CN106783649A - 一种集成供电系统封装件的封装方法 - Google Patents
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Abstract
本发明提供一种集成供电系统的封装方法,包括以下步骤:提供一载体;在所述载体上形成再布线层;在所述再布线层上形成柱状金属引线;分别将供电系统裸芯的有源模块和无源模块焊接在所述再布线层上;将所述有源模块和无源模块以及所述柱状金属引线在所述再布线层上封装成型,并研磨掉覆盖所述有源模块、无源模块和柱状金属引线的多余封装成型材料;形成连接所述柱状金属引线的底座焊料凸块,并去除所述载体;将用电系统裸芯焊接在所述再布线层上,然后通过底部填充将所述用电系统裸芯封装固定在所述再布线层上。本发明通过使用三维芯片堆叠技术,将供电系统直接集成在用电系统裸芯下方,提高了电力输送效率,增加了不同电压轨道的可用数量。
Description
技术领域
本发明涉及半导体封装技术领域,特别是涉及一种集成供电系统封装件的封装方法。
背景技术
所有的计算和通信系统都需要供电系统。供电系统会将电源的高电压转换成系统中离散器件所需的许多不同的低电压。供电系统的效率决定了向下转换的电力损失,而供电轨数决定了可支持的离散电压供应或器件的数量。
目前的供电技术面临着如下挑战:
一、随着过程中节点的收缩,设备电压的减小,电力输送的效率会随之降低,使功率消耗更大。
二、添加更多的供电轨道需要复制更多的供电组件,如增加元件数量、增大电路板尺寸、增加电路板的层数、加大系统体积、成本和重量。
三、由于再布线层的线距、线宽的限制,需要增加封装尺寸。
因此,如何提高电力输送效率,增加不同电压轨道的可用数量,已成为本领域技术人员亟待解决的一个重要技术问题。
发明内容
鉴于以上所述现有技术,本发明的目的在于提供一种集成供电系统封装件的封装方法,用于解决现有技术中的种种问题。
为实现上述目的及其他相关目的,本发明提供一种集成供电系统封装件的封装方法,所述封装件包括用电系统裸芯和位于所述用电系统裸芯下方的供电系统裸芯,所述封装方法包括以下步骤:
提供一载体;
在所述载体上形成再布线层;
在所述再布线层上形成柱状金属引线;
分别将供电系统裸芯的有源模块和无源模块焊接在所述再布线层上,所述再布线层实现有源模块和无源模块之间电连接,并提供多条对接所述用电系统裸芯的供电轨道;
将所述有源模块和无源模块以及所述柱状金属引线在所述再布线层上封装成型,并研磨掉覆盖所述有源模块、无源模块和柱状金属引线的多余封装成型材料;
形成连接所述柱状金属引线的底座焊料凸块,并去除所述载体;
通过多个焊接凸块将用电系统裸芯焊接在所述再布线层上,实现用电系统裸芯与多条所述供电轨道的对接,然后通过底部填充将所述用电系统裸芯封装固定在所述再布线层上。
可选地,所述供电系统裸芯为高压供电系统裸芯,将外部电源的高电压转换成所述用电系统裸芯中需要的多个不同的低电压,并提供多条对接所述用电系统裸芯的低压供电轨道。
可选地,所述有源模块包括控制器和降压转换器,所述无源模块包括电容、电感和电阻。
可选地,所述有源模块与所述无源模块横向排列。
可选地,所述再布线层包括:金属连线、通孔以及设于所述金属连线和通孔周围的介电层,所述金属连线通过所述通孔实现与所述有源模块、无源模块和柱状金属引线的电连接以及多层金属连线之间的层间连接。
可选地,所述再布线层上设有凸块下金属层,所述有源模块、无源模块、柱状金属引线以及用电系统裸芯通过所述凸块下金属层与所述再布线层电连接。
可选地,所述柱状金属引线为金属针或金属柱。
可选地,所述柱状金属引线采用键合或电镀的方法在所述再布线层上形成。
可选地,所述封装成型的方法为压缩成型、传递模塑、液封成型、真空层压或旋涂。
可选地,将所述用电系统裸芯焊接在所述再布线层上的多个焊接凸块为微凸块。
如上所述,本发明的集成供电系统封装件的封装方法,具有以下有益效果:
本发明提供了一种将整个供电系统集成到封装中的新方法,通过使用三维芯片堆叠技术,提高了电力输送效率,增加了不同电压轨道的可用数量。
