CN106715039B - Package sealing method - Google Patents
Package sealing method Download PDFInfo
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- CN106715039B CN106715039B CN201580051707.8A CN201580051707A CN106715039B CN 106715039 B CN106715039 B CN 106715039B CN 201580051707 A CN201580051707 A CN 201580051707A CN 106715039 B CN106715039 B CN 106715039B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The sealing paste of the present invention comprises a raw material powder containing 5 to 40 mass% of a low-melting metal powder having an average particle diameter of 0.5 to 20.0 [ mu ] m and a melting point or liquidus temperature of less than 240 ℃, 40 to 90 mass% of an Ag powder having an average particle diameter of 0.1 to 10.0 [ mu ] m, and 5 to 50 mass% of a Cu powder having an average particle diameter of 0.1 to 10.0 [ mu ] m, and a binder, and can easily form a solder bonding material, easily change the alloy composition of the solder bonding material, and reliably hermetically seal a package without generating cracks.
Description
Technical Field
The present invention relates to a sealing paste, a solder bonding material, and a package sealing method, and more particularly, to a sealing paste using a mixed powder paste which has a high degree of freedom in supply and is easily controlled in composition, a solder bonding material, a method for producing the solder bonding material, a sealing cap material, a method for producing the sealing cap material, and a package sealing method.
This application claims priority based on japanese patent application 2014-222900, 2015-164700, 2015-24, 2015-213467, which were applied on 31/10/2015, and the contents thereof are incorporated herein.
Background
Generally, a solder having a melting point lower than 450 ℃ or a brazing material having a melting point of 450 ℃ or higher is used as the sealing material. Further, in order to seal the package with the lid material, a material called a seal ring as described in patent document 1 may be sandwiched as a sealing material, and a material subjected to nickel plating treatment in the lid material or the sealing portion of the package, or a material subjected to nickel plating in the sealing portion of the seal ring itself may be sandwiched. In addition, glass or resin may be used as the sealing material.
Lead-free solder materials such as Pb (lead) -63 mass% Sn (tin) or Sn-3 mass% Ag (silver) -0.5 mass% Cu (copper), and high-temperature solder materials such as Pb-10 mass% Sn or Au-20 mass% Sn can be used as the solder material. As the brazing material, Ag brazing, for example, Ag-28 mass% Cu, Ag-22 mass% Cu-17 mass% Zn (zinc) -5 mass% Sn, or an Ag brazing alloy containing Cd (cadmium) or Ni, can be mainly used. The seal ring or the lid member may be made of cobalt or 42 alloy, and these members are subjected to nickel plating.
As a sealing method using a seal ring, when a solder material is used, a solder plate processed into a ring shape is sandwiched between a lid material and a package together with the seal ring, and melting and sealing are performed using an oven or an oven, or a solder frame formed into a ring shape using a solder paste or the like is formed on the lid material and then sealed with the package in some cases. On the other hand, when Ag brazing is used, an annular Ag brazing sheet is punched out and sandwiched between the lid member and the package together with the seal ring, and only the seal portion is locally brought into a high temperature state by a seam welding machine, a laser welding machine, or the like to be melted and seal the Ag brazing or the nickel plating formed on the seal ring.
In the sealing method using the seal ring, the seal ring serves as a buffer material, and therefore thermal shock and mechanical stress can be alleviated when sealing is performed by a seam welding method or the like.
However, when sealing is performed by a welding method using Ag solder and a seal ring with nickel plating, sealing must be performed after being sandwiched between a lid material and a package, and therefore, efficiency of alignment and the like is poor, which is very troublesome.
Therefore, a method has been proposed in which an Ag brazing alloy is powdered and slurried, printed on a lid material, and heat-treated to form a sealing frame.
The metal paste described in patent document 2 is a metal paste using a single metal powder of gold powder, silver powder, platinum powder, or palladium powder, and is not a metal paste obtained by alloying these metals.
Patent document 1: japanese laid-open patent publication No. 9-293799
Patent document 2: japanese laid-open patent publication No. 2008-28364
Patent document 3: japanese patent laid-open publication No. 2006 and 49595
Patent document 4: japanese patent laid-open publication No. 2003-163299
However, in the case of the Ag brazing paste, it is necessary to perform heat treatment at a temperature higher than the melting point of Ag brazing in forming the sealing frame, and then perform welding again in sealing. Further, since Ag brazing alloy powder is powdered, when a different alloy composition is desired, it is necessary to produce an alloy again and to perform a powdering treatment, which causes a great trouble.
Further, when sealing is performed by a seam welding method, a so-called straight seam method, which does not use a seal ring, or a laser welding method, an electron beam welding method, or the like, only a part of the sealing portion is in a high temperature state and sealed, and therefore cracks are likely to be generated in the bonding layer or the package due to thermal shock or mechanical stress.
Disclosure of Invention
The invention provides a sealing paste, a solder bonding material and a manufacturing method thereof, a sealing cover material and a manufacturing method thereof, and a sealing method of a package, wherein the solder bonding material can be easily formed, the alloy composition of the solder bonding material can be easily changed, and cracks can be reliably generated to hermetically seal the package.
The sealing slurry comprises a raw material powder and a binder, wherein the raw material powder contains 5-40 mass% of a low-melting metal powder having an average particle diameter of 0.5-20.0 [ mu ] m and a melting point or liquidus temperature of less than 240 ℃, 40-90 mass% of an Ag powder having an average particle diameter of 0.1-10.0 [ mu ] m, and 5-50 mass% of a Cu powder having an average particle diameter of 0.1-10.0 [ mu ] m.
In the sealing slurry of the present invention, the average particle diameter of the low melting point metal powder is preferably 1 to 10 times larger than the average particle diameter of the Ag powder and 1 to 10 times larger than the average particle diameter of the Cu powder.
In the sealing slurry of the present invention, the average particle diameter of the low melting point metal powder is preferably larger than the average particle diameter of the Ag powder and the average particle diameter of the Cu powder.
In the sealing slurry of the present invention, the mixing ratio of the binder is preferably 2 mass% or more and 50 mass% or less.
In the sealing paste of the present invention, at least one selected from the group consisting of Sn, In, Sn-Ag-Cu solder alloys, Sn-Bi solder alloys, and Sn-In solder alloys may be used as the low-melting-point metal powder.
The method for producing a brazing material according to the present invention comprises: and a slurry coating step of coating the sealing slurry on a carrier, and a heat treatment step of heating the sealing slurry coated on the carrier at a melting temperature of the low-melting metal to cause a liquid phase of the low-melting metal to penetrate between the Ag powder and the Cu powder, and then cooling and solidifying the mixture, thereby forming a solder bonding material having a porosity of 10% or more in which the Ag powder and the Cu powder are bonded by a bonding layer formed of the low-melting metal. In addition, the brazing material is preferably formed to have a porosity of 35% or less in order to secure strength and sealing properties.
