CN1068348C - 用于半固化片和复合材料的环氧树脂混合物 - Google Patents

用于半固化片和复合材料的环氧树脂混合物 Download PDF

Info

Publication number
CN1068348C
CN1068348C CN95194926A CN95194926A CN1068348C CN 1068348 C CN1068348 C CN 1068348C CN 95194926 A CN95194926 A CN 95194926A CN 95194926 A CN95194926 A CN 95194926A CN 1068348 C CN1068348 C CN 1068348C
Authority
CN
China
Prior art keywords
epoxy resin
resin mixture
epoxy
aminobenzenesulfonamide
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95194926A
Other languages
English (en)
Chinese (zh)
Other versions
CN1157628A (zh
Inventor
沃尔夫冈·冯根茨科
于尔根·休伯
海因里希·卡皮扎
沃尔夫冈·罗勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of CN1157628A publication Critical patent/CN1157628A/zh
Application granted granted Critical
Publication of CN1068348C publication Critical patent/CN1068348C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/444—Sulfonamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W70/695—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN95194926A 1994-09-09 1995-08-25 用于半固化片和复合材料的环氧树脂混合物 Expired - Fee Related CN1068348C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4432190.2 1994-09-09
DE4432190 1994-09-09

Publications (2)

Publication Number Publication Date
CN1157628A CN1157628A (zh) 1997-08-20
CN1068348C true CN1068348C (zh) 2001-07-11

Family

ID=6527845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95194926A Expired - Fee Related CN1068348C (zh) 1994-09-09 1995-08-25 用于半固化片和复合材料的环氧树脂混合物

Country Status (9)

Country Link
US (1) US5759690A (enExample)
EP (1) EP0779906B1 (enExample)
JP (1) JPH10505121A (enExample)
CN (1) CN1068348C (enExample)
AT (1) ATE168120T1 (enExample)
CZ (1) CZ70597A3 (enExample)
DE (1) DE59502777D1 (enExample)
TW (1) TW297034B (enExample)
WO (1) WO1996007686A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2266903A1 (en) 1996-09-26 1998-04-02 Wolfgang Von Gentzkow Epoxy resin mixtures
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
AU2089701A (en) 1999-12-13 2001-06-18 Dow Chemical Company, The Phosphorus element-containing crosslinking agents and flame retardant phosphoruselement-containing epoxy resin compositions prepared therewith
EP1268665B1 (en) 1999-12-13 2005-11-02 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
DE10043205A1 (de) * 2000-09-01 2002-03-28 Siemens Ag Epoxidharzmischung
ES2247006T3 (es) * 2000-12-18 2006-03-01 Mitsubishi Rayon Co., Ltd. Composicion de resina epoxi ignifuga y preimpregnados y materiales comuestos reforzados con fibras producidas utilizando la composicion.
ES2178588B1 (es) * 2000-12-29 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Caja de interconexion, control y gestion para automovil, con impacto medioambiental reducido.
KR20050010847A (ko) * 2002-05-30 2005-01-28 다우 글로벌 테크놀로지스 인크. 할로겐 비함유 내점화성 열가소성 수지 조성물
FR2848016B1 (fr) * 2002-11-29 2005-01-28 Nexans Cable ignifuge
US20050075024A1 (en) * 2003-10-01 2005-04-07 Ranken Paul F. Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
BRPI0510861A (pt) 2004-05-28 2007-12-26 Dow Global Technologies Inc processo para preparar um composto contendo fósforo, processo para preparar uma composição contendo fósforo, processo para preparar um composto de resina epóxi contendo fósforo, processo para preparar uma composição de resina epóxi contendo fósforo , processo para preparar um composto contendo um anel de benzoxazina e fósforo, processo para preparar uma composição de resina contendo anel de benzoxazina e fósforo, processo para preparar um composto contendo grupo termolábil e fósforo, processo para preparar uma composição de resina termolábil contendo fósforo, composto contendo fósforo, composição contendo fósforo, composição de resina epóxi contendo fósforo, composição contendo fósforo, composto de resina epóxi contendo fósforo, composto contendo anel de benzoxazina e fósforo, composição de resina contendo anel de benzoxazina e fósforo, composto contendo grupo termolábil e fósforo, composição de resina termolábil contendo fósforo, produto obtenìvel, composição de resina epóxi resistente à chama, composto de epóxi, composição de resina epóxi resistente a chama, composição de cura resistente à ignição, pré-impregnado, laminado, placa de circuito, poliol, resina de poliuretano resistente à chama, composição termoplástica resistente à ignição, composição hìbrida termoplástica / termofixa resistente à ignição e composição de revestimento
US20100294429A1 (en) * 2007-09-28 2010-11-25 Dow Global Technologies Inc. Epoxy resin formulations
US20110065838A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
US20110065870A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
CN103382242B (zh) 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
CN107266639B (zh) 2014-08-15 2019-08-27 江苏雅克科技股份有限公司 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物
CN107033343B (zh) 2014-11-06 2019-01-08 江苏雅克科技股份有限公司 含磷官能化聚(亚芳基醚)及包含含磷官能化聚(亚芳基醚)的可固化组合物
CN105566621B (zh) 2014-11-11 2018-09-21 江苏雅克科技股份有限公司 低介电含磷聚酯化合物组成及其制法
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
CN107428915B (zh) 2015-04-17 2021-02-09 澳泽化学特罗斯特贝格有限公司 用于固化环氧树脂的具有阻燃效果的固化剂和固化促进剂(ii)
WO2018164833A1 (en) 2017-03-07 2018-09-13 Icl-Ip America Inc. Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards
JP7582859B2 (ja) * 2020-12-21 2024-11-13 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2712001A (en) * 1952-03-17 1955-06-28 Devoe & Raynolds Co Sulfonamide-epoxide compositions
US2766139A (en) * 1955-04-13 1956-10-09 Masonite Corp Method of producing fire resistant lignocellulose hardboard products
US3398019A (en) * 1963-02-21 1968-08-20 Monsanto Co Method for fireproofing cellulosic material
US3373135A (en) * 1964-12-01 1968-03-12 Kalk Chemische Fabrik Gmbh Shaped articles of self-extinguishing epoxy resins
GB1112139A (en) * 1967-01-13 1968-05-01 Shell Int Research Curable polyepoxide compositions for making flame retardant articles
US4111909A (en) * 1977-04-11 1978-09-05 Celanese Polymer Specialties Company Controlled reactivity epoxy resin compositions
DE2933343A1 (de) * 1979-08-17 1981-03-26 Bayer Ag, 51373 Leverkusen Faerben von wolle/cellulosefasermischungen
US4528359A (en) * 1984-05-16 1985-07-09 The Dow Chemical Company Adducts of epoxy resins and amino-substituted aromatic sulfonic acid amides
NZ212747A (en) * 1984-07-17 1989-01-27 Dow Chemical Co Partially advanced epoxy resin compositions
US4618526A (en) * 1985-07-22 1986-10-21 The Dow Chemical Company Curable compositions containing multiglycidyl ethers and a sulfonic acid amide
US4799983A (en) * 1987-07-20 1989-01-24 International Business Machines Corporation Multilayer ceramic substrate and process for forming therefor
JPH01123892A (ja) * 1987-11-09 1989-05-16 Dai Ichi Kogyo Seiyaku Co Ltd 新規な反応性難燃剤
DE3836409A1 (de) * 1988-10-26 1990-05-03 Ferrozell Sachs & Co Gmbh Prepregs fuer selbstverloeschende verbundwerkstoffe und verfahren zu deren herstellung
ATE107677T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharzmischungen.
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
DE4308185A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie deren Verwendung
DE4308184A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
DE4336235A1 (de) * 1993-10-23 1995-04-27 Bosch Gmbh Robert Verfahren zur Herstellung von Keramik-Multilayern

