CN106504988A - 一种金刚石热沉衬底GaN HEMTs制备方法 - Google Patents
一种金刚石热沉衬底GaN HEMTs制备方法 Download PDFInfo
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Abstract
本发明公开了一种金刚石热沉衬底GaN基HEMTs制备方法,包括在蓝宝石衬底上MOCVD生长GaN基HEMTs外延结构;再采用激光剥离技术对蓝宝石衬底进行剥离;再刻蚀、抛光GaN底表面外延层,同时抛光金刚石热沉片;再在GaN底表面和金刚石热沉片抛光淀积薄层键合粘合剂,进行低温键合、固化得到金刚石/GaN基HEMTs外延材料/Si三层结构;再去除金刚石/GaN基HEMTs外延材料/Si三层结构中Si晶片的临时支撑材料,得到金刚石/GaN基HEMTs外延材料两层结构;再ICP刻蚀GaN基HEMTs外延材料,进行器件隔离;最后制备器件电极。本发明采用高热导率的金刚石做热沉,散热效果优;低温键合方法有效避免了传统的高温键合对材料性能的损伤;蓝宝石衬底激光剥离有效避免了激光剥离对GaN基HEMTs外延材料性能的影响。
Description
【技术领域】
本发明属于GaN HEMTs散热技术领域,具体涉及一种金刚石热沉衬底GaN HEMsT制备方法。
【背景技术】
GaN HEMTs作为典型的功率半导体器件,具有耐高压、大电流、高功率、耐高温的优势,是一种非常有应用前景的电力电子器件。然而随着器件输出功率的不断提高,器件所产生的热量将急剧升高,如果这些热量没有及时散发出去,器件内部因发热产生的高温将严重影响器件的性能。因此,散热成为GaN HEMTs功率器件设计和制造过程中一个亟待解决课题。
传统的解决GaN HEMTs功率器件散热的方法是将器件制备在蓝宝石或SiC衬底上,利用蓝宝石、SiC衬底散热,然而蓝宝石、SiC有限热导率(蓝宝石热导率35W/m·K、SiC热导率490W/m·K)很难满足器件高频、大功率应用时的散热需求。金刚石具有极高的热导率,IIa型天然单晶金刚石的室温热导率高达2000W/m·K,采用金刚石作热沉可以有效地解决GaN HEMTs功率器件散热问题。
【发明内容】
本发明所要解决的技术问题在于针对上述现有技术中的不足,提出一种金刚石热沉衬底GaN HEMTs制备方法,其目的在于形成以金刚石衬底做热沉的GaN HEMTs器件,利用金刚石的高热导率来解决GaN HEMTs功率器件高频、大功率应用时的散热问题。
本发明采用以下技术方案:
一种金刚石热沉衬底GaN基HEMTs制备方法,包括以下步骤:
S1:在蓝宝石衬底上MOCVD生长GaN基HEMTs外延结构;
S2:采用激光剥离技术对步骤S1所述蓝宝石衬底进行剥离;
S3:刻蚀、抛光GaN底表面外延层,同时抛光金刚石热沉片;
S4:将步骤S2制备的所述GaN底表面和步骤S3制备的所述金刚石热沉片表面进行抛光并淀积薄层,薄层上键合粘合剂,进行低温键合、固化得到金刚石/GaN基HEMTs外延材料/Si三层结构;
S5:去除所述步骤S4得到的金刚石/GaN基HEMTs外延材料/Si三层结构中Si晶片的临时支撑材料,得到金刚石/GaN基HEMTs外延材料两层结构;
S6:ICP刻蚀GaN基HEMTs外延材料,进行器件隔离;
S7:制备器件电极。
进一步的,所述步骤S1具体包括以下步骤:
S11:蓝宝石衬底清洗,丙酮、去离子水分别超声2~3分钟;
S12:将蓝宝石衬底在900~1000℃的H2气氛下进行烘烤;
