CN106883410A - 全氟醚基聚硅氧烷及其制备方法和应用 - Google Patents
全氟醚基聚硅氧烷及其制备方法和应用 Download PDFInfo
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- CN106883410A CN106883410A CN201710128103.XA CN201710128103A CN106883410A CN 106883410 A CN106883410 A CN 106883410A CN 201710128103 A CN201710128103 A CN 201710128103A CN 106883410 A CN106883410 A CN 106883410A
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- perfluoroether
- polysiloxanes
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- catalyst
- cyclotrisiloxane
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- -1 polysiloxanes Polymers 0.000 title claims abstract description 71
- UJMWVICAENGCRF-UHFFFAOYSA-N oxygen difluoride Chemical compound FOF UJMWVICAENGCRF-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229920001774 Perfluoroether Polymers 0.000 title claims abstract description 40
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 22
- 239000003054 catalyst Substances 0.000 claims description 19
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 8
- 238000009835 boiling Methods 0.000 claims description 7
- 239000003153 chemical reaction reagent Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- 238000010792 warming Methods 0.000 claims description 6
- YFCGDEUVHLPRCZ-UHFFFAOYSA-N [dimethyl(trimethylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C YFCGDEUVHLPRCZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 239000000314 lubricant Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000007363 ring formation reaction Methods 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000012805 post-processing Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- RSIHJDGMBDPTIM-UHFFFAOYSA-N ethoxy(trimethyl)silane Chemical compound CCO[Si](C)(C)C RSIHJDGMBDPTIM-UHFFFAOYSA-N 0.000 claims description 2
- 239000012467 final product Substances 0.000 claims description 2
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical group C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 claims description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical group C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 230000000717 retained effect Effects 0.000 claims description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 claims description 2