The brazing material of the present invention comprises an Ag powder having an average particle diameter of 0.1 to 10.0 [ mu ] m, a Cu powder having an average particle diameter of 0.1 to 10.0 [ mu ] m, and a bonding layer formed of a low-melting metal having a melting point or liquidus temperature of less than 240 ℃ and used for bonding the Ag powder and the Cu powder, and has a porosity of 10% or more and a mass ratio of 40 to 90% by mass of the Ag powder, 5 to 50% by mass of the Cu powder, and 5 to 40% by mass of the bonding layer.
The method for manufacturing a sealing cover material of the present invention comprises: and a slurry application step of applying the sealing slurry to a surface of a lid body, and a heat treatment step of heating the sealing slurry applied to the lid body at a melting temperature of the low-melting metal to cause a liquid phase of the low-melting metal to penetrate between the Ag powder and the Cu powder, and then cooling and solidifying the mixture, thereby forming a solder material having a porosity of 10% or more in which the Ag powder and the Cu powder are connected by a bonding layer formed of the low-melting metal. The brazing material is preferably formed to have a porosity of 35% or less.
In the method for manufacturing a sealing lid member according to the present invention, the step of removing the adhesive agent remaining in the brazing material may be provided after the step of heat-treating, and the step of removing the adhesive agent may include: cleaning treatment for cleaning the brazing bonding material with a cleaning solution; and heat-treating the brazing bonding material after the cleaning treatment.
In the method for manufacturing a sealing lid member, the slurry application step may apply the sealing slurry to a surface of a plate material having a size in which a plurality of the lid members are formed, and the heat treatment step may be followed by a singulation step of dividing the plate material into the lid members.
The sealing cover material of the present invention comprises: a cover body; and the brazing bonding material is arranged on the surface of the cover body.
The package sealing method of the present invention is a package sealing method for joining a package and a lid body by a brazing alloy, and includes a slurry application step of applying the sealing slurry to a surface of the lid body, a heat treatment step, and an alloying step; a heat treatment step of heating the sealing paste applied to the lid body at a melting temperature of the low-melting metal to cause a liquid phase of the low-melting metal to penetrate between the Ag powder and the Cu powder, and then cooling and solidifying the paste, thereby forming a solder bonding material having a porosity of 10% or more in which the Ag powder and the Cu powder are bonded to each other by a bonding layer formed of the low-melting metal; the alloying step is performed by heating and melting the brazing material in a state where the lid body is superimposed on the package body, and alloying the brazing material to obtain the brazing alloy. The brazing material is preferably formed to have a porosity of 35% or less in order to secure strength, sealing property, and the like.
In the package sealing method of the present invention, an adhesive removing step of removing an adhesive remaining in the solder bonding material may be provided between the heat treatment step and the alloying step, and the adhesive removing step may include a cleaning treatment of cleaning the solder bonding material with a cleaning liquid and a baking treatment of heat-treating the solder bonding material after the cleaning treatment.
In the package sealing method according to the present invention, the slurry application step may apply the sealing slurry to a surface of a plate material having a size in which a plurality of the lid bodies are formed, and may further include a singulation step of dividing the plate material into the lid bodies after the heat treatment step.
In the package sealing method of the present invention, a plating process step of plating a surface of the lid body with metal may be provided after the singulation step. The metal plating treatment is performed as the metallization of the lid body, and the metal plating treatment is performed after the lid body is divided, whereby the metal plating can be performed on the side wall of the lid body, and corrosion and rust of the side wall can be effectively prevented.
The package sealing method of the present invention is a package sealing method in which a lid is superimposed on a package and the lid is joined by a brazing alloy, and includes a slurry coating step of coating a sealing slurry on a carrier, a heat treatment step, and an alloying step; a heat treatment step of heating the sealing slurry applied to the carrier at a melting temperature of the low-melting metal to cause a liquid phase of the low-melting metal to penetrate between the Ag powder and the Cu powder, and then cooling and solidifying the mixture to form a solder bonding material having a porosity of 10% or more in which the Ag powder and the Cu powder are bonded to each other by a bonding layer formed of the low-melting metal; the alloying step is a step of laminating the brazing material between the package and the lid body, and then heating and melting the brazing material to alloy the brazing material to obtain the brazing alloy. The brazing material is preferably formed to have a porosity of 35% or less.
The raw material powder to be mixed in the sealing slurry of the present invention contains a low-melting metal powder having a melting point or liquidus temperature of less than 240 ℃, and raw material powders of Ag powder and Cu powder having a melting point higher than that of the low-melting metal powder. When the low-melting metal powder is melted, most of the Ag powder and the Cu powder having a melting point higher than that of the low-melting metal remain as solids, and the liquid phase of the low-melting metal permeates between the solid Ag powder and the solid Cu powder to be cooled and solidified, whereby the Ag powder and the Cu powder are bonded to each other through the bonding layer formed of the low-melting metal. In this case, since many voids are formed in the low melting point metal powder before heating in the heat treatment step, the brazing material has a porous structure with a porosity of 10% or more.
When the raw material powder mixed in the sealing slurry is used as the silver brazing alloy powder, the raw material powder must be heated to a temperature equal to or higher than the melting temperature (liquidus temperature) of the silver brazing alloy when forming a brazing material. The brazing material of the present invention is formed by heating a low-melting metal at a melting temperature (lower than 240 ℃) by liquid phase sintering of a low-melting metal powder, and therefore, a furnace or the like does not need to use a high-temperature device, and energy saving is achieved.
Further, when the sealing body and the lid body are sealed by using the brazing material of the present invention, even in a sealing method in which only a sealing portion is locally formed in a high temperature state by using a seam welding method, a laser welding method, an electron beam welding method, or the like, thermal shock or mechanical stress can be relaxed by the porous structure of the brazing material, and therefore, the occurrence of cracks in the bonding layer or the sealing body can be prevented. In addition, the solder bonding material is heated to the melting temperature of the Ag powder and the Cu powder to alloy Ag and Cu with the low melting point metal, whereby the package and the lid body can be reliably hermetically sealed.
Further, since the sealing paste of the present invention can be applied to the surface of the carrier or the lid body by a method such as printing, a solder bonding material (sealing frame) having a desired shape can be easily formed. When the brazing material of the present invention is formed on the surface of the lid body, the brazing material is fixed to the surface of the lid body by the molten low melting point metal, so that the stable brazing material can be easily formed on the surface of the lid body, and the brazing material does not fall off when the lid body is handled. Further, since the alloying step is performed in a state where the solder bonding material to which the sealing lid material is bonded is sandwiched and superposed on the package, the alloying and sealing of the solder bonding material can be performed at the same time, which is efficient.
Since the raw material powder mixed in the sealing slurry of the present invention is a combination of a plurality of metal powders, the mixing ratio and combination of the metal powders can be easily changed, and the alloy composition can be easily changed.