S13:以三甲基镓和氨气分别作为Ga源和N源,N2和H2作为载气,530~580℃下采用MOCVD技术在蓝宝石衬底上低温生长20nm的GaN成核层;
S14:继续升温至1050℃生长3.5μm的GaN缓冲层;
S15:再升温至1100℃,在氢气氛围下生长100nm的GaN-UID沟道层;
S16:保持温度不变,以三甲基铝和氨气分别作为Al源和N源在生长1nm的AlN插入层;
S17:最后以三甲基镓、三甲基铝和氨气分别作为Ga源、Al源和N源,N2和H2作为载气MOCVD交替生长25nm的AlGaN势垒层。
进一步的,所述外延材料具体为:蓝宝石衬底单面抛光,厚度500μm,GaN成核层厚度20nm,GaN缓冲层厚度3.5μm,本征GaN层厚度100nm,AlN层厚度1nm,AlGaN势垒层厚度20nm。
进一步的,步骤S2具体为:
S21:取Si晶片作为临时支撑材料,用热塑性粘合剂将所述Si临时支撑材料粘到所述GaN基HEMTs外延材料上,形成蓝宝石/GaN基HEMTs外延材料/Si三层结构;
S22:用波长248~480nm,脉冲宽度38ns KrF脉冲激光从蓝宝石一面扫描整个样品,激光脉冲的能量密度由焦距40cm的石英透镜调节;
S23:加热所述蓝宝石/GaN基HEMTs外延材料Si三层结构,去除蓝宝石衬底,得到GaN基HEMTs外延材料/Si两层结构。
进一步的,所述步骤S23中,加热所述蓝宝石衬底到Ga的熔点29℃以上。
进一步的,所述步骤S4中低温键合具体为:分别对GaN底表面和金刚石热沉片表面进行抛光并淀积一薄层,薄层上设置有键合粘合剂苯并环丁烯BCB,然后将所述GaN底表面和金刚石热沉片紧密接触进行低温键合、固化得到金刚石/GaN基HEMTs外延材料/Si三层结构,键合、固化温度不超过150℃。
进一步的,所述步骤S6具体为:
先对所述金刚石热沉/GaN基HEMTs外延材料清洗,再进行欧姆接触,然后离子注入隔离,形成肖特基栅,最后生长Si3N4隔离层。
进一步的,所述外延清洗采用三氯化碳、四氯乙烯、丙酮、乙醇、去离子水超声各3~5分钟,氮气吹干;然后采用磁控溅射Ti/Al/TiAu,N2保护下在850~900℃、50s进行退火;再注He+20KeV,1×1015cm-2和50KeV,1×1014cm-2;然后光刻3μm栅,磁控溅射Ni/Au,剥离形成肖特基栅,最后生长隔离层。
进一步的,所述步骤S7制备器件电极具体为:先磁控溅射Ti/Al/TiAu制备源、漏欧姆电极,再He+离子注入隔离,磁控溅射Ni/Au,剥离形成肖特基栅电极;接着PECVD生长Si3N4场板绝缘介质层;然后用ICP刻蚀进行第一次刻孔;然后磁控溅射金属Ni/Au,剥离形成源金属场板;然后在PECVD上生长Si3N4钝化层;然后用ICP刻蚀进行第二次刻蚀接触孔;然后磁控溅射Ni/Au,加厚电极;最后划片封装。
与现有技术相比,本发明至少具有以下有益效果:
本发明一种金刚石热沉衬底GaN基HEMTs制备方法采用高热导率的金刚石做热沉,散热效果优于传统的衬底;键合方法采用低温工作方式,有效避免了传统的高温键合对材料性能的损伤;蓝宝石衬底激光剥离过程中,先把GaN基HEMTs外延材料倒转到Si临时支撑材料上,有效避免了激光剥离对GaN基HEMTs外延材料性能的影响。;
进一步的,蓝宝石衬底在1000℃的H2气氛下进行烘烤,能够除去表面吸附杂质,AlN插入层用来减少AlGaN势垒层三元合金散射,提高二维电子气的迁移率。
综上所述,本发明所述制备方法工艺简单、容易实现,重复性好。
下面通过附图和实施例,对本发明的技术方案做进一步的详细描述。
【附图说明】
图1为实施例1蓝宝石衬底GaN基HEMTs外延材料剖面图;
