC集成基板和器件中具有良好的应用前景。
该温度稳定型高Qf值LTCC材料,包含Mg2SiO4、LiTiO2和Li2TiSiO5三相,化学通式为(1-x)Mg2SiO4–xLi2TiO3-yLiF,其中x(0.35~0.85),y(6~10wt%);
Mg2SiO4的原料组成为:MgO和SiO2按摩尔比MgO:SiO2=2:1配料;Li2TiO3的原料组成为:Li2CO3和TiO2按摩尔比Li2CO3:TiO2=2:1配料;LiF为助烧剂,所占比例y为Mg2SiO4与Li2TiO3之和质量百分比。
其烧结温度为800~950℃,εr=9.0~18.0,Q×f值50,000~250,000GHz,τf=-15~15ppm/℃。
上述LTCC材料的具体制备方法如下:
步骤1、将分析纯的MgO和SiO2按摩尔比MgO:SiO2=2:1配料;然后将其进行一次球磨使配料混合均匀,按照配料与去离子水质量比1:0.8~1.5加入去离子水,在球磨转速250~300 rpm下,球磨4~12h,球磨后将所得粉料在100~120℃下烘干备用。
步骤2、将步骤1所得的烘干粉料过40~100目筛网,过筛后放入坩埚中压实,按2~5℃/min 的升温速率升至1150~1350℃进行预烧,保温3~5h,随炉冷却得到Mg2SiO4预烧料。
步骤3、将分析纯的Li2CO3和TiO2按摩尔比Li2CO3:TiO2=2:1配料;将配好的原料进行一次球磨使配料混合均匀,按照配料与去离子水质量比1:0.8~1.5加入去离子水,在球磨转速 250~300rpm下,球磨4~12h,球磨后将所得粉料在100~120℃下烘干备用。
步骤4、将步骤3所得的烘干粉料过40~100目筛网,过筛后放入坩埚中压实,按2~5℃/min 的升温速率升至800~900℃进行预烧,保温3~5h,随炉冷却得到Li2TiO3预烧料。
步骤5、将步骤2和步骤4得到预烧料以及LiF,按照(1-x)Mg2SiO4–xLi2TiO3-yLiF配比进行称量配料,其中x=0.35~0.85,y=6~10wt%;然后按照配料与去离子水质量比1:0.8~1.5 加入去离子水,在球磨转速250~300rpm下,球磨4~12h,球磨后将粉料在100~120℃下烘干备用。
步骤6、将步骤5所得烘干粉料添加入占其20wt%~30wt%的PVA溶液作为粘结剂,进行造粒并在6~10MPa单轴干压成型。
步骤7、将步骤6所得产物放入烧结炉中,按2~5℃/min的升温速率升至400~600℃排胶3~6h,然后随炉冷却至室温,获得排胶后的生坯样品。
步骤8、将步骤7所得生坯样品再放入烧结炉中,按2~5℃/min的升温速率升至800℃~950 ℃进行烧结,并保温3~6h,后随炉冷却至室温,即可获得温度稳定型高Qf值LTCC材料。
所述步骤6中PVA溶液的浓度为8~10wt%。
本发明提供的LTCC材料,基于Mg2SiO4和Li2TiO3复合体系,通过固相法获得;实现烧结温度800~950℃低于960℃(Ag熔点),εr=9.0~18.0,且具有50,000~250,000GHz的高Qf 值和近零τf=-15~15ppm/℃,在LTCC技术领域具有很高的应用前景和价值。可广泛应用于 LTCC基板、叠层微波器件和模块中。
附图说明
图1为样品在850℃烧结下的X-射线衍射(XRD)图谱;
图2为样品在850℃烧结下的介电性能图。
具体实施方式
下面以实施例结合附图对本发明做进一步的详细说明。
步骤1:将分析纯的MgO和SiO2按摩尔比MgO:SiO2=2:1称料配置原料;将配好的原料进行一次球磨使原料混合均匀,按照粉料与去离子水质量比1:1加入去离子水,在球磨转速 300rpm下,球磨4h。球磨完将粉料在120℃下烘干备用。
步骤2:将步骤1所得的烘干粉料过60目筛网,过筛后放入坩埚中压实,按2℃/min的升温速率升至1350℃进行预烧,保温4h,随炉冷却得到Mg2SiO4预烧料。
步骤3:将分析纯的Li2CO3和TiO2按摩尔比Li2CO3:TiO2=2:1称料配置原料;将配好的原料进行一次球磨使原料混合均匀,按照粉料与去离子水质量比1:1加入去离子水,在球磨转速300rpm下,球磨4h。球磨完将粉料在120℃下烘干备用。
步骤4:将步骤3所得的烘干粉料过60目筛网,过筛后放入坩埚中压实,按2℃/min的升温速率升至900℃进行预烧,保温4h,随炉冷却得到Li2TiO3预烧料。