When the average particle size of the Ag powder and the Cu powder mixed in the sealing slurry is less than 0.1 μm, the porosity of the formed solder bonding material becomes less than 10%, and it is difficult to obtain an effect of alleviating thermal shock or mechanical stress. On the other hand, when the average particle size of the Ag powder and the Cu powder exceeds 10 μm, the porosity of the formed brazing material increases, and the sealing property deteriorates. The porosity of the brazing material according to the present invention is preferably 10% or more and 35% or less. If the porosity of the brazing material exceeds 35%, the sealing property may be lowered.
When the average particle size of the low melting point metal powder is less than 0.5 μm, the porosity of the formed solder bonding material is also lower than 10%, and the effect of relaxing thermal shock and mechanical stress is difficult to obtain, and when the average particle size of the low melting point metal powder exceeds 20 μm, the porosity of the formed solder bonding material becomes large, and the sealing property is deteriorated.
If the content ratio of Ag powder in the entire raw material powder is less than 40 mass%, the sealing property is lowered because the Ag powder is greatly deviated from the eutectic composition of Ag, Cu and the low-melting-point metal, and if it exceeds 90 mass%, the Ag powder may be peeled off from a lid body or the like to which a brazing material is bonded during cleaning for removing an adhesive residue, and the cost is increased because the amount of expensive Ag is large.
When the content ratio of the Cu powder in the entire raw material powder is out of the range of 5 mass% to 50 mass%, that is, less than 5 mass% or more than 50 mass%, the Cu powder greatly deviates from the eutectic composition of Ag, Cu and the low-melting-point metal, and thus the sealing property is degraded.
If the content ratio of the low-melting metal powder in the entire raw material powder is less than 5 mass%, the bonding layer may be insufficiently formed and may be peeled off from a lid body or the like to which a brazing material is bonded during cleaning, and if it exceeds 40 mass%, an excess low-melting metal may remain after sealing (after alloying), and a low-melting temperature region having a melting point lower than the eutectic temperature of Ag, Cu and a low-melting metal (for example, the eutectic temperature of Ag — Cu — Sn) may be generated in the sealing portion, so that a part of the sealing portion may be melted at the melting point of the low-melting metal (lower than the melting temperature of the brazing material) as opposed to a melting point expected to be at least 450 ℃. When the content ratio of the low-melting metal powder exceeds 40 mass%, the eutectic composition of Ag, Cu and the low-melting metal is greatly deviated, and the sealing property is also lowered.
When the binder is less than 2% by mass or the binder exceeds 50% by mass, the slurry is difficult to form even when the binder is kneaded with the raw material powder. In particular, when the binder exceeds 50 mass%, the binder holding the Ag powder and the Cu powder is softened by heating and cannot maintain the shape, and it is difficult to form the brazing material into a desired shape.
According to the present invention, the composition of the solder alloy can be easily changed, and the solder bonding material having a porous structure does not cause cracks, and the package can be reliably hermetically sealed.
Drawings
Fig. 1A is a schematic diagram illustrating a structure of the sealing slurry according to the present invention.
Fig. 1B is a schematic view illustrating a structure of a brazing material according to the present invention.
Fig. 2 is a perspective view showing a state where the sealing slurry is applied to the surface of the carrier according to the present invention.
Fig. 3 is a perspective view showing a sealing lid material according to the present invention in which a brazing material is formed on a surface of the lid material.
Fig. 4 is a perspective view showing an important part of a plate material in a state where a sealing paste is print-applied according to the present invention.
Fig. 5A is a front view showing a process of laminating a sealing lid member on a package according to the present invention.
Fig. 5B is a front view showing a step of bonding the stacked sealing lid members to the package according to the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
< construction of sealing slurry >
First, the sealing paste 20 used in the method for producing a brazing material or the sealing method according to the present invention will be described.
As shown in fig. 1A, the sealing slurry 20 is obtained by mixing a binder 25 with a raw material powder containing a low-melting metal powder 23 having a melting point or liquidus temperature lower than 240 ℃, and Ag powder 21 and Cu powder 22 having a melting point higher than that of the low-melting metal powder 23.
The raw material powder contains an Ag powder 21 having an average particle diameter of 0.1 to 10.0 [ mu ] m and 40 to 90 mass%, a Cu powder 22 having an average particle diameter of 0.1 to 10.0 [ mu ] m and 5 to 50 mass%, and a low-melting-point metal powder 23 having an average particle diameter of 0.5 to 20.0 [ mu ] m and 5 to 40 mass%, and these Ag powder 21, Cu powder 22, and low-melting-point metal powder 23 are appropriately mixed within the above numerical range. The content ratios of the Ag powder 21, the Cu powder 22, and the low melting point metal powder 23 are ratios to the raw material powder.
As the low melting point metal powder 23, one or more selected from Sn, In, Bi, Sn-Ag-Cu solder alloy, Sn-Bi solder alloy, and Sn-In solder alloy can be used. In addition, any of the Sn-Ag-Cu solder alloy, Sn-Bi solder alloy, and Sn-In solder alloy used as the low melting point metal powder 23 contains Sn, and has a composition ratio of, for example, 96.5 mass% Sn to 3.0 mass% Ag to 0.5 mass% Cu, 99.3 mass% Sn to 0.7 mass% Cu, and the like.
The binder 25 is composed of at least one of rosin, an active agent, a solvent, a thixotropic agent, and other additives.
The sealing slurry 20 is configured by mixing the raw material powder with the binder 25 at a ratio of 2 to 50 mass% (ratio in the slurry).
When the average particle diameters of the Ag powder 21 and the Cu powder 22 are smaller than 0.1 μm, the porosity of the solder bonding material formed using the sealing paste 20 is less than 10%, and it is difficult to obtain the effect of alleviating thermal shock and mechanical stress. On the other hand, when the average particle diameters of the Ag powder 21 and the Cu powder 22 exceed 10 μm, the porosity of the formed brazing material increases, and the sealing property deteriorates.
Further, when the average particle diameter of the low-melting metal powder 23 is less than 0.5 μm, the porosity of the formed brazing material is also less than 10%, and it is difficult to obtain the effect of relaxing thermal shock or mechanical stress. When the average particle diameter of the low-melting-point metal powder 23 exceeds 20 μm, the porosity of the formed brazing material increases, and the sealing property deteriorates.
The average particle diameter of the low-melting metal powder 23 is preferably in the range of 0.5 μm to 20.0 μm, and is preferably the same as or larger than the average particle diameters of the Ag powder 21 and the Cu powder 22. Specifically, the average particle diameter of the low melting point metal powder 23 is preferably 1 to 10 times, more preferably 1 to 5 times, and still more preferably 1.25 to 5 times the average particle diameter of the Ag powder 21 and the Cu powder 22.