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 claims 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000001704 evaporation Methods 0.000 abstract description 4
- 230000008020 evaporation Effects 0.000 abstract description 4
- SJBBXFLOLUTGCW-UHFFFAOYSA-N 1,3-bis(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC(C(F)(F)F)=C1 SJBBXFLOLUTGCW-UHFFFAOYSA-N 0.000 description 10
- 239000000376 reactant Substances 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical group CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 229910052731 fluorine Inorganic materials 0.000 description 9
- 125000001153 fluoro group Chemical group F* 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
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- 229920002545 silicone oil Polymers 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- ZHPNWZCWUUJAJC-UHFFFAOYSA-N fluorosilicon Chemical compound [Si]F ZHPNWZCWUUJAJC-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
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- 239000006227 byproduct Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
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- 238000005292 vacuum distillation Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910018557 Si O Inorganic materials 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
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- 238000005461 lubrication Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical class C* 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- BCQZXOMGPXTTIC-UHFFFAOYSA-N halothane Chemical compound FC(F)(F)C(Cl)Br BCQZXOMGPXTTIC-UHFFFAOYSA-N 0.000 description 1
- 229960003132 halothane Drugs 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 125000000962 organic group Chemical group 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 description 1
- JGHTXIKECBJCFI-UHFFFAOYSA-N trifluoro(propyl)silane Chemical compound CCC[Si](F)(F)F JGHTXIKECBJCFI-UHFFFAOYSA-N 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
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- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
- C10M107/50—Lubricating compositions characterised by the base-material being a macromolecular compound containing silicon
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- C10M155/00—Lubricating compositions characterised by the additive being a macromolecular compound containing atoms of elements not provided for in groups C10M143/00 - C10M153/00