步骤5:将步骤2和步骤4得到预烧料按照(1-x)Mg2SiO4–xLi2TiO3-yLiF(其中x=0.35~0.85, y=6~10wt%)配比进行称量;按照配得粉料与去离子水质量比1:1加入去离子水,在球磨转速300rpm下,球磨4h。球磨完将粉料在120℃下烘干备用。
步骤6:将步骤5所得粉料添加入占其20wt%的PVA溶液作为粘结剂,进行造粒并在10MPa单轴干压成直径×厚度=12mm×6mm圆柱;
步骤7:将步骤6所得产物放入烧结炉中,按2℃/min的升温速率升至600℃排胶4h,然后随炉冷却至室温,获得排胶后的生坯样品;
步骤8:将步骤7所得生坯样品再放入烧结炉中,按2℃/min的升温速率升至850℃进行烧结,并保温4h,后随炉冷却至室温,获得温度稳定型高Qf值的LTCC材料。
实施例选取了当x=0.35,0.45,0.55,0.65,0.75和0.85的值。
图1为850℃烧结时,实施例x不同取值对应的XRD图谱。从图中可以看出样品含有Mg2SiO4、LiTiO2和Li2TiSiO5三相的特征峰。
图2为850℃烧结时,实施例x不同取值对应的εr值、Qf值和τf值。
从实施例可见,本发明提供的LTCC材料,基于Mg2SiO4和Li2TiO3复合体系,通过固相法获得;实现烧结温度800~950℃低于960℃(Ag熔点),且具有高Qf值和近零τf,在LTCC技术领域具有很高的应用前景和价值。
Claims (3)
1.一种Mg2SiO4-Li2TiO3复合体系LTCC材料,其特征在于:包含Mg2SiO4、LiTiO2和Li2TiSiO5三相,其化学通式为(1-x)Mg2SiO4–xLi2TiO3-yLiF,x=0.35~0.85,y=6~10wt%;
Mg2SiO4的原料组成为:MgO和SiO2按摩尔比MgO:SiO2=2:1;
Li2TiO3的原料组成为:Li2CO3和TiO2按摩尔比Li2CO3:TiO2=2:1;
LiF为助烧剂,所占比例y为Mg2SiO4与Li2TiO3之和质量百分比;
烧结温度为800~950℃,εr=9.0~18.0,Q×f值50,000~250,000GHz,τf=-15~15ppm/℃。
2.如权利要求1所述Mg2SiO4-Li2TiO3复合体系LTCC材料的制备方法,包括以下步骤:
步骤1、将分析纯的MgO和SiO2按摩尔比MgO:SiO2=2:1配料;然后将其进行一次球磨使配料混合均匀,按照配料与去离子水质量比1:0.8~1.5加入去离子水,在球磨转速250~300rpm下,球磨4~12h,球磨后将所得粉料在100~120℃下烘干备用;
步骤2、将步骤1所得的烘干粉料过40~100目筛网,过筛后放入坩埚中压实,按2~5℃/min的升温速率升至1150~1350℃进行预烧,保温3~5h,随炉冷却得到Mg2SiO4预烧料;
步骤3、将分析纯的Li2CO3和TiO2按摩尔比Li2CO3:TiO2=2:1配料;将配好的原料进行一次球磨使配料混合均匀,按照配料与去离子水质量比1:0.8~1.5加入去离子水,在球磨转速250~300rpm下,球磨4~12h,球磨后将所得粉料在100~120℃下烘干备用;
步骤4、将步骤3所得的烘干粉料过40~100目筛网,过筛后放入坩埚中压实,按2~5℃/min的升温速率升至800~900℃进行预烧,保温3~5h,随炉冷却得到Li2TiO3预烧料;
步骤5、将步骤2和步骤4得到预烧料以及LiF,按照(1-x)Mg2SiO4–xLi2TiO3-yLiF配比进行称量配料,其中x=0.35~0.85,y=6~10wt%;然后按照配料与去离子水质量比1:0.8~1.5加入去离子水,在球磨转速250~300rpm下,球磨4~12h,球磨后将粉料在100~120℃下烘干备用;
步骤6、将步骤5所得烘干粉料添加入占其20wt%~30wt%的PVA溶液作为粘结剂,进行造粒并在6~10MPa单轴干压成型;
步骤7、将步骤6所得产物放入烧结炉中,按2~5℃/min的升温速率升至400~600℃排胶3~6h,然后随炉冷却至室温,获得排胶后的生坯样品;
步骤8、将步骤7所得生坯样品再放入烧结炉中,按2~5℃/min的升温速率升至800℃~950℃进行烧结,并保温3~6h,后随炉冷却至室温,即可获得Mg2SiO4-Li2TiO3复合体系LTCC材料。
3.如权利要求2所述Mg2SiO4-Li2TiO3复合体系LTCC材料的制备方法,其特征在于:所述步骤6中PVA溶液的浓度为8~10wt%。
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