If the content of Ag powder 21 in the entire raw material powder is less than 40 mass%, the sealing property is lowered, and if it exceeds 90 mass%, peeling occurs during cleaning for removing the binder residue, which further increases the cost. When the content ratio of the Cu powder 22 is out of the range of 5 mass% to 50 mass%, that is, when it is less than 5 mass% or exceeds 50 mass%, the sealing property is lowered. When the content ratio of the low-melting metal powder 23 is less than 5 mass%, peeling occurs during cleaning, and when it exceeds 40 mass%, a low-melting temperature region is generated, and a part of the low-melting temperature region may be melted at a temperature lower than the melting temperature of the brazing alloy. When the content ratio of the low-melting metal powder 23 exceeds 40 mass%, the sealing property is also lowered.
When the content ratio of the binder to the sealing slurry 20 is less than 2% by mass or more than 50% by mass, it is difficult to form a slurry suitable for a printing method even when the binder is kneaded with the raw material powder. In particular, when the binder exceeds 50 mass%, the binder extrudes Ag powder and Cu powder when forming the brazing material, making it difficult to form the brazing material into a desired shape.
< composition of solder bonding material and method for producing the same >
A method for manufacturing the brazing material 4 using the above sealing slurry 20 is explained with reference to fig. 2.
The method for manufacturing the brazing material 4 includes: a slurry coating step of printing and coating the sealing slurry 20 on the carrier 3; a heat treatment step of heating the sealing slurry 20 applied to the carrier 3 at the melting temperature of the low-melting-point metal powder 23; and a binder removal step for removing the binder after the heat treatment step.
< slurry coating Process >
A carrier 3 such as a ceramic substrate to which the brazing material is not fused is prepared, and the sealing paste 20 is applied to the surface of the carrier 3 by frame-like or sheet-like printing in a desired shape, for example, a shape corresponding to the peripheral edge portion of the package on the surface of the lid body (fig. 2). The sealing slurry 20 may be discharged and supplied onto the carrier 3 by a dispenser or the like.
[ Heat treatment Process ]
The carrier 3 coated with the sealing slurry 20 is subjected to a low-temperature reflow process to form a solder joint 4. Specifically, the sealing paste 20 applied to the carrier 3 is heated in a nitrogen atmosphere to a temperature not lower than the melting temperature of the low-melting metal powder 23 contained in the sealing paste 20, that is, not lower than the melting point or liquidus temperature of the low-melting metal powder 23 and lower than the melting points of Ag and Cu and not lower than the temperature at which the Ag powder 21 and Cu powder 22 do not melt, thereby melting the low-melting metal powder 23. Since the heat treatment is performed by melting the low melting point metal powder 23, the heat treatment can be performed by performing reflow (heat treatment) in a furnace or an oven used for a general welding material. More specifically, when the low-melting metal powder 23 is Sn powder, heat treatment is performed at a temperature of 10 to 30 ℃ in addition to the melting point of the low-melting metal within a temperature range of not less than the melting point of Sn (232 ℃) and not more than the melting point of Ag (961 ℃) and the melting point of Cu (1083 ℃).
When the low-melting-point metal powder 23 melts, the liquid phase of the low-melting-point metal is distributed between the high-melting-point metal Ag powder 21 and the Cu powder 22, which do not melt at the temperature of the heat treatment. Then, the low melting point metal is solidified by allowing the liquid phase of the low melting point metal to penetrate between the Ag powder 21 and the Cu powder 22 and then cooling, whereby the brazing material 4 in a state in which the high melting point metal powders (the Ag powder 21 and the Cu powder 22) are connected to each other is formed as shown in fig. 1B by the bonding layer 24 of the low melting point metal. At this time, although a part of the low melting point metal and the high melting point metal may be alloyed, most of the high melting point metal remains as it is as a powder, and therefore, a plurality of voids 41 are formed by heat treatment in the place where the low melting point metal powder 23 exists before heating, and the brazing material 4 has a porous structure with a porosity of 10% or more.
In this way, in the heat treatment step, the low-melting metal is melted and brought into a liquid state with respect to the Ag powder 21 and the Cu powder 22 made of the high-melting metal in the sealing slurry 20, and the melted metal is immersed between the high-melting metal powders 21 and 22 to perform liquid-phase sintering. Thereby, the brazing material 4 can be formed at a low heat treatment temperature. In this case, the brazing alloy of the low melting point metal and the high melting point metal is not formed.
[ Binder removal Process ]
As described above, the binder 25 is mixed in the sealing slurry 20. Therefore, the residue of the adhesive 25 remaining in the brazing material 4 is removed by the cleaning liquid after the heat treatment step (cleaning treatment). At this time, after the brazing material 4 is peeled off from the carrier, the brazing material 4 is cleaned alone. As the cleaning liquid, use may be made of Arakawa Chemical Industries, Ltd., precision parts cleaning agent (Pine Alpha Series) or the like.
After the residue of the adhesive 25 is removed by the cleaning liquid (cleaning treatment), a treatment for reducing the organic components remaining in the brazing material 4 may be performed as necessary. This treatment is, for example, a heat treatment of 300 to 1200 ℃ for 0.1 to 24 hours, preferably 600 ℃ for 9 hours, to the brazing material 4, and a baking treatment to vaporize and remove the organic components.
< construction of cover material for sealing and method for manufacturing the same
In the above-described method for producing the brazing material 4, the case where the brazing material 4 is produced by applying the sealing paste 20 to the carrier 3 alone was described, but the brazing material 4 for sealing the sealing body 5 and the lid body 1 (see fig. 5A and 5B) may be formed in advance on the surface of the lid body 1 to form the sealing lid member 6 in which the lid body 1 and the brazing material 4 are integrated.
A method for manufacturing the sealing lid material 6 will be described with reference to fig. 3.
The method for producing the sealing lid member 6 is the same as the method for producing the brazing material 4 except that the carrier 3 is replaced with the lid member 1 in the method for producing the brazing material 4 (fig. 2), and includes: a paste application step of applying the sealing paste 20 to the surface of the lid body 1 by printing; a heat treatment step of heating the sealing slurry 20 applied to the lid body 1 at the melting temperature of the low melting point metal powder 23; and an adhesive removing step of forming the brazing material 4 on the surface of the lid body 1 and then removing the adhesive 25.
[ slurry coating Process ]
Cobalt, 42 alloy, or the like can be used as a material of the lid body 1, and nickel plating (metal plating) is applied to the surface. The sealing paste 20 is applied by printing on the surface of the lid body 1 in a frame shape, for example, so as to be aligned with the peripheral edge portion of the package. At this time, the sealing slurry 20 may be discharged and supplied by a dispenser or the like to coat the lid body 1.