- C10M155/02—Monomer containing silicon
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- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/05—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon
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- C10M2229/04—Siloxanes with specific structure
- C10M2229/05—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon
- C10M2229/051—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon containing halogen
- C10M2229/0515—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon containing halogen used as base material
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- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
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Abstract
本发明涉及一种全氟醚基聚硅氧烷及其制备方法和应用。该全氟醚基聚硅氧烷具有如式(I)所示结构特征。该全氟醚基聚硅氧烷能够同时具有优异的耐低温特性、粘温特性、稳定性、耐腐蚀性和抗磨损能力性能,且蒸发损失少,能够适用于航空航天、特殊工业等环境恶劣的领域的应用。
Description
技术领域
本发明涉及高分子材料领域,特别是涉及一种全氟醚基聚硅氧烷及其制备方法和应用。
背景技术
硅油具有良好的耐热、耐低温和耐氧化的性能,抗剪力很强,粘度随温度的变化很小,具备了润滑油所要求的基本特性。但是硅油的润滑性能,随着硅原子上所连接的有机基团的不同而有很大差别,如在硅原子上连接甲基的甲基硅油润滑性较差,而向硅油分子中引入氟原子,不但可以增大润滑性而且可以提高它的耐热性。
硅油分子中引入氟原子后得到的含氟聚硅氧烷(氟硅油),其主链结构为柔顺的有机硅链、侧链为性质稳定且表面张力极低的有机氟链,克服了有机氟材料的耐低温性差和有机硅材料的耐化学腐蚀性差等缺点,具有耐高低温、耐化学腐蚀、耐油耐溶剂、低表面张力和低介电常数等优异性能。从化学结构上来看,由于氟原子的范德华半径比氢原子的范德华半径略为大一些,但比其他原子的半径小,可以把Si-O主链骨架严密包围,起到“屏蔽效应”。而且由于氟原子的特大电负性造成C-F的强极性,使共用电子对强烈地偏向氟原子,使氟原子带有多余的负电荷,形成“负电保护效应”,从而使带负电的亲核试剂难以靠近碳原子。这两种效应保证了氟硅油具有良好的化学稳定性和热稳定性。
氟硅油中开发和应用最早的是三氟丙基硅油,由于氟原子对硅原子有较强的亲和力,使得氟原子倾向于和硅原子配价,结果扭变了侧链3,3,3-三氟丙基的空间排布,使氟烷基不能定向密集排列,将Si-O主链骨架暴露出来,从而表面能升高,“屏蔽效应”和“负电保护效应”也不明显。而长链氟烃基侧链可定向密集排列屏蔽Si-O主链骨架,表面能显著降低,由于“屏蔽效应”和“负电保护效应”,稳定性也显著提升。
但是在航空、航天领域,要求润滑剂具有很好的耐低温特性,在一些工程和工业应用中,常要求润滑剂能在恶劣环境下长期使用,如电子工业方面诸如等离子蚀刻、化学蒸气沉积和离子注入等各种半导体集成生产工艺中机械真空泵的润滑;在电气工业中耐电弧的开关、滑线接触部件的润滑;在有化学腐蚀性气体的工作环境中,各种真空泵、压缩机和阀门的润滑等。这就对氟硅油的耐低温特性、粘温特性、稳定性(氧化稳定性、化学稳定性等)、耐腐蚀性、抗磨损能力等特性提出了更高的要求,而现有的长链氟烃基硅油是难以满足的。
发明内容
基于此,有必要针提供一种耐低温特性、粘温特性、稳定性、耐腐蚀性、抗磨损能力性能优异,能够适用于航空航天、特殊工业等恶劣环境的全氟醚基聚硅氧烷。
一种具有如式(I)所示结构特征的全氟醚基聚硅氧烷:
其中,p=0~180;q=3~60;R1为甲基或-(CH2)nRf;n=1~3;
m=1~5的整数。
在其中一个实施例中,式(I)中,p=6~90;q=3~30。
本发明还提所述的全氟醚基聚硅氧烷的制备方法,包括如下步骤:
(1)环化反应
采用催化剂催化二硅氧烷二醇与全氟醚基二氯硅烷的环化反应,制得全氟醚基环三硅氧烷;
其中,所述二硅氧烷二醇具有式(II)结构特征,所述全氟醚基二氯硅烷具有式(III)结构特征;
(2)开环聚合反应
在惰性气体保护下,将甲基环硅氧烷与封端剂和催化剂进行混合,升温至90~140℃后,滴加步骤(1)制得的全氟醚基环三硅氧烷,1~4h滴完;然后继续反应1~3h,经后处理纯化后,即得所述全氟醚基聚硅氧烷;
