CN106687893B - 布线体、布线基板、触摸传感器以及布线体的制造方法 - Google Patents

布线体、布线基板、触摸传感器以及布线体的制造方法 Download PDF

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Publication number
CN106687893B
CN106687893B CN201580047455.1A CN201580047455A CN106687893B CN 106687893 B CN106687893 B CN 106687893B CN 201580047455 A CN201580047455 A CN 201580047455A CN 106687893 B CN106687893 B CN 106687893B
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CN
China
Prior art keywords
wiring body
conductor pattern
conductive
wiring
top edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580047455.1A
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English (en)
Chinese (zh)
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CN106687893A (zh
Inventor
本户孝治
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Fujikura Ltd
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Fujikura Ltd
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Publication of CN106687893A publication Critical patent/CN106687893A/zh
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Publication of CN106687893B publication Critical patent/CN106687893B/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
CN201580047455.1A 2014-12-26 2015-12-25 布线体、布线基板、触摸传感器以及布线体的制造方法 Expired - Fee Related CN106687893B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014264492 2014-12-26
JP2014-264492 2014-12-26
PCT/JP2015/086271 WO2016104723A1 (ja) 2014-12-26 2015-12-25 配線体、配線基板、タッチセンサ、及び配線体の製造方法

Publications (2)

Publication Number Publication Date
CN106687893A CN106687893A (zh) 2017-05-17
CN106687893B true CN106687893B (zh) 2020-05-22

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CN201580047455.1A Expired - Fee Related CN106687893B (zh) 2014-12-26 2015-12-25 布线体、布线基板、触摸传感器以及布线体的制造方法

Country Status (6)

Country Link
US (1) US10379645B2 (enExample)
EP (1) EP3190488B1 (enExample)
JP (2) JP6046867B2 (enExample)
CN (1) CN106687893B (enExample)
TW (1) TWI587191B (enExample)
WO (1) WO2016104723A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106605455B (zh) * 2015-01-30 2020-04-14 株式会社藤仓 布线体、布线基板以及触摸传感器
CN104820533B (zh) * 2015-05-22 2019-03-12 京东方科技集团股份有限公司 触摸基板及其制备方法、显示装置
JPWO2017110038A1 (ja) * 2015-12-25 2018-10-18 パナソニックＩｐマネジメント株式会社 タッチパネルと、これを用いた表示装置
US20190327829A1 (en) * 2016-07-12 2019-10-24 Fujikura Ltd. Stretchable board
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
US12446160B2 (en) * 2016-07-28 2025-10-14 Landa Labs (2012) Ltd. Application of electrical conductors to an electrically insulating substrate
JP2019046405A (ja) * 2017-09-07 2019-03-22 日本航空電子工業株式会社 タッチセンサデバイス
KR102083184B1 (ko) * 2018-04-17 2020-03-02 울산과학기술원 자가 부착 투명 전극 및 이의 제조방법
WO2020066817A1 (ja) * 2018-09-28 2020-04-02 大日本印刷株式会社 配線基板および配線基板の製造方法
JP7115687B2 (ja) 2019-01-23 2022-08-09 株式会社デンソー カーボンナノチューブパターン配線、それを有する透明導電基板およびヒータ
KR102705615B1 (ko) * 2019-06-25 2024-09-12 삼성디스플레이 주식회사 표시 장치의 제조 방법 및 이에 사용되는 레이저 장치
KR20230004562A (ko) 2020-05-01 2023-01-06 다이니폰 인사츠 가부시키가이샤 배선 기판 및 배선 기판의 제조 방법
JP7374059B2 (ja) 2020-09-25 2023-11-06 コネクテックジャパン株式会社 配線形成方法
TWI784681B (zh) * 2021-08-20 2022-11-21 錼創顯示科技股份有限公司 微型發光二極體顯示裝置

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JPH04240792A (ja) * 1991-01-24 1992-08-28 Matsushita Electric Ind Co Ltd 回路基板の製造方法
JPH07169635A (ja) * 1993-09-21 1995-07-04 Matsushita Electric Ind Co Ltd 電子部品およびその製造方法
JP2006302930A (ja) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた電子部品実装体およびそれらの製造方法
JP2007324426A (ja) * 2006-06-02 2007-12-13 Hitachi Ltd パターン形成方法、導体配線パターン
JP2011139097A (ja) * 2005-04-25 2011-07-14 Brother Industries Ltd パターン形成方法
JP2012185813A (ja) * 2011-02-18 2012-09-27 Fujifilm Corp 導電シート及びタッチパネル

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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04240792A (ja) * 1991-01-24 1992-08-28 Matsushita Electric Ind Co Ltd 回路基板の製造方法
JPH07169635A (ja) * 1993-09-21 1995-07-04 Matsushita Electric Ind Co Ltd 電子部品およびその製造方法
JP2006302930A (ja) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた電子部品実装体およびそれらの製造方法
JP2011139097A (ja) * 2005-04-25 2011-07-14 Brother Industries Ltd パターン形成方法
JP2007324426A (ja) * 2006-06-02 2007-12-13 Hitachi Ltd パターン形成方法、導体配線パターン
JP2012185813A (ja) * 2011-02-18 2012-09-27 Fujifilm Corp 導電シート及びタッチパネル

Also Published As

Publication number Publication date
TW201636797A (zh) 2016-10-16
JP6735212B2 (ja) 2020-08-05
JP2017041654A (ja) 2017-02-23
TWI587191B (zh) 2017-06-11
US10379645B2 (en) 2019-08-13
EP3190488B1 (en) 2019-05-15
EP3190488A1 (en) 2017-07-12
JPWO2016104723A1 (ja) 2017-04-27
WO2016104723A1 (ja) 2016-06-30
JP6046867B2 (ja) 2016-12-21
EP3190488A4 (en) 2017-10-25
US20170285786A1 (en) 2017-10-05
CN106687893A (zh) 2017-05-17

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