[ Heat treatment Process ]
Next, the lid body 1 coated with the sealing paste 20 is subjected to a low-temperature reflow process. Specifically, the lid body 1 coated with the sealing slurry 20 is heated in a nitrogen atmosphere to a temperature equal to or higher than the melting temperature of the low-melting-point metal powder 23 contained in the sealing slurry 20, that is, equal to or higher than the melting point or liquidus temperature of the low-melting-point metal powder 23 and lower than the melting points of Ag and Cu, and at a temperature at which the Ag powder 21 and Cu powder 22 do not melt, so that the low-melting-point metal powder 23 is melted. Then, the liquid phase of the low melting point metal is infiltrated between the Ag powder 21 and the Cu powder 22, and then cooled to solidify the low melting point metal. Thus, the sealing lid member 6 provided with the brazing material 4 having a porous structure in which the Ag powder 21 and the Cu powder 22 are connected by the bonding layer 24 made of the low melting point metal and having a porosity of 10% or more can be formed on the surface of the lid body 1. Since the brazing material 4 thus formed is fixed to the surface of the lid body 1, the brazing material does not fall off from the lid body 1 when the sealing lid material 6 is handled.
[ Binder removal Process ]
As described above, the binder 25 is mixed in the sealing slurry 20. Therefore, the residue of the binder 25 remaining after the heat treatment step is removed by the cleaning liquid.
In this case, after the cleaning treatment of the adhesive, a step for reducing the organic component remaining in the brazing material 4 (for example, a baking treatment for vaporizing and removing the organic component by performing a heat treatment at 300 to 1200 ℃ for 0.1 to 24 hours, preferably at 600 ℃ for 9 hours) may be performed as necessary.
< method for producing a plurality of sealing lids >
In the method of manufacturing the sealing lid member 6, in addition to applying the sealing slurry 20 to each lid body 1 and performing the heat treatment, as shown in fig. 4, a plate material 2 having a size capable of forming a plurality of lid bodies 1 is prepared in advance, a plurality of brazing materials 4 are formed on the surface of the plate material 2, and then the plate material 2 is divided and divided into a plurality of lid bodies 1, thereby manufacturing a plurality of sealing lid members 6 at one time.
In this case, the method for manufacturing the sealing lid material includes: a paste application step of applying the sealing paste 20 to the surface of the plate 2 by printing; a heat treatment step of heating the sealing slurry 20 applied to the plate material 2 at the melting temperature of the low-melting-point metal powder to form the brazing material 4; an adhesive removing step of forming a brazing material 4 on the surface of the sheet material 2 and then removing the adhesive 25; and a singulation step of cutting the plate member 2 and dividing the plate member into the sealing lid members 6. If necessary, a plating process step of plating the surface of the sealing lid member 6 with metal may be provided after the singulation step.
[ slurry coating Process ]
A plate material 2 having a size in which a plurality of lid bodies 1 can be arranged is prepared, and the sealing paste 20 is printed and applied in a frame shape (not shown) on the surface of the plate material 2 so as to be aligned with the peripheral edge portion of the sealing body 5 superimposed on the surface of the sealing lid material 6. At this time, the sealing slurry 20 may be applied to the plate 2 by discharge and supply by a dispenser or the like. As a material of the plate member 2, cobalt, 42 alloy, or the like can be used, and nickel plating (metal plating) is applied to both or one of the surfaces.
[ Heat treatment Process ]
The plate material 2 (lid body 1) coated with the sealing slurry 20 is subjected to a low-temperature reflow treatment. Specifically, the plate material 2 coated with the sealing slurry 20 is heated in a nitrogen atmosphere to a temperature not lower than the melting temperature of the low-melting-point metal powder 23 contained in the sealing slurry 20, that is, not lower than the melting point or liquidus temperature of the low-melting-point metal powder 23 but lower than the melting points of Ag and Cu and not lower than the melting point of the Ag powder 21 and Cu powder 22, thereby melting the low-melting-point metal powder 23. Then, the liquid phase of the low melting point metal is infiltrated between the Ag powder 21 and the Cu powder 22, and then cooled to solidify the low melting point metal. As a result, a brazing material 4 (fig. 4) having a porous structure with a porosity of 10% or more, in which Ag powder 21 and Cu powder 22 are connected by a bonding layer 24 made of a low-melting metal, can be formed on the surface of the plate material 2 (lid body 1) (fig. 4). The brazing material 4 thus formed is fixed to the surface of the plate material 2 (lid body 1), and therefore does not fall off from the lid body when the plate material 2 (lid body 1) is handled.
[ Binder removal Process ]
As described above, the binder 25 is mixed in the sealing slurry 20. Therefore, the residue of the adhesive 25 remaining after the heat treatment step is removed by the cleaning liquid (cleaning treatment). As the cleaning liquid, use may be made of Arakawa Chemical Industries, Ltd., precision parts cleaning agent (Pine Alpha Series) or the like.
At this time, after the residue of the adhesive 25 is removed by the cleaning liquid (cleaning treatment), a treatment for reducing the organic matter component remaining in the brazing material 4 may be performed as necessary. This treatment is, for example, a heat treatment of 300 to 1200 ℃ for 0.1 to 24 hours, preferably 600 ℃ for 9 hours, to the brazing material 4, and a baking treatment to vaporize and remove the organic components.
[ singulation step ]
Next, the sheet material 2 on which the brazing material 4 is formed is cut to be singulated into the caps 1 (sealing cap material 6).
[ electroplating treatment Process ]
As described above, the nickel plating is applied to the surface of the plate material 2, but the plate material 2 on which the brazing material 4 is formed may be cut out to be separated into individual caps 1 (sealing cap material 6), and then the nickel plating (metal plating) may be applied to the entire structure. Thus, the cut surface (side surface) of the lid body 1 (the sealing lid material 6) is also plated with nickel, and corrosion, rust, or the like can be prevented from occurring on the side wall of the lid body 1 (the sealing lid material 6). The nickel plating may be formed by electroless plating or electrolytic plating, and the film thickness may be several μm. Other metal plating than nickel plating may be performed.
< method for sealing Package >
Next, a package sealing method in which a package is bonded to a lid is described with reference to fig. 5A and 5B.
The sealing method comprises the following steps: a paste application step of applying the sealing paste 20 on the surface of the lid body 1 by printing; a heat treatment step of heating the sealing slurry 20 applied to the lid body 1 at the melting temperature of the low melting point metal powder 23; a binder removal step of forming a brazing material 4 on the surface of the lid body 1 and then removing the binder 25; and an alloying step of overlapping the lid body 1 from which the adhesive 25 is removed on the package 5, heating and melting the brazing material 4 to alloy the lid body 1 to the package 5 to form a brazing alloy, and adding an alloying step to the above-described method for manufacturing the sealing lid body 6. The package sealing method includes a singulation step and a plating step as necessary. Therefore, in the description of the package sealing method, the description of the slurry application step, the heat treatment step, the binder removal step, the singulation step, and the plating treatment step is omitted, and only the alloying step of joining the package 5 and the lid body 1 by using the sealing lid material 6 having the brazing material 4 provided on the surface of the lid body 1 will be described.
