CN106715039B - 封装体密封方法 - Google Patents

封装体密封方法 Download PDF

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Publication number
CN106715039B
CN106715039B CN201580051707.8A CN201580051707A CN106715039B CN 106715039 B CN106715039 B CN 106715039B CN 201580051707 A CN201580051707 A CN 201580051707A CN 106715039 B CN106715039 B CN 106715039B
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China
Prior art keywords
powder
sealing
melting
package
low
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CN201580051707.8A
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English (en)
Chinese (zh)
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CN106715039A (zh
Inventor
石川雅之
山本佳史
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority claimed from PCT/JP2015/080651 external-priority patent/WO2016068272A1/ja
Publication of CN106715039A publication Critical patent/CN106715039A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201580051707.8A 2014-10-31 2015-10-30 封装体密封方法 Active CN106715039B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2014-222900 2014-10-31
JP2014222900 2014-10-31
JP2015-164700 2015-08-24
JP2015164700 2015-08-24
JP2015213467A JP6575301B2 (ja) 2014-10-31 2015-10-29 封止用ペースト、ろう接合材とその製造方法、封止用蓋材とその製造方法、及びパッケージ封止方法
JP2015-213467 2015-10-29
PCT/JP2015/080651 WO2016068272A1 (ja) 2014-10-31 2015-10-30 封止用ペースト、ろう接合材とその製造方法、封止用蓋材とその製造方法、及びパッケージ封止方法

Publications (2)

Publication Number Publication Date
CN106715039A CN106715039A (zh) 2017-05-24
CN106715039B true CN106715039B (zh) 2020-06-12

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JP (1) JP6575301B2 (ja)
KR (1) KR102203608B1 (ja)
CN (1) CN106715039B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11095104B2 (en) * 2017-05-05 2021-08-17 Harvey L Frierson Chord organizer
JP6890520B2 (ja) * 2017-10-04 2021-06-18 三菱電機株式会社 電力用半導体装置
CN110961831B (zh) * 2018-09-28 2022-08-19 株式会社田村制作所 成形软钎料及成形软钎料的制造方法
JP6845444B1 (ja) * 2019-10-15 2021-03-17 千住金属工業株式会社 接合材、接合材の製造方法及び接合体
CN111926231B (zh) * 2020-08-27 2021-08-03 湘潭大学 制备氧化物弥散强化MoNbTaVW难熔高熵合金方法
CN113814504A (zh) * 2021-09-03 2021-12-21 广州德芯半导体科技有限公司 一种非高温连接温度传感器的封装方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0110307A2 (en) * 1982-11-24 1984-06-13 Samsung Electronics Co., Ltd. Semiconductor die-attach technique and composition therefor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05254949A (ja) * 1992-03-05 1993-10-05 Nippon Cement Co Ltd セラミックスと金属の接合用ロウ材及びその接合方法
JP3030479B2 (ja) * 1992-04-23 2000-04-10 日本特殊陶業株式会社 セラミックパッケージ
JP2803636B2 (ja) 1996-04-26 1998-09-24 日本電気株式会社 半導体集積回路パッケージ及びその製造方法
JP2002160090A (ja) * 2000-11-27 2002-06-04 Tanaka Kikinzoku Kogyo Kk Ａｇ−Ｃｕ−Ｉｎ系ろう材及びＡｇ−Ｃｕ−Ｉｎ系ろう材の製造方法
JP2003163299A (ja) * 2001-11-29 2003-06-06 Nippon Filcon Co Ltd 電子素子パッケージ用封止キャップとその製造方法及びそのキャップを用いた封止方法
JP2006049595A (ja) 2004-08-05 2006-02-16 Tanaka Kikinzoku Kogyo Kk 銀ろうクラッド材並びにパッケージ封止用の蓋体及びリング体
CN101087673B (zh) * 2005-01-11 2010-05-12 株式会社村田制作所 焊膏及电子装置
JP5065718B2 (ja) 2006-06-20 2012-11-07 田中貴金属工業株式会社 圧電素子の気密封止方法、及び、圧電デバイスの製造方法
JP5045673B2 (ja) * 2006-09-01 2012-10-10 千住金属工業株式会社 機能部品用リッドとその製造方法
JP5537119B2 (ja) * 2009-10-28 2014-07-02 京セラ株式会社 蓋体並びに蓋体の製造方法および電子装置の製造方法
JP2013081966A (ja) * 2011-10-06 2013-05-09 Fujitsu Ltd 導電性接合材料、並びに導体の接合方法、及び半導体装置の製造方法
US11440142B2 (en) * 2012-11-16 2022-09-13 Ormet Circuits, Inc. Alternative compositions for high temperature soldering applications
JP6488896B2 (ja) * 2014-06-13 2019-03-27 三菱マテリアル株式会社 パッケージ封止方法及び封止用ペースト

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0110307A2 (en) * 1982-11-24 1984-06-13 Samsung Electronics Co., Ltd. Semiconductor die-attach technique and composition therefor

Also Published As

Publication number Publication date
JP6575301B2 (ja) 2019-09-18
KR102203608B1 (ko) 2021-01-14
CN106715039A (zh) 2017-05-24
KR20170074913A (ko) 2017-06-30
JP2017039163A (ja) 2017-02-23

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