本发明采用现有的有源元件和无源模块形成2.5D中间层,再将用电系统裸芯如ASIC集成到2.5D中间层的顶部得到3D堆栈结构,通过直接在用电系统裸芯下方紧密集成供电系统裸芯,解决了现有供电系统面临的问题。供电系统裸芯能够提供数千条低压供电轨道与用电系统通过微凸块直接对接;由于集成了无源模块,可以消除PCB板的寄生电阻,提高了供电控制的供电效率和响应时间,通过减少压降和噪声提高了保真度,减少了所需的设计余量。
附图说明
图1显示为本发明实施例提供的集成供电系统封装件的封装方法示意图。
图2a-2f显示为本发明实施例提供的集成供电系统封装件的封装方法的工艺流程示意图。
元件标号说明
101 载体
1011 黏附层
200 再布线层
201 金属连线
202 介电层
301 柱状金属引线
401 有源模块
402 无源模块
4021 电感模块
4022 电容模块
501 底座焊料凸块
601 用电系统裸芯
602 焊接凸块
S1~S7 步骤
具体实施方式
以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用,本说明书中的各项细节也可以基于不同观点与应用,在没有背离本发明的精神下进行各种修饰或改变。需说明的是,在不冲突的情况下,以下实施例及实施例中的特征可以相互组合。
需要说明的是,以下实施例中所提供的图示仅以示意方式说明本发明的基本构想,遂图式中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制,其实际实施时各组件的型态、数量及比例可为一种随意的改变,且其组件布局型态也可能更为复杂。
为了克服现有技术中供电系统面临的问题,本发明提出了一种通过使用三维芯片堆叠技术将整个供电系统集成到封装中的新方法。
这种集成了供电系统的封装件包括用电系统裸芯和位于所述用电系统裸芯下方的供电系统裸芯;其中,所述供电系统裸芯包括有源模块、无源模块和再布线层,所述有源模块和无源模块封装成型,所述再布线层位于封装成型的所述有源模块和无源模块之上,实现有源模块和无源模块之间电连接,并提供多条对接所述用电系统裸芯的供电轨道;所述用电系统裸芯通过多个焊接凸块与多条所述供电轨道对接,并封装固定在所述再布线层上;外部电源直接通过所述供电系统裸芯向所述用电系统裸芯供电。
请参阅图1,本实施例提供一种上述集成供电系统封装件的封装方法,包括以下步骤:
S1提供一载体;
S2在所述载体上形成再布线层;
S3在所述再布线层上形成柱状金属引线;
S4分别将供电系统裸芯的有源模块和无源模块焊接在所述再布线层上,所述再布线层实现有源模块和无源模块之间电连接,并提供多条对接所述用电系统裸芯的供电轨道;
S5将所述有源模块和无源模块以及所述柱状金属引线在所述再布线层上封装成型,并研磨掉覆盖所述有源模块、无源模块和柱状金属引线的多余封装成型材料;
S6形成连接所述柱状金属引线的底座焊料凸块,并去除所述载体;
S7通过多个焊接凸块将用电系统裸芯焊接在所述再布线层上,实现用电系统裸芯与多条所述供电轨道的对接,然后通过底部填充将所述用电系统裸芯封装固定在所述再布线层上。
下面通过附图2a-2f来详细说明上述封装方法的具体工艺流程。
首先,如图2a所示,提供一载体101。所述载体101的材料可以选自玻璃、不锈钢、硅、氧化硅、金属或陶瓷中的一种或多种,或其他类似物。所述载体101可以为平板型。例如,所述载体101可以为具有一定厚度的硅基圆形平板。本实施例中,在所述载体101表面形成黏附层1011用于黏附固定所述再布线层200。具体地,可以采用胶水或胶带的方式黏附所述再布线层200。后续去除所述载体101时,黏附层1011也一并去除。例如,黏附层1011可以是采用加热或UV解胶的双面胶带,剥离时可以一面采用UV解胶另一面采用加热解胶,或者一面采用加热解胶另一面直接撕去,两面胶带解除粘性的方法不同。或者,黏附层1011也可以是镭射解胶的牺牲层,形成这层牺牲层后,在牺牲层上涂胶水可以黏附固定所述再布线层200。剥离时,可采用镭射去除牺牲层,然后再清除胶水。牺牲层可以在载体101上采用CVD沉积,也可以涂覆LTHC(light to heat)材料得到,胶水可以采用化学试剂清除。