Also Published As

Publication number Publication date
WO1996007686A1 (de) 1996-03-14
DE59502777D1 (de) 1998-08-13
JPH10505121A (ja) 1998-05-19
ATE168120T1 (de) 1998-07-15
EP0779906B1 (de) 1998-07-08
CZ70597A3 (en) 1997-06-11
EP0779906A1 (de) 1997-06-25
TW297034B (enExample) 1997-02-01
US5759690A (en) 1998-06-02
CN1157628A (zh) 1997-08-20

Similar Documents

Publication Publication Date Title
CN1068349C (zh) 用于半固化片和复合材料的环氧树脂混合物
CN1068348C (zh) 用于半固化片和复合材料的环氧树脂混合物
CN1046949C (zh) 环氧树脂混合物
CN1046950C (zh) 环氧树脂混合物
FI96034B (fi) Epoksidihartsiseoksia
JP3412585B2 (ja) プリント配線板及び多層プリント配線板の製造に用いられるプリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
CN1068350C (zh) 用于半固化片和复合材料的环氧树脂混合物
KR100705269B1 (ko) 비할로겐 난연성 에폭시 수지 조성물, 이를 이용한프리프레그 및 동박 적층판
JP3906961B2 (ja) 燐および窒素を含む樹脂硬化剤とその硬化剤を含む難燃性樹脂組成物
US6500546B1 (en) Halogen-free phosphorous-containing flame-resistant epoxy resin compositions
JP2000351828A (ja) 難燃性のリン変性エポキシ樹脂
WO2003042291A1 (en) Halogen-free phosphorous- and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof
JP3659908B2 (ja) リン含有樹脂を含有する難燃性樹脂組成物
CN102838842A (zh) 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
JP4200251B2 (ja) エポキシ樹脂組成物、フィルム、プリプレグ、積層板
JP2000053845A (ja) ガラスエポキシ銅張積層板用樹脂組成物
WO2001059002A1 (en) Halogen-free phosphorous-containing flame-resistant epoxy resin compositions
JPWO2002006399A1 (ja) ハロゲンフリーの難燃性エポキシ樹脂組成物、ハロゲンフリーのビルドアップ多層板用難燃性エポキシ樹脂組成物、プリプレグ、銅張積層板、プリント配線板、銅箔付き樹脂フィルム、キャリア付き樹脂フィルム、ビルドアップ型積層板およびビルドアップ型多層板
HK1044163A1 (zh) 含磷和氮的樹脂固化劑及含該固化劑的難燃性樹脂組合物
HK1040410A1 (en) Epoxy resin compositions containing phosphorus and the uses thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee