CN1068348C - 用于半固化片和复合材料的环氧树脂混合物 - Google Patents

用于半固化片和复合材料的环氧树脂混合物 Download PDF

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Publication number
CN1068348C
CN1068348C CN95194926A CN95194926A CN1068348C CN 1068348 C CN1068348 C CN 1068348C CN 95194926 A CN95194926 A CN 95194926A CN 95194926 A CN95194926 A CN 95194926A CN 1068348 C CN1068348 C CN 1068348C
Authority
CN
China
Prior art keywords
epoxy resin
resin mixture
epoxy
aminobenzenesulfonamide
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95194926A
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English (en)
Chinese (zh)
Other versions
CN1157628A (zh
Inventor
沃尔夫冈·冯根茨科
于尔根·休伯
海因里希·卡皮扎
沃尔夫冈·罗勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of CN1157628A publication Critical patent/CN1157628A/zh
Application granted granted Critical
Publication of CN1068348C publication Critical patent/CN1068348C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/444—Sulfonamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN95194926A 1994-09-09 1995-08-25 用于半固化片和复合材料的环氧树脂混合物 Expired - Fee Related CN1068348C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4432190 1994-09-09
DEP4432190.2 1994-09-09

Publications (2)

Publication Number Publication Date
CN1157628A CN1157628A (zh) 1997-08-20
CN1068348C true CN1068348C (zh) 2001-07-11

Family

ID=6527845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95194926A Expired - Fee Related CN1068348C (zh) 1994-09-09 1995-08-25 用于半固化片和复合材料的环氧树脂混合物

Country Status (9)

Country Link
US (1) US5759690A (enExample)
EP (1) EP0779906B1 (enExample)
JP (1) JPH10505121A (enExample)
CN (1) CN1068348C (enExample)
AT (1) ATE168120T1 (enExample)
CZ (1) CZ70597A3 (enExample)
DE (1) DE59502777D1 (enExample)
TW (1) TW297034B (enExample)
WO (1) WO1996007686A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE271574T1 (de) 1996-09-26 2004-08-15 Siemens Ag Epoxidharzmischungen
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
EP1268665B1 (en) 1999-12-13 2005-11-02 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
WO2001042253A2 (en) * 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
DE10043205A1 (de) * 2000-09-01 2002-03-28 Siemens Ag Epoxidharzmischung
ES2247006T3 (es) * 2000-12-18 2006-03-01 Mitsubishi Rayon Co., Ltd. Composicion de resina epoxi ignifuga y preimpregnados y materiales comuestos reforzados con fibras producidas utilizando la composicion.
ES2178588B1 (es) * 2000-12-29 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Caja de interconexion, control y gestion para automovil, con impacto medioambiental reducido.
US20050239975A1 (en) * 2002-05-30 2005-10-27 Joseph Gan Halogen free ignition resistant thermoplastic resin compositions
FR2848016B1 (fr) * 2002-11-29 2005-01-28 Nexans Cable ignifuge
US20050075024A1 (en) * 2003-10-01 2005-04-07 Ranken Paul F. Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
CN103554184A (zh) * 2004-05-28 2014-02-05 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
WO2009045817A1 (en) * 2007-09-28 2009-04-09 Dow Global Technologies Inc. Epoxy resin formulations
US20110065870A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
US20110065838A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
CN103382242B (zh) 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
CN107266639B (zh) 2014-08-15 2019-08-27 江苏雅克科技股份有限公司 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物
CN105623238B (zh) 2014-11-06 2018-07-27 江苏雅克科技股份有限公司 含磷官能化聚(亚芳基醚)及以其为原料制备组合物
CN105566621B (zh) 2014-11-11 2018-09-21 江苏雅克科技股份有限公司 低介电含磷聚酯化合物组成及其制法
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
DE102016004590A1 (de) 2015-04-17 2016-11-03 Alzchem Ag Härter und Härtungsbeschleuniger mit Flammschutzwirkung zur Härtung von Epoxidharzen (II)
WO2018164833A1 (en) 2017-03-07 2018-09-13 Icl-Ip America Inc. Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards
JP7582859B2 (ja) * 2020-12-21 2024-11-13 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2712001A (en) * 1952-03-17 1955-06-28 Devoe & Raynolds Co Sulfonamide-epoxide compositions
US2766139A (en) * 1955-04-13 1956-10-09 Masonite Corp Method of producing fire resistant lignocellulose hardboard products
US3398019A (en) * 1963-02-21 1968-08-20 Monsanto Co Method for fireproofing cellulosic material
US3373135A (en) * 1964-12-01 1968-03-12 Kalk Chemische Fabrik Gmbh Shaped articles of self-extinguishing epoxy resins
GB1112139A (en) * 1967-01-13 1968-05-01 Shell Int Research Curable polyepoxide compositions for making flame retardant articles
US4111909A (en) * 1977-04-11 1978-09-05 Celanese Polymer Specialties Company Controlled reactivity epoxy resin compositions
DE2933343A1 (de) * 1979-08-17 1981-03-26 Bayer Ag, 51373 Leverkusen Faerben von wolle/cellulosefasermischungen
US4528359A (en) * 1984-05-16 1985-07-09 The Dow Chemical Company Adducts of epoxy resins and amino-substituted aromatic sulfonic acid amides
NZ212747A (en) * 1984-07-17 1989-01-27 Dow Chemical Co Partially advanced epoxy resin compositions
US4618526A (en) * 1985-07-22 1986-10-21 The Dow Chemical Company Curable compositions containing multiglycidyl ethers and a sulfonic acid amide
US4799983A (en) * 1987-07-20 1989-01-24 International Business Machines Corporation Multilayer ceramic substrate and process for forming therefor
JPH01123892A (ja) * 1987-11-09 1989-05-16 Dai Ichi Kogyo Seiyaku Co Ltd 新規な反応性難燃剤
DE3836409A1 (de) * 1988-10-26 1990-05-03 Ferrozell Sachs & Co Gmbh Prepregs fuer selbstverloeschende verbundwerkstoffe und verfahren zu deren herstellung
DE58907953D1 (de) * 1989-03-03 1994-07-28 Siemens Ag Epoxidharzmischungen.
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DE4308185A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie deren Verwendung
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DE4336235A1 (de) * 1993-10-23 1995-04-27 Bosch Gmbh Robert Verfahren zur Herstellung von Keramik-Multilayern

Also Published As

Publication number Publication date
CZ70597A3 (en) 1997-06-11
DE59502777D1 (de) 1998-08-13
EP0779906B1 (de) 1998-07-08
CN1157628A (zh) 1997-08-20
JPH10505121A (ja) 1998-05-19
WO1996007686A1 (de) 1996-03-14
TW297034B (enExample) 1997-02-01
ATE168120T1 (de) 1998-07-15
US5759690A (en) 1998-06-02
EP0779906A1 (de) 1997-06-25

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