其中,所述全氟醚基环三硅氧烷、甲基环硅氧烷、封端剂的摩尔比为1:0~3:0.01~1,优选为1:1~3:0.01~1。
在其中一个实施例中,步骤(2)中,所述甲基环硅氧烷为六甲基环三硅氧烷、八甲基环四硅氧烷、十甲基环五硅氧烷、二甲基硅氧烷混合环体(DMC)中的一种或多种。
在其中一个实施例中,步骤(2)中,所述封端剂为六甲基二硅氧烷、八甲基三硅氧烷、十甲基四硅氧烷、十二甲基五硅氧烷、三甲基甲氧基硅烷、三甲基乙氧基硅烷中的至少一种,优选为十甲基四硅氧烷和/或十二甲基五硅氧烷。
在其中一个实施例中,步骤(2)中,所述催化剂为氢氧化钠、氢氧化钾或四甲基氢氧化铵。
在其中一个实施例中,步骤(2)中,当所述催化剂为氢氧化钠或氢氧化钾时,所述后处理纯化的方法为:用酸(如盐酸、硫酸、磷酸、乙酸或丙酸)或二氧化碳进行中和,所述酸或二氧化碳与氢氧化钠或氢氧化钾的摩尔比为0.4~1.3:1;然后真空脱除残留原料和低沸物;
当所述催化剂为四甲基氢氧化铵时,所述后处理纯化的方法为:通过加热分解催化剂,然后真空脱除残留的原料和低沸物。
在其中一个实施例中,所述加热分解催化剂的温度为130~160℃,分解时间0.5~1小时。
在其中一个实施例中,所述真空脱除的条件为:真空度为-0.085~-0.099Mpa,温度为160~210℃,脱除时间1~4h。
在其中一个实施例中,步骤(2)中,所述催化剂的加入量为所述全氟醚基环三硅氧烷的0.2~1.5mol%。
在其中一个实施例中,步骤(1)中,所述催化剂为三乙胺、吡啶、二甲基苯胺或乙胺,所述催化剂与所述全氟醚基二氯硅烷的摩尔比为2~3:1。
在其中一个实施例中,步骤(1)中,所述全氟醚基二氯硅烷与二硅氧烷二醇的摩尔比为1:1~1.1。
在其中一个实施例中,步骤(1)所述环化反应的步骤如下:
反应容器中加入溶剂(优选为六氟化间二甲苯)和催化剂,搅拌混合均匀后,加热至反应温度,同时滴加所述全氟醚基二氯硅烷的六氟化间二甲苯溶液,以及所述二硅氧烷二醇的甲乙酮溶液,60~150min滴完;滴完后,将反应混合物搅拌20~40min;所得反应物水洗除掉副产的盐酸盐,分出有机层进行减压蒸馏,得到所述全氟醚基环三硅氧烷。所述反应温度优选为30~80℃。
本发明还提供所述全氟醚基聚硅氧烷在润滑剂中的应用。
所述全氟醚基聚硅氧烷不仅可以单独作为润滑剂使用,还可作为添加剂加入到其他合成油或矿物油中。
与现有技术相比,本发明具有以下有益效果:
本发明所述的全氟醚基聚硅氧烷,相对于长链氟烃基侧链,采用全氟醚基侧链引入C-O键,C-O键易于自由旋转、卷曲和松弛,在此基础上结合特定的分子结构和聚合度,使制得的全氟醚基聚硅氧烷具有高度柔软性,破坏了低温下的结晶,因此相对来说具有更好的黏温特性和低的凝点,而粘温特性是影响氟硅油润滑性的重要因素,黏温特性越好,越适合在高低温环境中使用。同时,C-O键能高于C-C键能,进一步提高了氟硅油的分解温度;此外,全氟醚基侧链的引入还提高了产品沸点,因而蒸发损失少,扩大了氟硅油的使用范围。由此,本发明所述的全氟醚基聚硅氧烷能够同时具有优异的耐低温特性、粘温特性、稳定性、耐腐蚀性和抗磨损能力性能,且蒸发损失少,能够适用于航空航天、特殊工业等环境恶劣的领域的应用。
本发明所述的全氟醚基聚硅氧烷的制备方法,操作简便,反应条件温和,易于控制产物的分子结构。
具体实施方式
以下结合具体实施例对本发明的全氟醚基聚硅氧烷及其制备方法作进一步详细的说明。
本发明实施例所述二硅氧烷二醇具有式(II)结构特征,购自湖北巨胜科技有限公司;所述全氟醚基二氯硅烷具有式(III)结构特征,购自信越化学工业株式会社。
制得的全氟醚基环三硅氧烷具有如式(IV)所示结构特征。
实施例1
在四口烧瓶中加入六氟化间二甲苯500mL,三乙胺0.25mol,搅拌混合均匀后,加热至60℃,同时滴加全氟醚基二氯硅烷0.1mol与六氟化间二甲苯150mL的混合溶液,以及二硅氧烷二醇0.105mol与甲乙酮150mL的混合溶液,80min滴完,滴完后,将反应混合物搅拌30min;将反应物水洗涤除掉副产的盐酸盐,分出有机层进行减压蒸馏,得到全氟醚基环三硅氧烷。
在惰性气体保护下,将0.3mol八甲基环四硅氧烷、0.1mol十甲基四硅氧烷、0.0003mol氢氧化钾混合,升温至140℃,滴加0.1mol全氟醚基环三硅氧烷,2h滴完,继续反应1h,反应后用0.00012mol磷酸中和,然后在-0.095Mpa,190℃下真空脱除3h,得到全氟醚基聚硅氧烷。
结构式:p=6~90,q=3~30,
实施例2
在四口烧瓶中加入六氟化间二甲苯500mL,二甲基苯胺0.22mol,搅拌混合均匀后,加热至80℃,同时滴加全氟醚基二氯硅烷0.1mol与六氟化间二甲苯150mL的混合溶液,以及二硅氧烷二醇0.105mol与甲乙酮150mL的混合溶液,60min滴完,滴完后,将反应混合物搅拌30min;将反应物水洗涤除掉副产的盐酸盐,分出有机层进行减压蒸馏,得到全氟醚基环三硅氧烷。
在惰性气体保护下,将0.2mol DMC、0.05mol十二甲基五硅氧烷、0.0015mol氢氧化钾混合,升温至120℃,滴加0.2mol全氟醚基环三硅氧烷,4h滴完,继续反应3h,反应后用0.0015mol盐酸中和,然后在-0.099Mpa,200℃下真空脱除1h,得到全氟醚基聚硅氧烷。
结构式:p=6~90,q=3~30,
实施例3
在四口烧瓶中加入六氟化间二甲苯500mL,吡啶0.3mol,搅拌混合均匀后,加热至30℃,同时滴加全氟醚基二氯硅烷0.1mol与六氟化间二甲苯150mL的混合溶液,以及二硅氧烷二醇0.1mol与甲乙酮150mL的混合溶液,150min滴完,滴完后,将反应混合物搅拌30min;将反应物水洗涤除掉副产的盐酸盐,分出有机层进行减压蒸馏,得到全氟醚基环三硅氧烷。
