CN106825999A - 一种泡沫金属复合焊料片的制备方法 - Google Patents
一种泡沫金属复合焊料片的制备方法 Download PDFInfo
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- CN106825999A CN106825999A CN201710149734.XA CN201710149734A CN106825999A CN 106825999 A CN106825999 A CN 106825999A CN 201710149734 A CN201710149734 A CN 201710149734A CN 106825999 A CN106825999 A CN 106825999A
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- metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201710149734.XA CN106825999B (zh) | 2017-03-14 | 2017-03-14 | 一种泡沫金属复合焊料片的制备方法 |
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CN201710149734.XA CN106825999B (zh) | 2017-03-14 | 2017-03-14 | 一种泡沫金属复合焊料片的制备方法 |
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CN106825999A true CN106825999A (zh) | 2017-06-13 |
CN106825999B CN106825999B (zh) | 2019-04-30 |
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Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107400903A (zh) * | 2017-06-20 | 2017-11-28 | 广东工业大学 | 一种三维纳米多孔铜修饰的泡沫镍及其制备方法和应用 |
CN107486651A (zh) * | 2017-08-02 | 2017-12-19 | 中国电器科学研究院有限公司 | 一种低温焊料片的制备方法 |
CN108453414A (zh) * | 2018-03-28 | 2018-08-28 | 武汉理工大学 | 一种Sn基复合焊料片的制备方法 |
CN108511407A (zh) * | 2018-03-26 | 2018-09-07 | 清华大学深圳研究生院 | 一种热界面材料及其制备方法、应用方法 |
CN108677121A (zh) * | 2018-06-11 | 2018-10-19 | 江西理工大学 | 一种泡沫镍/Pb复合电极的制备方法 |
CN109848611A (zh) * | 2019-02-01 | 2019-06-07 | 武汉理工大学 | 一种基于多孔Ni/Cu合金的Sn基复合焊料片的制备方法 |
CN110315161A (zh) * | 2019-07-10 | 2019-10-11 | 哈尔滨理工大学 | 一种高温封装用Cu3Sn/泡沫铜复合接头的制备方法 |
CN111151915A (zh) * | 2020-03-23 | 2020-05-15 | 东北石油大学 | 一种用于SiC陶瓷低应力钎焊的复合钎料及其制备方法 |
CN111151912A (zh) * | 2020-03-23 | 2020-05-15 | 东北石油大学 | 一种用于SiC陶瓷钎焊的Sn基钎料及其制备方法 |
CN111702368A (zh) * | 2020-06-23 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种金属气凝胶基预成型焊片的制备方法及封装方法 |
CN112122804A (zh) * | 2020-09-23 | 2020-12-25 | 厦门大学 | 一种功率芯片封装用耐高温接头的低温快速无压制造方法 |
CN112605486A (zh) * | 2020-12-16 | 2021-04-06 | 宁波施捷电子有限公司 | 一种超薄焊接垫片及制备方法、焊接方法与半导体器件 |
CN113182733A (zh) * | 2021-04-28 | 2021-07-30 | 武汉理工大学 | 一种低温活性焊料的制备及钎焊方法 |
CN113560768A (zh) * | 2021-07-29 | 2021-10-29 | 南昌航空大学 | 一种泡沫金属增强无铅焊料及其制备方法 |
CN114043027A (zh) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | 一种熔浸法烧结焊接方法 |
CN114094286A (zh) * | 2021-11-26 | 2022-02-25 | 多氟多新能源科技有限公司 | 一种非焊接导电连接电芯的制备方法及其电芯 |
CN114952082A (zh) * | 2022-05-09 | 2022-08-30 | 广东省科学院中乌焊接研究所 | 用于高精度坡度工件的复合焊料、其制备方法及应用 |