[ alloying Process ]
As shown by the arrows in fig. 5A, the sealing lid member 6 is superposed so that the brazing material 4 comes into contact with the package 5, and as shown in fig. 5B, the brazing material 4 is heated in a state where a predetermined pressure is applied, melted, and cooled to solidify, thereby joining the lid body 1 to the package 5. The package 5 is made of ceramic or the like, and a gold plating layer, for example, is formed as a conductive metal layer on a bonding surface with the lid 1.
The brazing material 4 is heated by: a welding method (heat sealing method), a seam welding method (resistance welding method), a laser welding method, an electron beam welding method, an ultrasonic welding method, and the like, in which treatment is performed at a temperature equal to or higher than the melting point of the brazing material using an oven, a conveyor furnace, or the like.
For example, in the seam welding method, as shown in fig. 5B, the sealing cover material 6 is overlapped so that the package 5 contacts the solder bonding material 4, the roller electrode 11 is brought into contact with the sealing cover material 6 from above the lid body 1, and the roller electrode 11 is moved along the peripheral edge portion of the lid body 1 while applying a predetermined pressure and applying a current. The brazing material 4 is locally melted by joule heat corresponding to the current value of the roller electrode 11, and the brazing material 4 is melted by instantaneously heating to a temperature equal to or higher than the melting point of the high melting point metal powder (Ag powder 21 and Cu powder 22) by appropriately setting the current value.
Although not shown in the drawings, the brazing material 4 may be heated instantaneously by irradiating the joining surface with laser light or an electron beam in a state where the sealing lid material 6 is superimposed on the package 5.
In this way, by melting the high-melting-point metal powders 21 and 22, the low-melting-point metal is also included, the entire brazing material 4 is in a molten state, and a brazing alloy is formed from each metal included, thereby completing the sealing. For example, the solder bonding material 4 containing Sn as Ag, Cu, or a low melting point metal is an Ag — Cu — Sn based solder alloy, and can bond the lid 1 and the package 5.
In this alloying step, when a heating method such as seam welding, laser welding, or electron beam welding is used to locally raise the temperature of the seal portion, a part of the seal portion is sequentially locally heated, and thus thermal shock or mechanical stress is generated in the heated portion and the unheated portion. From this point, the brazing material 4 has a porous structure having a porosity of 10% or more and having voids therein, and thus thermal shock and mechanical stress during welding can be alleviated. Therefore, the sealing layer between the package 5 and the lid 1 or the package 5 is prevented from cracking, and the package 5 and the lid 1 can be hermetically sealed. Further, since the sealing property is lowered when the porosity of the brazing material 4 is increased, the porosity is preferably 35% or less.
The brazing material 4 is formed into a porous structure having voids therein, but when the brazing material 4 is heated to the melting temperature of the Ag powder 21 and the Cu powder 22 to melt Ag and Cu and the low melting point metal to be alloyed, that is, when the brazing material 4 is heated along the peripheral edge portion of the lid body 1 by various welding methods, the melted portions of the brazing material 4 move in sequence, and therefore the voids inside the brazing material 4 are pushed out to the outside along with the movement of the melted portions, and the package 5 and the lid body 1 can be reliably hermetically sealed.
When the solder bonding material 4 is used for bonding a substrate and a mounted object, for example, that is, when hermetic sealing is not necessary unlike the sealing application of the package 5, an alloying step is not necessarily required. In the brazing material 4, the substrate and the object to be mounted may be joined without alloying Ag and Cu with the low melting point metal or partially alloying them, and with the porous structure remaining.
In the method of joining and sealing the lid body 1 and the package 5 in this manner, since the brazing material 4 is formed in advance on the lid body 1, the brazing material 4 can be easily formed stably on the surface of the lid body 1, and the brazing material 4 does not fall off from the lid body 1 when the sealing lid material 6 is handled, and the handling is easy. As described above, the sealing paste 20 is a brazing material 4 (sealing frame) that can be applied to the surface of the carrier 3 or the lid body 1 by printing or the like and can be easily formed into a desired shape. The operation of forming the lid body 1 with the brazing material 4 can be performed by heat treatment at a low temperature, and is efficient.
Further, the alloying step is performed in a state where the sealing lid material 6 after the heat treatment step is stacked on the package 5 with the brazing material 4 interposed therebetween, whereby the alloying and sealing of the brazing material 4 can be performed at the same time, and therefore, the efficiency is high.
Further, since the raw material powder mixed in the sealing slurry 20 contains a plurality of kinds of metal powder in combination, the mixing ratio and the kind of each metal powder can be easily changed, and the alloy composition can be easily changed.
In addition, when the raw material powder mixed in the sealing slurry is silver brazing alloy powder, it is necessary to heat the raw material powder to a temperature equal to or higher than the melting temperature (liquidus temperature) of the silver brazing alloy in forming the brazing material, but the brazing material 4 of the present embodiment can be formed by liquid phase sintering of the low melting point metal and heating the raw material powder at the melting temperature (lower than 240 ℃) of the low melting point metal, and therefore, a furnace or the like does not need to use equipment of high temperature specification, and the processing energy can be reduced.
Further, the package sealing method may also employ: a method (not shown) of laminating the previously prepared brazing material 4 between the package 5 and the lid body 1, and then heating and melting the brazing material 4 to alloy the brazing material. That is, in the package sealing method, a slurry coating step, a heat treatment step, and an alloying step are performed; a slurry coating step of coating the sealing slurry 20 on the carrier 3; a heat treatment step of heating the sealing slurry 20 applied to the carrier 3 at a melting temperature of the low-melting metal to cause a liquid phase of the low-melting metal to penetrate between the Ag powder 21 and the Cu powder 22, and then cooling and solidifying the mixture to form the brazing material 4 having a porosity of 10% or more in which the Ag powder 21 and the Cu powder 22 are joined by the joining layer 24 made of the low-melting metal; in this alloying step, the brazing material 4 is laminated between the package 5 and the lid body 1, and then the brazing material 4 is heated and melted to alloy the brazing material into a brazing alloy.
Examples
In examples 1 to 9 and comparative examples 1 to 11, 100 samples of the package and the lid (sealing lid) were used for the experiment. The package used a ceramic (alumina) having a planar size of 3.2mm × 2.5mm and a thickness of 0.5mm, and a gold-plated layer of 0.5 μm was formed as a metal plating (metallization layer) on the nickel-plated layer of 5 μm. As the lid, a cobalt plate having a plane size of 3.1 mm. times.2.4 mm and a thickness of 0.1mm was used, and a 0.1 μm gold-plated layer was formed as a metal plating (metallized layer) on a 5 μm nickel-plated layer.