图2为实施例2蓝宝石衬底GaN基HEMTs外延材料向Si临时支撑材料转移示意图;
图3为实施例2脉冲激光扫描蓝宝石衬底示意图;
图4为实施例2蓝宝石衬底剥离示意图;
图5为实施例3GaN基HEMTs外延材料与金刚石热沉衬底键合示意图;
图6为实施例3去除Si临时支撑材料示意图;
图7为实施例4ICP刻蚀示意图;
图8为实施例4制备器件电极、场板、钝化层示意图。
其中:1.蓝宝石衬底;2.GaN成核层;3.GaN缓冲层;4.本征GaN层;5.二维电子层;6.AlN层;7.AlGaN势垒层;8.Si临时支撑材料;9.粘合剂苯并环丁烯(BCB);10.金刚石热沉衬底;11.源欧姆电极;12.漏欧姆电极;13.肖特基栅电极;14.场板绝缘介质层;15.金属场板;16.钝化层。
【具体实施方式】
一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,包括以下步骤:
S1:在蓝宝石衬底1上MOCVD生长GaN基HEMTs外延材料;
请参阅图1所示,所述蓝宝石衬底GaN基HEMTs外延材料,蓝宝石衬底(0001)单面抛光,厚度500μm,GaN成核层2厚度20nm,GaN缓冲层3厚度3.5μm,本征GaN层4厚度100nm,本征GaN层4上设置有二维电子层5,AlN层6厚度1nm,AlGaN势垒层7厚度20nm,蓝宝石衬底1上外延生长GaN基HEMTs外延材料包括以下步骤:
(1)蓝宝石衬底清洗,丙酮、去离子水超声各2~3分钟;
(2)将蓝宝石衬底在900~1000℃的H2气氛下进行烘烤,除去表面吸附杂质;
(3)以三甲基镓TMGa和氨气NH3分别作为Ga源和N源,N2和H2作为载气,530~580℃下采用MOCVD技术在蓝宝石衬底上低温生20nmGaN成核层;
(4)接着升温至1050℃生长3.5μmGaN缓冲层;
(5)升温至1100℃,在氢气氛围下生长100nm厚GaN-UID沟道层;
(6)保持温度不变,以三甲基铝TMAl和氨气NH3分别作为Al源和N源在生长1nm厚AlN插入层,AlN插入层主要用来减少AlGaN势垒层三元合金散射,提高二维电子气的迁移率。
(7)最后以三甲基镓TMGa,三甲基铝TMAl和氨气NH3分别作为Ga源、Al源和N源,N2和H2作为载气MOCVD交替生长25nm厚AlGaN势垒层。
S2:采用激光剥离技术对步骤S1所述蓝宝石衬底进行剥离;
请参阅图2、图3和图4所示,器件临时支撑材料为(111)晶向Si的晶片,扫描激光采用波长为248~480nm,脉冲宽度为38ns KrF脉冲激光。包括以下步骤:
(1)取一块Si(111)的晶片作为Si临时支撑材料8,用粘合剂将所述蓝宝石衬底GaN基HEMTs外延材料临时倒转到Si临时支撑材料8上,形成蓝宝石/蓝GaN基HEMTs外延材料/Si的三层结构;
(2)用一束波长248~480nm,脉冲宽度38ns KrF脉冲激光从蓝宝石一面扫描整个样品;激光脉冲的能量密度可以由一个焦距40cm的石英透镜来调节。
(3)加热所述蓝宝石/GaN基HEMTs外延材料Si三层结构(加热衬底到Ga的熔点29℃以上)去除蓝宝石衬底,得到GaN基HEMTs外延材料/Si两层结构;
S3:刻蚀、抛光GaN底表面外延层,同时抛光金刚石热沉片;
S4:将步骤S2制备的所述GaN底表面和步骤S3制备的所述金刚石热沉片表面进行抛光并淀积薄层,薄层上键合粘合剂,进行低温键合、固化得到金刚石/GaN基HEMTs外延材料/Si三层结构;
S5:去除所述金刚石/GaN基HEMTs外延材料/Si三层结构中Si晶片的临时支撑材料,得到金刚石/GaN基HEMTs外延材料两层结构;
