CN106661227B - 介电膜及其制造方法、显示器及其制造方法、组成物以及触控面板 - Google Patents

介电膜及其制造方法、显示器及其制造方法、组成物以及触控面板 Download PDF

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CN106661227B
CN106661227B CN201580044448.6A CN201580044448A CN106661227B CN 106661227 B CN106661227 B CN 106661227B CN 201580044448 A CN201580044448 A CN 201580044448A CN 106661227 B CN106661227 B CN 106661227B
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dielectric film
nitride
siloxane
particles
substrate
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CN106661227A (zh
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朱哈·连达拉
亚克·海基宁
剑倪·其玛
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Inkron Oy
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    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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  • Macromonomer-Based Addition Polymer (AREA)
  • Liquid Crystal (AREA)
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