然后,在所述载体101上形成再布线层200,并在所述再布线层200上形成柱状金属引线301,如图2b所示。具体地,所述再布线层200可以包括:金属连线201、通孔以及设于所述金属连线201和通孔周围的介电层202,所述金属连线201通过所述通孔实现与所述有源模块401、无源模块402和柱状金属引线301的电连接以及多层金属连线201之间的层间连接。其中,金属连线201的材料包括Cu、Al、Ag、Au、Sn、Ni、Ti、Ta中的一种或多种,或其他适合的导电金属材料。例如,金属连线201可以为Cu线,制作Cu线的种子层可以为Ti/Cu层。形成所述金属连线201的方法可以包括电解镀、化学镀、丝网印刷中的一种或多种,或其他适合的金属沉积工艺。所述通孔的形成方法可以为激光钻孔、机械钻孔、反应离子刻蚀、纳米压印或其他适合的开孔方法。所述通孔的填充材料可以为焊料或Cu,填充方法可以为电解镀、化学镀、丝网印刷、引线键合或其他适合在通孔中填充导电材料的方法。
本实施例中,所述再布线层200上还设有凸块下金属层(UBM),所述有源模块401、无源模块402和柱状金属引线301以及用电系统裸芯601通过所述凸块下金属层与所述再布线层200电连接。所述柱状金属引线301用于实现封装件与外部器件的电连接,在本实施例中,所述柱状金属引线301为竖直柱状的金属针或金属柱,可采用键合或电镀的方法在所述再布线层200上形成,例如电镀Cu螺柱或键合铜针等。
随后,如图2c所示,分别将供电系统裸芯的有源模块401和无源模块402焊接在所述再布线层200上,所述再布线层200实现有源模块401和无源模块402之间的电连接,并提供多条对接所述用电系统裸芯601的供电轨道。本实施例中,供电系统裸芯可以为高压供电系统裸芯,将外部电源的高电压转换成所述用电系统裸芯中需要的多个不同的低电压,并提供多条对接所述用电系统裸芯的低压供电轨道。所述有源模块401可以包括控制器和降压转换器,所述无源模块402可以包括电容、电感和电阻,本实施例中,无源模块402包括电容模块4022、电感模块4021和电阻(图中未示出)等。有源模块401与电容模块4022、电感模块4021等无源模块402横向排列封装在同一平层中,便于再布线层200的电连接和布图设计,具体排布的位置可以根据实际需要进行设计,本发明对此不作限制。
接下来,如图2d所示,将所述有源模块401和无源模块402以及所述柱状金属引线301在所述再布线层200上封装成型,并研磨掉覆盖所述有源模块401、无源模块402和柱状金属引线301的多余封装成型材料。具体地,所述封装成型方法可以为压缩成型、传递模塑、液封成型、真空层压、旋涂或其他适合的方法。封装成型的材料可以为环氧类树脂、液体型热固性环氧树脂、塑料成型化合物或类似物。研磨的方法可以包括机械研磨、化学抛光、刻蚀中的一种或多种。
然后,如图2e所示,形成连接所述柱状金属引线301的底座焊料凸块501,并去除所述载体101。本实施例中,所述底座焊料凸块501可以是焊锡球、铜球或锡铜合金球等,本实施例采用球状引脚栅格阵列(Ball Grid Array,BGA)焊球。所述封装件通过所述底座焊料凸块501可以实现在封装基底上的固定以及与外部器件的电连接。具体地,去除所述载体101的方法可以包括机械研磨、化学抛光、刻蚀、紫外线剥离、机械剥离中的一种或多种,或其他适合的方法。本实施例中,可以通过解胶的方式去除黏附层1011,从而去除所述载体101。
最后,如图2f所示,通过多个焊接凸块602将用电系统裸芯601焊接在所述再布线层200上,实现与多条所述供电轨道的对接,然后通过底部填充将所述用电系统裸芯601封装固定在所述再布线层200上。本实施例中,所述用电系统裸芯可以为专用集成电路裸芯(ASIC Die)。具体地,所述用电系统裸芯601与所述再布线层200连接的多个焊接凸块602可以为微凸块(μ-Bumps)或常规凸块。所述底部填充可以为毛细管底部填充(CUF,CapillaryUnderfill)或成型材料底部填充(MUF,Molding UnderFill)。