The sealing slurries forming the sealing caps of examples 1 to 9 and comparative examples 1 to 10 were prepared by mixing the raw material powders and the binder, which were obtained by mixing the metal powders at the mixing ratios and the average particle diameters shown in table 1. SAC305 in Table 1 is a Sn-Ag-Cu solder alloy of Sn-3 mass% Ag-0.5 mass% Cu. Next, after applying these sealing slurries to the respective caps, a brazing material was formed by heat treatment at a maximum temperature of 240 ℃ to form a sealing cap material, and the sealing cap material was cleaned in order to remove the adhesive.
The median diameter (D50) of the particle diameters measured by a laser diffraction/scattering particle size distribution measuring apparatus was defined as the average particle diameter for each metal powder.
A rolled material of a silver brazing alloy having no porous structure (BAg-8: 72 mass% Ag-28 mass% Cu) was used as the brazing material of comparative example 11.
In the brazing material formed of the sealing cap materials of examples 1 to 9 and comparative examples 1 to 11, the porosity was calculated using the equation of (ρ 1 — ρ 2)/ρ 1, where ρ 1 is the theoretical density of the mixed powder (raw material powder) of the composition, and ρ 2 is the density of the brazing material after cleaning measured by the archimedes method.
In addition, the brazing material of comparative examples 7 and 10 was peeled off in the adhesive removing step. In addition, the brazing material of comparative example 8 collapsed in shape during the heat treatment process, and could not retain its shape. Therefore, the brazing materials of comparative examples 7, 8, and 10 were not able to measure the porosity, and the porosity was indicated by "-".
Next, the respective lid bodies (sealing lid materials) are stacked on the package body and seam-welded to perform airtight sealing.
Thereafter, the vicinity of the joint between the package and the lid was observed with a solid microscope (magnification × 50), and the presence or absence of cracks was checked. The ceramic package near the joint was judged as good (OK) without cracks and as bad (NG) with cracks (table 2).
Then, an airtight sealing test based on He leak test and in-liquid bubbling test was performed on each of 100 samples, and the airtight failure rate was checked based on the number of leaks generated. The sealing property evaluation was defined as pass (OK) when the hermetic defect rate was less than 2% in both the He leak test and the in-liquid foaming test, and as fail (NG) when the hermetic defect rate was 2% or more in at least one of the tests (table 2).
These results are shown in table 2.
[ Table 1]
[ Table 2]
| Cracking of | Sealing property | |
| Example 1 | OK | OK |
| Example 2 | OK | OK |
| Example 3 | OK | OK |
| Example 4 | OK | OK |
| Example 5 | OK | OK |
| Example 6 | OK | OK |
| Example 7 | OK | OK |
| Example 8 | OK | OK |
| Example 9 | OK | OK |
| Comparative example 1 | OK | NG |
| Comparative example 2 | OK | NG |
| Comparative example 3 | OK | NG |
| Comparative example 4 | OK | NG |
| Comparative example 5 | OK | NG |
| Comparative example 6 | OK | NG |
| Comparative example 7 | - | - |
| Comparative example 8 | - | - |
| Comparative example 9 | NG | OK |
| Comparative example 10 | - | - |
| Comparative example 11 | NG | OK |
As is apparent from tables 1 and 2, as the raw material powders, the sealing pastes containing Ag powder having an average particle size of 0.1 μm to 10.0 μm and 40 mass% to 90 mass%, Cu powder having an average particle size of 0.1 μm to 10.0 μm and 5 mass% to 50 mass%, and low-melting-point metal powder having an average particle size of 0.5 μm to 20.0 μm and 5 mass% to 40 mass% were used, and the sealing lid materials of examples 1 to 9 having the porous structure with the porosity of 10% or more were not cracked, and the package was highly airtight and could be sealed satisfactorily.
When the average particle size of the Ag powder and the Cu powder mixed in the sealing paste is less than 0.1 μm and the average particle size of the low-melting metal powder is less than 0.5 μm (comparative example 9), the porosity of the solder bonding material formed using the sealing paste is less than 10%, and cracks are generated in the bonding layer between the package and the lid body or in the package itself. On the other hand, when the average particle diameters of the Ag powder and the Cu powder exceed 10 μm (comparative example 1), the porosity of the formed brazing material increases, and the sealing property deteriorates. When the average particle diameter of the low-melting metal powder exceeds 20 μm (comparative example 2), the porosity of the formed brazing material also increases, and the sealing property also deteriorates.
If the content ratio of Ag powder is less than 40 mass% (comparative example 3), the sealing property is lowered, and if it exceeds 90 mass% (comparative example 10), peeling occurs in the binder removal step. When the content ratio of the Cu powder is out of the range of 5 mass% to 50 mass%, that is, when it is less than 5 mass% (comparative examples 4 and 10) or when it exceeds 50 mass% (comparative examples 5 and 7), the sealing property is lowered. When the content ratio of the low melting point metal powder is less than 5% by mass (comparative examples 7 and 10), peeling occurs in the binder removal step, and when it exceeds 40% by mass (comparative example 6), the sealing property is lowered.
The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the present invention.
Industrial applicability
The solder material having a porous structure can be easily changed in alloy composition, and thus the package can be reliably hermetically sealed without generating cracks.
Description of the symbols
1-cover body, 2-plate, 3-carrier, 4-brazing bonding material, 5-packaging body, 6-sealing cover material, 11-roller electrode, 20-sealing slurry, 21-Ag powder, 22-Cu powder, 23-low-melting-point metal powder, 24-bonding layer, 25-adhesive and 41-gap.
Claims (8)
1. A method for sealing a package in which a package and a lid are joined to each other by a brazing alloy, comprising:
a slurry coating step of coating a sealing slurry on the surface of the lid body, the sealing slurry containing a raw material powder and a binder, the raw material powder containing 5 mass% to 40 mass% of a low-melting-point metal powder having an average particle diameter of 0.5 μm to 20.0 μm and a melting point or liquidus temperature of less than 240 ℃, 40 mass% to 90 mass% of an Ag powder having an average particle diameter of 0.1 μm to 10.0 μm, and 5 mass% to 50 mass% of a Cu powder having an average particle diameter of 0.1 μm to 10.0 μm;
a heat treatment step of heating the sealing paste applied to the lid body at a melting temperature of the low-melting metal to cause a liquid phase of the low-melting metal to penetrate between the Ag powder and the Cu powder, and then cooling and solidifying the paste to form a solder bonding material having a porosity of 10% or more in which the Ag powder and the Cu powder are bonded to each other by a bonding layer formed of the low-melting metal; and
and an alloying step of melting the Ag powder and the Cu powder of the brazing material in a state where the lid body is superimposed on the package, thereby also including the low melting point metal to make the entire body in a molten state, and forming a brazing alloy from the respective metals included therein.
2. The package sealing method according to claim 1, wherein a porosity of the brazing material is 35% or less.
3. The package sealing method according to claim 1 or 2,
an adhesive removing step of removing an adhesive remaining in the brazing material is provided between the heat treatment step and the alloying step.