CN115106678A (zh) * | 2022-07-13 | 2022-09-27 | 哈尔滨工业大学(深圳) | 一种高温复合钎料及其制备方法和应用 |
CN115319327A (zh) * | 2022-08-19 | 2022-11-11 | 武汉理工大学 | 一种低温活性焊料制备方法 |
CN115433552A (zh) * | 2022-09-23 | 2022-12-06 | 云南科威液态金属谷研发有限公司 | 一种泡沫金属与低熔点合金复合的热界面材料及制备方法 |
US20230031736A1 (en) * | 2019-12-19 | 2023-02-02 | Rogers Germany Gmbh | Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer |
Citations (6)
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JPH0929478A (ja) * | 1995-07-18 | 1997-02-04 | Senju Metal Ind Co Ltd | フォームソルダー及びフォームソルダーへ物質を微量付着させる方法 |
CN101351295A (zh) * | 2005-12-30 | 2009-01-21 | 英特尔公司 | 芯片封装中的焊料泡沫,纳米多孔焊料,发泡焊料凸点,组装该芯片封装的方法,以及包含该芯片封装的系统 |
WO2013045308A1 (de) * | 2011-09-30 | 2013-04-04 | Sgl Carbon Se | Laserstrahllöten von materialien auf siliciumkarbidbasis |
CN103205601A (zh) * | 2013-04-11 | 2013-07-17 | 广东普赛特电子科技股份有限公司 | 一种减震型钎料合金及其制备方法 |
CN106141490A (zh) * | 2016-07-01 | 2016-11-23 | 江苏科技大学 | 一种用于钎焊泡沫铝的钎料及泡沫铝和铝的钎焊方法 |
CN106216873A (zh) * | 2016-08-12 | 2016-12-14 | 哈尔滨工业大学深圳研究生院 | 一种基于金属锡填充泡沫银的高温钎料制备方法 |
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2017
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JPH0929478A (ja) * | 1995-07-18 | 1997-02-04 | Senju Metal Ind Co Ltd | フォームソルダー及びフォームソルダーへ物質を微量付着させる方法 |
CN101351295A (zh) * | 2005-12-30 | 2009-01-21 | 英特尔公司 | 芯片封装中的焊料泡沫,纳米多孔焊料,发泡焊料凸点,组装该芯片封装的方法,以及包含该芯片封装的系统 |
WO2013045308A1 (de) * | 2011-09-30 | 2013-04-04 | Sgl Carbon Se | Laserstrahllöten von materialien auf siliciumkarbidbasis |
CN103205601A (zh) * | 2013-04-11 | 2013-07-17 | 广东普赛特电子科技股份有限公司 | 一种减震型钎料合金及其制备方法 |
CN106141490A (zh) * | 2016-07-01 | 2016-11-23 | 江苏科技大学 | 一种用于钎焊泡沫铝的钎料及泡沫铝和铝的钎焊方法 |
CN106216873A (zh) * | 2016-08-12 | 2016-12-14 | 哈尔滨工业大学深圳研究生院 | 一种基于金属锡填充泡沫银的高温钎料制备方法 |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107400903A (zh) * | 2017-06-20 | 2017-11-28 | 广东工业大学 | 一种三维纳米多孔铜修饰的泡沫镍及其制备方法和应用 |
CN107486651A (zh) * | 2017-08-02 | 2017-12-19 | 中国电器科学研究院有限公司 | 一种低温焊料片的制备方法 |
CN107486651B (zh) * | 2017-08-02 | 2020-10-23 | 中国电器科学研究院股份有限公司 | 一种低温焊料片的制备方法 |
CN108511407B (zh) * | 2018-03-26 | 2020-07-17 | 清华大学深圳研究生院 | 一种热界面材料及其制备方法、应用方法 |
CN108511407A (zh) * | 2018-03-26 | 2018-09-07 | 清华大学深圳研究生院 | 一种热界面材料及其制备方法、应用方法 |
CN108453414A (zh) * | 2018-03-28 | 2018-08-28 | 武汉理工大学 | 一种Sn基复合焊料片的制备方法 |
CN108677121A (zh) * | 2018-06-11 | 2018-10-19 | 江西理工大学 | 一种泡沫镍/Pb复合电极的制备方法 |
CN109848611A (zh) * | 2019-02-01 | 2019-06-07 | 武汉理工大学 | 一种基于多孔Ni/Cu合金的Sn基复合焊料片的制备方法 |