在惰性气体保护下,将0.2mol八甲基环四硅氧烷、0.001mol十甲基四硅氧烷、0.00025mol四甲基氢氧化铵混合,升温至90℃,滴加0.1mol全氟醚基环三硅氧烷,3h滴完,继续反应2h,反应后加热到160℃保温0.5h,分解催化剂,然后在-0.085Mpa,210℃下真空脱除3h,得到全氟醚基聚硅氧烷。
结构式:p=6~90,q=3~30,
实施例4
在四口烧瓶中加入六氟化间二甲苯500mL,三乙胺0.20mol,搅拌混合均匀后,加热至80℃,同时滴加全氟醚基二氯硅烷0.1mol与六氟化间二甲苯150ml的混合溶液,以及二硅氧烷二醇0.11mol与甲乙酮150mL的混合溶液,60min滴完,滴完后,将反应混合物搅拌30min;将反应物水洗涤除掉副产的盐酸盐,分出有机层进行减压蒸馏,得到全氟醚基环三硅氧烷。
在惰性气体保护下,将0.2mol DMC、0.003mol十二甲基五硅氧烷、0.0005mol四甲基氢氧化铵混合,升温至110℃,滴加0.15mol全氟醚基环三硅氧烷,3h滴完,继续反应1h,反应后加热到140℃保温1h,分解催化剂,然后在-0.090Mpa,180℃下真空脱除4h,得到全氟醚基聚硅氧烷。
结构式:p=6~90,q=3~30,
对实施例1-4制得的全氟醚基聚硅氧烷以及现有的长链氟烃基硅油进行性能测试,结果如表1所示:
长链氟烃基硅油结构式:p=10~60,q=10~30。
表1
由表1可知,相对于长链氟烃基硅油,本发明制备的全氟醚基聚硅氧烷凝点更低,耐低温性能更佳,同时耐热性更好,高温蒸发损失更小,抗磨性能更好,更适合在恶劣条件下长期使用。
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。
Claims (10)
1.一种具有如式(I)所示结构特征的全氟醚基聚硅氧烷:
其中,p=0~180;q=3~60;R1为甲基或-(CH2)nRf;n=1~3;
m=1~5的整数。
2.根据权利要求1所述的全氟醚基聚硅氧烷,其特征在于,式(I)中,p=6~90;q=3~30。
3.权利要求1或2所述的全氟醚基聚硅氧烷的制备方法,其特征在于,包括如下步骤:
(1)环化反应
采用催化剂催化二硅氧烷二醇与全氟醚基二氯硅烷进行环化反应,制得全氟醚基环三硅氧烷;
其中,所述二硅氧烷二醇具有式(II)结构特征,所述全氟醚基二氯硅烷具有式(III)结构特征;
(2)开环聚合反应
在惰性气体保护下,将甲基环硅氧烷与封端剂和催化剂进行混合,升温至90~140℃后,滴加步骤(1)制得的全氟醚基环三硅氧烷,1~4h滴完;然后继续反应1~3h,经后处理纯化后,即得所述全氟醚基聚硅氧烷;
其中,所述全氟醚基环三硅氧烷、甲基环硅氧烷、封端剂的摩尔比为1:0~3:0.01~1。
4.根据权利要求3所述的全氟醚基聚硅氧烷的制备方法,其特征在于,步骤(2)中,所述甲基环硅氧烷为六甲基环三硅氧烷、八甲基环四硅氧烷、十甲基环五硅氧烷、二甲基硅氧烷混合环体中的一种或多种。
5.根据权利要求3所述的全氟醚基聚硅氧烷的制备方法,其特征在于,步骤(2)中,所述封端剂为六甲基二硅氧烷、八甲基三硅氧烷、十甲基四硅氧烷、十二甲基五硅氧烷、三甲基甲氧基硅烷、三甲基乙氧基硅烷中的至少一种;所述催化剂为氢氧化钠、氢氧化钾或四甲基氢氧化铵。
6.根据权利要求5所述的全氟醚基聚硅氧烷的制备方法,其特征在于,步骤(2)中,当所述催化剂为氢氧化钠或氢氧化钾时,所述后处理纯化的方法为:用酸或二氧化碳进行中和,所述酸或二氧化碳与所述催化剂的摩尔比为0.4~1.3:1;然后真空脱除残留原料和低沸物;
当所述催化剂为四甲基氢氧化铵时,所述后处理纯化的方法为:通过加热分解所述催化剂,然后真空脱除残留的原料和低沸物。
7.根据权利要求6所述的全氟醚基聚硅氧烷的制备方法,其特征在于,所述加热分解的温度为130~160℃,分解时间0.5~1小时。
8.根据权利要求6所述的全氟醚基聚硅氧烷的制备方法,其特征在于,所述真空脱除的条件为:真空度为-0.085~-0.099Mpa,温度为160~210℃,脱除时间1~4h。
9.根据权利要求5所述的全氟醚基聚硅氧烷的制备方法,其特征在于,步骤(2)中,所述催化剂的加入量为所述全氟醚基环三硅氧烷的0.2~1.5mol%。
10.权利要求1或2所述的全氟醚基聚硅氧烷在润滑剂中的应用。
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CN110301005A (zh) * | 2017-03-02 | 2019-10-01 | 昭和电工株式会社 | 磁记录介质用润滑剂及磁记录介质的制造方法 |
CN110301005B (zh) * | 2017-03-02 | 2021-01-26 | 昭和电工株式会社 | 磁记录介质用润滑剂及磁记录介质的制造方法 |
US11514945B2 (en) | 2017-03-02 | 2022-11-29 | Showa Denko K.K. | Lubricant for magnetic recording medium, and method for producing magnetic recording medium |
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