请参阅图5、图6和图7所示,金刚石为多晶金刚石,厚度0.3mm,粘合剂为苯并环丁烯(BCB),键合时间25~30min,键合和固化温度低于150℃。采用粘合剂低温键合技术来完成GaN基HEMTs外延材料与金刚石热沉衬底10低温键合,包括以下步骤:
(1)刻蚀、抛光所述暴露的GaN底表面外延层,抛光到纳米级表面粗糙度,为晶片键合做准备,同时抛光金刚石热沉片;
(2)在所述暴露的GaN底表面和金刚石热沉片抛光淀积一薄层键合粘合剂苯并环丁烯(BCB),所述两部分紧密接触进行低温键合、固化得到金刚石/GaN基HEMTs外延材料/Si三层结构,键合、固化温度不超过150℃。
(3)请参阅图7所示,去除所述金刚石/GaN基HEMTs外延材料/Si三层结构中Si晶片临时支撑材料,得到金刚石热沉衬底/GaN基HEMTs外延结构。
S6:ICP刻蚀GaN基HEMTs外延材料,进行器件隔离;
S7:制备器件电极。
请参阅图8所示,肖特基栅电极采用Ni/Au复合两层金属结构,源、漏欧姆电极采用Ti/Al/Ti/Au多层技术结构,场板绝缘介质采用氮化硅。完成金刚石热沉衬底GaN基HEMTs的隔离、电极与场板的制备,包括以下步骤:
(1)所述金刚石热沉/GaN基HEMTs外延材料清洗,三氯化碳、四氯乙烯、丙酮、乙醇、去离子水超声各3~5分钟,氮气吹干。
(2)制备源欧姆电极11和漏欧姆电极12:磁控溅射Ti/Al/TiAu,N2保护下850~900℃、50s退火;
(3)离子注入隔离:注He+20KeV,1×1015cm-2和50KeV,1×1014cm-2;
(4)形成肖特基栅电极:光刻3μm栅,磁控溅射Ni/Au,剥离形成肖特基栅电极13;
(5)PECVD生长Si3N4场板绝缘介质层14;
(6)ICP第一次刻孔;
(7)磁控溅射金属Ni/Au,剥离形成金属源场板15;
(8)PECVD生长Si3N4钝化层16;
(9)ICP第二次刻蚀接触孔;
(10)磁控溅射Ni/Au,加厚电极;
(11)划片封装。
Claims (9)
1.一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,包括以下步骤:
S1:在蓝宝石衬底上MOCVD生长GaN基HEMTs外延结构;
S2:采用激光剥离技术对步骤S1所述蓝宝石衬底进行剥离;
S3:刻蚀、抛光GaN底表面外延层,同时抛光金刚石热沉片;
S4:将步骤S2制备的所述GaN底表面和步骤S3制备的所述金刚石热沉片表面进行抛光并淀积薄层,薄层上键合粘合剂,进行低温键合、固化得到金刚石/GaN基HEMTs外延材料/Si三层结构;
S5:去除所述步骤S4得到的金刚石/GaN基HEMTs外延材料/Si三层结构中的Si晶片的临时支撑材料,得到金刚石/GaN基HEMTs外延材料两层结构;
S6:ICP刻蚀GaN基HEMTs外延材料,进行器件隔离;
S7:制备器件电极。
2.根据权利要求1所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,所述步骤S1具体包括以下步骤:
S11:蓝宝石衬底清洗,丙酮、去离子水分别超声2~3分钟;
S12:将蓝宝石衬底在900~1000℃的H2气氛下进行烘烤;
S13:以三甲基镓和氨气分别作为Ga源和N源,N2和H2作为载气,530~580℃下采用MOCVD技术在蓝宝石衬底上低温生长20nm的GaN成核层;
S14:继续升温至1050℃生长3.5μm的GaN缓冲层;
S15:再升温至1100℃,在氢气氛围下生长100nm的GaN-UID沟道层;
