CN106501706A - 一种印刷电路板的盲孔检测方法 - Google Patents
一种印刷电路板的盲孔检测方法 Download PDFInfo
- Publication number
- CN106501706A CN106501706A CN201610953545.3A CN201610953545A CN106501706A CN 106501706 A CN106501706 A CN 106501706A CN 201610953545 A CN201610953545 A CN 201610953545A CN 106501706 A CN106501706 A CN 106501706A
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- Prior art keywords
- printed circuit
- blind hole
- circuit board
- pcb
- model
- Prior art date
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- 238000001514 detection method Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000012360 testing method Methods 0.000 claims abstract description 17
- 238000005259 measurement Methods 0.000 claims abstract description 14
- 230000007547 defect Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 9
- 208000003351 Melanosis Diseases 0.000 claims description 8
- 238000004364 calculation method Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 9
- 238000003825 pressing Methods 0.000 description 8
- 238000005553 drilling Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610953545.3A CN106501706B (zh) | 2016-11-03 | 2016-11-03 | 一种印刷电路板的盲孔检测方法 |
TW106109061A TWI618940B (zh) | 2016-11-03 | 2017-03-20 | 印刷電路板的盲孔檢測裝置與方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610953545.3A CN106501706B (zh) | 2016-11-03 | 2016-11-03 | 一种印刷电路板的盲孔检测方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106501706A true CN106501706A (zh) | 2017-03-15 |
CN106501706B CN106501706B (zh) | 2019-06-04 |
Family
ID=58322251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610953545.3A Active CN106501706B (zh) | 2016-11-03 | 2016-11-03 | 一种印刷电路板的盲孔检测方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106501706B (zh) |
TW (1) | TWI618940B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107064778A (zh) * | 2017-05-05 | 2017-08-18 | 柏承科技(昆山)股份有限公司 | Pcb盲孔检测方法 |
CN107728043A (zh) * | 2017-11-15 | 2018-02-23 | 奥士康科技股份有限公司 | 一种电路板测试方法及电路板测试系统 |
CN109557454A (zh) * | 2018-11-28 | 2019-04-02 | 江门市利诺达电路科技有限公司 | 一种用于检测电路板质量的检测方法 |
CN111351432A (zh) * | 2020-04-13 | 2020-06-30 | 深圳市强华科技发展有限公司 | 一种pcb板孔位加工制程能力评估方法 |
CN112304215A (zh) * | 2019-07-31 | 2021-02-02 | 由田新技股份有限公司 | 印刷电路板的孔位信息的检测方法及设备 |
CN113808067A (zh) * | 2020-06-11 | 2021-12-17 | 广东美的白色家电技术创新中心有限公司 | 电路板检测方法、视觉检测设备及具有存储功能的装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3982135B1 (en) * | 2020-10-12 | 2024-09-11 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Test target defect identification and evaluation for assessing quality of component carrier structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068819A (ja) * | 1999-08-26 | 2001-03-16 | Sharp Corp | プリント基板の不良判定方法及びこの判定に用いるマーク |
CN1641315A (zh) * | 2004-01-16 | 2005-07-20 | 牧德科技股份有限公司 | 印刷电路板的盲孔质量分析方法 |
US20070115014A1 (en) * | 2004-08-13 | 2007-05-24 | Lameres Brock J | Incorporation of Isolation Resistor(s) into Probes using Probe Tip Spring Pins |
CN101216522A (zh) * | 2008-01-16 | 2008-07-09 | 中国电子科技集团公司第四十五研究所 | 基于fpga的印刷电路板快速抽取图像特征值检测方法 |
CN105259463A (zh) * | 2015-11-06 | 2016-01-20 | 天津普林电路股份有限公司 | 一种高密度积层板覆铜线路层短路点和断路点测试方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000005748A2 (en) * | 1998-07-22 | 2000-02-03 | Digirad Corporation | Blind pin placement on circuit boards |
TWI267325B (en) * | 2004-03-17 | 2006-11-21 | Cin Phown Technology Co Ltd | Checking machine of simulating three-dimensional profile for blind hole on the PCB |
TWI361029B (en) * | 2008-09-12 | 2012-03-21 | Zhen Ding Technology Co Ltd | Multilayer printed circuit boards, method for manu |
JP5794502B2 (ja) * | 2012-01-23 | 2015-10-14 | 京セラサーキットソリューションズ株式会社 | 印刷配線板の製造方法 |
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2016
- 2016-11-03 CN CN201610953545.3A patent/CN106501706B/zh active Active
-
2017
- 2017-03-20 TW TW106109061A patent/TWI618940B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068819A (ja) * | 1999-08-26 | 2001-03-16 | Sharp Corp | プリント基板の不良判定方法及びこの判定に用いるマーク |
CN1641315A (zh) * | 2004-01-16 | 2005-07-20 | 牧德科技股份有限公司 | 印刷电路板的盲孔质量分析方法 |
US20070115014A1 (en) * | 2004-08-13 | 2007-05-24 | Lameres Brock J | Incorporation of Isolation Resistor(s) into Probes using Probe Tip Spring Pins |
CN101216522A (zh) * | 2008-01-16 | 2008-07-09 | 中国电子科技集团公司第四十五研究所 | 基于fpga的印刷电路板快速抽取图像特征值检测方法 |
CN105259463A (zh) * | 2015-11-06 | 2016-01-20 | 天津普林电路股份有限公司 | 一种高密度积层板覆铜线路层短路点和断路点测试方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107064778A (zh) * | 2017-05-05 | 2017-08-18 | 柏承科技(昆山)股份有限公司 | Pcb盲孔检测方法 |
CN107728043A (zh) * | 2017-11-15 | 2018-02-23 | 奥士康科技股份有限公司 | 一种电路板测试方法及电路板测试系统 |
CN109557454A (zh) * | 2018-11-28 | 2019-04-02 | 江门市利诺达电路科技有限公司 | 一种用于检测电路板质量的检测方法 |
CN109557454B (zh) * | 2018-11-28 | 2021-08-24 | 江门市利诺达电路科技有限公司 | 一种用于检测电路板质量的检测方法 |
CN112304215A (zh) * | 2019-07-31 | 2021-02-02 | 由田新技股份有限公司 | 印刷电路板的孔位信息的检测方法及设备 |
CN111351432A (zh) * | 2020-04-13 | 2020-06-30 | 深圳市强华科技发展有限公司 | 一种pcb板孔位加工制程能力评估方法 |
CN113808067A (zh) * | 2020-06-11 | 2021-12-17 | 广东美的白色家电技术创新中心有限公司 | 电路板检测方法、视觉检测设备及具有存储功能的装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI618940B (zh) | 2018-03-21 |
CN106501706B (zh) | 2019-06-04 |
TW201818090A (zh) | 2018-05-16 |
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Effective date of registration: 20210512 Address after: 215300 No. 299, Shansong Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: ALL-RING TECH PRECISION MACHINE (KUNSHAN) Co.,Ltd. Address before: 215300 No. 299, Shansong Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: ISUN TEK Co.,Ltd. |
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Effective date of registration: 20240507 Address after: Building 3, No. 20 Jinyang East Road, Lujia Town, Kunshan City, Suzhou City, Jiangsu Province, 215300 Patentee after: Suzhou Secheng High-tech Co.,Ltd. Country or region after: China Address before: 215300 No. 299, Shansong Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: ALL-RING TECH PRECISION MACHINE (KUNSHAN) Co.,Ltd. Country or region before: China |