CN110315161A (zh) * | 2019-07-10 | 2019-10-11 | 哈尔滨理工大学 | 一种高温封装用Cu3Sn/泡沫铜复合接头的制备方法 |
CN110315161B (zh) * | 2019-07-10 | 2021-03-26 | 哈尔滨理工大学 | 一种高温封装用Cu3Sn/泡沫铜复合接头的制备方法 |
US20230031736A1 (en) * | 2019-12-19 | 2023-02-02 | Rogers Germany Gmbh | Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer |
CN111151915A (zh) * | 2020-03-23 | 2020-05-15 | 东北石油大学 | 一种用于SiC陶瓷低应力钎焊的复合钎料及其制备方法 |
CN111151912A (zh) * | 2020-03-23 | 2020-05-15 | 东北石油大学 | 一种用于SiC陶瓷钎焊的Sn基钎料及其制备方法 |
CN111151912B (zh) * | 2020-03-23 | 2021-08-24 | 东北石油大学 | 一种用于SiC陶瓷钎焊的Sn基钎料及其制备方法 |
CN111151915B (zh) * | 2020-03-23 | 2021-08-24 | 东北石油大学 | 一种用于SiC陶瓷低应力钎焊的复合钎料及其制备方法 |
CN111702368A (zh) * | 2020-06-23 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种金属气凝胶基预成型焊片的制备方法及封装方法 |
CN111702368B (zh) * | 2020-06-23 | 2022-04-22 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种金属气凝胶基预成型焊片的制备方法及封装方法 |
CN112122804B (zh) * | 2020-09-23 | 2021-06-11 | 厦门大学 | 一种功率芯片封装用耐高温接头的低温快速无压制造方法 |
CN112122804A (zh) * | 2020-09-23 | 2020-12-25 | 厦门大学 | 一种功率芯片封装用耐高温接头的低温快速无压制造方法 |
CN112605486A (zh) * | 2020-12-16 | 2021-04-06 | 宁波施捷电子有限公司 | 一种超薄焊接垫片及制备方法、焊接方法与半导体器件 |
WO2022127748A1 (zh) * | 2020-12-16 | 2022-06-23 | 宁波施捷电子有限公司 | 一种超薄焊接垫片及制备方法、焊接方法与半导体器件 |
CN113182733A (zh) * | 2021-04-28 | 2021-07-30 | 武汉理工大学 | 一种低温活性焊料的制备及钎焊方法 |
CN113560768A (zh) * | 2021-07-29 | 2021-10-29 | 南昌航空大学 | 一种泡沫金属增强无铅焊料及其制备方法 |
CN114043027A (zh) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | 一种熔浸法烧结焊接方法 |
CN114043027B (zh) * | 2021-11-12 | 2024-01-12 | 哈尔滨工业大学 | 一种熔浸法烧结焊接方法 |
CN114094286A (zh) * | 2021-11-26 | 2022-02-25 | 多氟多新能源科技有限公司 | 一种非焊接导电连接电芯的制备方法及其电芯 |
CN114094286B (zh) * | 2021-11-26 | 2024-05-14 | 多氟多新能源科技有限公司 | 一种非焊接导电连接电芯的制备方法及其电芯 |
CN114952082A (zh) * | 2022-05-09 | 2022-08-30 | 广东省科学院中乌焊接研究所 | 用于高精度坡度工件的复合焊料、其制备方法及应用 |
CN114952082B (zh) * | 2022-05-09 | 2023-11-14 | 广东省科学院中乌焊接研究所 | 用于高精度坡度工件的复合焊料、其制备方法及应用 |
CN115106678A (zh) * | 2022-07-13 | 2022-09-27 | 哈尔滨工业大学(深圳) | 一种高温复合钎料及其制备方法和应用 |
CN115319327A (zh) * | 2022-08-19 | 2022-11-11 | 武汉理工大学 | 一种低温活性焊料制备方法 |
CN115319327B (zh) * | 2022-08-19 | 2024-02-27 | 武汉理工大学 | 一种低温活性焊料制备方法 |
CN115433552A (zh) * | 2022-09-23 | 2022-12-06 | 云南科威液态金属谷研发有限公司 | 一种泡沫金属与低熔点合金复合的热界面材料及制备方法 |
CN115433552B (zh) * | 2022-09-23 | 2024-03-29 | 云南科威液态金属谷研发有限公司 | 一种泡沫金属与低熔点合金复合的热界面材料及制备方法 |
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