S16:保持温度不变,以三甲基铝和氨气分别作为Al源和N源在生长1nm的AlN插入层;
S17:最后以三甲基镓、三甲基铝和氨气分别作为Ga源、Al源和N源,N2和H2作为载气MOCVD交替生长25nm的AlGaN势垒层。
3.根据权利要求2所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,所述外延材料具体为:蓝宝石衬底单面抛光,厚度500μm,GaN成核层厚度20nm,GaN缓冲层厚度3.5μm,本征GaN层厚度100nm,AlN层厚度1nm,AlGaN势垒层厚度20nm。
4.根据权利要求1所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,步骤S2具体为:
S21:取Si晶片作为临时支撑材料,用热塑性粘合剂将所述Si临时支撑材料粘到所述GaN基HEMTs外延材料上,形成蓝宝石/GaN基HEMTs外延材料/Si三层结构;
S22:用波长248~480nm,脉冲宽度38ns KrF脉冲激光从蓝宝石一面扫描整个样品,激光脉冲的能量密度由焦距40cm的石英透镜调节;
S23:加热所述蓝宝石/GaN基HEMTs外延材料Si三层结构,去除蓝宝石衬底,得到GaN基HEMTs外延材料/Si两层结构。
5.根据权利要求4所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于:所述步骤S23中,加热所述蓝宝石衬底到Ga的熔点29℃以上。
6.根据权利要求1所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,所述步骤S4中低温键合具体为:分别对GaN底表面和金刚石热沉片表面进行抛光并淀积一薄层,薄层上设置有键合粘合剂苯并环丁烯BCB,然后将所述GaN底表面和金刚石热沉片紧密接触进行低温键合、固化得到金刚石/GaN基HEMTs外延材料/Si三层结构,键合、固化温度不超过150℃。
7.根据权利要求1所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,所述步骤S6具体为:
先对所述金刚石热沉/GaN基HEMTs外延材料清洗,再进行欧姆接触,然后离子注入隔离,形成肖特基栅,最后生长Si3N4隔离层。
8.根据权利要求7所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,所述外延清洗采用三氯化碳、四氯乙烯、丙酮、乙醇、去离子水超声各3~5分钟,氮气吹干;然后采用磁控溅射Ti/Al/TiAu,N2保护下在850~900℃、50s进行退火;再注He+20KeV,1×1015cm-2和50KeV,1×1014cm-2;然后光刻3μm栅,磁控溅射Ni/Au,剥离形成肖特基栅,最后生长隔离层。
9.根据权利要求1所述的一种金刚石热沉衬底GaN基HEMTs制备方法,其特征在于,所述步骤S7制备器件电极具体为:先磁控溅射Ti/Al/TiAu制备源、漏欧姆电极,再He+离子注入隔离,磁控溅射Ni/Au,剥离形成肖特基栅电极;接着PECVD生长Si3N4场板绝缘介质层;然后用ICP刻蚀进行第一次刻孔;然后磁控溅射金属Ni/Au,剥离形成源金属场板;然后在PECVD上生长Si3N4钝化层;然后用ICP刻蚀进行第二次刻蚀接触孔;然后磁控溅射Ni/Au,加厚电极;最后划片封装。
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