4. The package sealing method according to claim 3,
the binder removal step includes: a cleaning process of cleaning the brazing bonding material with a cleaning liquid; and heat-treating the brazing bonding material after the cleaning treatment.
5. The package sealing method according to claim 1 or 2,
in the slurry applying step, the sealing slurry is applied to a surface of a plate material having a size capable of forming a plurality of the lid bodies,
and a step of dividing the plate material into individual pieces of the lid body after the heat treatment step.
6. The package sealing method according to claim 5, comprising:
and a plating step of performing metal plating on the surface of the lid body after the singulation step.
7. A method for sealing a package in which a lid is superimposed on a package and the lid is joined to the package by a solder alloy, the method comprising the steps of:
a slurry coating step of coating a carrier with a sealing slurry containing a raw material powder and a binder, the raw material powder containing 5 to 40 mass% of a low-melting-point metal powder having an average particle diameter of 0.5 to 20.0 [ mu ] m and a melting point or liquidus temperature of less than 240 ℃, 40 to 90 mass% of an Ag powder having an average particle diameter of 0.1 to 10.0 [ mu ] m, and 5 to 50 mass% of a Cu powder having an average particle diameter of 0.1 to 10.0 [ mu ] m;
a heat treatment step of heating the sealing slurry applied to the carrier at a melting temperature of the low-melting metal to cause a liquid phase of the low-melting metal to penetrate between the Ag powder and the Cu powder, and then cooling and solidifying the mixture to form a solder bonding material in which the Ag powder and the Cu powder are bonded to each other by a bonding layer formed of the low-melting metal and which has a porosity of 10% or more; and
and an alloying step of forming a solder alloy from the metals contained by the Ag powder and the Cu powder, which are contained in the brazing material, by melting the Ag powder and the Cu powder of the brazing material after the brazing material is laminated between the package and the lid.
8. The package sealing method according to claim 7, wherein a porosity of the brazing material is 35% or less.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-222900 | 2014-10-31 | ||
| JP2014222900 | 2014-10-31 | ||
| JP2015164700 | 2015-08-24 | ||
| JP2015-164700 | 2015-08-24 | ||
| JP2015-213467 | 2015-10-29 | ||
| JP2015213467A JP6575301B2 (en) | 2014-10-31 | 2015-10-29 | Sealing paste, brazing joint material and method for producing the same, sealing lid material and method for producing the same, and package sealing method |
| PCT/JP2015/080651 WO2016068272A1 (en) | 2014-10-31 | 2015-10-30 | Sealing paste, brazing material and production method thereof, sealing lid member and production method thereof, and package sealing method |
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| Publication Number | Publication Date |
|---|---|
| CN106715039A CN106715039A (en) | 2017-05-24 |
| CN106715039B true CN106715039B (en) | 2020-06-12 |
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| CN201580051707.8A Active CN106715039B (en) | 2014-10-31 | 2015-10-30 | Package sealing method |
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| JP (1) | JP6575301B2 (en) |
| KR (1) | KR102203608B1 (en) |
| CN (1) | CN106715039B (en) |
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| US11095104B2 (en) * | 2017-05-05 | 2021-08-17 | Harvey L Frierson | Chord organizer |
| JP6890520B2 (en) * | 2017-10-04 | 2021-06-18 | 三菱電機株式会社 | Power semiconductor device |
| CN110961831B (en) | 2018-09-28 | 2022-08-19 | 株式会社田村制作所 | Forming solder and manufacturing method of forming solder |
| JP7500943B2 (en) * | 2019-10-11 | 2024-06-18 | 株式会社レゾナック | Metal paste for bonding, method for manufacturing bonded body, and bonded body |
| JP6845444B1 (en) * | 2019-10-15 | 2021-03-17 | 千住金属工業株式会社 | Joining material, manufacturing method of joining material and joining body |
| CN111926231B (en) * | 2020-08-27 | 2021-08-03 | 湘潭大学 | Method for preparing oxide dispersion strengthening MoNbTaVW refractory high-entropy alloy |
| CN113814504A (en) * | 2021-09-03 | 2021-12-21 | 广州德芯半导体科技有限公司 | Packaging method for non-high-temperature connection temperature sensor |
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| EP0110307A2 (en) * | 1982-11-24 | 1984-06-13 | Samsung Electronics Co., Ltd. | Semiconductor die-attach technique and composition therefor |
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| JPH05254949A (en) * | 1992-03-05 | 1993-10-05 | Nippon Cement Co Ltd | Brazing filler metal for joining metal to ceramics and joining method |
| JP3030479B2 (en) * | 1992-04-23 | 2000-04-10 | 日本特殊陶業株式会社 | Ceramic package |
| JP2803636B2 (en) | 1996-04-26 | 1998-09-24 | 日本電気株式会社 | Semiconductor integrated circuit package and method of manufacturing the same |
| JP2002160090A (en) * | 2000-11-27 | 2002-06-04 | Tanaka Kikinzoku Kogyo Kk | Ag-Cu-In-BASED BRAZING FILLER MATERIAL AND METHOD FOR PRODUCING THE SAME |
| JP2003163299A (en) * | 2001-11-29 | 2003-06-06 | Nippon Filcon Co Ltd | Sealing cap for electronic element package and its manufacturing method as well as method for sealing using the cap |
| JP2006049595A (en) | 2004-08-05 | 2006-02-16 | Tanaka Kikinzoku Kogyo Kk | Silver solder cladding material, and lid and ring for package sealing |
| WO2006075459A1 (en) * | 2005-01-11 | 2006-07-20 | Murata Manufacturing Co., Ltd | Solder paste and electronic device |
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| CN101529583B (en) * | 2006-09-01 | 2011-03-02 | 千住金属工业株式会社 | Lid for functional part and process for producing the same |
| JP5537119B2 (en) * | 2009-10-28 | 2014-07-02 | 京セラ株式会社 | Lid, lid manufacturing method and electronic device manufacturing method |
| JP2013081966A (en) * | 2011-10-06 | 2013-05-09 | Fujitsu Ltd | Conductive bonding material, conductor bonding method, and semiconductor device production method |
| US11440142B2 (en) * | 2012-11-16 | 2022-09-13 | Ormet Circuits, Inc. | Alternative compositions for high temperature soldering applications |
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2015
- 2015-10-29 JP JP2015213467A patent/JP6575301B2/en not_active Expired - Fee Related
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0110307A2 (en) * | 1982-11-24 | 1984-06-13 | Samsung Electronics Co., Ltd. | Semiconductor die-attach technique and composition therefor |
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|---|---|
| KR20170074913A (en) | 2017-06-30 |
| JP2017039163A (en) | 2017-02-23 |
| CN106715039A (en) | 2017-05-24 |
| KR102203608B1 (en) | 2021-01-14 |
| JP6575301B2 (en) | 2019-09-18 |
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