本发明采用现有的有源元件和无源模块形成2.5D中间层,再将用电系统裸芯如ASIC集成到2.5D中间层的顶部得到3D堆栈结构,从而直接在用电系统裸芯下方紧密集成供电系统裸芯。外部高压电源可直接向封装件供电,封装件的供电系统将高电压转化为符合用电系统需要的电压,并通过多条供电轨道通过微凸块或凸块直接供给用电系统裸芯。采用本发明的技术方案,供电系统裸芯能够提供数千条低压供电轨道与用电系统通过微凸块直接对接;由于集成了无源模块,可以消除采用传统PCB板产生的寄生电阻,提高了供电控制的供电效率和响应时间,通过减少压降和噪声提高了保真度,减少了所需的设计余量,从而可有效的解决传统供电系统面临的问题。
综上所述,本发明通过使用三维芯片堆叠技术将整个供电系统集成到器件封装中,提高了电力输送效率,增加了不同电压轨道的可用数量,解决了现有供电系统面临的多种问题。所以,本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。
Claims (10)
1.一种集成供电系统封装件的封装方法,其特征在于,所述封装件包括用电系统裸芯和位于所述用电系统裸芯下方的供电系统裸芯,所述封装方法包括以下步骤:
提供一载体;
在所述载体上形成再布线层;
在所述再布线层上形成柱状金属引线;
分别将供电系统裸芯的有源模块和无源模块焊接在所述再布线层上,所述再布线层实现有源模块和无源模块之间电连接,并提供多条对接所述用电系统裸芯的供电轨道;
将所述有源模块和无源模块以及所述柱状金属引线在所述再布线层上封装成型,并研磨掉覆盖所述有源模块、无源模块和柱状金属引线的多余封装成型材料;
形成连接所述柱状金属引线的底座焊料凸块,并去除所述载体;
通过多个焊接凸块将用电系统裸芯焊接在所述再布线层上,实现用电系统裸芯与多条所述供电轨道的对接,然后通过底部填充将所述用电系统裸芯封装固定在所述再布线层上。
2.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述供电系统裸芯为高压供电系统裸芯,将外部电源的高电压转换成所述用电系统裸芯中需要的多个不同的低电压,并提供多条对接所述用电系统裸芯的低压供电轨道。
3.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述有源模块包括控制器和降压转换器,所述无源模块包括电容、电感和电阻。
4.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述有源模块与所述无源模块横向排列。
5.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述再布线层包括:金属连线、通孔以及设于所述金属连线和通孔周围的介电层,所述金属连线通过所述通孔实现与所述有源模块、无源模块和柱状金属引线的电连接以及多层金属连线之间的层间连接。
6.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述再布线层上设有凸块下金属层,所述有源模块、无源模块、柱状金属引线以及用电系统裸芯通过所述凸块下金属层与所述再布线层电连接。
7.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述柱状金属引线为金属针或金属柱。
8.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述柱状金属引线采用键合或电镀的方法在所述再布线层上形成。
9.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:所述封装成型的方法为压缩成型、传递模塑、液封成型、真空层压或旋涂。
10.根据权利要求1所述的集成供电系统封装件的封装方法,其特征在于:将所述用电系统裸芯焊接在所述再布线层上的多个焊接凸块为微凸块。
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